TWI630536B - 靜電電容式觸控面板 - Google Patents

靜電電容式觸控面板 Download PDF

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Publication number
TWI630536B
TWI630536B TW106118013A TW106118013A TWI630536B TW I630536 B TWI630536 B TW I630536B TW 106118013 A TW106118013 A TW 106118013A TW 106118013 A TW106118013 A TW 106118013A TW I630536 B TWI630536 B TW I630536B
Authority
TW
Taiwan
Prior art keywords
conductive
transparent electrode
film
substrate
layer
Prior art date
Application number
TW106118013A
Other languages
English (en)
Chinese (zh)
Other versions
TW201734742A (zh
Inventor
田仲裕之
山崎宏
五十嵐由三
伊藤豊樹
太田絵美子
Original Assignee
日商日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立化成股份有限公司 filed Critical 日商日立化成股份有限公司
Publication of TW201734742A publication Critical patent/TW201734742A/zh
Application granted granted Critical
Publication of TWI630536B publication Critical patent/TWI630536B/zh

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/0009Details relating to the conductive cores
    • H01B7/0027Liquid conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1884Manufacture of transparent electrodes, e.g. TCO, ITO
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/0281Conductive fibers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0514Photodevelopable thick film, e.g. conductive or insulating paste
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
  • Structure Of Printed Boards (AREA)
TW106118013A 2012-04-04 2013-04-02 靜電電容式觸控面板 TWI630536B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012085523 2012-04-04
JP2012-085523 2012-04-04

Publications (2)

Publication Number Publication Date
TW201734742A TW201734742A (zh) 2017-10-01
TWI630536B true TWI630536B (zh) 2018-07-21

Family

ID=49300533

Family Applications (2)

Application Number Title Priority Date Filing Date
TW102111902A TWI592761B (zh) 2012-04-04 2013-04-02 導電圖案的形成方法及導電圖案基板
TW106118013A TWI630536B (zh) 2012-04-04 2013-04-02 靜電電容式觸控面板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW102111902A TWI592761B (zh) 2012-04-04 2013-04-02 導電圖案的形成方法及導電圖案基板

Country Status (5)

Country Link
JP (3) JP5940648B2 (ja)
KR (2) KR20170072956A (ja)
CN (1) CN104170029B (ja)
TW (2) TWI592761B (ja)
WO (1) WO2013151052A1 (ja)

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* Cited by examiner, † Cited by third party
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JPWO2016013587A1 (ja) * 2014-07-24 2017-05-25 日立化成株式会社 感光性樹脂組成物、感光性フィルム、パターン基板、感光性導電フィルム及び導電パターン基板
JP2016133937A (ja) * 2015-01-16 2016-07-25 アルプス電気株式会社 静電容量式センサの製造方法、静電容量式センサ、感光型導電性シート、タッチパネル及び電子機器
JP6042486B1 (ja) * 2015-05-29 2016-12-14 日本写真印刷株式会社 タッチセンサの製造方法及びタッチセンサ
JP2017059171A (ja) * 2015-09-18 2017-03-23 日立化成株式会社 静電容量方式タッチパネル
JP2017207906A (ja) * 2016-05-18 2017-11-24 日立化成株式会社 静電容量方式タッチパネル及びその製造方法
CN107093494B (zh) * 2017-03-22 2021-07-13 中山大学 一种可转移图案化的导电薄膜及其制备与图案化的方法
CN110998457B (zh) * 2017-07-28 2023-12-08 富士胶片株式会社 图案形成方法、层叠体及触摸面板制造方法
WO2019124307A1 (ja) * 2017-12-20 2019-06-27 住友電気工業株式会社 プリント配線板の製造方法及び積層体
JP7317102B2 (ja) * 2019-03-28 2023-07-28 富士フイルム株式会社 導電性転写材料及び導電パターンの製造方法
JPWO2022071422A1 (ja) * 2020-09-30 2022-04-07
CN113921622B (zh) * 2021-09-30 2024-04-05 中国科学院苏州纳米技术与纳米仿生研究所 电池片基板、光伏电池、光伏电池组件及其组装方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203436A (ja) * 2000-01-18 2001-07-27 Nippon Synthetic Chem Ind Co Ltd:The 電極形成用シートとその製造法および基板上への電極の形成方法
CN101292362A (zh) * 2005-08-12 2008-10-22 凯博瑞奥斯技术公司 基于纳米线的透明导体
TW201128504A (en) * 2010-02-03 2011-08-16 Wintek Corp Capacitive touch sensor and its fabrication method and capacitive touch panel
TW201137714A (en) * 2010-04-23 2011-11-01 Samsung Electro Mech Method for manufacturing one-layer type capacitive touch screen
WO2012005205A1 (ja) * 2010-07-05 2012-01-12 Dic株式会社 透明導電層付き基体及びその製造方法、並びにタッチパネル用透明導電膜積層体、タッチパネル
TW201214257A (en) * 2007-04-27 2012-04-01 Tpk Touch Solutions Inc Conductor pattern structure of a capacitive touch panel and method thereof

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JPH0439816A (ja) * 1990-06-05 1992-02-10 Bridgestone Corp 導電部材
JPH06162820A (ja) * 1992-11-25 1994-06-10 Kao Corp 導電性ペーストおよび導電性塗膜
JP4035888B2 (ja) * 1998-04-21 2008-01-23 Jsr株式会社 電極の製造方法および転写フィルム
JP2003086910A (ja) * 2001-09-12 2003-03-20 Mesh Kk 導電感光性フィルム、及び導電感光性フィルムを利用する導体パターン形成方法
US20080152870A1 (en) * 2006-12-22 2008-06-26 Katsunori Takada Transparent electrically-conductive hard-coated substrate and method for producing the same
CN102124529B (zh) 2008-08-22 2014-11-05 日立化成株式会社 感光性导电膜、导电膜的形成方法、导电图形的形成方法以及导电膜基板
KR101328887B1 (ko) * 2008-09-04 2013-11-13 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물, 감광성 수지 적층체, 레지스트 패턴 형성 방법 그리고 도체 패턴, 프린트 배선판, 리드 프레임, 기재 및 반도체 패키지의 제조 방법
JP5387894B2 (ja) * 2009-04-17 2014-01-15 日立化成株式会社 導電性転写フィルム及びそれを用いた導電性パターンの形成方法
JP5515789B2 (ja) * 2010-01-28 2014-06-11 コニカミノルタ株式会社 透明パターン電極、該電極の製造方法、該電極を用いた有機電子デバイスおよびその製造方法
JP5569144B2 (ja) * 2010-02-24 2014-08-13 日立化成株式会社 感光性導電フィルム、導電膜の形成方法及び導電パターンの形成方法
JP2012033466A (ja) * 2010-07-02 2012-02-16 Fujifilm Corp 導電層転写材料、及びタッチパネル
JP2012022844A (ja) * 2010-07-13 2012-02-02 Fujifilm Corp 導電膜形成用積層体及びその製造方法、並びにパターン形成方法、タッチパネル及び集積型太陽電池
JP2012169072A (ja) * 2011-02-10 2012-09-06 Fujifilm Corp 導電膜形成用積層体、導電膜形成方法、導電膜、導電要素、タッチパネル及び集積型太陽電池

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001203436A (ja) * 2000-01-18 2001-07-27 Nippon Synthetic Chem Ind Co Ltd:The 電極形成用シートとその製造法および基板上への電極の形成方法
CN101292362A (zh) * 2005-08-12 2008-10-22 凯博瑞奥斯技术公司 基于纳米线的透明导体
TW201214257A (en) * 2007-04-27 2012-04-01 Tpk Touch Solutions Inc Conductor pattern structure of a capacitive touch panel and method thereof
TW201128504A (en) * 2010-02-03 2011-08-16 Wintek Corp Capacitive touch sensor and its fabrication method and capacitive touch panel
TW201137714A (en) * 2010-04-23 2011-11-01 Samsung Electro Mech Method for manufacturing one-layer type capacitive touch screen
WO2012005205A1 (ja) * 2010-07-05 2012-01-12 Dic株式会社 透明導電層付き基体及びその製造方法、並びにタッチパネル用透明導電膜積層体、タッチパネル

Also Published As

Publication number Publication date
JP2017224309A (ja) 2017-12-21
JP6176295B2 (ja) 2017-08-09
KR20140111024A (ko) 2014-09-17
CN104170029B (zh) 2018-02-16
CN104170029A (zh) 2014-11-26
JP5940648B2 (ja) 2016-06-29
JPWO2013151052A1 (ja) 2015-12-17
TWI592761B (zh) 2017-07-21
TW201351051A (zh) 2013-12-16
WO2013151052A1 (ja) 2013-10-10
TW201734742A (zh) 2017-10-01
KR20170072956A (ko) 2017-06-27
JP2016006901A (ja) 2016-01-14
KR101751588B1 (ko) 2017-06-27

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