TWI620350B - 發光裝置及其製造方法 - Google Patents

發光裝置及其製造方法 Download PDF

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TWI620350B
TWI620350B TW105122937A TW105122937A TWI620350B TW I620350 B TWI620350 B TW I620350B TW 105122937 A TW105122937 A TW 105122937A TW 105122937 A TW105122937 A TW 105122937A TW I620350 B TWI620350 B TW I620350B
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莫慶偉
迪克 保羅 喬瑟夫 凡德哈吉恩
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皇家飛利浦電子股份有限公司
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Abstract

一種低成本傳導載體元件提供對一發光裝置(LED)晶粒之結構性支撐以及至該LED晶粒之電及熱耦合。提供一種包含至少一個載體元件之引線框架，該載體元件經分割以形成該LED晶粒附著至的可區分傳導區域。當自該框架分離該載體元件時，該等傳導區域彼此電隔離。一電介質可放置於該載體元件之該等傳導區域之間。

Description

發光裝置及其製造方法
本發明係關於積體電路(IC)製作及組裝領域，且特定而言係關於發光裝置(LED)之製作。
隨著半導體發光裝置(LED)之發光能力不斷改良，其在習用照明應用中之使用不斷增加，以一成本效率方式提供可靠之持久產品之競爭壓力亦不斷增加。儘管LED產品之成本相對較低，但即使每裝置節省幾美分亦可對利潤邊際具有一重大影響，此歸因於此等裝置之日益成長之市場。
在減小提供發光裝置之個別晶粒之大小藉此減小材料成本中已不斷取得進步，但搬運考量需要將該晶粒安裝於一較大基板上。亦即，舉例而言，儘管半導體製造商具有可拾取並放置可小至1毫米×1毫米之個別晶粒且提供至每一晶粒上之接觸件之連接的設備，但習慣上用於印刷電路製造之設備並不適於放置或連接此等晶粒。以相似方式，發光裝置通常係插入式可替換物項，且需要足夠大以由人手抓握。
圖1A至圖1B圖解說明用於安裝一LED晶粒110之一實例性基板150。基板150通常係一陶瓷，諸如硝酸鋁(AlN)或氧化鋁(Al2O3)，且一晶粒110與基板150之組合通常稱為一陶瓷上裝置(DoC)。
圖1之實例性LED晶粒110圖解說明四個發光元件116之使用。接觸件112使得能夠將該等發光元件耦合至一外部電力源。在此實例中，壓力夾122將晶粒110固持至基板150，以及提供至接觸件112之電耦合。壓力夾之使用促進晶粒110之替換。
墊120提供將基板安裝式LED裝置附著至一外部電力源，且可用作(舉例而言)用於將該裝置接合至一印刷電路板或類似結構之接合墊。接合墊120提供與接觸件112相同之功能，但如上文所提及，接合墊120明顯更大以促進共同印刷電路板製造設備及技術。
基板150亦充當用於耗散發光元件116所產生之熱之一散熱片。
圖1C圖解說明一替代配置，其中LED晶粒110經由焊料元件122焊接至基板150上之墊120。在此實例性實施例中，晶粒110中之一或多個通孔115或者其他內部路由提供至發光元件116之耦合。在圖1C之實例中，亦提供上部接觸件112以使得LED晶粒可用於圖1B或圖1C之組態中。
圖1C之實例亦圖解說明LED晶粒焊接至的一散熱片墊130之使用。此配置通常將提供LED晶粒110與基板150之間的一經改良熱耦合，但一般在晶粒110之下表面上需要一對應可焊接熱傳遞接觸件118。
儘管將導電跡線放置於陶瓷(諸如，墊120、130)上係一成熟技術，但存在涉及製作具有此等墊120、130之陶瓷基板之一成本問題以及自該基板分離墊120、130之某種風險，此歸因於通常用以提供此等墊之金屬之熱係數與該陶瓷基板之熱係數之間的不匹配。
提供一種較低成本發光產品將係有利的。提供一種具有潛在較高可靠性及/或較長操作壽命之發光產品亦將係有利的。提供一種製作此等發光產品之成本效率方法亦將係有利的。
此等優點及其他優點可藉由使用提供對LED晶粒之結構性支撐以及至LED晶粒之電及熱耦合之一低成本傳導載體元件之一製程而實現。提供一種包含至少一個載體元件之引線框架，該載體元件經分割以形成該LED晶粒附著至的可區分傳導區域。當自該框架分離該載體元件時，該等傳導區域彼此電隔離。一電介質可放置於該載體元件之該等傳導區域之間。
110‧‧‧發光裝置晶粒
112‧‧‧上部接觸件
115‧‧‧通孔
116‧‧‧發光元件
118‧‧‧可焊接熱傳遞接觸件
120‧‧‧接合墊
122‧‧‧壓力夾/焊料元件
130‧‧‧散熱片墊
150‧‧‧基板
200‧‧‧發光裝置
210‧‧‧傳導載體結構/傳導區域/電導體
220‧‧‧傳導載體結構/傳導區域/熱傳遞導體
350‧‧‧引線框架
355‧‧‧狹縫/開口
357‧‧‧連接片
550‧‧‧框架
650‧‧‧框架
660‧‧‧鋸口
700‧‧‧裝置
710‧‧‧接針形部分
715‧‧‧電介質
在附圖中：圖1A至圖1C圖解說明兩個習用陶瓷上晶粒(DoC)配置。
圖2A至圖2B圖解說明一實例性傳導載體上晶粒配置。
圖3圖解說明包含包括三個可區分傳導區域之一載體結構的一實例性引線框架。
圖4圖解說明用於提供基於載體之發光裝置之一實例性流程圖。
圖5圖解說明包含多個載體結構之一實例性引線框架。
圖6圖解說明包含多個載體結構之另一實例性引線框架。
圖7A至圖7C圖解說明實例性載體結構。
參考附圖進一步詳細地且以實例方式解釋本發明。
在以下說明中，出於解釋而非限制目的陳述特定細節(諸如，特定架構、界面、技術等)以提供對本發明概念之一透徹理解。然而，熟習此項技術者將顯而易見，可在背離此等特定細節之其他實施例中實踐本發明。以相似方式，本說明之正文係針對如各圖中所圖解說明之實例性實施例，且並非意欲限制所主張之發明超出申請專利範圍中明確包含的限制。出於簡單及清晰目的，省略對眾所周知之裝置、電路及方法之詳細說明以使對本發明之說明不會因不必要細節而模糊。
並且在以下說明中，參考通常所使用之材料及製程以促進對本 文中所呈現之原理之較好及/或較容易理解，但熟習此項技術者將認識到，本發明之原理並不限於此等參考。
圖2A至圖2B圖解說明一實例性傳導載體上晶粒配置。在此實例中，LED晶粒110安裝於提供對晶粒110之結構性支撐以及至晶粒110之電及熱耦合兩者之一傳導載體結構210-220上。此實例中之載體結構包含兩個電導體210及一熱傳遞導體220。
在此實例性實施例中，可使用習用SMD(表面安裝裝置)焊料回流技術來將LED晶粒110焊接至導體210以及導體220。由於導體210係導電的，因此可使用此等導體210之任何可接達側或邊緣來達成自一外部源至LED晶粒110之電耦合。以相似方式，可使用導體220之任何可接達側或邊緣來達成熱耦合。
圖3圖解說明包含包括三個可區分傳導區域(對應於圖2A至圖2B中之導體210、220)之一載體結構的一實例性引線框架350。亦即，引線框架350包含呈界定用於耦合至LED晶粒110之導體210、220之既定形狀及放置之一圖案之狹縫或開口355。開口355之間的連接片357使導體210、220保持附著至整體框架結構。舉例而言，引線框架350可係一銅片，其足夠厚(例如，大於0.75毫米、較佳係1.5毫米，端視大小而定)以為圖2之發光裝置200提供主要結構性支撐，但亦可使用其他導電材料。
為了清晰起見，本文中使用術語「區域」來指代框架上最終將成為用於基於載體之發光裝置(諸如，圖2A中之裝置200)之既定導體的區。由於此等區域及最終導體係相同元件，因此在參考框架上之區域或裝置上之導體時將使用相同元件符號210、220。以相似方式，由於此等導體210、220之組合形成整體載體結構，因此該組合將稱為載體結構210-220。
參考圖4之流程圖最佳地理解此引線框架350之使用。在此實例 中，使用實例性引線框架350及LED晶粒110之元件符號來闡述圖4，但熟習此項技術者將認識到，該流程並不限於此特定實例。
在410處，提供具有載體結構210-220之引線框架350。在420處，將LED晶粒110放置於載體結構210-220上。通常，在每一載體結構210-220上放置一個LED晶粒110，但亦可在一單個載體結構上安裝多個LED晶粒。
在430處，通常使用SMD焊料回流技術來將LED晶粒110附著至載體結構210-220之對應傳導區域210、220，但亦可使用其他方式來將LED晶粒110耦合至此等區域210、220。舉例而言，若該LED晶粒不包含通孔115或經由其底表面耦合之其他構件，則可使用習用線接合技術來將該晶粒上之接觸件112線接合至區域210。
在某些實施例中，LED晶粒110本身可不依靠機械接觸而附著至區域220，或許可添加有熱傳遞膏或化合物以確保LED晶粒110與區域220之間的一高效熱耦合。以相似方式，在某些實施例中，引線框架350可至少在至LED晶粒110之接觸點處鍍覆有金以確保LED晶粒110與區域210之間的一可靠電耦合。
在440處，通常藉由鋸斷將載體結構210-220連接至框架350之剩餘部分之連接片357而自框架350分離載體結構210-220(具有所附著之LED晶粒110)，藉此產生圖2A至圖2B之發光裝置200。
儘管將實例性框架350圖解說明為形成一個載體結構210-220，但熟習此項技術者將認識到，亦可在一單個框架上提供多個載體結構，如圖5及圖6之實例性框架550、650中所圖解說明。
實例性框架550包含圖3之實例性框架350之一複製。在此實例中，在框架550中提供十六個載體結構210-220，每一載體結構210-220具有一所附著之LED晶粒110。
實例性框架650經設計以在自該框架移除具有所附著之LED晶粒 110之載體結構210-220時最小化浪費之材料。實例性框架650包括多個I型開口355之一第一列、多個I型開口355之一第二列及位於該第一與第二列之間且不具有任何開口之一第三列，其中I型開口355之每一者具有一上緣(頂部水平部分)、一下緣(底部水平部分)及連接該等緣之一腹(web，垂直部分)。在此實例中，載體結構210-220係交替地定位以減小框架650中所需要之開口355之數目，且使區域210、220保持附著至框架650之連接片357係沿將在自框架650分離載體結構210-220時產生之鋸口660定位。在此實例中，將產生十六個發光裝置(圖2中之200)，但框架650之大小明顯小於圖5中之框架550之大小。
圖7A至圖7C圖解說明實例性載體結構。在此等實例中，相對於晶粒110，載體結構210-220之大小約與圖1中之基板150之大小相同。為了減小此等較大結構210-220所導致之晶粒110上之潛在應力，用一介電材料來填充導體210、220之間的空間。以此方式，結構210-220實質上係自支撐的且在晶粒110上施加最小應力。
可在將LED晶粒110附著至載體結構210-220之前或之後且在自框架分離載體結構210-220之前或之後或者兩者之一組合之前或之後添加該電介質。舉例而言，在圖7B中，導體210係以電介質715而隔離，且因此必須在自該框架分離導體210之後已添加電介質715之至少一部分(在連接片已將導體210固持至該框架之位置處)。然而，可在將LED晶粒110附著至導體210、220之前填充此等導體之間的空間。
圖7C圖解說明導體210可提供額外功能之事實。在此實例中，導體210包含促進將裝置700插入至一對應插座(諸如，一印刷電路板中之孔)中之接針形部分710或允許替換裝置700之一插頭。
以上僅圖解說明瞭本發明之原理。因此，將瞭解，熟習此項技術者將能夠設想出各種配置，儘管未在本文中明確闡述或展示該等配置，但其體現本發明之原理且因此屬於以下申請專利範圍之精神及範疇內。
在解釋此等申請專利範圍時，應理解：a)詞語「包括」並不排除一給定請求項中所列示之彼等元件或 動作之外的其它元件或動作之存在；b)一元件之前的詞語「一(a)」或「一(an)」並不排除複數個此等元件之存在；c)該等申請專利範圍中之任何參考符號並不限制其範疇；d)數個「構件」可由同一物項或者以硬體或軟體實施之結構或功能表示；e)所揭示元件中之每一者可由若干硬體部分(例如，包含離散電子電路及積體電子電路)、軟體部分(例如，電腦程式化)及其任何組合組成；f)硬體部分可包含一處理器，且軟體部分可儲存於一非暫時性電腦可讀媒體上且可經組態以致使該處理器執行所揭示元件中之一或多者之功能中的某些或全部功能；g)硬體部分可由類比及數位部分中之一者或兩者組成；h)除非另外具體說明，否則所揭示裝置或其部分中之任一者可組合在一起或被分離成其他部分；i)除非具體指示，否則並不意欲需要任何特定動作序列；及j)術語「複數個」元件包含兩個或兩個以上所主張元件，且並不暗示任何特定元件數目範圍；亦即，複數個元件可少至兩個元件且可包含不可計量數目的元件。

Claims (4)

  1. 一種製造一發光裝置(LED)之方法，該方法包括：提供一引線框架，該引線框架定義多個I型開口之一第一列(first row of I-shaped openings)、多個I型開口之一第二列及位於該第一與第二列之間且不具有任何開口之一第三列；定位多個LED晶粒於該第一與第二列上，其中各LED晶粒均位於一下接面(lower junction)或一上接面(upper junction)上方，該下接面或該上接面包含一相對應之I型開口的一下緣(lower flange)或一上緣(upper flange)及一腹(web)；及藉由以下步驟而自該引線框架分離(singulating)多個載體元件：沿著多個垂直鋸口(vertical kerfs)進行切割，該等垂直鋸口在各列中相鄰的I型開口之間通過連接片(tab)部分；及沿著多個水平鋸口進行切割，該等水平鋸口通過該第一、第二及第三列，其中各載體元件包含在藉由該切割所形成的三個分離區域上之一LED晶粒以及一相對應之上或下接面。
  2. 如請求項1之方法，其中該三個分離區域包含：一陽極區域、一陰極區域及一熱傳遞區域。
  3. 一種引線框架，其包括：多個I型開口之一第一列；多個I型開口之一第二列；位於該第一與第二列之間且不具有任何開口之一第三列，其中各I型開口包含一上緣、一下緣及一腹，該腹連結該上緣與該下緣；多個垂直鋸口，其在各列中相鄰的I型開口之間通過連接片部分；及多個水平鋸口，其通過該第一、第二及第三列。
  4. 如請求項3之引線框架，其中兩個垂直鋸口及一I型開口定義：一陽極區域、一陰極區域及一熱傳遞區域。
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