TWI643945B - 光硬化性丙烯酸系熱傳導組成物、丙烯酸系熱傳導性片及其製造方法 - Google Patents
光硬化性丙烯酸系熱傳導組成物、丙烯酸系熱傳導性片及其製造方法 Download PDFInfo
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- TWI643945B TWI643945B TW103116800A TW103116800A TWI643945B TW I643945 B TWI643945 B TW I643945B TW 103116800 A TW103116800 A TW 103116800A TW 103116800 A TW103116800 A TW 103116800A TW I643945 B TWI643945 B TW I643945B
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- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical group [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
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- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
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- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- 150000004706 metal oxides Chemical class 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- AXRSHKZFNKUGQB-UHFFFAOYSA-N octyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC)OC1=CC=CC=C1 AXRSHKZFNKUGQB-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
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- 230000000704 physical effect Effects 0.000 description 1
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- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
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- 230000006641 stabilisation Effects 0.000 description 1
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- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- MGMXGCZJYUCMGY-UHFFFAOYSA-N tris(4-nonylphenyl) phosphite Chemical compound C1=CC(CCCCCCCCC)=CC=C1OP(OC=1C=CC(CCCCCCCCC)=CC=1)OC1=CC=C(CCCCCCCCC)C=C1 MGMXGCZJYUCMGY-UHFFFAOYSA-N 0.000 description 1
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- 239000011787 zinc oxide Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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Abstract
本發明之適合於丙烯酸系熱傳導性片用之光硬化性丙烯酸系熱傳導組成物含有(甲基)丙烯酸酯單體,且相對於(甲基)丙烯酸酯單體100質量份,含有熱傳導性填料300~2000質量份、光自由基聚合起始劑0.5~7.0質量份、一次抗氧化劑0.5~4.0質量份、二次抗氧化劑0.5~8.0質量份、及抗熱劣化劑0.1~4.0質量份。
Description
本發明係關於一種光硬化性丙烯酸系熱傳導組成物、由其獲得之丙烯酸系熱傳導性片及其製造方法。
為了使驅動時伴有發熱之IC晶片等電氣元件密接於散熱器(heat sink)等散熱構件而廣泛地使用熱傳導性片。作為此種熱傳導性片,已使用如下者,即,於含有光硬化性之聚矽氧系化合物或丙烯酸系化合物等光硬化性化合物及光聚合起始劑之光硬化性黏合劑組成物中,分散氧化鋁微粒子等熱傳導性填料等,將藉此製成之光硬化性熱傳導組成物片化,並使其光硬化而成者(專利文獻1、2)。
專利文獻1:日本特開2004-090516號公報
專利文獻2:日本特開2004-315663號公報
然而,於使用有聚矽氧系化合物作為光硬化性黏合劑組成物之主要硬化成分之聚矽氧系熱傳導性片之情形時,雖然光硬化後之聚矽氧系樹脂本身之耐熱性或耐氧劣化性良好,但有如下缺點:材料成本高,並且有自片表面釋出會因熱分解而產生絕緣性之氧化矽之三聚物~五聚物之
環狀矽氧烷之氣體的情形,從而引起電子機器之接點故障。
另一方面,於使用有較聚矽氧系化合物具有材料成本優勢之丙烯酸系化合物作為光硬化性黏合劑組成物之主要硬化成分之丙烯酸系熱傳導性片之情形時,當然不會發生低分子矽氧烷氣體之釋出,因此接點故障之產生受到抑制,雖然如此,但有如下問題:與聚矽氧系熱傳導性片相比,耐熱性變差,光硬化後之丙烯酸系樹脂由因活性氧而產生之過氧自由基或氫過氧化物導致氧化劣化,隨之,熱傳導性片之柔軟性喪失,其熱傳導性特性降低。
因此,已嘗試藉由於光硬化性丙烯酸系熱傳導組成物中添加捕捉過氧自由基之所謂之一次抗氧化劑、及分解氫過氧化物之所謂之二次抗氧化劑,而防止由過氧自由基或氫過氧化物導致之丙烯酸系熱傳導性片之氧化劣化。然而,若過剩地添加,則於光硬化性丙烯酸系熱傳導組成物中之光硬化性黏合劑組成物藉由紫外線照射而進行光自由基聚合硬化反應時,會使光聚合起始劑失去活性,因此可於某程度上抑制丙烯酸系熱傳導性片之氧化劣化,但關於在高熱環境下使用丙烯酸系熱傳導性片之情形時產生的丙烯酸系樹脂之由熱與氧之作用導致之熱劣化,難謂可充分地抑制,而存在丙烯酸系熱傳導性片之柔軟性降低之問題。
本發明係欲解決以上習知之問題點者,其目的在於提供一種光硬化性丙烯酸系熱傳導組成物、以及由其獲得之丙烯酸系熱傳導性片及其製造方法,該光硬化性丙烯酸系熱傳導組成物係含有一次抗氧化劑及二次抗氧化劑,尤其適合於丙烯酸系熱傳導性片用者,且可形成防止由熱與氧導致之柔軟性之降低之丙烯酸系熱傳導性片。
本發明人發現,藉由於光硬化性丙烯酸系熱傳導組成物中摻合一次抗氧化劑及二次抗氧化劑,並以特定比例摻合通常藉由聚合物自由基之捕捉而防止光聚合後之聚合物之熱劣化且未摻合於光聚合前之光硬化
性黏合劑組成物中之抗熱劣化劑,可達成上述目的,從而完成本發明。
即,本發明提供一種光硬化性丙烯酸系熱傳導組成物,其適於丙烯酸系熱傳導性片用,其特徵在於:含有(甲基)丙烯酸酯單體,且相對於(甲基)丙烯酸酯單體100質量份,含有熱傳導性填料300~2000質量份、光自由基聚合起始劑0.5~7.0質量份、一次抗氧化劑0.5~4.0質量份、二次抗氧化劑0.5~8.0質量份、及抗熱劣化劑0.1~4.0質量份。
又,本發明提供一種丙烯酸系熱傳導性片,其特徵在於:其係由該光硬化性丙烯酸系熱傳導組成物之片狀光硬化物構成。
進而,本發明提供一種製造方法,將含有熱傳導性填料之光硬化性丙烯酸系熱傳導組成物成形為片狀,並照射紫外線使其光聚合,藉此製造丙烯酸系熱傳導性片;其特徵在於:
使用如下者作為該光硬化性丙烯酸系熱傳導組成物:含有(甲基)丙烯酸酯單體,且相對於(甲基)丙烯酸酯單體100質量份,含有熱傳導性填料300~2000質量份、光自由基聚合起始劑0.5~7.0質量份、一次抗氧化劑0.5~4.0質量份、二次抗氧化劑0.5~8.0質量份、及抗熱劣化劑0.1~4.0質量份。
適合於丙烯酸系熱傳導性片之本發明之光硬化性丙烯酸系熱傳導組成物以特定比例含有(甲基)丙烯酸酯單體、熱傳導性填料、光自由基聚合起始劑、一次抗氧化劑、二次抗氧化劑、進而聚合物自由基捕捉性之抗熱劣化劑。該光硬化性丙烯酸系熱傳導組成物於光聚合前已含有抗熱劣化劑。因此,預想會阻礙該光硬化性丙烯酸系熱傳導組成物之光聚合反應,但不會預想之外地嚴重阻礙藉由紫外線之照射而進行之光聚合反應,並且於光聚合後之丙烯酸系熱傳導性片中含有保持有抗熱劣化作用之抗熱劣化劑。因此,根據本發明之光硬化性丙烯酸系熱傳導組成物,可提供一種藉由一次抗氧化劑與二次抗氧化劑防止氧化劣化,並且亦防止由熱
與氧導致之熱劣化之丙烯酸系熱傳導性片。
<光硬化性丙烯酸系熱傳導組成物>
本發明係一種適合於丙烯酸系熱傳導性片用之光硬化性丙烯酸系熱傳導組成物。該光硬化性丙烯酸系熱傳導組成物以特定比例含有(甲基)丙烯酸酯單體、熱傳導性填料、光自由基聚合起始劑、一次抗氧化劑、二次抗氧化劑、及抗熱劣化劑。
((甲基)丙烯酸酯單體)
作為(甲基)丙烯酸酯單體,可使用公知之單官能(甲基)丙烯酸酯(此處,(甲基)丙烯酸酯包含丙烯酸酯與甲基丙烯酸酯)、二官能以上之多官能(甲基)丙烯酸酯。本發明中,為了將接著劑設為熱硬化性,較佳為至少一部分丙烯酸系單體使用多官能(甲基)丙烯酸酯。
作為單官能(甲基)丙烯酸酯,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸三級丁酯、(甲基)丙烯酸2-甲基丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸正庚酯、(甲基)丙烯酸2-甲基己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸2-丁基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、苯氧基(甲基)丙烯酸酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸
月桂酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸嗎福啉-4-基酯等。作為二官能(甲基)丙烯酸酯,可列舉:雙酚F-EO改質二(甲基)丙烯酸酯、雙酚A-EO改質二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、聚乙二醇(甲基)丙烯酸酯、三環癸烷二羥甲基二(甲基)丙烯酸酯、二環戊二烯(甲基)丙烯酸酯等。作為三官能(甲基)丙烯酸酯,可列舉:三羥甲基丙烷三(甲基)丙烯酸酯、三羥甲基丙烷PO改質(甲基)丙烯酸酯、異三聚氰酸EO改質三(甲基)丙烯酸酯等。作為四官能以上之(甲基)丙烯酸酯,可列舉:二新戊四醇五(甲基)丙烯酸酯、新戊四醇六(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二-三羥甲基丙烷四丙烯酸酯等。此外,亦可使用多官能(甲基)丙烯酸胺基甲酸酯。具體而言,可列舉M1100、M1200、M1210、M1600(以上,東亞合成(股))、AH-600、AT-600(以上,共榮社化學(股))等。
作為特佳之(甲基)丙烯酸酯單體,就對丙烯酸系熱傳導性片賦予較佳之柔軟性之方面而言,可列舉丙烯酸2-乙基己酯或丙烯酸月桂酯。
(抗熱劣化劑)
抗熱劣化劑係防止光硬化性丙烯酸系熱傳導組成物之由熱與氧導致之熱劣化者。抗熱劣化劑通常係捕捉因熱與氧之作用而產生之聚合物自由基,從而保持為穩定之自由基化合物者。
本發明中,作為抗熱劣化劑,可較佳地使用以下之式(1)之1,1-雙(2-羥基-3,5-二三級烷基苯基)烷烴之丙烯酸單酯。
此處,苯基之3位上所鍵結之R1為碳數4~6之三級烷基,具體而言,可較佳地列舉三級丁基、三級戊基、三級己基。其中,特佳為三級丁基、三級戊基。
又,苯基之5位上所鍵結之R2可列舉碳數1~5之烷基、碳數3~5之二級烷基、碳數4~5之三級烷基。具體而言,可列舉:甲基、乙基、丙基、異丙基、丁基、異丁基、二級丁基、三級丁基、戊基、異戊基、二級戊基、三級戊基、己基、異己基、二級己基、三級己基等。其中,較佳為甲基、三級丁基、三級戊基。
兩個苯基殘基所鍵結之R為2價之烴基,較佳為-(CH2)n-基(n為1~2之整數)、-(CH(CH3))n-基(n為1~2之整數)。其中,較佳為-(CH(CH3))-基。
因此,作為抗熱劣化劑之較佳之具體例,可列舉1,1-雙(2-羥基-3,5-二三級烷基苯基)烷烴之丙烯酸單酯,作為特佳之具體例,可列舉1,1-雙(2-羥基-3,5-二三級戊基苯基)乙烷之丙烯酸單酯(Sumilizer GS、住友化學(股))。
就實現抗熱劣化劑之適當之添加效果且不阻礙硬化之觀點而言,抗熱劣化劑於光硬化性丙烯酸系熱傳導組成物中之含量相對於(甲基)丙烯酸酯單體100質量份為0.1~4.0質量份,較佳為0.2~3.0質量份。
又,就實現抗劣化劑之適當之添加效果且不產生硬化阻礙之觀點而言,抗熱劣化劑相對於下述一次抗氧化劑100質量份之摻合量較佳
為10~130質量份,更佳為20~100質量份。
(一次抗氧化劑)
一次抗氧化劑係用以捕捉過氧自由基而防止樹脂之氧化劣化者,可應用習知公知之一次抗氧化劑,可較佳地使用酚系抗氧化劑。作為酚系抗氧化劑,可列舉:六亞甲基雙[(3,5-二三級丁基-4-羥基苯基)丙醯胺]、4,4'-硫代雙(6-三級丁基間甲酚)、2,2'-亞甲基雙(4-甲基-6-三級丁基苯酚)、2,2'-亞甲基雙(4-乙基-6-三級丁基苯酚)、雙[3,3-雙(4-羥基-3-三級丁基苯基)丁酸]二醇酯、2,2'-亞乙基雙(4,6-二三級丁基苯酚)、2,2'-亞乙基雙(4-二級丁基-6-三級丁基苯酚)、1,1,3-三(2-甲基-4-羥基-5-三級丁基苯基)丁烷、對苯二甲酸雙[2-三級丁基-4-甲基-6-(2-羥基-3-三級丁基-5-甲基苄基)苯基]酯、1,3,5-三(3,5-二三級丁基-4-羥基苄基)-2,4,6-三甲基苯、三聚異氰酸1,3,5-三[(3,5-二三級丁基-4-羥基苯基)丙醯氧基乙基]酯、四[亞甲基-3-(3,5-二三級丁基-4-羥基苯基)丙酸酯]甲烷、2-三級丁基-4-甲基-6-(2-丙烯醯氧基-3-三級丁基-5-甲基苄基)苯酚、3,9-雙[1,1-二甲基-2-{(3-三級丁基-4-羥基-5-甲基苯基)丙醯氧基}乙基]-2,4,8,10-四氧雜螺[5,5]十一烷、三乙二醇雙[(3-三級丁基-4-羥基-5-甲基苯基)丙酸酯]、正十八基-3-(4'-羥基-3',5'-二三級丁基苯基)丁烷等。其中,可較佳地列舉正十八基-3-(4'-羥基-3',5'-二三級丁基苯基)丁烷。
就實現一次抗氧化劑之適當之添加效果且不阻礙硬化之觀點而言,一次抗氧化劑於光硬化性丙烯酸系熱傳導組成物中之含量相對於(甲基)丙烯酸酯單體100質量份為0.5~4.0質量份,較佳為1.0~3.0質量份。
(二次抗氧化劑)
二次抗氧化劑係用以分解氫氧化物自由基而防止樹脂之氧化劣化者,可應用習知公知之二次抗氧化劑,可較佳地使用磷系抗氧化劑。作為磷系抗氧化劑,可列舉:亞磷酸三壬基苯酯、亞磷酸三(2,4-二三級丁基苯基)酯、亞磷酸三[2-三級丁基-4-(3-三級丁基-4-羥基-5-甲基苯硫基)-5-甲基苯基]酯、亞磷酸三癸酯、亞磷酸辛基二苯酯、亞磷酸二(癸基)單苯酯、二(十三基)新戊四醇二亞磷酸酯、二硬脂基新戊四醇二亞磷酸酯、二(壬基苯基)新戊四醇二亞磷酸酯、雙(2,4-二三級丁基苯基)新戊四醇二亞磷酸酯、雙(2,6-二三級丁基-4-甲基苯基)新戊四醇二亞磷酸酯、雙(2,4,6-三三級丁基苯基)新戊四醇二亞磷酸酯、四(十三基)亞異丙基二苯酚二亞磷酸酯、四(十三基)-4,4'-正亞丁基雙(2-三級丁基-5-甲基苯酚)二亞磷酸酯、六(十三基)-1,1,3-三(2-甲基-4-羥基-5-三級丁基苯基)丁烷三亞磷酸酯、四(2,4-二三級丁基苯基)伸聯苯基二亞磷酸酯、9,10-二氫-9--10-磷雜菲-10-氧化物、2,2'-亞甲基雙(4-甲基-6-三級丁基苯基)-2-乙基己基亞磷酸酯、4-[3-[(2,4,8,10-四三級丁基二苯并[d,f][1,3,2]二氧雜磷呯(dioxaphosphepin))-6-基氧基]丙基]-2-甲基-6-三級丁基苯酚等。其中,可較佳地列舉4-[3-[(2,4,8,10-四三級丁基二苯并[d,f][1,3,2]二氧雜磷呯)-6-基氧基]丙基]-2-甲基-6-三級丁基苯酚。
就實現二次抗氧化劑之適當之添加效果且不阻礙硬化之觀點而言,二次抗氧化劑於光硬化性丙烯酸系熱傳導組成物中之含量相對於(甲基)丙烯酸酯單體100質量份為0.5~8.0質量份,較佳為0.8~4.0質量份。
就實現二次抗氧化劑之適當之添加效果且不產生硬化阻害之觀點而言,二次抗氧化劑相對於一次抗氧化劑100質量份之摻合量較佳為50~270質量份,更佳為80~130質量份。
(光自由基聚合起始劑)
作為光自由基聚合起始劑,可應用習知公知之光自由基聚合起始劑。例如,作為苯乙酮系光聚合起始劑,可列舉:2-羥基-2-環己基苯乙酮(Irgacure184、BASF Japan(股))、α-羥基-a,a'-二甲基苯乙酮(Darocure1173、BASF Japan(股))、2,2-二甲氧基-2-苯基苯乙酮(Irgacure651、BASF Japan(股))、4-(2-羥基乙氧基)苯基(2-羥基-2-丙基)酮(Darocure2959、BASF Japan(股))、2-羥基-1-[4-{4-(2-羥基-2-甲基-丙醯基)-苄基}苯基]-2-甲基-丙烷-1-酮(Irgacure127、BASF Japan(股))等。作為二苯乙二酮縮酮(benzil ketal)系光聚合起始劑,可列舉:二苯甲酮、茀酮、二苯并環庚酮、4-胺基二苯甲酮、4,4'-二胺基二苯甲酮、4-羥基二苯甲酮、4-氯二苯甲酮、4,4'-二氯二苯甲酮等。作為磷系光聚合起始劑,可列舉:雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物(Irgacure819、BASF Japan(股))、(2,4,6-三甲基苯甲醯基-二苯基膦氧化物(DarocureTPO、BASF Japan(股))等。其中,就實現順利之光硬化之觀點而言,可列舉:2-羥基-2-環己基苯乙酮、α-羥基-α,a'-二甲基苯乙酮、尤其係雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物。
就獲得適當之硬化物性之觀點而言,光自由基聚合起始劑於光硬化性丙烯酸系熱傳導組成物中之含量相對於(甲基)丙烯酸酯單體100質量份為0.5~7.0質量份,較佳為1.0~3.0質量份。
(熱傳導性填料)
作為熱傳導性填料,可使用球狀、扁平狀、纖維狀之習知公知之熱傳導性填料。可併用2種以上形狀或大小不同者。
作為熱傳導性填料之大小,於為球狀或扁平狀之情形時,平均粒徑較佳為0.1~100μm,更佳為1~80μm,於為纖維狀之情形時,平
均長度較佳為1μm~6mm,更佳為5~900μm。
作為熱傳導性填料之具體例,可列舉:氧化鋁、氮化鋁、氧化矽、氧化鋅、氧化鎂、氫氧化鋁、氫氧化鎂等絕緣性金屬氧化物填料;矽、SiC等半導體填料;銅、銀、鋁等金屬填料;鐵氧體、鐵矽鋁合金(Sendust)、非晶質金屬等磁性填料;玻璃纖維、碳纖維等纖維填料等。其中,就實現良好之難燃性與絕緣性之方面而言,可較佳地使用氫氧化鋁、氧化鋁、氧化鎂。
若熱傳導性填料於光硬化性丙烯酸系熱傳導組成物中之含量過少,則無法充分地降低熱阻,若過多,則樹脂成分量相對減少,難以充分地混合,因此,相對於(甲基)丙烯酸酯單體100質量份,較佳為300~2000質量份,更佳為650~1400質量份。
本發明之光硬化性丙烯酸系熱傳導組成物可含有用於丙烯酸系樹脂用之公知之塑化劑以對熱傳導性片賦予柔軟性。例如,可含有鄰苯二甲酸酯系塑化劑、脂肪族二元酸酯系塑化劑、蓖麻油系脂肪酸酯系塑化劑、聚酯系塑化劑、1,2,4-苯三甲酸系塑化劑、焦蜜石酸酯系塑化劑、磷酸酯系塑化劑等。為了獲得適當之塑化劑之添加效果,該等塑化劑於光硬化性丙烯酸系熱傳導組成物中之含量相對於(甲基)丙烯酸酯單體100質量份,較佳為20~220質量份,更佳為50~200質量份。
光硬化性丙烯酸系熱傳導組成物可進而視需要含有矽烷偶合劑、氧化矽、雲母等填充劑、顏料、抗靜電劑、抗氧化劑、防銹劑、分散劑、沈降抑制劑、難燃劑等。
(光硬化性丙烯酸系熱傳導組成物之製備)
光硬化性丙烯酸系熱傳導組成物可藉由如下方式製備:藉由常規方法利用例如行星式攪拌裝置(Thinky(股))分別以特定之摻合量將(甲基)丙烯酸酯單體、熱傳導性填料、光自由基聚合起始劑、一次抗氧化劑、二
次抗氧化劑、進而抗熱劣化劑、及視需要摻合之其他添加劑均勻地混合。
<丙烯酸系熱傳導性片及其製造>
本發明之光硬化性丙烯酸系熱傳導組成物可藉由製成片狀光硬化物而以丙烯酸系熱傳導性片之形式使用。即,藉由將含有熱傳導性填料之光硬化性丙烯酸系熱傳導組成物成形為片狀並照射紫外線使其進行光聚合而製造丙烯酸系熱傳導性片。具體而言,首先,藉由軋光法(calendaring)等常規方法將以上所說明之含有熱傳導性填料之光硬化性丙烯酸系熱傳導組成物成形為通常500~2000μm厚之片狀。針對該片,自紫外線燈以1mW/cm2之照射強度對片之兩面分別同時照射5分鐘於300~400nm具有最大強度之紫外線而使其進行光聚合硬化,藉此可製造丙烯酸系熱傳導性片。
再者,本發明中,丙烯酸系熱傳導性片之「熱傳導性」之程度較佳為1~5W‧m-1‧K-1,更佳為1~3W‧m-1‧K-1。
[實施例]
以下,藉由實施例具體地說明本發明。
實施例1~2、比較例1~5
使用行星式攪拌裝置(Thinky(股))將表1之摻合成分均勻地混合,藉此製備光硬化性丙烯酸系熱傳導組成物。繼而,利用棒式塗佈機將該光硬化性丙烯酸系熱傳導組成物成形為1000μm厚之片。針對該片,自於300~400nm之波長具有最大強度之紫外線燈以1mW/cm2之照射強度對片之兩面分別同時照射5分鐘而使其進行光聚合硬化,藉此製造丙烯酸系熱傳導性片。
<壓縮維持率之測定>
藉由測定於125℃或150℃進行100小時之老化處理後之壓縮維持率而評價所獲得之丙烯酸系熱傳導性片之柔軟性因由熱與氧導致之熱劣化而喪失之程度。並且,目視觀察老化處理後之著色之程度。將所獲得之結果示
於表1。
再者,作為測定壓縮維持率(%)之前提,測定老化前之壓縮率(初期壓縮率)。具體而言,將各實施例及各比較例中所製作之熱傳導性片切割成特定之大小(13.0mm×9.5mm×1000μm(厚)),施加98.135kPa之負重,測定穩定後之厚度(初期壓縮厚度[μm]),根據以下之式(1)求出初期壓縮率(%)。又,壓縮維持率(%)係與老化前之壓縮率(初期壓縮率)同樣地測定老化後之壓縮率,根據以下之式(2)而求出。
初期壓縮率(%)=((1000-初期壓縮厚度)/1000)×100 (1)
壓縮維持率(%)=(老化後壓縮率/初期壓縮率)×100 (2)
於實用上期待120℃老化後以及150℃老化後之壓縮維持率為65%以上。又,較理想為老化後未著色。
由表1可知,實施例1及2中所獲得之丙烯酸系熱傳導性片於125℃及150℃之各溫度進行100小時老化後壓縮維持率超過65%。亦未觀察到老化後之著色。
相對於此,於比較例1中所獲得之熱傳導性片之情形時,雖然使用一次抗氧化劑,但未使用二次抗氧化劑與抗熱劣化劑,因此,於150℃進行100小時老化後,壓縮維持率低於65%。並且,觀察到著色。
於比較例2中所獲得之丙烯酸系熱傳導性片之情形時,雖然使用二次抗氧化劑,但未使用一次抗氧化劑與抗熱劣化劑,因此,於150℃進行100小時老化後,壓縮維持率低於65%。並且,觀察到著色。
於比較例3中所獲得之丙烯酸系熱傳導性片之情形時,雖然使用抗熱劣化劑,但未使用一次抗氧化劑與二次抗氧化劑,因此,於150℃進行100小時老化後,壓縮維持率大幅地低於65%。並且,觀察到著色。
於比較例4中所獲得之丙烯酸系熱傳導性片之情形時,雖然使用一次抗氧化劑與二次抗氧化劑,但未使用抗熱劣化劑,因此,於150℃進行100小時老化後,壓縮維持率低於65%。並且,觀察到著色。
於比較例5中所獲得之丙烯酸系熱傳導性片之情形時,雖然使用一次抗氧化劑、二次抗氧化劑、及抗熱劣化劑,但抗熱劣化劑之含量過剩,因此,光聚合根本無法充分進行,硬化不充分。又,於150℃進行100小時老化後,壓縮維持率大幅地低於65%。並且,觀察到著色。
[產業上之可利用性]
適合於丙烯酸系熱傳導性片用之本發明之光硬化性丙烯酸系熱傳導組成物以特定比例含有(甲基)丙烯酸酯單體、熱傳導性填料、光自由基聚合起始劑、一次抗氧化劑、二次抗氧化劑、進而聚合物自由基捕捉性之抗熱劣化劑。因此,不會嚴重阻礙藉由紫外線之照射進行之光聚合反應,並且於光聚合後之丙烯酸系熱傳導性片中含有保持有抗熱劣化作用之抗熱劣化劑。因此,本發明之光硬化性丙烯酸系熱傳導組成物可用於製造對於氧化劣化及熱劣化均具有耐受性之丙烯酸系熱傳導性片。
Claims (11)
- 一種光硬化性丙烯酸系熱傳導組成物,適於丙烯酸系熱傳導性片用,其特徵在於:含有(甲基)丙烯酸酯單體,且相對於(甲基)丙烯酸酯單體100質量份,含有熱傳導性填料300~2000質量份、光自由基聚合起始劑0.5~7.0質量份、一次抗氧化劑0.5~4.0質量份、二次抗氧化劑0.5~8.0質量份、及抗熱劣化劑0.1~4.0質量份,且上述抗熱劣化劑為1,1-雙(2-羥基-3-三級烷基-5-烷基苯基)烷烴之丙烯酸單酯。
- 如申請專利範圍第1項之光硬化性丙烯酸系熱傳導組成物,其中,抗熱劣化劑為1,1-雙(2-羥基-3,5-二三級烷基苯基)烷烴之丙烯酸單酯。
- 如申請專利範圍第1項之光硬化性丙烯酸系熱傳導組成物,其中,抗熱劣化劑為1,1-雙(2-羥基-3,5-二三級戊基苯基)乙烷之丙烯酸單酯。
- 如申請專利範圍第1至3項中任一項之光硬化性丙烯酸系熱傳導組成物,其中,一次抗氧化劑為酚系抗氧化劑,二次抗氧化劑為磷系抗氧化劑。
- 如申請專利範圍第1至3項中任一項之光硬化性丙烯酸系熱傳導組成物,其中,一次抗氧化劑為正十八基-3-(4'-羥基-3',5'-二三級丁基苯基)丁烷,二次抗氧化劑為4-[3-[(2,4,8,10-四三級丁基二苯并[d,f][1,3,2]二氧雜磷呯(dioxaphosphepin))-6-基氧基]丙基]-2-甲基-6-三級丁基苯酚。
- 如申請專利範圍第1至3項中任一項之光硬化性丙烯酸系熱傳導組成物,其中,相對於一次抗氧化劑100質量份,二次抗氧化劑之摻合量為50~270質量份,抗熱劣化劑之摻合量為10~130質量份。
- 如申請專利範圍第1至3項中任一項之光硬化性丙烯酸系熱傳導組成物,其中,(甲基)丙烯酸酯單體為丙烯酸2-乙基己酯或丙烯酸月桂酯。
- 如申請專利範圍第1至3項中任一項之光硬化性丙烯酸系熱傳導組成物,其中,光自由基聚合起始劑為雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物。
- 如申請專利範圍第1至3項中任一項之光硬化性丙烯酸系熱傳導組成物,其中,熱傳導性填料為氫氧化鋁、氧化鋁或氧化鎂。
- 一種丙烯酸系熱傳導性片,係由申請專利範圍第1至9項中任一項之光硬化性丙烯酸系熱傳導組成物之片狀光硬化物構成。
- 一種丙烯酸系熱傳導性片之製造方法,將含有熱傳導性填料之光硬化性丙烯酸系熱傳導組成物成形為片狀,並照射紫外線使其進行光聚合,藉此製造丙烯酸系熱傳導性片,其特徵在於:使用如下者作為該光硬化性丙烯酸系熱傳導組成物:含有(甲基)丙烯酸酯單體,且相對於(甲基)丙烯酸酯單體100質量份,含有熱傳導性填料300~2000質量份、光自由基聚合起始劑0.5~7.0質量份、一次抗氧化劑0.5~4.0質量份、二次抗氧化劑0.5~8.0質量份、及抗熱劣化劑0.1~4.0質量份,且上述抗熱劣化劑為1,1-雙(2-羥基-3-三級烷基-5-烷基苯基)烷烴之丙烯酸單酯。
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004002527A (ja) * | 2002-05-31 | 2004-01-08 | Dainippon Ink & Chem Inc | 難燃性熱伝導電気絶縁粘着体 |
JP2004027039A (ja) * | 2002-06-26 | 2004-01-29 | Dainippon Ink & Chem Inc | 難燃性熱伝導電気絶縁粘着体 |
JP2006160830A (ja) * | 2004-12-03 | 2006-06-22 | Three M Innovative Properties Co | 熱伝導性シート及びその製造方法 |
CN1809602A (zh) * | 2003-06-30 | 2006-07-26 | 株式会社钟化 | 固化性组合物 |
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JP5101862B2 (ja) * | 2006-10-31 | 2012-12-19 | スリーエム イノベイティブ プロパティズ カンパニー | シート形成性単量体組成物、熱伝導性シート及びその製法 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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JP2004027039A (ja) * | 2002-06-26 | 2004-01-29 | Dainippon Ink & Chem Inc | 難燃性熱伝導電気絶縁粘着体 |
CN1809602A (zh) * | 2003-06-30 | 2006-07-26 | 株式会社钟化 | 固化性组合物 |
JP2006160830A (ja) * | 2004-12-03 | 2006-06-22 | Three M Innovative Properties Co | 熱伝導性シート及びその製造方法 |
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