TWI639095B - 製造具有一或更多層的積體電路之方法及相應的積體電路 - Google Patents

製造具有一或更多層的積體電路之方法及相應的積體電路 Download PDF

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Publication number
TWI639095B
TWI639095B TW103116991A TW103116991A TWI639095B TW I639095 B TWI639095 B TW I639095B TW 103116991 A TW103116991 A TW 103116991A TW 103116991 A TW103116991 A TW 103116991A TW I639095 B TWI639095 B TW I639095B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
layout design
layers
changed
circuit
Prior art date
Application number
TW103116991A
Other languages
English (en)
Chinese (zh)
Other versions
TW201504832A (zh
Inventor
Gregory Munson Yeric
葉立克格瑞格利莫森
Original Assignee
Arm Limited
Ａｒｍ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arm Limited, Ａｒｍ股份有限公司 filed Critical Arm Limited
Publication of TW201504832A publication Critical patent/TW201504832A/zh
Application granted granted Critical
Publication of TWI639095B publication Critical patent/TWI639095B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18—Manufacturability analysis or optimisation for manufacturability

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electron Beam Exposure (AREA)
TW103116991A 2013-07-17 2014-05-14 製造具有一或更多層的積體電路之方法及相應的積體電路 TWI639095B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/944,129 2013-07-17
US13/944,129 US9672316B2 (en) 2013-07-17 2013-07-17 Integrated circuit manufacture using direct write lithography

Publications (2)

Publication Number Publication Date
TW201504832A TW201504832A (zh) 2015-02-01
TWI639095B true TWI639095B (zh) 2018-10-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW103116991A TWI639095B (zh) 2013-07-17 2014-05-14 製造具有一或更多層的積體電路之方法及相應的積體電路

Country Status (13)

Country Link
US (2) US9672316B2 (https=)
EP (1) EP3022605B1 (https=)
JP (1) JP2016531424A (https=)
KR (2) KR20160034300A (https=)
CN (1) CN105378565B (https=)
AU (1) AU2014291840B2 (https=)
BR (1) BR112016000222B1 (https=)
CA (1) CA2917723C (https=)
IL (1) IL243151B (https=)
MY (1) MY174370A (https=)
SG (1) SG11201600093PA (https=)
TW (1) TWI639095B (https=)
WO (1) WO2015008021A1 (https=)

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JP6896055B2 (ja) 2016-07-19 2021-06-30 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィステップにおける基板に施されるべきパターンの組み合わせの決定
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EP3821794B1 (en) * 2016-12-16 2023-02-15 St. Jude Medical International Holding S.à r.l. Wireless force sensor
CN116666358A (zh) * 2016-12-23 2023-08-29 Asml荷兰有限公司 具有序列号的安全芯片
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CN117192908B (zh) * 2023-08-22 2024-04-09 安徽国芯智能装备有限公司 一种直写式光刻机涨缩一致的补偿方法

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Also Published As

Publication number Publication date
KR102386526B1 (ko) 2022-04-14
CA2917723C (en) 2022-04-19
MY174370A (en) 2020-04-13
EP3022605A1 (en) 2016-05-25
US9672316B2 (en) 2017-06-06
AU2014291840A1 (en) 2016-02-18
WO2015008021A1 (en) 2015-01-22
EP3022605B1 (en) 2020-02-19
US20150026650A1 (en) 2015-01-22
KR20160034300A (ko) 2016-03-29
CN105378565A (zh) 2016-03-02
SG11201600093PA (en) 2016-02-26
IL243151B (en) 2019-03-31
CA2917723A1 (en) 2015-01-22
US10303840B2 (en) 2019-05-28
BR112016000222B1 (pt) 2022-05-17
BR112016000222A2 (https=) 2017-07-25
US20170228493A1 (en) 2017-08-10
JP2016531424A (ja) 2016-10-06
AU2014291840B2 (en) 2018-02-08
TW201504832A (zh) 2015-02-01
CN105378565B (zh) 2018-03-27
KR20210037758A (ko) 2021-04-06

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