RU2016133432A - Островковый держатель для светоизлучающего устройства - Google Patents

Островковый держатель для светоизлучающего устройства Download PDF

Info

Publication number
RU2016133432A
RU2016133432A RU2016133432A RU2016133432A RU2016133432A RU 2016133432 A RU2016133432 A RU 2016133432A RU 2016133432 A RU2016133432 A RU 2016133432A RU 2016133432 A RU2016133432 A RU 2016133432A RU 2016133432 A RU2016133432 A RU 2016133432A
Authority
RU
Russia
Prior art keywords
row
windows
shaped
rows
output frame
Prior art date
Application number
RU2016133432A
Other languages
English (en)
Other versions
RU2721101C2 (ru
RU2016133432A3 (ru
Inventor
Цинвэй МО
Дирк Пауль Джозеф ВАНДЕРХАГЕН
Original Assignee
Люмиледс Холдинг Б.В.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Люмиледс Холдинг Б.В. filed Critical Люмиледс Холдинг Б.В.
Publication of RU2016133432A publication Critical patent/RU2016133432A/ru
Publication of RU2016133432A3 publication Critical patent/RU2016133432A3/ru
Application granted granted Critical
Publication of RU2721101C2 publication Critical patent/RU2721101C2/ru

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Claims (14)

1. Способ, содержащий этапы, на которых
обеспечивают выводную рамку, задающую первый ряд I-образных окон, второй ряд I-образных окон и третий ряд без каких-либо окон между упомянутым первым и упомянутым вторым рядами;
размещают кристаллы СИД на упомянутом первом и упомянутом втором ряду, причем каждый кристалл СИД помещают над нижним или верхним разветвлением, содержащим нижний или верхний выступ, и перемычкой соответствующего I-образного окна; и
отделяют несущие элементы от выводной рамки посредством:
резки вдоль вертикальных пропилов, которые проходят через упомянутый первый и упомянутый второй ряды между соседними I-образными окнами в каждом ряду, и
резки вдоль горизонтальных пропилов, которые проходят через упомянутый первый, упомянутый второй и упомянутый третий ряд, причем каждый несущий элемент содержит кристалл СИД на трех отделенный областях, образованных упомянутой резкой и соответствующим нижним или верхним разветвлением.
2. Способ по п. 1, в котором три отделенные области содержат анодную область, катодную область и теплопередающую область.
3. Выводная рамка, задающая
первый ряд I-образных окон;
второй ряд I-образных окон;
третий ряд без каких-либо окон между упомянутым первым и упомянутым вторым рядами, причем каждое I-образное окно содержит верхний выступ, нижний выступ и перемычку, соединяющую верхний и нижний выступ;
вертикальные пропилы через упомянутый первый и упомянутый второй ряды между соседними I-образными окнами в каждом ряду; и
горизонтальные пропилы через упомянутый первый, упомянутый второй и упомянутый третий ряд.
4. Выводная рамка по п. 3, в которой два вертикальных пропила, горизонтальный пропил и I-образное окно задают анодную область, катодную область и теплопередающую область.
RU2016133432A 2010-11-19 2011-11-14 Островковый держатель для светоизлучающего устройства RU2721101C2 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41539510P 2010-11-19 2010-11-19
US61/415,395 2010-11-19

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
RU2013127670/28A Division RU2597674C2 (ru) 2010-11-19 2011-11-14 Островковый держатель для светоизлучающего устройства

Publications (3)

Publication Number Publication Date
RU2016133432A true RU2016133432A (ru) 2018-12-10
RU2016133432A3 RU2016133432A3 (ru) 2019-12-05
RU2721101C2 RU2721101C2 (ru) 2020-05-15

Family

ID=45496212

Family Applications (2)

Application Number Title Priority Date Filing Date
RU2016133432A RU2721101C2 (ru) 2010-11-19 2011-11-14 Островковый держатель для светоизлучающего устройства
RU2013127670/28A RU2597674C2 (ru) 2010-11-19 2011-11-14 Островковый держатель для светоизлучающего устройства

Family Applications After (1)

Application Number Title Priority Date Filing Date
RU2013127670/28A RU2597674C2 (ru) 2010-11-19 2011-11-14 Островковый держатель для светоизлучающего устройства

Country Status (8)

Country Link
US (2) US9172018B2 (ru)
EP (1) EP2641279B1 (ru)
JP (2) JP6297838B2 (ru)
CN (1) CN103201863B (ru)
BR (1) BR112013012333A2 (ru)
RU (2) RU2721101C2 (ru)
TW (3) TWI620350B (ru)
WO (1) WO2012066461A1 (ru)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2641279B1 (en) * 2010-11-19 2017-09-27 Koninklijke Philips N.V. Islanded carrier for light emitting device
US10043960B2 (en) * 2011-11-15 2018-08-07 Cree, Inc. Light emitting diode (LED) packages and related methods
KR101661140B1 (ko) * 2015-06-25 2016-09-29 (주)포인트엔지니어링 금속 및 비금속 접합 기판
US11677059B2 (en) 2017-04-26 2023-06-13 Samsung Electronics Co., Ltd. Light-emitting device package including a lead frame
KR102335216B1 (ko) 2017-04-26 2021-12-03 삼성전자 주식회사 발광소자 패키지

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393177A (ja) * 1986-10-07 1988-04-23 Nec Corp 発光ダイオ−ド
JPH05129661A (ja) * 1991-10-31 1993-05-25 Iwasaki Electric Co Ltd 発光ダイオードランプ
JPH07117628B2 (ja) * 1992-07-23 1995-12-18 山一電機株式会社 光電気変換器
JP4023698B2 (ja) * 1996-11-15 2007-12-19 シチズン電子株式会社 下面電極付き側面使用電子部品の製造方法
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package
JP3217322B2 (ja) * 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
US6373078B1 (en) * 1999-09-28 2002-04-16 International Rectifier Corp. Microelectronic relay with upset and downset lead frames
RU2197680C1 (ru) * 2001-09-19 2003-01-27 Открытое акционерное общество "АВТОВАЗ" Светотехнический блок
US20030057421A1 (en) * 2001-09-27 2003-03-27 Tzer-Perng Chen High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate
JP2003309293A (ja) * 2002-04-17 2003-10-31 Sony Corp 半導体発光素子パッケージ、表示装置、発光素子の除去方法及び発光素子の検査方法
DE10237084A1 (de) * 2002-08-05 2004-02-19 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements
JP3910171B2 (ja) 2003-02-18 2007-04-25 シャープ株式会社 半導体発光装置、その製造方法および電子撮像装置
RU2267188C2 (ru) * 2003-06-23 2005-12-27 Федорова Галина Владимировна Светодиодное полупроводниковое устройство в корпусе для поверхностного монтажа
JP4114557B2 (ja) * 2003-06-25 2008-07-09 松下電工株式会社 発光装置
US6972438B2 (en) * 2003-09-30 2005-12-06 Cree, Inc. Light emitting diode with porous SiC substrate and method for fabricating
KR20050092300A (ko) * 2004-03-15 2005-09-21 삼성전기주식회사 고출력 발광 다이오드 패키지
JP2005302944A (ja) * 2004-04-09 2005-10-27 Tabuchi Electric Co Ltd 発光装置
DE102004029941B3 (de) * 2004-06-21 2005-12-15 Infineon Technologies Ag System zur Auswertung eines Sensorsignals
US7476913B2 (en) 2004-08-10 2009-01-13 Renesas Technology Corp. Light emitting device having a mirror portion
RU2355068C1 (ru) * 2004-12-16 2009-05-10 Сеул Семикондактор Ко., Лтд. Рамка с выводами, имеющая поддерживающее теплоотвод кольцо, способ изготовления корпуса светоизлучающего диода с ее использованием и корпус светоизлучающего диода, изготовленный этим способом
WO2006065007A1 (en) 2004-12-16 2006-06-22 Seoul Semiconductor Co., Ltd. Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method
JPWO2006095834A1 (ja) * 2005-03-09 2008-08-21 旭化成エレクトロニクス株式会社 光デバイス及び光デバイスの製造方法
JP2006261519A (ja) * 2005-03-18 2006-09-28 Sharp Corp 半導体装置及びその製造方法
WO2007018098A1 (ja) * 2005-08-05 2007-02-15 Olympus Medical Systems Corp. 発光ユニット
JP2007073575A (ja) * 2005-09-05 2007-03-22 Matsushita Electric Ind Co Ltd 半導体発光装置
KR101187943B1 (ko) * 2005-09-20 2012-10-05 르네사스 일렉트로닉스 가부시키가이샤 Ｌｅｄ 광원 및 그 제조 방법
JP3117281U (ja) * 2005-09-30 2006-01-05 鼎元光電科技股▲ふん▼有限公司 効率の高いマトリックス発光ダイオード素子
JP2007109911A (ja) * 2005-10-14 2007-04-26 Renesas Technology Corp 発光ダイオードおよびその製造方法
JP2007134376A (ja) * 2005-11-08 2007-05-31 Akita Denshi Systems:Kk 発光ダイオード装置及びその製造方法
US20070228386A1 (en) * 2006-03-30 2007-10-04 Jin-Shown Shie Wire-bonding free packaging structure of light emitted diode
CA2648321A1 (en) 2006-03-31 2007-11-15 Hendrickson International Corporation Movable subframe for tractor-trailers
JP5057707B2 (ja) * 2006-06-16 2012-10-24 日亜化学工業株式会社 発光装置
WO2008047933A1 (en) * 2006-10-17 2008-04-24 C.I.Kasei Company, Limited Package assembly for upper/lower electrode light-emitting diodes and light-emitting device manufacturing method using same
JP2008103401A (ja) * 2006-10-17 2008-05-01 C I Kasei Co Ltd 上下電極型発光ダイオード用パッケージおよび上下電極型発光ダイオード用パッケージの製造方法
JP2008258567A (ja) * 2006-11-08 2008-10-23 C I Kasei Co Ltd 発光装置および発光装置の製造方法
US7999277B2 (en) * 2006-11-08 2011-08-16 C. I. Kasei Company, Limited Light emitting device and production method of same
DE102007036226A1 (de) 2007-08-02 2009-02-05 Perkinelmer Elcos Gmbh Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur
US7652301B2 (en) * 2007-08-16 2010-01-26 Philips Lumileds Lighting Company, Llc Optical element coupled to low profile side emitting LED
JPWO2009051178A1 (ja) * 2007-10-19 2011-03-03 日本タングステン株式会社 Ｌｅｄパッケージ基板およびそれを用いたｌｅｄパッケージ
JP4758976B2 (ja) * 2007-12-03 2011-08-31 日立ケーブルプレシジョン株式会社 半導体発光素子搭載用リードフレーム及びその製造方法並びに発光装置
KR100981214B1 (ko) * 2008-01-28 2010-09-10 알티전자 주식회사 발광다이오드 패키지
JP2009224376A (ja) * 2008-03-13 2009-10-01 Toshiba Discrete Technology Kk 側面型発光装置及びその製造方法
CN101533819B (zh) * 2008-03-14 2013-01-16 旭丽电子(广州)有限公司 半导体封装构造、应用于半导体封装构造的导线架及导电件
US8080827B2 (en) * 2008-07-31 2011-12-20 Bridgelux, Inc. Top contact LED thermal management
JPWO2010035788A1 (ja) * 2008-09-25 2012-02-23 電気化学工業株式会社 発光素子搭載用基板及びその製造方法
US8288785B2 (en) * 2008-12-03 2012-10-16 Seoul Semiconductor Co., Ltd. Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode
JP5368809B2 (ja) * 2009-01-19 2013-12-18 ローム株式会社 Ｌｅｄモジュールの製造方法およびｌｅｄモジュール
JP2010177329A (ja) * 2009-01-28 2010-08-12 Sharp Corp 樹脂複合リードフレームとその製造方法、及びその実装体
JP2010238833A (ja) * 2009-03-31 2010-10-21 Panasonic Corp 光半導体装置用パッケージおよび光半導体装置
DE102009015963A1 (de) 2009-04-02 2010-10-07 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
KR101673913B1 (ko) * 2009-07-20 2016-11-08 삼성전자 주식회사 발광 패키지 및 그 제조 방법
CN102024882A (zh) * 2009-09-14 2011-04-20 展晶科技(深圳)有限公司 发光二极管装置及其制造方法
US8502257B2 (en) * 2009-11-05 2013-08-06 Visera Technologies Company Limited Light-emitting diode package
EP2641279B1 (en) * 2010-11-19 2017-09-27 Koninklijke Philips N.V. Islanded carrier for light emitting device

Also Published As

Publication number Publication date
EP2641279A1 (en) 2013-09-25
TWI620350B (zh) 2018-04-01
RU2721101C2 (ru) 2020-05-15
JP2013543277A (ja) 2013-11-28
CN103201863A (zh) 2013-07-10
WO2012066461A1 (en) 2012-05-24
TW201639197A (zh) 2016-11-01
US9997686B2 (en) 2018-06-12
EP2641279B1 (en) 2017-09-27
JP2018022930A (ja) 2018-02-08
TW201242101A (en) 2012-10-16
RU2016133432A3 (ru) 2019-12-05
RU2013127670A (ru) 2014-12-27
TWI689113B (zh) 2020-03-21
TW201813136A (zh) 2018-04-01
BR112013012333A2 (pt) 2019-03-06
US9172018B2 (en) 2015-10-27
CN103201863B (zh) 2016-04-13
JP6297838B2 (ja) 2018-03-20
RU2597674C2 (ru) 2016-09-20
JP6738785B2 (ja) 2020-08-12
US20130221386A1 (en) 2013-08-29
US20160043295A1 (en) 2016-02-11

Similar Documents

Publication Publication Date Title
RU2016133432A (ru) Островковый держатель для светоизлучающего устройства
EP2960946A3 (en) Solar cell module
WO2013032605A3 (en) Optoelectronic device package, array and method of fabrication
AR079046A1 (es) Sistema de cultivo vegetal flotante y bandeja de flotacion para usar con el sistema
WO2012175631A3 (de) Verfahren zum herstellen einer mehrzahl von optoelektronischen halbleiterbauelementen im verbund, derart hergestelltes halbleiterbauelement und dessen verwendung
WO2010128462A3 (en) Solar panel structure and corresponding solar panel
MY196784A (en) Growth device for crop, use of such a device, and a series of growth devices
BR112014013918A8 (pt) método para formar um módulo fotovoltaico, método para formar células fotovoltaicas e célula fotovoltaica
WO2012108627A3 (en) Light emitting diode having photonic crystal structure and method of fabricating the same
AR091248A1 (es) Tanque estanco y termicamente aislante
EA201790166A1 (ru) Способ выращивания растений с использованием несущего элемента с расположенной на нем съемной боковой опорной конструкцией
WO2012169845A3 (ko) 태양전지 기판과 그 제조방법 및 이를 이용한 태양전지
TR201905021T4 (tr) Skualen içeren bir suda yağ emülsiyonunun üretimi.
WO2014144698A3 (en) Large-area, laterally-grown epitaxial semiconductor layers
ES2572092T3 (es) Instalación de tratamiento de agua por UV con canal abierto
CO2018003181A2 (es) Portador de celda de propagación de planta
DE102005054365A1 (de) Abdeckung von Solarzellen
FR2959599B1 (fr) Dispositif et procede de texturation mecanique d'une plaquette de silicium destinee a constituer une cellule photovoltaique, plaquette de silicium obtenue
EP2688112A3 (en) Resin substrate solar cell module
FR3024283B1 (fr) Module photovoltaique comprenant une pluralite de cellules bifaciales et procede de fabrication d'un tel module
WO2011095560A3 (de) Verfahren und vorrichtung zur wärmebehandlung des scheibenförmigen grundmaterials einer solarzelle
ES2545408T3 (es) Estructura autoportante para el soporte de lamas para fachadas de edificios
MY168446A (en) Method for separating and purifying 1, 4-diaminobutane from fermented solution
WO2011091903A3 (de) Lumineszenz-konzentrator-modul mit erneuerbarer aktiver schicht
FR3037441B1 (fr) Module photovoltaique et procede d'interconnexion de cellules photovoltaiques pour fabriquer un tel module