TWI627640B - 金屬奈米結構化之網絡及透明導電材料 - Google Patents
金屬奈米結構化之網絡及透明導電材料 Download PDFInfo
- Publication number
- TWI627640B TWI627640B TW102122029A TW102122029A TWI627640B TW I627640 B TWI627640 B TW I627640B TW 102122029 A TW102122029 A TW 102122029A TW 102122029 A TW102122029 A TW 102122029A TW I627640 B TWI627640 B TW I627640B
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- Prior art keywords
- transparent conductive
- coating
- metal
- nanowires
- network
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/138—Manufacture of transparent electrodes, e.g. transparent conductive oxides [TCO] or indium tin oxide [ITO] electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/244—Electrodes made of transparent conductive layers, e.g. transparent conductive oxide [TCO] layers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Human Computer Interaction (AREA)
- General Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Laminated Bodies (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/530,822 US10029916B2 (en) | 2012-06-22 | 2012-06-22 | Metal nanowire networks and transparent conductive material |
| US13/530,822 | 2012-06-22 | ||
| US201261684409P | 2012-08-17 | 2012-08-17 | |
| US61/684,409 | 2012-08-17 | ||
| US13/664,159 | 2012-10-30 | ||
| US13/664,159 US9920207B2 (en) | 2012-06-22 | 2012-10-30 | Metal nanostructured networks and transparent conductive material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201405583A TW201405583A (zh) | 2014-02-01 |
| TWI627640B true TWI627640B (zh) | 2018-06-21 |
Family
ID=49769704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102122029A TWI627640B (zh) | 2012-06-22 | 2013-06-20 | 金屬奈米結構化之網絡及透明導電材料 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US9920207B2 (cg-RX-API-DMAC7.html) |
| EP (2) | EP2864990B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6392213B2 (cg-RX-API-DMAC7.html) |
| KR (3) | KR102376788B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN104685577B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI627640B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2013192437A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (85)
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| EP2619816A4 (en) | 2010-09-24 | 2014-06-11 | Univ California | NANO WIRE POLYMER COMPOSITE ELECTRODES |
| KR101348546B1 (ko) | 2011-10-03 | 2014-01-07 | 히타치가세이가부시끼가이샤 | 도전 패턴의 형성 방법, 도전 패턴 기판 및 터치 패널 센서 |
| CN107425252B (zh) * | 2012-05-01 | 2020-08-28 | 纳米通股份有限公司 | 射频(rf)传导媒介 |
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| US9920207B2 (en) | 2012-06-22 | 2018-03-20 | C3Nano Inc. | Metal nanostructured networks and transparent conductive material |
| US10029916B2 (en) | 2012-06-22 | 2018-07-24 | C3Nano Inc. | Metal nanowire networks and transparent conductive material |
| US10020807B2 (en) | 2013-02-26 | 2018-07-10 | C3Nano Inc. | Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks |
| US9519366B2 (en) * | 2013-05-10 | 2016-12-13 | Samsung Electro-Mechanics Co., Ltd. | Touch sensor |
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| CN112513797A (zh) | 2018-07-17 | 2021-03-16 | 深圳市柔宇科技股份有限公司 | 导电薄膜及其制备方法、触控面板及显示装置 |
| CN110875098A (zh) * | 2018-08-29 | 2020-03-10 | 天津大学 | 基于热压烧结的纳米银线导电墨水烧结薄膜及其制备方法和应用 |
| CN110875100A (zh) * | 2018-08-29 | 2020-03-10 | 天津大学 | 基于氯化钠热压烧结的纳米银线导电墨水烧结薄膜及其制备方法和应用 |
| CN111435614A (zh) * | 2019-01-11 | 2020-07-21 | 天津大学 | 一种纳米银片/纳米银颗粒复合薄膜及其制备方法和应用 |
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| US10781324B2 (en) | 2020-09-22 |
| KR102143963B1 (ko) | 2020-08-13 |
| US11987713B2 (en) | 2024-05-21 |
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| EP2864990A2 (en) | 2015-04-29 |
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| TW201405583A (zh) | 2014-02-01 |
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| KR20190112187A (ko) | 2019-10-02 |
| EP3611231A1 (en) | 2020-02-19 |
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| JP2015530693A (ja) | 2015-10-15 |
| EP3611231B1 (en) | 2022-09-14 |
| WO2013192437A2 (en) | 2013-12-27 |
| US20130342221A1 (en) | 2013-12-26 |
| CN104685577A (zh) | 2015-06-03 |
| KR102376788B1 (ko) | 2022-03-18 |
| US9920207B2 (en) | 2018-03-20 |
| WO2013192437A3 (en) | 2014-03-13 |
| JP6392213B2 (ja) | 2018-09-19 |
| KR20200096852A (ko) | 2020-08-13 |
| CN104685577B (zh) | 2018-01-16 |
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