CN104853581B - 基板检查装置和部件安装装置 - Google Patents

基板检查装置和部件安装装置 Download PDF

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Publication number
CN104853581B
CN104853581B CN201510079186.9A CN201510079186A CN104853581B CN 104853581 B CN104853581 B CN 104853581B CN 201510079186 A CN201510079186 A CN 201510079186A CN 104853581 B CN104853581 B CN 104853581B
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CN
China
Prior art keywords
substrate
fulcrum post
allocation position
scolding tin
determining means
Prior art date
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CN201510079186.9A
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English (en)
Chinese (zh)
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CN104853581A (zh
Inventor
奥田学
大山刚
坂井田宪彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CKD Corp
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CKD Corp
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Publication date
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Publication of CN104853581A publication Critical patent/CN104853581A/zh
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Publication of CN104853581B publication Critical patent/CN104853581B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646—Soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813—Checking the presence, location, orientation or value, e.g. resistance, of components or conductors

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Toxicology (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN201510079186.9A 2014-02-17 2015-02-13 基板检查装置和部件安装装置 Active CN104853581B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-027386 2014-02-17
JP2014027386A JP5911899B2 (ja) 2014-02-17 2014-02-17 基板検査装置及び部品実装装置

Publications (2)

Publication Number Publication Date
CN104853581A CN104853581A (zh) 2015-08-19
CN104853581B true CN104853581B (zh) 2018-06-15

Family

ID=53797291

Family Applications (1)

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CN201510079186.9A Active CN104853581B (zh) 2014-02-17 2015-02-13 基板检查装置和部件安装装置

Country Status (5)

Country Link
US (1) US9511455B2 (enExample)
JP (1) JP5911899B2 (enExample)
CN (1) CN104853581B (enExample)
DE (1) DE102015202610B4 (enExample)
TW (2) TWI626866B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6670180B2 (ja) * 2016-06-02 2020-03-18 ヤマハ発動機株式会社 バックアップピン配置位置決定装置、バックアップピン配置位置決定方法および基板作業システム
JP6306230B1 (ja) * 2017-02-09 2018-04-04 Ckd株式会社 半田印刷検査装置、半田印刷検査方法、及び、基板の製造方法
JP6928527B2 (ja) * 2017-10-03 2021-09-01 ヤマハ発動機株式会社 高さ測定装置、高さ測定方法および基板作業装置
WO2019138509A1 (ja) * 2018-01-11 2019-07-18 株式会社Ｆｕｊｉ 部品実装システム
JP6999254B2 (ja) * 2018-05-23 2022-01-18 ヤマハ発動機株式会社 支持部材配置決定装置、支持部材配置決定方法
WO2019225010A1 (ja) * 2018-05-25 2019-11-28 株式会社Ｆｕｊｉ 決定装置、これを有する部品実装機および決定方法
JP7032009B2 (ja) * 2018-06-29 2022-03-08 ヤマハ発動機株式会社 支持部材配置支援装置、印刷機、印刷システム、支持部材配置支援方法
US11917766B2 (en) * 2019-06-06 2024-02-27 Fuji Corporation Substrate work machine
EP4027764B1 (en) * 2019-09-06 2024-08-28 Fuji Corporation Automatic backup pin arrangement system for component mounting machine
CN111486350A (zh) * 2020-04-14 2020-08-04 东莞市明固照明科技有限公司 一种避免积锡的led灯基板
CN114535916B (zh) * 2022-04-01 2023-12-22 长鑫存储技术有限公司 焊接对位设备以及采用该焊接设备进行焊接的方法
CN117715405B (zh) * 2024-02-01 2024-05-24 赛晶亚太半导体科技(浙江)有限公司 一种叠层结构贴片方法及叠层结构贴片系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013114478A1 (ja) * 2012-02-02 2013-08-08 パナソニック株式会社 下受けピンの配置方法および下受けピンの返戻方法
TW201350835A (zh) * 2012-04-17 2013-12-16 Omron Tateisi Electronics Co 焊料之沾附狀態的檢查方法及使用該方法之自動外觀檢查裝置、和基板檢查系統

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3006964B2 (ja) 1992-10-07 2000-02-07 山形カシオ株式会社 バックアップピン自動入替装置
JPH0758423A (ja) * 1993-08-19 1995-03-03 Sony Corp バックアップピン受け部を設けたプリント基板
JP4540838B2 (ja) 2000-12-12 2010-09-08 パナソニック株式会社 回路基板固定方法
JP2003204198A (ja) 2002-01-04 2003-07-18 Hitachi Communication Technologies Ltd プリント回路板のバックアップピン自動配置装置
US7543259B2 (en) 2003-05-16 2009-06-02 Fuji Machine Mfg. Co., Ltd. Method and device for deciding support portion position in a backup device
JP4349091B2 (ja) 2003-11-12 2009-10-21 パナソニック株式会社 プリント基板支持装置及びプリント基板支持方法
JP4051568B2 (ja) * 2004-02-09 2008-02-27 ソニー株式会社 部品実装基板検査装置
JP3960346B2 (ja) * 2004-12-27 2007-08-15 オムロン株式会社 画像処理方法、基板検査方法、基板検査装置、および基板検査用の検査データ作成方法
JP2007311711A (ja) * 2006-05-22 2007-11-29 Anritsu Corp 基板バックアップ装置、該装置を備えた印刷半田検査装置及び方法
JP4841460B2 (ja) * 2007-02-27 2011-12-21 ヤマハ発動機株式会社 バックアップピン配設位置決定装置、バックアップユニット形成装置、及び基板処理装置
JP5723221B2 (ja) * 2011-05-31 2015-05-27 ヤマハ発動機株式会社 スクリーン印刷装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013114478A1 (ja) * 2012-02-02 2013-08-08 パナソニック株式会社 下受けピンの配置方法および下受けピンの返戻方法
TW201350835A (zh) * 2012-04-17 2013-12-16 Omron Tateisi Electronics Co 焊料之沾附狀態的檢查方法及使用該方法之自動外觀檢查裝置、和基板檢查系統

Also Published As

Publication number Publication date
TWI595814B (zh) 2017-08-11
JP2015153935A (ja) 2015-08-24
US9511455B2 (en) 2016-12-06
TW201543974A (zh) 2015-11-16
TWI626866B (zh) 2018-06-11
TW201737788A (zh) 2017-10-16
CN104853581A (zh) 2015-08-19
DE102015202610B4 (de) 2023-10-26
JP5911899B2 (ja) 2016-04-27
US20150231744A1 (en) 2015-08-20
DE102015202610A1 (de) 2015-09-03

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