TWI642930B - 照明單元、缺陷檢查裝置及照明方法 - Google Patents

照明單元、缺陷檢查裝置及照明方法 Download PDF

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Publication number
TWI642930B
TWI642930B TW106121226A TW106121226A TWI642930B TW I642930 B TWI642930 B TW I642930B TW 106121226 A TW106121226 A TW 106121226A TW 106121226 A TW106121226 A TW 106121226A TW I642930 B TWI642930 B TW I642930B
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TW
Taiwan
Prior art keywords
illumination
light
lighting
unit
inspection
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Application number
TW106121226A
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English (en)
Chinese (zh)
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TW201804151A (zh
Inventor
松山晃久
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日商歐姆龍股份有限公司
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Publication of TW201804151A publication Critical patent/TW201804151A/zh
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Publication of TWI642930B publication Critical patent/TWI642930B/zh

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/94Investigating contamination, e.g. dust
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8809Adjustment for highlighting flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8812Diffuse illumination, e.g. "sky"
    • G01N2021/8816Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8835Adjustable illumination, e.g. software adjustable screen
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8845Multiple wavelengths of illumination or detection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N2021/8924Dents; Relief flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/062LED's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/063Illuminating optical parts
TW106121226A 2016-07-29 2017-06-26 照明單元、缺陷檢查裝置及照明方法 TWI642930B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016149104A JP6759812B2 (ja) 2016-07-29 2016-07-29 欠陥検査装置、および欠陥検査方法
JP2016-149104 2016-07-29

Publications (2)

Publication Number Publication Date
TW201804151A TW201804151A (zh) 2018-02-01
TWI642930B true TWI642930B (zh) 2018-12-01

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Family Applications (1)

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TW106121226A TWI642930B (zh) 2016-07-29 2017-06-26 照明單元、缺陷檢查裝置及照明方法

Country Status (4)

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JP (1) JP6759812B2 (ja)
KR (1) KR101969378B1 (ja)
CN (1) CN107664645B (ja)
TW (1) TWI642930B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6969439B2 (ja) * 2018-02-23 2021-11-24 オムロン株式会社 外観検査装置、及び外観検査装置の照明条件設定方法
JP7010057B2 (ja) * 2018-02-26 2022-01-26 オムロン株式会社 画像処理システムおよび設定方法
JP6958444B2 (ja) 2018-03-13 2021-11-02 オムロン株式会社 コントローラおよび画像処理システム
JP7067148B2 (ja) * 2018-03-13 2022-05-16 オムロン株式会社 照明装置、および画像処理システム
CN109596625A (zh) * 2019-02-01 2019-04-09 东莞中科蓝海智能视觉科技有限公司 料盘中的工件缺陷检测识别方法
CN109859192A (zh) * 2019-02-01 2019-06-07 东莞中科蓝海智能视觉科技有限公司 圆形高反光工件的检测识别方法
CN111044521A (zh) * 2019-12-13 2020-04-21 苏州通富超威半导体有限公司 一种用于芯片检测的组合光源装置及方法
CN116819857A (zh) * 2023-08-22 2023-09-29 苏州默然光电科技有限公司 一种照明单元、视觉检测系统及其方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005091049A (ja) * 2003-09-12 2005-04-07 Ccs Inc 画像処理用光照射装置及び画像処理用光照射方法
JP2005274558A (ja) * 2004-02-27 2005-10-06 Omron Corp 表面状態検査方法およびその方法を用いた表面状態検査装置ならびに基板検査装置
JP2007240431A (ja) * 2006-03-10 2007-09-20 Omron Corp 欠陥検査装置および欠陥検査方法
JP2009174857A (ja) * 2008-01-21 2009-08-06 Omron Corp 照明装置およびこの装置を用いた欠陥検査装置
TWI491871B (zh) * 2013-07-05 2015-07-11 Machvision Inc 用於光學檢測的照明系統及使用其之檢測系統、檢測方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11237210A (ja) * 1998-02-19 1999-08-31 Komatsu Ltd 半導体パッケージの検査装置
CN1844901A (zh) * 2005-04-08 2006-10-11 欧姆龙株式会社 缺陷检查方法以及利用该方法的缺陷检查装置
JP4826750B2 (ja) 2005-04-08 2011-11-30 オムロン株式会社 欠陥検査方法およびその方法を用いた欠陥検査装置
JP4809032B2 (ja) * 2005-10-04 2011-11-02 ヤマハ発動機株式会社 実装基板の検査装置および印刷装置
US7567344B2 (en) * 2006-05-12 2009-07-28 Corning Incorporated Apparatus and method for characterizing defects in a transparent substrate
JP4389982B2 (ja) * 2007-08-09 2009-12-24 オムロン株式会社 基板外観検査装置
KR101175595B1 (ko) * 2011-09-26 2012-08-24 주식회사 미르기술 비접촉식 부품검사장치 및 부품검사방법
JP5927930B2 (ja) * 2012-01-19 2016-06-01 株式会社リコー 情報処理装置及びプログラム
JP5673621B2 (ja) * 2012-07-18 2015-02-18 オムロン株式会社 欠陥検査方法及び欠陥検査装置
JP2014035307A (ja) * 2012-08-10 2014-02-24 Hitachi High-Technologies Corp 欠陥検査装置、及び欠陥検査方法
JP2014038045A (ja) * 2012-08-17 2014-02-27 Sony Corp 検査装置、照明、検査方法、プログラム及び基板の製造方法
JP2014122863A (ja) * 2012-12-21 2014-07-03 Murata Mfg Co Ltd 撮像装置及び撮像方法
JP6220521B2 (ja) * 2013-01-18 2017-10-25 株式会社ニューフレアテクノロジー 検査装置
JP5825278B2 (ja) * 2013-02-21 2015-12-02 オムロン株式会社 欠陥検査装置および欠陥検査方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005091049A (ja) * 2003-09-12 2005-04-07 Ccs Inc 画像処理用光照射装置及び画像処理用光照射方法
JP2005274558A (ja) * 2004-02-27 2005-10-06 Omron Corp 表面状態検査方法およびその方法を用いた表面状態検査装置ならびに基板検査装置
JP2007240431A (ja) * 2006-03-10 2007-09-20 Omron Corp 欠陥検査装置および欠陥検査方法
JP2009174857A (ja) * 2008-01-21 2009-08-06 Omron Corp 照明装置およびこの装置を用いた欠陥検査装置
TWI491871B (zh) * 2013-07-05 2015-07-11 Machvision Inc 用於光學檢測的照明系統及使用其之檢測系統、檢測方法

Also Published As

Publication number Publication date
JP2018017638A (ja) 2018-02-01
JP6759812B2 (ja) 2020-09-23
KR101969378B1 (ko) 2019-04-16
CN107664645A (zh) 2018-02-06
KR20180013709A (ko) 2018-02-07
CN107664645B (zh) 2020-08-18
TW201804151A (zh) 2018-02-01

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