TWI628024B - 液冷套匣的製造方法及液冷套匣 - Google Patents
液冷套匣的製造方法及液冷套匣 Download PDFInfo
- Publication number
- TWI628024B TWI628024B TW105127023A TW105127023A TWI628024B TW I628024 B TWI628024 B TW I628024B TW 105127023 A TW105127023 A TW 105127023A TW 105127023 A TW105127023 A TW 105127023A TW I628024 B TWI628024 B TW I628024B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- substrate portion
- peripheral wall
- metal
- joining
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
- B23K20/1225—Particular aspects of welding with a non-consumable tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
- B23K20/1245—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding characterised by the apparatus
- B23K20/1255—Tools therefor, e.g. characterised by the shape of the probe
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/06—Fastening; Joining by welding
- F28F2275/062—Fastening; Joining by welding by impact pressure or friction welding
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015166411 | 2015-08-26 | ||
JP2015-166411 | 2015-08-26 | ||
JP2016-100366 | 2016-05-19 | ||
JP2016100367A JP6443391B2 (ja) | 2015-08-26 | 2016-05-19 | 液冷ジャケットの製造方法及び液冷ジャケット |
JP2016-100367 | 2016-05-19 | ||
JP2016100366A JP6443390B2 (ja) | 2015-08-26 | 2016-05-19 | 液冷ジャケットの製造方法及び液冷ジャケット |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201710006A TW201710006A (zh) | 2017-03-16 |
TWI628024B true TWI628024B (zh) | 2018-07-01 |
Family
ID=58211069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105127023A TWI628024B (zh) | 2015-08-26 | 2016-08-24 | 液冷套匣的製造方法及液冷套匣 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20180243858A1 (ja) |
EP (1) | EP3342525B1 (ja) |
JP (4) | JP6372515B2 (ja) |
CN (1) | CN107921576A (ja) |
TW (1) | TWI628024B (ja) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6489219B2 (ja) * | 2015-08-26 | 2019-03-27 | 日本軽金属株式会社 | 接合方法、液冷ジャケットの製造方法及び液冷ジャケット |
US10766097B2 (en) * | 2017-04-13 | 2020-09-08 | Raytheon Company | Integration of ultrasonic additive manufactured thermal structures in brazements |
JP6750563B2 (ja) * | 2017-05-26 | 2020-09-02 | 日本軽金属株式会社 | 接合方法 |
JP6750562B2 (ja) * | 2017-05-26 | 2020-09-02 | 日本軽金属株式会社 | 接合方法 |
JP2019000890A (ja) * | 2017-06-19 | 2019-01-10 | 日本軽金属株式会社 | 摩擦攪拌接合方法 |
JP2019038009A (ja) * | 2017-08-24 | 2019-03-14 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP2019058934A (ja) | 2017-09-27 | 2019-04-18 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP2019058933A (ja) | 2017-09-27 | 2019-04-18 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP6885285B2 (ja) * | 2017-09-28 | 2021-06-09 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP6943139B2 (ja) * | 2017-10-27 | 2021-09-29 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP6943140B2 (ja) * | 2017-10-27 | 2021-09-29 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
WO2019082439A1 (ja) * | 2017-10-27 | 2019-05-02 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP6950580B2 (ja) * | 2018-02-28 | 2021-10-13 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
WO2019082435A1 (ja) * | 2017-10-27 | 2019-05-02 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP6950569B2 (ja) * | 2018-02-21 | 2021-10-13 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP2019107665A (ja) * | 2017-12-18 | 2019-07-04 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP6769427B2 (ja) * | 2017-12-18 | 2020-10-14 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP2019111547A (ja) * | 2017-12-21 | 2019-07-11 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP2019181473A (ja) | 2018-04-02 | 2019-10-24 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
GB201810475D0 (en) * | 2018-06-26 | 2018-08-08 | Depuy Ireland Ultd Co | Femoral neck resection guide |
JP7003862B2 (ja) * | 2018-07-19 | 2022-01-21 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
US11794271B2 (en) * | 2018-07-19 | 2023-10-24 | Nippon Light Metal Company, Ltd. | Method for manufacturing liquid-cooled jacket |
JP7003861B2 (ja) * | 2018-07-19 | 2022-01-21 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP7246161B2 (ja) * | 2018-10-25 | 2023-03-27 | 日本発條株式会社 | 接合体 |
JP2020075255A (ja) * | 2018-11-05 | 2020-05-21 | 日本軽金属株式会社 | 液冷ジャケットの製造方法及び摩擦攪拌接合方法 |
JP7070389B2 (ja) | 2018-12-19 | 2022-05-18 | 日本軽金属株式会社 | 接合方法 |
CN110328427A (zh) * | 2019-07-17 | 2019-10-15 | 郭建业 | 一种送丝电机供电方式 |
JP7347234B2 (ja) * | 2020-01-24 | 2023-09-20 | 日本軽金属株式会社 | 液冷ジャケットの製造方法及び摩擦攪拌接合方法 |
JP7347235B2 (ja) * | 2020-01-24 | 2023-09-20 | 日本軽金属株式会社 | 液冷ジャケットの製造方法及び摩擦攪拌接合方法 |
KR20210098786A (ko) * | 2020-02-03 | 2021-08-11 | 엘에스일렉트릭(주) | 냉각 플레이트 및 이의 제조 방법 |
US11872650B2 (en) * | 2020-05-15 | 2024-01-16 | Lockheed Martin Corporation | Systems and methods for friction stir welding a cold plate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52123358A (en) * | 1976-04-09 | 1977-10-17 | Shigeru Kimura | Frictional welding method |
JP2005103617A (ja) * | 2003-09-30 | 2005-04-21 | Mazda Motor Corp | 金属部材の接合方法 |
JP2006324647A (ja) * | 2005-04-21 | 2006-11-30 | Nippon Light Metal Co Ltd | 液冷ジャケット |
WO2015107716A1 (ja) * | 2014-01-14 | 2015-07-23 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6045028A (en) * | 1998-07-17 | 2000-04-04 | Mcdonnell Douglas Corporation | Integral corrosion protection of friction-welded joints |
JP2002035962A (ja) * | 2000-05-19 | 2002-02-05 | Kobe Steel Ltd | 重ね継手の摩擦撹拌接合方法 |
CN100543975C (zh) * | 2005-04-21 | 2009-09-23 | 日本轻金属株式会社 | 液冷套 |
JP5813300B2 (ja) * | 2010-08-23 | 2015-11-17 | 三桜工業株式会社 | 冷却装置 |
JP2014094409A (ja) * | 2012-10-10 | 2014-05-22 | Nippon Light Metal Co Ltd | 伝熱板の製造方法及び摩擦攪拌接合方法 |
WO2014103874A1 (ja) * | 2012-12-25 | 2014-07-03 | 株式会社Gsユアサ | 蓄電素子、蓄電素子アセンブリ及び蓄電素子の製造方法 |
JP6036715B2 (ja) * | 2014-01-14 | 2016-11-30 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
JP6036714B2 (ja) * | 2014-01-14 | 2016-11-30 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
CN105358285B (zh) * | 2014-01-28 | 2021-09-03 | 日本轻金属株式会社 | 摩擦搅拌接合方法 |
CN107000114B (zh) * | 2014-11-05 | 2020-08-25 | 日本轻金属株式会社 | 液冷套筒的制造方法及液冷套筒 |
-
2016
- 2016-04-21 JP JP2016085512A patent/JP6372515B2/ja active Active
- 2016-04-21 JP JP2016085513A patent/JP6372516B2/ja active Active
- 2016-05-19 JP JP2016100366A patent/JP6443390B2/ja active Active
- 2016-05-19 JP JP2016100367A patent/JP6443391B2/ja active Active
- 2016-08-19 EP EP16839196.9A patent/EP3342525B1/en active Active
- 2016-08-19 CN CN201680048899.1A patent/CN107921576A/zh active Pending
- 2016-08-19 US US15/755,521 patent/US20180243858A1/en not_active Abandoned
- 2016-08-24 TW TW105127023A patent/TWI628024B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52123358A (en) * | 1976-04-09 | 1977-10-17 | Shigeru Kimura | Frictional welding method |
JP2005103617A (ja) * | 2003-09-30 | 2005-04-21 | Mazda Motor Corp | 金属部材の接合方法 |
JP2006324647A (ja) * | 2005-04-21 | 2006-11-30 | Nippon Light Metal Co Ltd | 液冷ジャケット |
WO2015107716A1 (ja) * | 2014-01-14 | 2015-07-23 | 日本軽金属株式会社 | 液冷ジャケットの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3342525B1 (en) | 2020-10-21 |
JP2017042817A (ja) | 2017-03-02 |
US20180243858A1 (en) | 2018-08-30 |
JP2017042819A (ja) | 2017-03-02 |
JP2017042816A (ja) | 2017-03-02 |
TW201710006A (zh) | 2017-03-16 |
CN107921576A (zh) | 2018-04-17 |
JP6443390B2 (ja) | 2018-12-26 |
JP6372515B2 (ja) | 2018-08-15 |
JP2017042818A (ja) | 2017-03-02 |
EP3342525A1 (en) | 2018-07-04 |
JP6372516B2 (ja) | 2018-08-15 |
EP3342525A4 (en) | 2019-10-30 |
JP6443391B2 (ja) | 2018-12-26 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |