JP6675356B2 - 電子部品実装装置 - Google Patents

電子部品実装装置 Download PDF

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Publication number
JP6675356B2
JP6675356B2 JP2017137420A JP2017137420A JP6675356B2 JP 6675356 B2 JP6675356 B2 JP 6675356B2 JP 2017137420 A JP2017137420 A JP 2017137420A JP 2017137420 A JP2017137420 A JP 2017137420A JP 6675356 B2 JP6675356 B2 JP 6675356B2
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JP
Japan
Prior art keywords
substrate
electronic component
unit
crimping
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017137420A
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English (en)
Japanese (ja)
Other versions
JP2018029171A (ja
JP2018029171A5 (enExample
Inventor
寛久 神戸
寛久 神戸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to KR1020170095224A priority Critical patent/KR102004606B1/ko
Publication of JP2018029171A publication Critical patent/JP2018029171A/ja
Publication of JP2018029171A5 publication Critical patent/JP2018029171A5/ja
Application granted granted Critical
Publication of JP6675356B2 publication Critical patent/JP6675356B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2017137420A 2016-08-16 2017-07-13 電子部品実装装置 Active JP6675356B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020170095224A KR102004606B1 (ko) 2016-08-16 2017-07-27 전자 부품 실장 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016159645 2016-08-16
JP2016159645 2016-08-16

Publications (3)

Publication Number Publication Date
JP2018029171A JP2018029171A (ja) 2018-02-22
JP2018029171A5 JP2018029171A5 (enExample) 2019-05-23
JP6675356B2 true JP6675356B2 (ja) 2020-04-01

Family

ID=61249130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017137420A Active JP6675356B2 (ja) 2016-08-16 2017-07-13 電子部品実装装置

Country Status (4)

Country Link
JP (1) JP6675356B2 (enExample)
KR (1) KR102004606B1 (enExample)
CN (1) CN107770970B (enExample)
TW (1) TWI642337B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112566485B (zh) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 电子零件的安装装置
KR102813187B1 (ko) 2020-03-12 2025-05-29 삼성디스플레이 주식회사 본딩 장치
WO2021243545A1 (zh) * 2020-06-02 2021-12-09 南京溧水高新创业投资管理有限公司 一种电子零件安装装置
KR102510422B1 (ko) * 2021-01-18 2023-03-15 주식회사 제이스텍 표시장치를 제조하는 장치 및 이를 이용한 표시장치의 제조 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2971180B2 (ja) 1991-05-30 1999-11-02 株式会社東芝 アウタリードボンディング装置
JP3909816B2 (ja) * 2001-10-31 2007-04-25 オプトレックス株式会社 液晶表示パネルへの回路部品接続装置
JP2004273688A (ja) * 2003-03-07 2004-09-30 Seiko Epson Corp 圧着方法、圧着装置、電気光学装置の製造方法及び製造装置
CN100596266C (zh) * 2005-08-24 2010-03-24 芝浦机械电子株式会社 电子部件的安装装置和安装方法
JP2008084952A (ja) * 2006-09-26 2008-04-10 Fujifilm Corp 配線板接続方法
JP5574401B2 (ja) * 2007-01-10 2014-08-20 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP5008476B2 (ja) 2007-06-27 2012-08-22 パナソニック株式会社 電極接合ユニット及び電極接合方法
JP2009272457A (ja) 2008-05-08 2009-11-19 Sharp Corp 基板実装構造及び液晶表示装置、並びに基板実装構造の製造方法
JP2011047984A (ja) * 2009-08-25 2011-03-10 Hitachi High-Technologies Corp Ｆｐｄモジュール実装装置およびその実装方法
JP2011054815A (ja) 2009-09-03 2011-03-17 Hitachi High-Technologies Corp 実装処理作業装置及び実装処理作業方法並びに表示基板モジュール組立ライン

Also Published As

Publication number Publication date
JP2018029171A (ja) 2018-02-22
CN107770970B (zh) 2020-06-30
KR102004606B1 (ko) 2019-07-26
KR20180019480A (ko) 2018-02-26
TW201808084A (zh) 2018-03-01
CN107770970A (zh) 2018-03-06
TWI642337B (zh) 2018-11-21

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