RU2016133432A3 - - Google Patents
Download PDFInfo
- Publication number
- RU2016133432A3 RU2016133432A3 RU2016133432A RU2016133432A RU2016133432A3 RU 2016133432 A3 RU2016133432 A3 RU 2016133432A3 RU 2016133432 A RU2016133432 A RU 2016133432A RU 2016133432 A RU2016133432 A RU 2016133432A RU 2016133432 A3 RU2016133432 A3 RU 2016133432A3
- Authority
- RU
- Russia
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US41539510P | 2010-11-19 | 2010-11-19 | |
| US61/415,395 | 2010-11-19 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2013127670/28A Division RU2597674C2 (ru) | 2010-11-19 | 2011-11-14 | Островковый держатель для светоизлучающего устройства |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| RU2016133432A RU2016133432A (ru) | 2018-12-10 |
| RU2016133432A3 true RU2016133432A3 (ru) | 2019-12-05 |
| RU2721101C2 RU2721101C2 (ru) | 2020-05-15 |
Family
ID=45496212
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2013127670/28A RU2597674C2 (ru) | 2010-11-19 | 2011-11-14 | Островковый держатель для светоизлучающего устройства |
| RU2016133432A RU2721101C2 (ru) | 2010-11-19 | 2011-11-14 | Островковый держатель для светоизлучающего устройства |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2013127670/28A RU2597674C2 (ru) | 2010-11-19 | 2011-11-14 | Островковый держатель для светоизлучающего устройства |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US9172018B2 (ru) |
| EP (1) | EP2641279B1 (ru) |
| JP (2) | JP6297838B2 (ru) |
| CN (1) | CN103201863B (ru) |
| BR (1) | BR112013012333A2 (ru) |
| RU (2) | RU2597674C2 (ru) |
| TW (3) | TWI689113B (ru) |
| WO (1) | WO2012066461A1 (ru) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012066461A1 (en) * | 2010-11-19 | 2012-05-24 | Koninklijke Philips Electronics N.V. | Islanded carrier for light emitting device |
| US10043960B2 (en) * | 2011-11-15 | 2018-08-07 | Cree, Inc. | Light emitting diode (LED) packages and related methods |
| KR101661140B1 (ko) * | 2015-06-25 | 2016-09-29 | (주)포인트엔지니어링 | 금속 및 비금속 접합 기판 |
| KR102335216B1 (ko) | 2017-04-26 | 2021-12-03 | 삼성전자 주식회사 | 발광소자 패키지 |
| US11677059B2 (en) | 2017-04-26 | 2023-06-13 | Samsung Electronics Co., Ltd. | Light-emitting device package including a lead frame |
Family Cites Families (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393177A (ja) * | 1986-10-07 | 1988-04-23 | Nec Corp | 発光ダイオ−ド |
| JPH05129661A (ja) * | 1991-10-31 | 1993-05-25 | Iwasaki Electric Co Ltd | 発光ダイオードランプ |
| JPH07117628B2 (ja) * | 1992-07-23 | 1995-12-18 | 山一電機株式会社 | 光電気変換器 |
| JP4023698B2 (ja) * | 1996-11-15 | 2007-12-19 | シチズン電子株式会社 | 下面電極付き側面使用電子部品の製造方法 |
| US6335548B1 (en) * | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
| JP3217322B2 (ja) * | 1999-02-18 | 2001-10-09 | 日亜化学工業株式会社 | チップ部品型発光素子 |
| US6373078B1 (en) * | 1999-09-28 | 2002-04-16 | International Rectifier Corp. | Microelectronic relay with upset and downset lead frames |
| RU2197680C1 (ru) * | 2001-09-19 | 2003-01-27 | Открытое акционерное общество "АВТОВАЗ" | Светотехнический блок |
| US20030057421A1 (en) * | 2001-09-27 | 2003-03-27 | Tzer-Perng Chen | High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate |
| JP2003309293A (ja) * | 2002-04-17 | 2003-10-31 | Sony Corp | 半導体発光素子パッケージ、表示装置、発光素子の除去方法及び発光素子の検査方法 |
| DE10237084A1 (de) * | 2002-08-05 | 2004-02-19 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines elektrischen Leiterrahmens und Verfahren zum Herstellen eines oberflächenmontierbaren Halbleiterbauelements |
| JP3910171B2 (ja) | 2003-02-18 | 2007-04-25 | シャープ株式会社 | 半導体発光装置、その製造方法および電子撮像装置 |
| RU2267188C2 (ru) * | 2003-06-23 | 2005-12-27 | Федорова Галина Владимировна | Светодиодное полупроводниковое устройство в корпусе для поверхностного монтажа |
| JP4114557B2 (ja) * | 2003-06-25 | 2008-07-09 | 松下電工株式会社 | 発光装置 |
| US6972438B2 (en) * | 2003-09-30 | 2005-12-06 | Cree, Inc. | Light emitting diode with porous SiC substrate and method for fabricating |
| KR20050092300A (ko) * | 2004-03-15 | 2005-09-21 | 삼성전기주식회사 | 고출력 발광 다이오드 패키지 |
| JP2005302944A (ja) * | 2004-04-09 | 2005-10-27 | Tabuchi Electric Co Ltd | 発光装置 |
| DE102004029941B3 (de) * | 2004-06-21 | 2005-12-15 | Infineon Technologies Ag | System zur Auswertung eines Sensorsignals |
| JP4571139B2 (ja) * | 2004-08-10 | 2010-10-27 | ルネサスエレクトロニクス株式会社 | 発光装置および発光装置の製造方法 |
| WO2006065007A1 (en) * | 2004-12-16 | 2006-06-22 | Seoul Semiconductor Co., Ltd. | Leadframe having a heat sink supporting ring, fabricating method of a light emitting diodepackage using the same and light emitting diodepackage fabbricated by the method |
| RU2355068C1 (ru) * | 2004-12-16 | 2009-05-10 | Сеул Семикондактор Ко., Лтд. | Рамка с выводами, имеющая поддерживающее теплоотвод кольцо, способ изготовления корпуса светоизлучающего диода с ее использованием и корпус светоизлучающего диода, изготовленный этим способом |
| EP1858086B1 (en) * | 2005-03-09 | 2016-11-23 | Asahi Kasei EMD Corporation | Optical device and manufacturing method of optical device |
| JP2006261519A (ja) * | 2005-03-18 | 2006-09-28 | Sharp Corp | 半導体装置及びその製造方法 |
| CN101227855B (zh) * | 2005-08-05 | 2010-06-09 | 奥林巴斯医疗株式会社 | 发光单元 |
| JP2007073575A (ja) | 2005-09-05 | 2007-03-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
| WO2007034537A1 (ja) * | 2005-09-20 | 2007-03-29 | Renesas Technology Corp. | Ｌｅｄ光源およびその製造方法 |
| JP3117281U (ja) * | 2005-09-30 | 2006-01-05 | 鼎元光電科技股▲ふん▼有限公司 | 効率の高いマトリックス発光ダイオード素子 |
| JP2007109911A (ja) * | 2005-10-14 | 2007-04-26 | Renesas Technology Corp | 発光ダイオードおよびその製造方法 |
| JP2007134376A (ja) * | 2005-11-08 | 2007-05-31 | Akita Denshi Systems:Kk | 発光ダイオード装置及びその製造方法 |
| US20070228386A1 (en) * | 2006-03-30 | 2007-10-04 | Jin-Shown Shie | Wire-bonding free packaging structure of light emitted diode |
| MX2008011762A (es) | 2006-03-31 | 2008-09-26 | Hendrickson Int Corp | Bastidor auxiliar movil para camiones con remolque. |
| JP5057707B2 (ja) * | 2006-06-16 | 2012-10-24 | 日亜化学工業株式会社 | 発光装置 |
| KR20090067180A (ko) * | 2006-10-17 | 2009-06-24 | 씨. 아이. 카세이 가부시기가이샤 | 상하전극형 발광 다이오드용 패키지 집합체와 그것을 이용한 발광장치의 제조방법 |
| JP2008103401A (ja) * | 2006-10-17 | 2008-05-01 | C I Kasei Co Ltd | 上下電極型発光ダイオード用パッケージおよび上下電極型発光ダイオード用パッケージの製造方法 |
| WO2008056813A1 (fr) * | 2006-11-08 | 2008-05-15 | C.I.Kasei Company, Limited | Dispositif électroluminescent et son procédé de fabrication |
| JP2008258567A (ja) * | 2006-11-08 | 2008-10-23 | C I Kasei Co Ltd | 発光装置および発光装置の製造方法 |
| DE102007036226A1 (de) * | 2007-08-02 | 2009-02-05 | Perkinelmer Elcos Gmbh | Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur |
| US7652301B2 (en) * | 2007-08-16 | 2010-01-26 | Philips Lumileds Lighting Company, Llc | Optical element coupled to low profile side emitting LED |
| WO2009051178A1 (ja) * | 2007-10-19 | 2009-04-23 | Nippon Tungsten Co., Ltd. | Ｌｅｄパッケージ基板およびそれを用いたｌｅｄパッケージ |
| JP4758976B2 (ja) * | 2007-12-03 | 2011-08-31 | 日立ケーブルプレシジョン株式会社 | 半導体発光素子搭載用リードフレーム及びその製造方法並びに発光装置 |
| KR100981214B1 (ko) * | 2008-01-28 | 2010-09-10 | 알티전자 주식회사 | 발광다이오드 패키지 |
| JP2009224376A (ja) * | 2008-03-13 | 2009-10-01 | Toshiba Discrete Technology Kk | 側面型発光装置及びその製造方法 |
| CN101533819B (zh) * | 2008-03-14 | 2013-01-16 | 旭丽电子(广州)有限公司 | 半导体封装构造、应用于半导体封装构造的导线架及导电件 |
| US8080827B2 (en) * | 2008-07-31 | 2011-12-20 | Bridgelux, Inc. | Top contact LED thermal management |
| WO2010035788A1 (ja) * | 2008-09-25 | 2010-04-01 | デンカＡｇｓｐ株式会社 | 発光素子搭載用基板及びその製造方法 |
| US8288785B2 (en) | 2008-12-03 | 2012-10-16 | Seoul Semiconductor Co., Ltd. | Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode |
| JP5368809B2 (ja) | 2009-01-19 | 2013-12-18 | ローム株式会社 | Ｌｅｄモジュールの製造方法およびｌｅｄモジュール |
| JP2010177329A (ja) * | 2009-01-28 | 2010-08-12 | Sharp Corp | 樹脂複合リードフレームとその製造方法、及びその実装体 |
| JP2010238833A (ja) * | 2009-03-31 | 2010-10-21 | Panasonic Corp | 光半導体装置用パッケージおよび光半導体装置 |
| DE102009015963A1 (de) | 2009-04-02 | 2010-10-07 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| KR101673913B1 (ko) * | 2009-07-20 | 2016-11-08 | 삼성전자 주식회사 | 발광 패키지 및 그 제조 방법 |
| CN102024882A (zh) * | 2009-09-14 | 2011-04-20 | 展晶科技(深圳)有限公司 | 发光二极管装置及其制造方法 |
| US8502257B2 (en) * | 2009-11-05 | 2013-08-06 | Visera Technologies Company Limited | Light-emitting diode package |
| WO2012066461A1 (en) * | 2010-11-19 | 2012-05-24 | Koninklijke Philips Electronics N.V. | Islanded carrier for light emitting device |
-
2011
- 2011-11-14 WO PCT/IB2011/055063 patent/WO2012066461A1/en active Application Filing
- 2011-11-14 BR BR112013012333-8A patent/BR112013012333A2/pt active Search and Examination
- 2011-11-14 JP JP2013539375A patent/JP6297838B2/ja active Active
- 2011-11-14 RU RU2013127670/28A patent/RU2597674C2/ru active
- 2011-11-14 US US13/878,432 patent/US9172018B2/en active Active
- 2011-11-14 EP EP11808937.4A patent/EP2641279B1/en active Active
- 2011-11-14 CN CN201180055232.1A patent/CN103201863B/zh active Active
- 2011-11-14 RU RU2016133432A patent/RU2721101C2/ru active
- 2011-11-17 TW TW106142287A patent/TWI689113B/zh active
- 2011-11-17 TW TW105122937A patent/TWI620350B/zh active
- 2011-11-17 TW TW100142112A patent/TW201242101A/zh unknown
-
2015
- 2015-10-23 US US14/921,938 patent/US9997686B2/en active Active
-
2017
- 2017-11-10 JP JP2017217314A patent/JP6738785B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI689113B (zh) | 2020-03-21 |
| WO2012066461A1 (en) | 2012-05-24 |
| JP2018022930A (ja) | 2018-02-08 |
| CN103201863B (zh) | 2016-04-13 |
| JP2013543277A (ja) | 2013-11-28 |
| RU2721101C2 (ru) | 2020-05-15 |
| JP6297838B2 (ja) | 2018-03-20 |
| RU2597674C2 (ru) | 2016-09-20 |
| US20130221386A1 (en) | 2013-08-29 |
| US9172018B2 (en) | 2015-10-27 |
| CN103201863A (zh) | 2013-07-10 |
| US20160043295A1 (en) | 2016-02-11 |
| TWI620350B (zh) | 2018-04-01 |
| RU2013127670A (ru) | 2014-12-27 |
| JP6738785B2 (ja) | 2020-08-12 |
| TW201639197A (zh) | 2016-11-01 |
| EP2641279A1 (en) | 2013-09-25 |
| TW201242101A (en) | 2012-10-16 |
| BR112013012333A2 (pt) | 2019-03-06 |
| TW201813136A (zh) | 2018-04-01 |
| US9997686B2 (en) | 2018-06-12 |
| EP2641279B1 (en) | 2017-09-27 |
| RU2016133432A (ru) | 2018-12-10 |