TWI621232B - Semiconductor device - Google Patents

Semiconductor device Download PDF

Info

Publication number
TWI621232B
TWI621232B TW106104226A TW106104226A TWI621232B TW I621232 B TWI621232 B TW I621232B TW 106104226 A TW106104226 A TW 106104226A TW 106104226 A TW106104226 A TW 106104226A TW I621232 B TWI621232 B TW I621232B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
bonding
semiconductor device
substrate
semiconductor
Prior art date
Application number
TW106104226A
Other languages
English (en)
Chinese (zh)
Other versions
TW201803063A (zh
Inventor
Naoki Iwamasa
Original Assignee
Toshiba Memory Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Memory Corp filed Critical Toshiba Memory Corp
Publication of TW201803063A publication Critical patent/TW201803063A/zh
Application granted granted Critical
Publication of TWI621232B publication Critical patent/TWI621232B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H01L2224/48147—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
TW106104226A 2016-03-15 2017-02-09 Semiconductor device TWI621232B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016051543A JP6586036B2 (ja) 2016-03-15 2016-03-15 半導体装置の製造方法
JP??2016-051543 2016-03-15

Publications (2)

Publication Number Publication Date
TW201803063A TW201803063A (zh) 2018-01-16
TWI621232B true TWI621232B (zh) 2018-04-11

Family

ID=59870854

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104226A TWI621232B (zh) 2016-03-15 2017-02-09 Semiconductor device

Country Status (3)

Country Link
JP (1) JP6586036B2 (ja)
CN (1) CN107195589B (ja)
TW (1) TWI621232B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7042713B2 (ja) 2018-07-12 2022-03-28 キオクシア株式会社 半導体装置
JP2020021908A (ja) 2018-08-03 2020-02-06 キオクシア株式会社 半導体装置およびその製造方法
JP2020038902A (ja) * 2018-09-04 2020-03-12 キオクシア株式会社 半導体装置
TWI665770B (zh) * 2018-12-13 2019-07-11 力成科技股份有限公司 半導體封裝結構及其製法
JP2020155559A (ja) 2019-03-19 2020-09-24 キオクシア株式会社 半導体装置
JP2022097769A (ja) * 2019-04-25 2022-07-01 昭和電工マテリアルズ株式会社 ドルメン構造を有する半導体装置の製造方法及び支持片の製造方法
JPWO2020218530A1 (ja) * 2019-04-25 2020-10-29
JP2021015922A (ja) * 2019-07-16 2021-02-12 キオクシア株式会社 半導体装置およびその製造方法
JP2021044362A (ja) * 2019-09-10 2021-03-18 キオクシア株式会社 半導体装置
JP2022113250A (ja) 2021-01-25 2022-08-04 キオクシア株式会社 半導体装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW525193B (en) * 2000-07-13 2003-03-21 Mitsui Takeda Chemicals Inc Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same
TW200746406A (en) * 2006-04-11 2007-12-16 Sharp Kk Module for optical apparatus and method of producing module for optical apparatus
TW200832661A (en) * 2003-03-31 2008-08-01 Sanyo Electric Co Semiconductor module and method for making same
TW201201327A (en) * 2010-02-15 2012-01-01 Toshiba Kk Semiconductor storage device and manufacturing method thereof
TW201214778A (en) * 2010-09-16 2012-04-01 Hitachi Cable Substrate for installing semiconductor light emitting component and semiconductor light emitting device using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222889A (ja) * 2001-01-24 2002-08-09 Nec Kyushu Ltd 半導体装置及びその製造方法
JP2015176906A (ja) * 2014-03-13 2015-10-05 株式会社東芝 半導体装置および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW525193B (en) * 2000-07-13 2003-03-21 Mitsui Takeda Chemicals Inc Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the same
TW200832661A (en) * 2003-03-31 2008-08-01 Sanyo Electric Co Semiconductor module and method for making same
TW200746406A (en) * 2006-04-11 2007-12-16 Sharp Kk Module for optical apparatus and method of producing module for optical apparatus
TW201201327A (en) * 2010-02-15 2012-01-01 Toshiba Kk Semiconductor storage device and manufacturing method thereof
TW201214778A (en) * 2010-09-16 2012-04-01 Hitachi Cable Substrate for installing semiconductor light emitting component and semiconductor light emitting device using the same

Also Published As

Publication number Publication date
TW201803063A (zh) 2018-01-16
CN107195589B (zh) 2021-03-16
JP6586036B2 (ja) 2019-10-02
JP2017168586A (ja) 2017-09-21
CN107195589A (zh) 2017-09-22

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