TWI640371B - 接合裝置及接合方法 - Google Patents

接合裝置及接合方法 Download PDF

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Publication number
TWI640371B
TWI640371B TW102133582A TW102133582A TWI640371B TW I640371 B TWI640371 B TW I640371B TW 102133582 A TW102133582 A TW 102133582A TW 102133582 A TW102133582 A TW 102133582A TW I640371 B TWI640371 B TW I640371B
Authority
TW
Taiwan
Prior art keywords
support
cleaning
substrate
cleaning unit
item
Prior art date
Application number
TW102133582A
Other languages
English (en)
Chinese (zh)
Other versions
TW201429569A (zh
Inventor
嚴東斌
Original Assignee
三星顯示器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星顯示器有限公司 filed Critical 三星顯示器有限公司
Publication of TW201429569A publication Critical patent/TW201429569A/zh
Application granted granted Critical
Publication of TWI640371B publication Critical patent/TWI640371B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7501—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning In General (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW102133582A 2013-01-24 2013-09-17 接合裝置及接合方法 TWI640371B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020130008127A KR20140095301A (ko) 2013-01-24 2013-01-24 본딩 장치 및 그 방법
??10-2013-0008127 2013-01-24

Publications (2)

Publication Number Publication Date
TW201429569A TW201429569A (zh) 2014-08-01
TWI640371B true TWI640371B (zh) 2018-11-11

Family

ID=51241487

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102133582A TWI640371B (zh) 2013-01-24 2013-09-17 接合裝置及接合方法

Country Status (3)

Country Link
KR (1) KR20140095301A (ko)
CN (1) CN103972131B (ko)
TW (1) TWI640371B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102401361B1 (ko) * 2017-07-19 2022-05-24 세메스 주식회사 다이 본딩 장치
CN110125052B (zh) * 2018-07-02 2023-11-14 厦门新页科技有限公司 一种应用于无线充电的异物清除系统及其控制方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100589044B1 (ko) * 2004-03-10 2006-06-19 한동희 평판표시장치의 편광필름 본딩장치
US20070227565A1 (en) * 2006-03-29 2007-10-04 Taiwan Semiconductor Manufacturing Co., Ltd. Workstation and cleaning apparatus thereof
TW200839321A (en) * 2007-03-27 2008-10-01 Dong-Hee Han Polarized film attaching apparatus
US20090139040A1 (en) * 2001-11-09 2009-06-04 Formfactor, Inc. Apparatuses and methods for cleaning test probes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090139040A1 (en) * 2001-11-09 2009-06-04 Formfactor, Inc. Apparatuses and methods for cleaning test probes
KR100589044B1 (ko) * 2004-03-10 2006-06-19 한동희 평판표시장치의 편광필름 본딩장치
US20070227565A1 (en) * 2006-03-29 2007-10-04 Taiwan Semiconductor Manufacturing Co., Ltd. Workstation and cleaning apparatus thereof
TW200839321A (en) * 2007-03-27 2008-10-01 Dong-Hee Han Polarized film attaching apparatus

Also Published As

Publication number Publication date
CN103972131B (zh) 2018-06-01
CN103972131A (zh) 2014-08-06
TW201429569A (zh) 2014-08-01
KR20140095301A (ko) 2014-08-01

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