TWI643978B - 半導體製造裝置用構件 - Google Patents

半導體製造裝置用構件 Download PDF

Info

Publication number
TWI643978B
TWI643978B TW106131172A TW106131172A TWI643978B TW I643978 B TWI643978 B TW I643978B TW 106131172 A TW106131172 A TW 106131172A TW 106131172 A TW106131172 A TW 106131172A TW I643978 B TWI643978 B TW I643978B
Authority
TW
Taiwan
Prior art keywords
layer
region
corrosion
aluminum substrate
semiconductor manufacturing
Prior art date
Application number
TW106131172A
Other languages
English (en)
Chinese (zh)
Other versions
TW201812098A (zh
Inventor
新田安隆
Original Assignee
日商Ｔｏｔｏ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商Ｔｏｔｏ股份有限公司 filed Critical 日商Ｔｏｔｏ股份有限公司
Publication of TW201812098A publication Critical patent/TW201812098A/zh
Application granted granted Critical
Publication of TWI643978B publication Critical patent/TWI643978B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/02—Coating starting from inorganic powder by application of pressure only
    • C23C24/04—Impact or kinetic deposition of particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/0203—Protection arrangements
    • H01J2237/0213—Avoiding deleterious effects due to interactions between particles and tube elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Drying Of Semiconductors (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW106131172A 2016-09-13 2017-09-12 半導體製造裝置用構件 TWI643978B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2016-178671 2016-09-13
JP2016178671 2016-09-13
JP2017173746A JP6331181B2 (ja) 2016-09-13 2017-09-11 半導体製造装置用部材
JP2017-173746 2017-09-11

Publications (2)

Publication Number Publication Date
TW201812098A TW201812098A (zh) 2018-04-01
TWI643978B true TWI643978B (zh) 2018-12-11

Family

ID=61695216

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106131172A TWI643978B (zh) 2016-09-13 2017-09-12 半導體製造裝置用構件

Country Status (4)

Country Link
JP (2) JP6331181B2 (ja)
KR (1) KR102093678B1 (ja)
CN (1) CN108780750B (ja)
TW (1) TWI643978B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020132947A (ja) * 2019-02-20 2020-08-31 日本特殊陶業株式会社 膜付き部材及びその製造方法
CN111627790B (zh) 2019-02-27 2024-05-03 Toto株式会社 半导体制造装置构件、半导体制造装置、显示器制造装置
JP2020141124A (ja) * 2019-02-27 2020-09-03 Toto株式会社 半導体製造装置用部材および半導体製造装置用部材を備えた半導体製造装置並びにディスプレイ製造装置
JP6801773B2 (ja) * 2019-02-27 2020-12-16 Toto株式会社 半導体製造装置用部材および半導体製造装置用部材を備えた半導体製造装置並びにディスプレイ製造装置
JP2020141123A (ja) * 2019-02-27 2020-09-03 Toto株式会社 半導体製造装置用部材および半導体製造装置用部材を備えた半導体製造装置並びにディスプレイ製造装置
US11142829B2 (en) 2019-02-27 2021-10-12 Toto Ltd. Semiconductor manufacturing apparatus member, and display manufacturing apparatus and semiconductor manufacturing apparatus comprising semiconductor manufacturing apparatus member
US11424140B2 (en) 2019-10-10 2022-08-23 Samsung Electronics Co., Ltd. Member, method of manufacturing the same, apparatus for manufacturing the same, and semiconductor manufacturing apparatus
CN114256047B (zh) * 2020-09-25 2023-12-22 中微半导体设备(上海)股份有限公司 半导体零部件、涂层形成方法和等离子体反应装置
US11749507B2 (en) 2021-04-21 2023-09-05 Toto Ltd. Semiconductor manufacturing apparatus member and semiconductor manufacturing apparatus
JP7197036B2 (ja) * 2021-04-21 2022-12-27 Toto株式会社 半導体製造装置用部材及び半導体製造装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201600490A (zh) * 2014-06-26 2016-01-01 Toto Ltd 耐電漿性構件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4006535B2 (ja) 2003-11-25 2007-11-14 独立行政法人産業技術総合研究所 半導体または液晶製造装置部材およびその製造方法
JP4873857B2 (ja) * 2004-12-24 2012-02-08 京セラ株式会社 耐食性部材およびその製造方法並びに半導体・液晶製造装置用部材
WO2007026739A1 (ja) * 2005-08-31 2007-03-08 Kyocera Corporation 耐食性部材、これを用いた処理装置および試料処理方法ならびに耐食性部材の製造方法
JP2012057251A (ja) * 2010-08-13 2012-03-22 Toshiba Corp 保護膜とその形成方法、並びに半導体製造装置およびプラズマ処理装置
JP2016102264A (ja) * 2014-06-26 2016-06-02 Toto株式会社 耐プラズマ性部材
JP2016008352A (ja) * 2014-06-26 2016-01-18 Toto株式会社 耐プラズマ性部材
JP6714978B2 (ja) 2014-07-10 2020-07-01 東京エレクトロン株式会社 プラズマ処理装置用の部品、プラズマ処理装置、及びプラズマ処理装置用の部品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201600490A (zh) * 2014-06-26 2016-01-01 Toto Ltd 耐電漿性構件

Also Published As

Publication number Publication date
JP2018137476A (ja) 2018-08-30
KR20180096734A (ko) 2018-08-29
KR102093678B1 (ko) 2020-03-26
JP6331181B2 (ja) 2018-05-30
JP2018046278A (ja) 2018-03-22
CN108780750A (zh) 2018-11-09
TW201812098A (zh) 2018-04-01
CN108780750B (zh) 2023-07-21

Similar Documents

Publication Publication Date Title
TWI643978B (zh) 半導體製造裝置用構件
US11295934B2 (en) Member for semiconductor manufacturing device
JP6058822B2 (ja) プラズマ抵抗性が向上したセラミック被膜の形成方法およびこれによるセラミック被膜
KR20220110695A (ko) 이트륨 플루오라이드 분무된 코팅, 이를 위한 분무 물질, 및 분무된 코팅을 포함하는 내식성 코팅
KR102135664B1 (ko) 내플라즈마성 부재
TWI724797B (zh) 半導體製造裝置用構件及具備半導體製造裝置用構件之半導體製造裝置以及顯示器製造裝置
US10618847B2 (en) Structure
KR101961411B1 (ko) 대면적 oled 패널 제조용 챔버의 코팅재 및 그 제조 방법
CN106460190A (zh) 耐等离子体性构件
JP7089707B2 (ja) 半導体製造装置用部材および半導体製造装置用部材を備えた半導体製造装置並びにディスプレイ製造装置
TWI663142B (zh) 結構物
US20170121805A1 (en) Corrosion resistant member and method for manufacturing the same
TWI638795B (zh) Structure
KR101123719B1 (ko) 내플라즈마성 전자빔증착 세라믹 피막 부재
KR102612460B1 (ko) 반도체 제조 장치용 부재 및 반도체 제조 장치
JP2009029686A (ja) 耐食性部材およびその製造方法ならびに処理装置
CN111627790A (zh) 半导体制造装置构件、半导体制造装置、显示器制造装置
JP6358492B2 (ja) 耐プラズマ性部材