TWI626866B - 基板檢查方法、零件安裝方法及印刷基板的製造方法 - Google Patents
基板檢查方法、零件安裝方法及印刷基板的製造方法 Download PDFInfo
- Publication number
- TWI626866B TWI626866B TW106121611A TW106121611A TWI626866B TW I626866 B TWI626866 B TW I626866B TW 106121611 A TW106121611 A TW 106121611A TW 106121611 A TW106121611 A TW 106121611A TW I626866 B TWI626866 B TW I626866B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- solder
- electronic component
- support
- electrode
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 259
- 238000007689 inspection Methods 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 224
- 230000008569 process Effects 0.000 claims description 23
- 238000007639 printing Methods 0.000 claims description 21
- 238000005476 soldering Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 230000000875 corresponding effect Effects 0.000 description 55
- 238000013461 design Methods 0.000 description 21
- 230000008859 change Effects 0.000 description 12
- 238000003384 imaging method Methods 0.000 description 8
- 238000001179 sorption measurement Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000013459 approach Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Toxicology (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-027386 | 2014-02-17 | ||
| JP2014027386A JP5911899B2 (ja) | 2014-02-17 | 2014-02-17 | 基板検査装置及び部品実装装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201737788A TW201737788A (zh) | 2017-10-16 |
| TWI626866B true TWI626866B (zh) | 2018-06-11 |
Family
ID=53797291
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106121611A TWI626866B (zh) | 2014-02-17 | 2015-02-04 | 基板檢查方法、零件安裝方法及印刷基板的製造方法 |
| TW104103654A TWI595814B (zh) | 2014-02-17 | 2015-02-04 | 基板檢查裝置及零件安裝裝置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104103654A TWI595814B (zh) | 2014-02-17 | 2015-02-04 | 基板檢查裝置及零件安裝裝置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9511455B2 (enExample) |
| JP (1) | JP5911899B2 (enExample) |
| CN (1) | CN104853581B (enExample) |
| DE (1) | DE102015202610B4 (enExample) |
| TW (2) | TWI626866B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6670180B2 (ja) * | 2016-06-02 | 2020-03-18 | ヤマハ発動機株式会社 | バックアップピン配置位置決定装置、バックアップピン配置位置決定方法および基板作業システム |
| JP6306230B1 (ja) * | 2017-02-09 | 2018-04-04 | Ckd株式会社 | 半田印刷検査装置、半田印刷検査方法、及び、基板の製造方法 |
| JP6928527B2 (ja) * | 2017-10-03 | 2021-09-01 | ヤマハ発動機株式会社 | 高さ測定装置、高さ測定方法および基板作業装置 |
| WO2019138509A1 (ja) * | 2018-01-11 | 2019-07-18 | 株式会社Ｆｕｊｉ | 部品実装システム |
| JP6999254B2 (ja) * | 2018-05-23 | 2022-01-18 | ヤマハ発動機株式会社 | 支持部材配置決定装置、支持部材配置決定方法 |
| WO2019225010A1 (ja) * | 2018-05-25 | 2019-11-28 | 株式会社Ｆｕｊｉ | 決定装置、これを有する部品実装機および決定方法 |
| JP7032009B2 (ja) * | 2018-06-29 | 2022-03-08 | ヤマハ発動機株式会社 | 支持部材配置支援装置、印刷機、印刷システム、支持部材配置支援方法 |
| US11917766B2 (en) * | 2019-06-06 | 2024-02-27 | Fuji Corporation | Substrate work machine |
| EP4027764B1 (en) * | 2019-09-06 | 2024-08-28 | Fuji Corporation | Automatic backup pin arrangement system for component mounting machine |
| CN111486350A (zh) * | 2020-04-14 | 2020-08-04 | 东莞市明固照明科技有限公司 | 一种避免积锡的led灯基板 |
| CN114535916B (zh) * | 2022-04-01 | 2023-12-22 | 长鑫存储技术有限公司 | 焊接对位设备以及采用该焊接设备进行焊接的方法 |
| CN117715405B (zh) * | 2024-02-01 | 2024-05-24 | 赛晶亚太半导体科技(浙江)有限公司 | 一种叠层结构贴片方法及叠层结构贴片系统 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758423A (ja) * | 1993-08-19 | 1995-03-03 | Sony Corp | バックアップピン受け部を設けたプリント基板 |
| TWI288366B (en) * | 2004-12-27 | 2007-10-11 | Omron Tateisi Electronics Co | Image processing method, printed wiring board inspection method, printed wiring board inspection device, and inspection data producing |
| JP2007311711A (ja) * | 2006-05-22 | 2007-11-29 | Anritsu Corp | 基板バックアップ装置、該装置を備えた印刷半田検査装置及び方法 |
| TWI294759B (enExample) * | 2004-02-09 | 2008-03-11 | Sony Corp | |
| JP2008211051A (ja) * | 2007-02-27 | 2008-09-11 | Yamaha Motor Co Ltd | バックアップピン配設位置決定装置、バックアップユニット形成装置、及び基板処理装置 |
| WO2013114478A1 (ja) * | 2012-02-02 | 2013-08-08 | パナソニック株式会社 | 下受けピンの配置方法および下受けピンの返戻方法 |
| TW201350835A (zh) * | 2012-04-17 | 2013-12-16 | Omron Tateisi Electronics Co | 焊料之沾附狀態的檢查方法及使用該方法之自動外觀檢查裝置、和基板檢查系統 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3006964B2 (ja) | 1992-10-07 | 2000-02-07 | 山形カシオ株式会社 | バックアップピン自動入替装置 |
| JP4540838B2 (ja) | 2000-12-12 | 2010-09-08 | パナソニック株式会社 | 回路基板固定方法 |
| JP2003204198A (ja) | 2002-01-04 | 2003-07-18 | Hitachi Communication Technologies Ltd | プリント回路板のバックアップピン自動配置装置 |
| US7543259B2 (en) | 2003-05-16 | 2009-06-02 | Fuji Machine Mfg. Co., Ltd. | Method and device for deciding support portion position in a backup device |
| JP4349091B2 (ja) | 2003-11-12 | 2009-10-21 | パナソニック株式会社 | プリント基板支持装置及びプリント基板支持方法 |
| JP5723221B2 (ja) * | 2011-05-31 | 2015-05-27 | ヤマハ発動機株式会社 | スクリーン印刷装置 |
-
2014
- 2014-02-17 JP JP2014027386A patent/JP5911899B2/ja active Active
-
2015
- 2015-02-04 TW TW106121611A patent/TWI626866B/zh active
- 2015-02-04 TW TW104103654A patent/TWI595814B/zh active
- 2015-02-13 CN CN201510079186.9A patent/CN104853581B/zh active Active
- 2015-02-13 DE DE102015202610.8A patent/DE102015202610B4/de active Active
- 2015-02-17 US US14/624,124 patent/US9511455B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758423A (ja) * | 1993-08-19 | 1995-03-03 | Sony Corp | バックアップピン受け部を設けたプリント基板 |
| TWI294759B (enExample) * | 2004-02-09 | 2008-03-11 | Sony Corp | |
| TWI288366B (en) * | 2004-12-27 | 2007-10-11 | Omron Tateisi Electronics Co | Image processing method, printed wiring board inspection method, printed wiring board inspection device, and inspection data producing |
| JP2007311711A (ja) * | 2006-05-22 | 2007-11-29 | Anritsu Corp | 基板バックアップ装置、該装置を備えた印刷半田検査装置及び方法 |
| JP2008211051A (ja) * | 2007-02-27 | 2008-09-11 | Yamaha Motor Co Ltd | バックアップピン配設位置決定装置、バックアップユニット形成装置、及び基板処理装置 |
| WO2013114478A1 (ja) * | 2012-02-02 | 2013-08-08 | パナソニック株式会社 | 下受けピンの配置方法および下受けピンの返戻方法 |
| TW201350835A (zh) * | 2012-04-17 | 2013-12-16 | Omron Tateisi Electronics Co | 焊料之沾附狀態的檢查方法及使用該方法之自動外觀檢查裝置、和基板檢查系統 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI595814B (zh) | 2017-08-11 |
| JP2015153935A (ja) | 2015-08-24 |
| US9511455B2 (en) | 2016-12-06 |
| TW201543974A (zh) | 2015-11-16 |
| TW201737788A (zh) | 2017-10-16 |
| CN104853581A (zh) | 2015-08-19 |
| DE102015202610B4 (de) | 2023-10-26 |
| JP5911899B2 (ja) | 2016-04-27 |
| CN104853581B (zh) | 2018-06-15 |
| US20150231744A1 (en) | 2015-08-20 |
| DE102015202610A1 (de) | 2015-09-03 |
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