TWI642337B - Electronic component mounting device - Google Patents
Electronic component mounting device Download PDFInfo
- Publication number
- TWI642337B TWI642337B TW106126808A TW106126808A TWI642337B TW I642337 B TWI642337 B TW I642337B TW 106126808 A TW106126808 A TW 106126808A TW 106126808 A TW106126808 A TW 106126808A TW I642337 B TWI642337 B TW I642337B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- electronic component
- crimping
- component mounting
- mounting device
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 197
- 238000002788 crimping Methods 0.000 claims abstract description 134
- 238000010438 heat treatment Methods 0.000 claims abstract description 47
- 238000003825 pressing Methods 0.000 claims description 127
- 230000007246 mechanism Effects 0.000 claims description 53
- 238000001179 sorption measurement Methods 0.000 claims description 18
- 238000003384 imaging method Methods 0.000 description 27
- 230000006835 compression Effects 0.000 description 15
- 238000007906 compression Methods 0.000 description 15
- 239000010408 film Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-159645 | 2016-08-16 | ||
| JP2016159645 | 2016-08-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201808084A TW201808084A (zh) | 2018-03-01 |
| TWI642337B true TWI642337B (zh) | 2018-11-21 |
Family
ID=61249130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106126808A TWI642337B (zh) | 2016-08-16 | 2017-08-09 | Electronic component mounting device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6675356B2 (enExample) |
| KR (1) | KR102004606B1 (enExample) |
| CN (1) | CN107770970B (enExample) |
| TW (1) | TWI642337B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566485B (zh) * | 2019-09-25 | 2022-05-13 | 芝浦机械电子装置株式会社 | 电子零件的安装装置 |
| KR102813187B1 (ko) | 2020-03-12 | 2025-05-29 | 삼성디스플레이 주식회사 | 본딩 장치 |
| WO2021243545A1 (zh) * | 2020-06-02 | 2021-12-09 | 南京溧水高新创业投资管理有限公司 | 一种电子零件安装装置 |
| KR102510422B1 (ko) * | 2021-01-18 | 2023-03-15 | 주식회사 제이스텍 | 표시장치를 제조하는 장치 및 이를 이용한 표시장치의 제조 방법 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273688A (ja) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置 |
| TWI311792B (enExample) * | 2005-08-24 | 2009-07-01 | Shibaura Mechatronics Corporatio | |
| TWI439775B (zh) * | 2007-01-10 | 2014-06-01 | Shibaura Mechatronics Corp | Installation device and installation method of electronic parts |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2971180B2 (ja) | 1991-05-30 | 1999-11-02 | 株式会社東芝 | アウタリードボンディング装置 |
| JP3909816B2 (ja) * | 2001-10-31 | 2007-04-25 | オプトレックス株式会社 | 液晶表示パネルへの回路部品接続装置 |
| JP2008084952A (ja) * | 2006-09-26 | 2008-04-10 | Fujifilm Corp | 配線板接続方法 |
| JP5008476B2 (ja) | 2007-06-27 | 2012-08-22 | パナソニック株式会社 | 電極接合ユニット及び電極接合方法 |
| JP2009272457A (ja) | 2008-05-08 | 2009-11-19 | Sharp Corp | 基板実装構造及び液晶表示装置、並びに基板実装構造の製造方法 |
| JP2011047984A (ja) * | 2009-08-25 | 2011-03-10 | Hitachi High-Technologies Corp | Ｆｐｄモジュール実装装置およびその実装方法 |
| JP2011054815A (ja) | 2009-09-03 | 2011-03-17 | Hitachi High-Technologies Corp | 実装処理作業装置及び実装処理作業方法並びに表示基板モジュール組立ライン |
-
2017
- 2017-07-13 JP JP2017137420A patent/JP6675356B2/ja active Active
- 2017-07-27 KR KR1020170095224A patent/KR102004606B1/ko active Active
- 2017-08-04 CN CN201710664234.XA patent/CN107770970B/zh active Active
- 2017-08-09 TW TW106126808A patent/TWI642337B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004273688A (ja) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置 |
| TWI311792B (enExample) * | 2005-08-24 | 2009-07-01 | Shibaura Mechatronics Corporatio | |
| TWI439775B (zh) * | 2007-01-10 | 2014-06-01 | Shibaura Mechatronics Corp | Installation device and installation method of electronic parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018029171A (ja) | 2018-02-22 |
| CN107770970B (zh) | 2020-06-30 |
| KR102004606B1 (ko) | 2019-07-26 |
| JP6675356B2 (ja) | 2020-04-01 |
| KR20180019480A (ko) | 2018-02-26 |
| TW201808084A (zh) | 2018-03-01 |
| CN107770970A (zh) | 2018-03-06 |
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