TWI636501B - 使用水蒸氣處理將材料層從基材移除的方法 - Google Patents

使用水蒸氣處理將材料層從基材移除的方法 Download PDF

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Publication number
TWI636501B
TWI636501B TW101141568A TW101141568A TWI636501B TW I636501 B TWI636501 B TW I636501B TW 101141568 A TW101141568 A TW 101141568A TW 101141568 A TW101141568 A TW 101141568A TW I636501 B TWI636501 B TW I636501B
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Taiwan
Prior art keywords
substrate
dielectric layer
water vapor
layer
exposing
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TW101141568A
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English (en)
Chinese (zh)
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TW201330085A (zh
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李光德道格拉斯
拉提蘇哈
程秋
西蒙斯馬丁Ｊ
金秉憲
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應用材料股份有限公司
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    • H10P72/0411—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • H10P50/285—
    • H10P50/73—
    • H10P70/234—
    • H10W20/081—

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
TW101141568A 2011-11-08 2012-11-08 使用水蒸氣處理將材料層從基材移除的方法 TWI636501B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/291,286 US9653327B2 (en) 2011-05-12 2011-11-08 Methods of removing a material layer from a substrate using water vapor treatment
US13/291,286 2011-11-08

Publications (2)

Publication Number Publication Date
TW201330085A TW201330085A (zh) 2013-07-16
TWI636501B true TWI636501B (zh) 2018-09-21

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TW101141568A TWI636501B (zh) 2011-11-08 2012-11-08 使用水蒸氣處理將材料層從基材移除的方法

Country Status (5)

Country Link
US (1) US9653327B2 (enExample)
JP (1) JP6158199B2 (enExample)
KR (1) KR102033707B1 (enExample)
TW (1) TWI636501B (enExample)
WO (1) WO2013070570A1 (enExample)

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Also Published As

Publication number Publication date
WO2013070570A1 (en) 2013-05-16
TW201330085A (zh) 2013-07-16
JP2015504239A (ja) 2015-02-05
KR102033707B1 (ko) 2019-10-17
KR20140089383A (ko) 2014-07-14
JP6158199B2 (ja) 2017-07-05
US9653327B2 (en) 2017-05-16
US20120285481A1 (en) 2012-11-15

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