201019514 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於構裝發光二極體晶片等之發光 元件的發光元件搭載用基板、及其製造方法。此發光元件 搭載用基板有用於照明裝置之發光元件面板、發光元件封 裝等之發光元件搭載用基板》 【先前技術】 以往，作爲搭載晶片LED等之LED封裝用的基板，係 φ 廣泛地使用陶瓷基板至今。又，亦開發了 LED封裝等用的 樹脂製基板，而用於改良散熱性或傳熱性的技術有幾個是 習知。 例如，在下列專利文獻1中，揭示一種發光元件搭載 用基板，其藉由蝕刻將金屬凸部形成於金屬基板的上面， 在此金屬凸部的周圍形成與金屬凸部同樣高度的絕緣樹脂 層，以鍍覆方式將散熱用圖案形成在金屬凸部上面，並將 供電用圖案形成在絕緣樹脂層上面，而作成可透過散熱用 〇 圖案將發光元件構裝在金屬凸部之上面。 [專利文獻1]日本特開2005-167086號公報 【發明内容】 [發明所欲解決的課題] 但是，專利文獻1的基板，由於在將金屬凸部形成於 、 金屬基板的上面之時係利用蝕刻，而有製造步驟變成煩雜 且花費不少的藥品、輔助材料、加工費之問題。又，由於 利用蝕刻將對應於金屬凸部之高度的厚度之金屬加以浸 201019514 蝕、除去’故浪費金屬，在成本上並不利。 此外，到現在爲止，雖已知利用沖壓成型將發光元件 搭載用基板之反射板部分形成凹狀的技術，但將散熱用的 金屬凸部進行沖壓成型的方法迄至目前爲止還是未知。 因而，本發明之目的在於提供一種發光元件搭載用基 板及其製造方法，其能以簡單的步驟且有利於成本地製造 具有散熱用凸部之基板。 [解決課題之手段] ❹ 上述目的可利用如下之本發明來達成》 即，本發明之發光元件搭載用基板，其特徵爲具備： 金屬板，至少在發光元件之搭載位置，具有利用沖壓加工 形成的凸部；絕緣層，至少形成在上述凸部之附近；供電 用圖案，設於該絕緣層之上面。在本發明之「沖壓加工」 中，除了是使用沖壓面的沖壓加工之外，亦包含在具有對 應於凸部之形狀的溝之輥間進行的沖壓加工（滾輪成型加 工）。在此，「金屬板」可爲具有一部分開口者，亦可包含 ® 例如金屬製導線架等。 依據本發明之發光元件搭載用基板，由於係藉由屬乾 式製程的沖壓加工來形成金屬板之凸部，所以相較於利用 蝕刻等形成的情況，製造步驟變簡單，亦消除藥品、輔助 材料及金屬之浪費，製程簡化且提高良率，故能以簡單的 步驟且有利於地成本地製造具有散熱用凸部之基板，以利 用沖壓加工的凸部而言，可容易地變化在複數個凸部間各 自的高度，更可形成前端尖銳狀之凸部。前端尖銳狀之凸 201019514 部，在絕緣層之形成時，可作成不易殘留樹脂等在凸部之 上面的構造。 在前述中，散熱用圖案宜形成接觸上述凸部之上面的 狀態。藉此，可利用散熱用圖案與凸部兩者的厚度’在面 方向及厚度方向進行有效的熱傳導’因而使自發光元件之 散熱變更良好。又，藉由在絕緣層使用高熱傳導材’亦可 更進一步提高散熱性。尤其，當散熱用圖案利用鍍覆形成 於凸部之上面時，使散熱變更良好。又，透過擴大散熱用 ® 圖案的面積（例如一面避開供電用圖案一面設置散熱用圖 案），可更提高面方向的散熱效果。 又，上述凸部宜形成爲連續的凸條。依此構成，相較 於形成散點狀的凸部，從連續的凸條散熱到表面側的熱量 增加，因此散熱效果變更大。又，由於將發光元件排列爲 線狀，因此散熱特性均勻且良好，減少亮度變動、色變動 等，而具有更進一步提高LED發光効率之效果。 又，在上述凸部之背面宜設置熱管，尤其在上述凸部 ® 之背面具有凹部，且設有一部分插入此凹部的熱管者更 佳。當在凸部之背面設熱管時，熱管之散熱效果非常大， 故使來自發光元件的散熱變更良好。尤其，在熱管之一部 分插入金屬板的凹部之情況，朝向熱管之傳熱效果變更 大’使來自發光元件的散熱變更良好。此外，在利用沖壓 形成凸部時’背面的凹部能以鍍覆、焊接及其他的方法來 充塡金屬等》 另一方面’本發明之發光元件搭載用基板的製造方法 201019514 之特徵爲包含：將金靥板進行沖壓加工，而在至少發光元 件之搭載位置形成凸部的步驟；至少在上述凸部的附近形 成絕緣層的步驟；及在此絕緣層的上面形成供電用圖案的 步驟。 依據本發明之發光元件搭載用基板的製造方法，由於 將金屬板進行沖壓加工，而在至少發光元件之搭載位置形 成凸部，因此能以乾式製程形成凸部，與利用蝕刻等形成 的情況相較下，製造步驟變簡單，亦消除金屬之浪費，故 β 能以簡單的步驟且有利於成本地製造具有散熱用凸部之基 板。 又，本發明之另一發光元件搭載用基板的製造方法之 特徵爲包含：將含有金靥板、絕緣層形成材及金屬層形成 材的積層物進行加熱沖壓，於上述金屬板之至少發光元件 之搭載位置上形成凸部，且獲得透過絕緣層形成在表面的 金屬層是具有凸部的積層體之步驟；除去積層體之凸部的 步驟；及將上述金屬層加以蝕刻而形成供電用圖案的步驟。 ® 依據本發明之發光元件搭載用基板的製造方法，可利 用加熱沖壓形成金屬板之凸部，同時形成絕緣層及表面之 金屬層。此時，在表面之金屬層亦可形成凸部，因此藉由 除去積層體之凸部，可露出金屬板之凸部，同時可縮小此 凸部之上面的絕緣層之厚度。藉由在此部分搭載發光元 件，從發光元件通過金屬板之凸部而朝向金屬板之散熱變 成良好。結果，與利用蝕刻等形成金屬板之凸部的情況相 較下’製造步驟變簡單，亦消除金屬之浪費，故能以簡單 201019514 的步驟且有利於成本地製造具有散熱用凸部之基板。 【實施方式】 以下，將參照圖面說明本發明之實施形態。第1圖係 顯示本發明之發光元件搭載用基板之一例的圖。從第2圖 至第4圖係顯示本發明之發光元件搭載用基板之製造步驟 流程的一例之圖面。 本發明之發光元件搭載用基板，如第1圖所示，具備 有：金屬板10，至少在發光元件30之搭載位置，具有利 ❹ 用沖壓加工形成的凸部l〇a;絕緣層16，至少形成在上述 凸部l〇a之附近；供電用圖案2 0a，設於該絕緣層16之上 面。在本實施形態中，如第1(a)圖所示，顯示大致爲圓形 的凸部l〇a係形成在金屬板10，散熱用圖案20b形成接觸 其上面的狀態之例。 在本發明之發光元件搭載用基板上搭載發光元件30。 作爲所使用的發光元件30,可舉出：在底面及/或上面具有 電極的發光二極體晶片（覆晶、裸晶）、封裝化之表面構裝 〇 式之發光二極體晶片（LED封裝、晶片LED)、半導體雷射 晶片等。有關底面具有1個電極之發光二極體晶片，有底 面爲陰極型及陽極型之2種類，任何一種均可使用。 本發明在是封裝有發光元件30之LED的情況，宜在 底面具備有散熱用之襯墊32,宜將襯墊32接合到金屬板 10之凸部10a的上面或散熱用圖案20b的上面。又，在使 用裸晶等的情況，宜將其在金屬板1〇之凸部l〇a的上面或 散熱用圖案2 0b的上面進行晶粒接合爲宜。藉此，可從襯 201019514 墊32等對金屬板10之凸部10a進行有効的傳熱，而良好 地進行自LED的散熱。在本實施形態中顯示有，發光元件 3〇係使用在底面具備有散熱用襯墊32之封裝LED，將其 接合在散熱用圖案2 Ob的上面之例。 本發明中，發光元件30之電極31係電性連接到供電 用圖案20a。與供電用圖案20之接續，在表面黏著型之封 裝LED之情況，雖然藉由銲料之回流接續等爲可能，但在 裸晶等之情況，係使用打線接合等。 © 本發明之發光元件搭載用基板，如第1(b)圖所示，凸 部10a可形成爲連續之凸條，又，在上述凸部10a之背面 具有凹部，且在此凹部設有一部分插入的熱管40爲較佳。 在圖示之例中，在連續之凸條之背面具有溝部l〇b，且在 此溝部l〇b設有一部分插入的熱管40，在其上面形成有截 面爲梯形的凸條4 1。 依此，在將金屬板10之凸部l〇a形成爲連續之凸條的 情況，將複數個發光元件3 0沿著凸條搭載爲較佳。此外， ® 圖中的假想線係顯示發光元件30之搭載位置。如此的凸條 亦可設置複數列。 熱管40具有將熱媒體封入由金屬等之傳熱材料形成 的管子之內部的構造，具有利用熱媒體之蒸發、冷凝作用 將局部的熱快速地傳遞到另一部分的功能。此種熱管40有 各種的尺寸及形狀在市場上銷售。 熱管40之凸條41，可將由金屬形成的凸條41以焊接 等加以接合，或利用傳熱性之接著劑進行接著等而設置。 201019514 又，亦可預先利用具有凸條41的金屬製作熱管40。 雖然熱管40之凸條41，可爲半圓形、四角形等任何 之截面形狀，但以能內接於金屬板10之溝部l〇b的形狀爲 宜，大致全面地接觸之形狀更佳。在凸條41與溝部10b之 間具有間隙之情況，以插入熱板等的傳熱性材料爲較佳。 本發明之發光元件搭載用基板，如第1(c)圖所示，在 發光元件30之搭載位置的周圍，亦可形成具有反射器功能 的壩體201。在此例中，屬於發光元件30之裸晶被接合在' φ 散熱用圖案20b之上面，更進一步利用打線接合而與供電 用圖案20a電性連接。在打線接合時，可使用金等之金屬 細線或帶狀引出線，以超音波或與其併用加熱的方法進行 結線係爲可能。此外，在本發明，如此例，亦可爲使凸部 l〇a之上面不與散熱用圖案20b接觸，而介入構成絕緣層 1 6之樹脂等的狀態。 壩體201利用接著劑202而接著在供電用圖案20a的 上面。壩體201，例如可藉由在預定厚度之A1板施加壩體 ^ 形狀的孔加工而形成。在壩體202的反射面，可再施作Ni、 Ag、Cu等之電鍍。其後，能以透明樹脂、螢光色樹脂等被 覆壩體201的內側。又，在其上方可設置凸面的透明樹脂 透鏡。藉由使透明樹脂透鏡具有凸面，能有効地將光從基 板發射到上方。此外，透明樹脂透鏡亦可爲著色者。透明 樹脂透鏡等並不設在壩體201上，係藉埋入成型、接合等 之公知的方法，或直接形成於基板亦靥可能。 依此，以透明樹脂配被覆（封住）壩體201之內部，設 置透明樹脂透鏡而可構成發光元件封裝或發光元件面板 201019514 發光元件封裝，一般係在形成配線圖案的基板黏著1個發 光元件的封裝構成，此發光元件封裝被構裝在電路基板 上。又，發光元件封裝，一般係在形成配線圖案的基板黏 著複數個發光元件的構成。 又，在供電用圖案2 0a之上面介入接著劑，可形成絕 緣樹脂製之壩體，使用例如Ni，Ag等鍍覆處理其反射面， 而發揮反射器功能爲較佳。絕緣樹脂製之壩體，可藉由在 預定厚度之絕緣樹脂板施加壩體形狀的孔加工而形成。此 〇 絕緣樹脂板之基材亦可使用絕緣樹脂之電路基板。 其次，將根據從第2圖至第4圖所示之製造步驟流程， 說明本發明之發光元件搭載用基板及其製造方法之一例。 (1)將金屬板10進行沖壓加工，而在至少發光元件 30之搭載位置形成凸部l〇a的步驟（步驟S1)。 首先，如第3(a)圖所示，準備金屬板10。金屬板10 可爲單層或積層體之任何一種，構成的金屬，可爲任何之 金屬，例如可使用銅、銅合金、鋁、不銹鋼、鎳、鐵、其 ® 他之合金。其中，由熱傳導性或電氣傳導性之點，亦以銅、 銅合金、鋁爲較佳。如上述，藉由具備散熱良好的金屬基 板，可防止發光元件30之溫度上昇，因此熱電阻爲小的驅 動電流大量地流動，可增加發光量。 金屬板10之厚度，從更進一步提高散熱性之觀點，以 70〜3 000μπι爲較佳，70〜ΙΟΟΟμιη爲更佳。但是，在第3(f) 圖所示之步驟中，在使用平坦的下模之情況，金屬板10之 凸部l〇a的強度最好爲高，此時，金屬板10之厚度以 10 · 201019514 100~1000μιη 爲較佳。 其次，如第3(b)圖所示，準備在至少對向於發 3 0之搭載位置的位置具有凸部42a之下模42、及在 搭載位置的位置具有凹部41a之上模41。下模42 41係在作動沖壓裝置時，只要凸部4 2a及凹部41a 爲可能的話，亦可作爲附屬設備而使用，亦可介入 置之沖壓面而使用。此外，下模42及上模41亦可 轉，此時，在下側形成凸狀的凸部l〇a。 e 獲得的金屬板10之凸部l〇a，係藉由上模41 41a、及下模’42之凸部42a的形狀、尺寸，而決定其 尺寸等。凸部l〇a之高度（從金屬板10之上面算 度），從來自凸部10a之散熱性、或絕緣層之厚度、 性之觀點，以60〜150μιη爲較佳，6 0~100μιη爲更佳 又，凸部l〇a之上面的尺寸，可爲比構裝的發 30更小或更大，例如爲圓形之時，其上面之 400μπι~10ϊηιη爲較佳。凸部10a之上面的形狀，可 ® 形、圓形、橢圓形之任何一種，又，亦可形成連續ίΚ 其次，如第3(c)圖所示，將金屬板10進行沖歷 至少在發光元件30之搭載位置形成凸部10a。此時 等的條件，係與通常之金靥加工之時同樣。 其次，如第3 (d)圖所示，進行脫模，在以後的 當使用具有凸部42a之下模42時，僅使上模41進 爲宜。在以後的步驟當不使用具有凸部42a之下模 使金靥板10從雙方之上模41,下模42進行脫模。 光元件 對向於 及上模 的定位 沖壓裝 上下逆 之凹部 ;形狀、 起之高 熱傳導 〇 光元件 直徑以 爲四角 ]凸條。 I加工， 之沖壓 步驟， 行脫模 42時， -11- 201019514 (2)至少在上述凸部l〇a的附近形成絕緣層16的步驟 (步驟S2)。 在本實施形態中，係將此步驟藉由對含有金靥板10、 絕緣層形成材16a、及金屬層形成材19a的積層物進行加熱 祌壓，且獲得透過絕緣層16形成於表面的金屬層19是具 有凸部A的積層體之步驟，顯示實施之例。在第3(e)圖所 示之例中，屬於絕緣層形成材16a的絕緣樹脂材料及屬於 金屬層形成材19a的銅箔，係使用付有被積層一體化樹脂 ® 的銅箔。 如第3(f)圖所示，對金屬板10從沖壓面進行加熱沖 壓，藉此而獲得同時積層形成絕緣層16及金屬層19，同 時在對應於金屬板10之凸部10a的位置形成凸部A之積層 體。此時，在沖壓面與被積層體之間，預先配置容許凹狀 變形的板材（例如緩衝材）爲宜。又，在對應於金屬板10之 凸部l〇a的位置，亦可使用具有凹部的沖壓面。 上述之絕緣樹脂材料及銅箔，在市場上有各種的東西 ® 販賣，可使用其等之任何一種。又，絕緣樹脂材料的形成 材、及銅箔的形成材，亦可分別地配置。在此步驟中，板 材係利用金屬板10之凸部l〇a的存在，在加熱沖壓時進行 凹狀變形，因此對應於此的凸部A被形成在積層體上。 加熱沖壓的方法，可使用加熱加壓裝置（真空熱沖壓 床、熱貼合裝置、加熱沖床）等而進行，此時，爲了避免空 氣的混入，亦可將環境作成真空（真空貼合裝置等）。加熱 溫度、壓力等條件等，可因應於絕緣層形成材及金靥層形 -12- 201019514 成材的材質而適宜地設定，但壓力宜爲0.5~3 0MPa。 絕緣層形成材16a，只要在積層時利用加熱等而硬化， 且具有配線基膽所要求的耐熱性者的話，可使用任何材 料。具體上可舉出：聚亞醯胺、酚醛樹脂、環氧樹脂等之 各種反應硬化樹脂，或其等與玻璃纖維、陶瓷纖維、芳香 族聚醯胺纖維之複合體（預浸料坯）等。 又，絕緣層16之絕緣層形成材，係以熱傳導性高的材 料構成爲宜，例如包含熱傳導性充塡物的樹脂等爲其例示。 Φ 此時之絕緣層16,具有1.0 W/mK以上之熱傳導率，但 以具有1.2W/mK以上之熱傳導率爲較佳，以具有1.5W/mK 以上之熱傳導率爲更佳。藉此，可使來自凸部l〇a的熱有 効地散熱到金屬板10側。在此，絕緣層16之熱傳導率， 雖然能適宜地選擇考慮熱傳導性充塡物的配合量及粒度分 布而決定，但是當考慮硬化前之絕緣性接著劑的塗布性 時，一般以l〇W/mK左右作爲上限爲宜。 上述之絕緣層16係以屬於金屬氧化物及/或金屬氮化 ® 物之熱傳導性充塡物和樹脂（絕緣性接著劑）構成爲宜。金 屬氧化物及金屬氮化物，以熱傳導性優異，且電氣絕緣性 者爲較佳。金靥氧化物可選擇氧化鋁、氧化矽、氧化鋇、 氧化鎂，而金屬氮化物可選擇氮化硼、氮化矽、氮化鋁， 或可將其等單價或2種以上加以混合而使用。尤其，上述 金屬氧化物之中，氧化鋁以可容易地獲得在電氣絕緣性' 熱傳導性均良好的絕緣接著劑層，而且能便宜地取得之理 由而較佳，而上述金屬氮化物之中，氮化硼以在電氣絕緣 •13- 201019514 性、熱傳導性均優異，更進一步介電率亦小之理由而較佳。 熱傳導性充塡物，以包含小徑充塡物及大徑充塡物者 爲宜。依此，藉由使用2種以上之大小的相異粒子（粒度分 布不同的粒子），而提高大徑充塡物本身的傳熱功能、及小 徑充塡物之與大徑充塡物之間的樹脂之傳熱性之功能，藉 此可提高絕緣層16之熱傳導率。由這樣的觀點，小徑充塡 物之平均徑較佳爲0.5〜2 μιη，以0.5〜Ιμιη爲更佳。又，大 徑充塡物之平均徑較佳爲1〇~40μπι，以15〜20μιη爲更佳。 © 構成上述之絕緣層16的樹脂，在包含金屬氧化物及金 屬氮化物者之中，選擇在硬化狀態下，與金屬板10之接合 力優異，又不損害耐電壓特性等者。此種樹脂，除了環氧 樹脂、酚醛樹脂、聚亞醯胺之外，可將各種工程塑膠單獨 或2種以上加以混合而使用，但是其中以環氧樹脂在與金 屬之接合力優異爲宜。尤其，在環氧樹脂中，以流動性高， 與上述金屬氧化物及金屬氮化物之混合性優異的雙酚醛A 型環氧樹脂、雙酚醛F型環氧樹脂、水添雙酚醛A型環氧 ® 樹脂、水添雙酚醛F型環氧樹脂、兩末端具有水添雙酚醛 A型環氧樹脂構造的三鏈段共聚合物、兩末端具有水添雙 酚醛F型環氧樹脂構造的三鏈段共聚合物，爲更佳的樹脂。 板材，係只要在加熱沖壓時容許凹狀變形的材料的話 即可，可舉出：緩衝紙、橡膠板、彈性體板、不織布、織 布、多孔質板、發泡體板、金屬箔、其等之複合體等。尤 其，緩衝紙、橡膠板、彈性體板、發泡體板、其等之複合 體等可彈性變形者爲較佳》 -14- 201019514 (3)在絕緣層16的上面形成供電用圖案 (步驟S3)。 此步驟，例如，可藉由：將金屬板10之凸 方之凸部A除去而露出凸部l〇a的步驟、及以 將金屬箔（金屬層19)加以蝕刻的步驟而實施。 在第3(g)圖所示之例中，將凸部A除去而露 以形成平坦面B。在此凸部A的除去之時，係{ 之高度與凸部10a之高度作成一致的方式，進 〇 坦化爲宜。 凸部A的除去方法，以硏磨或輪磨的方法 舉出：使用具有將鑽石製等之硬質刃複數支配 之半徑方向的硬質旋轉刃的硏磨裝置之方法、 器、皮帶噴砂器、輪磨機、平面硏磨機、硬質 品等的方法等。當使用硏磨裝置時，藉由一面 轉刃旋轉、一面沿著固定被支撐之配線基板的 而可將上面平坦化。又，硏磨的方法，可舉出 © 噴砂器、半硏磨等進行輕度硏磨之方法。如本 積層體形成凸部A時，僅此部分被硏磨係較容 之平坦化可更確實地實行。 其次，實施金屬層19之蝕刻，如第3(h)圖 刻之前，將已露出的凸部l〇a及金屬層19進行 以形成金屬鍍覆層20爲宜。又，至少將露出的 行金屬鍍覆的方法亦可。金屬鍍覆的金屬種， 銀、鎳等爲較佳。形成金屬鍍覆層20的方法，例 2〇a的步驟 部l〇a的上 預定之圖案 .出凸部1 0 a 吏金屬層19 行除去而平 爲較佳，可 置在旋轉板 或使用噴砂 砂輪粒成型 將該硬質旋 上面移動， :利用皮帶 發明，當在 易，故全體 所示，在蝕 金屬鑛覆' 凸部l〇a進 以例如銅、 I如可舉出： -15- 201019514 使用防蝕阻劑而進行圖案形成的面板鍍覆法、使用圖案鍍 覆用阻劑進行鍍覆而形成的圖案鍍覆法等。 其次，如第4(i)〜（j)圖所示’使用防蝕阻劑Μ以預定 之圖案而蝕刻金屬鍍覆層20及金屬層19 ’藉此而形成具 有襯墊20b及供電用圖案20a的上面金屬層。雖然襯墊20b 之尺寸可以比發光元件30之尺寸更大或更小，例如其上面 之直徑爲400μιη〜10mm。襯墊20b之上面的形狀可爲四角 形、圓形之任何一種。 0 防蝕阻劑Μ之除去，可因應於防蝕阻劑Μ之種類而適 宜地選擇藥劑除去、剝離除去等即可。例如，利用網印形 成的感光性之墨水的情況，可使用鹼等之藥品加以除去。 又，直接搭載晶片之情況等，爲了在襯墊20b及供電 用圖案2 0a提高反射效率及接合性，利用金、鎳、銀等之 貴金屬進行鍍覆爲較佳。又，與習知的配線基板同樣地形 成阻焊劑，或局部地進行焊劑鍍覆亦可。 (本發明之另一實施形態） φ 本發明之另外的發光元件搭載用基板之製造方法，如 第5圖所示，包含：藉由對含有金屬板1〇、絕緣層形成材 16a、及金屬層形成材19a的積層物進行加熱沖壓，在前述 金屬板10之至少發光元件30的搭載位置形成凸部i〇a， 且獲得透過絕緣層16而形成於表面的金屬層19具有凸部 A的積層體之步驟；除去上述積層體之凸部a的步驟；及 對上述金屬層19進行蝕刻而形成供電用圖案2〇a的步驟。 亦即’本發明之另—製造方法與第3圖所示之製造方 法的不同’係後者分兩次進行沖壓，第1次之沖壓加工係 -16- 201019514 在金屬板10形成凸部l〇a，第2次之沖壓加工係在表面之 金屬層19形成凸部A，相對於此，第5圖所示之本發明之 另一製造方法，係第1次之沖壓加工在金屬板10形成凸部 l〇a，同時在表面之金屬層19形成凸部A之點不同。因而， 從第5(d)圖所示的步驟以後的步驟，兩者均相同。以下， 僅對不同點加以說明，其他部分係與第2圖〜第4圖所示之 發光元件搭載用基板之製造方法的說明保持相同。 首先，如第5(a)圖所示，準備金屬板10、絕緣層形成 e 材16a、及金屬層形成材19a。其次，如第5(b)圖所示，準 備在至少對向於發光元件30之搭載位置的位置具有凸部 42a之下模42、及在對向於搭載位置的位置具有凹部41a 之上模41。下模42之凸部42a係與形成的金屬板10之凸 部l〇a之形狀、大小吻合而設計。又。上模41之凹部41a 係與金屬層19之凸部A之形狀、大小吻合而設計。 取代使用具有凹部41a的上模41，而使用下面爲平坦 的上模41，亦可介入緩衝材。又，取代單層的緩衝材，而 ❹ 使用以緩衝材挾持的金屬板（例如不銹鋼板）亦可。依此， 藉由使用緩衝材，不必製作具有凹部41a的上模41，以1 次之加熱沖壓可一體化實施凸部形成及絕緣層形成，又， 位置對準的問題不易產生。 其次，如第5(c)圖所示，對含有金屬板10、絕緣層形 成材16a、及金屬層形成材19a的積層物進行加熱沖壓，而 在上述金屬板10之至少發光元件30的搭載位置形成凸部 10a’同時獲得透過絕緣層16而形成於表面的金屬層19是 -17- 201019514 具有凸部A的積層體。 更進一步，如第5(d)圖所示，藉由將金屬板1〇之凸部 l〇a的上方之凸部a除去而露出凸部l〇a的步驟、及以預 定之圖案將金屬箔（金屬層19)加以蝕刻的步驟，可形成供 電用圖案2 0a。此等之步驟，係與第3 ~4圖所示的步驟相 同。 (另外實施形態） (1) 雖然在上述實施形態中，下面側金屬板係顯示未進 鬌 行圖案形成之面板狀的下面側金屬板之例，但金屬板亦能 以預定的圖案進行電路形成。此時，亦能以構裝複數個發 光元件而使串聯接續爲可能的方式，形成接續相鄰的發光 元件之下方之諸層間接續部之圖案。此時，在一方之層間 接續部，接續陰極側電極，另一方之層間接續部接續陽極 側電極。又，亦可併用串聯接續及並聯接續。 (2) 在上述實施形態中，雖然發光元件搭載用基板係顯 示發光元件搭載用基板與電極構成之例，但是本發明亦可 ® 在同一基板上形成其他之電子電路。例如，形成發光二極 體之驅動電路等爲較佳。此時，在基板之周邊，尤其是角 部及其附近，配線、島部，接合用之襯墊、與外部之電性 接續襯墊等被圖案化，配線間可設置配置晶片電容器、晶 片電阻及印刷電阻等之零件、變壓器、二極體、1C等。 (3) 在上述實施形態中，雖然係顯示在金屬層19之上 面進行鍍覆之例，但本發明亦可不在金屬層19之上面進行 鍍覆，而原樣地將金屬層19進行鈾刻，因而形成供電用圖 -18 - 201019514 案2 0 a等爲可能。 (4)在上述實施形態中，雖然係顯示藉由將絕緣層形 成材加以積層而進行加熱沖壓以形成絕緣層之例，但是亦 可利用塗布淋幕塗料等之樹脂的方法形成絕緣層。此時， 藉由對形成後之樹脂層的表面全體或表面之一部分，進行 切削或硏磨，而可露出金屬板10之凸部l〇a的上面。其後， 利用鍍覆等形成金屬層，將其加以蝕刻而可形成供電用圖 案 20a。 〇 (5)本發明，亦可在將發光元件構裝於基板之後，或 者形成反射器之後，使用1層或複數層之耐光性薄膜，將 其表面加以被覆或封裝。耐光性薄膜可使用含有氟系樹脂 及甲基丙烯酸酯系樹脂的樹脂組成物等。 氟系樹脂，可舉出：例如聚氟亞乙烯、聚四氟乙烯、 聚氯三氟乙烯、聚六氟丙烯、聚氟乙烯之均聚物或共聚體。 所謂甲基丙烯酸酯系樹脂，係指甲基丙烯酸（MMA)之均聚 物或可與甲基丙烯酸進行共聚之單量體的共聚體及甲基丙 ® 烯酸與丙烯系橡膠之混合物等。可共聚之單量體，可爲將 碳數2〜4之甲基丙烯酸酯、甲基丙烯酸丁酯作爲首項之碳 數1〜8之丙烯酸酯、苯乙烯、α·甲基苯乙烯、丙烯腈、丙 烯酸、其他之乙烯性不飽和單體。 在耐光性薄膜構成的至少1層，亦可含有螢光體。螢 光體可爲：將活化劑姉導入螢光體母體鋁酸釔的YAG : Ce 螢光體、將活化劑銪導入螢光體母體矽酸緦•鋇的Sr， Ba)2Si〇4: Eu登光體等之氧化物蟹光體、α-sialon(氮化砂） -19- 201019514 螢光體、β-Sialon(氮化矽）螢光體等之氮化物螢光體，及 銅、使用銅及鋁、鎂活化的硫化鋅等。螢光體之粒徑可廣 圍例如在0.001〜20μιη的範圍內變化，由於光散亂係可正比 於粒徑而增加，因此以1~2μπι以下大小之粒子爲較佳，以 0.01~0.4μιη以下大小之粒子爲更佳。 在耐光性薄膜構成的至少1層，亦可使用紫外線吸收 劑、氧化防止劑、分散劑、耦合劑等。 (6) 本發明，亦可取代使用熱管，而將更厚之大的金 φ 屬板在背面側積層，將髙熱傳導性之材料形成的層形成在 背面側。此時，亦可在凸部之背面側的凹部，作成充塡該 材料的構造。 高熱傳導性之材料，以可提高傳熱及輻射效果的金屬 基複合體（MMC)爲較佳。所謂MMC，可舉出例如鋁與碳化 矽之複合體、鋁與碳之複合體等。 (7) 本發明，可取代在凸部之上面使用平坦的金屬 板，如第7(a)圖或第7(b)圖所示，可使用更在前端具有尖 φ 銳化形狀的凸部l〇a之金屬板10。前端具有尖銳化形狀的 凸部10a，可作成在絕緣層16之形成時，樹脂等不易殘留 在凸部l〇a之上面的構造。 具體上，利用將絕緣層形成材16a加以積層而進行加 熱沖壓的方法，或者塗布淋幕塗料等之樹脂的方法，在金 屬板10上形成絕緣層16之時，可將尖銳化形狀的凸部10a 之前端從絕緣層16露出或大致露出。其後，將凸部10a之 前端加以切削或硏磨等，而可將金屬板10之凸部10a作爲 平坦的話，可在此部分將發光元件進行接合等而搭載。 -20- 201019514 【圖式簡單說明】 第1圖係顯示本發明之發光元件搭載用基板之例的 圖。 第2圖係顯示本發明之發光元件搭載用基板之製造步 驟流程的一例之圖。 第3礓1係顯示本發明之發光元件搭載用基板之製造步 驟流程的一例之圖。 第4圖係顯示本發明之發光元件搭載用基板之製造步 〇 驟流程的一例之圖。 第5圖係顯示本發明之發光元件搭載用基板之製造步 驟流程的另一例之圖。 第6圖係顯示本發明之發光元件搭載用基板的要部之 另一例的圖。 【主要元件符號說明】 10 金 屬 板 10a 凸 部 10b 溝 部 16 絕 緣 層 16a 絕 緣 層 形 成 材 19 金 屬 層 19a 金 屬 層 形 成 材 20 金 屬 鍍 覆 層 20a 供 電 用 圖 案 20b 襯 墊 -21- 201019514[Technical Field] The present invention relates to a substrate for mounting a light-emitting element for constituting a light-emitting element such as a light-emitting diode wafer, and a method of manufacturing the same. In the light-emitting element mounting substrate, the light-emitting element mounting plate for a lighting device, and a light-emitting element mounting substrate such as a light-emitting element package. [Prior Art] Conventionally, as a substrate for mounting an LED package such as a wafer LED, φ is widely used. The substrate is still here. Further, resin substrates for LED packages and the like have been developed, and several techniques for improving heat dissipation or heat transfer properties are known. For example, in the following Patent Document 1, a substrate for mounting a light-emitting element is disclosed in which a metal convex portion is formed on the upper surface of a metal substrate by etching, and an insulating resin layer having the same height as the metal convex portion is formed around the metal convex portion. The heat dissipation pattern is formed on the metal convex portion by plating, and the power supply pattern is formed on the insulating resin layer, and the light-emitting element is formed on the upper surface of the metal convex portion by the heat dissipation heat dissipation pattern. [Problem to be Solved by the Invention] However, the substrate of Patent Document 1 is utilized when the metal convex portion is formed on the upper surface of the metal substrate. Etching, and manufacturing steps become cumbersome and costly for pharmaceuticals, auxiliary materials, and processing costs. Further, since the metal corresponding to the thickness of the metal convex portion is etched by etching, the metal is impregnated and removed, so that the metal is wasted, which is not advantageous in terms of cost. Further, although a technique of forming a concave portion of a reflecting plate portion of a substrate for mounting a light-emitting element by press molding has been known, a method of press-forming a metal convex portion for heat dissipation has not been known until now. Accordingly, an object of the present invention is to provide a substrate for mounting a light-emitting element and a method of manufacturing the same, which can manufacture a substrate having a heat-dissipating convex portion in a simple procedure and in a cost-effective manner. [Means for Solving the Problems] The above-described object is achieved by the present invention, which is characterized in that the substrate for mounting a light-emitting element of the present invention is characterized in that it includes a metal plate and is formed by press working at least at a mounting position of the light-emitting element. The convex portion; the insulating layer is formed at least in the vicinity of the convex portion; and the power supply pattern is provided on the upper surface of the insulating layer. In the "pressing process" of the present invention, in addition to press working using a press surface, press work (roller forming) is performed between rolls having grooves corresponding to the shape of the convex portion. Here, the "metal plate" may have a part of the opening, and may also include a metal lead frame, for example. According to the substrate for mounting a light-emitting element of the present invention, since the convex portion of the metal plate is formed by press working in a dry process, the manufacturing steps are simplified as compared with the case of forming by etching or the like, and the drug and the auxiliary material are eliminated. And the waste of metal, the process is simplified, and the yield is improved, so that the substrate having the heat-dissipating convex portion can be manufactured in a simple step and in a cost-effective manner, and can be easily changed in plural by using the convex portion of the press working. The height between the convex portions can further form a convex portion having a sharp pointed end. The tip end is sharply convex. In the 201019514 portion, when the insulating layer is formed, a structure in which the resin or the like is not easily left on the convex portion can be formed. In the foregoing, the heat dissipation pattern is preferably formed in a state of contacting the upper surface of the convex portion. Thereby, the thickness "both of the heat dissipation pattern and the convex portion can be effectively conducted in the surface direction and the thickness direction", whereby the heat dissipation from the light-emitting element can be changed well. Further, heat dissipation can be further improved by using a high heat conductive material in the insulating layer. In particular, when the heat dissipation pattern is formed on the upper surface of the convex portion by plating, the heat dissipation is preferably changed. Further, by enlarging the area of the heat-dissipating ® pattern (for example, providing a heat-dissipating pattern while avoiding the power supply pattern), the heat-dissipating effect in the plane direction can be further improved. Further, the convex portion is preferably formed as a continuous ridge. According to this configuration, the amount of heat radiated from the continuous ridges to the surface side is increased as compared with the embossed convex portions, so that the heat radiation effect is largely changed. Further, since the light-emitting elements are arranged in a line shape, the heat dissipation characteristics are uniform and good, and variations in luminance, color fluctuation, and the like are reduced, and the effect of further improving the luminous efficiency of the LED is obtained. Further, it is preferable that a heat pipe is provided on the back surface of the convex portion, and in particular, a concave portion is provided on the back surface of the convex portion ®, and a heat pipe in which a part of the concave portion is inserted is preferably provided. When the heat pipe is provided on the back surface of the convex portion, the heat radiation effect of the heat pipe is extremely large, so that the heat radiation from the light-emitting element is changed well. In particular, when one of the heat pipes is inserted into the concave portion of the metal plate, the heat transfer effect toward the heat pipe is greatly changed, and the heat radiation from the light-emitting element is changed to be good. In addition, when the convex portion is formed by press, the recessed portion on the back surface can be filled with metal by plating, soldering, or the like. On the other hand, the method of manufacturing the substrate for mounting a light-emitting element of the present invention 201019514 includes: a step of forming a convex portion at a mounting position of at least the light-emitting element, a step of forming an insulating layer in the vicinity of the convex portion, and a step of forming a power supply pattern on the insulating layer. According to the method for manufacturing a substrate for mounting a light-emitting element of the present invention, since the metal plate is subjected to press working, at least the convex portion is formed at the mounting position of the light-emitting element, so that the convex portion can be formed by a dry process and formed by etching or the like. In the lower part, the manufacturing steps are simplified, and the waste of metal is also eliminated, so that the substrate having the heat-dissipating convex portion can be manufactured in a simple step and in a cost-effective manner. Further, in another method of manufacturing a substrate for mounting a light-emitting element of the present invention, the laminate comprising a metal plate, an insulating layer forming material, and a metal layer forming material is heated and pressed, and at least a light-emitting element of the metal plate is provided. a step of forming a convex portion at the mounting position, obtaining a layered body having a convex portion through the insulating layer, a step of removing the convex portion of the laminated body, and etching the metal layer to form a power supply pattern A step of. According to the method for producing a substrate for mounting a light-emitting element of the present invention, the convex portion of the metal plate can be formed by hot stamping, and the insulating layer and the metal layer on the surface can be formed. At this time, since the convex portion can be formed on the metal layer on the surface, the convex portion of the metal plate can be exposed to expose the convex portion of the metal plate, and the thickness of the insulating layer on the upper surface of the convex portion can be reduced. By mounting the light-emitting element in this portion, heat dissipation from the light-emitting element to the metal plate through the convex portion of the metal plate becomes good. As a result, the manufacturing step becomes simpler than the case where the convex portion of the metal plate is formed by etching or the like, and the waste of the metal is eliminated, so that the substrate having the heat radiating convex portion can be manufactured with a simple procedure of 201019514 and cost-effectively. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 is a view showing an example of a substrate for mounting a light-emitting element of the present invention. Fig. 2 to Fig. 4 are views showing an example of a flow of a manufacturing step of the substrate for mounting a light-emitting element of the present invention. As shown in Fig. 1, the light-emitting element mounting substrate of the present invention includes a metal plate 10 having a convex portion 10a formed by press working at least at a mounting position of the light-emitting element 30, and an insulating layer 16; At least in the vicinity of the convex portion 10a; the power supply pattern 20a is provided on the upper surface of the insulating layer 16. In the present embodiment, as shown in Fig. 1(a), a substantially circular convex portion 10a is formed on the metal plate 10, and the heat dissipation pattern 20b is in contact with the upper surface. The light-emitting element 30 is mounted on the substrate for mounting a light-emitting element of the present invention. Examples of the light-emitting element 30 to be used include a light-emitting diode wafer (flip-chip, bare crystal) having electrodes on the bottom surface and/or the surface thereof, and a packaged surface-mounted light-emitting diode chip (LED). Package, wafer LED), semiconductor laser wafer, etc. The light-emitting diode wafer having one electrode on the bottom surface has two types of cathode type and cathode type, and any of them can be used. In the case of the LED in which the light-emitting element 30 is packaged, it is preferable to provide the spacer 32 for heat dissipation on the bottom surface, and it is preferable to bond the spacer 32 to the upper surface of the convex portion 10a of the metal plate 10 or the upper surface of the heat dissipation pattern 20b. Further, in the case of using a bare crystal or the like, it is preferable to perform die bonding on the upper surface of the convex portion 10a of the metal plate 1 or the upper surface of the heat dissipation pattern 20b. Thereby, the convex portion 10a of the metal plate 10 can be efficiently transferred from the lining 201019514 pad 32 or the like, and the heat dissipation from the LED can be favorably performed. In the present embodiment, the light-emitting element 3 is formed by using a package LED having a heat-dissipating pad 32 on its bottom surface and bonding it to the upper surface of the heat-dissipation pattern 2 Ob. In the present invention, the electrode 31 of the light-emitting element 30 is electrically connected to the power supply pattern 20a. In the case of the surface-adhesive type of the packaged LED, it is possible to connect the LED with the surface of the power supply pattern by solder reflow or the like. However, in the case of bare crystal or the like, wire bonding or the like is used. In the light-emitting element mounting substrate of the present invention, as shown in Fig. 1(b), the convex portion 10a can be formed as a continuous ridge, and has a concave portion on the back surface of the convex portion 10a, and a portion is provided in the concave portion. The inserted heat pipe 40 is preferred. In the illustrated example, a groove portion 10b is provided on the back surface of the continuous ridge, and a part of the inserted heat pipe 40 is provided in the groove portion 10b, and a ridge 41 having a trapezoidal shape is formed on the upper surface. Accordingly, in the case where the convex portion 10a of the metal plate 10 is formed as a continuous ridge, it is preferable to mount a plurality of light-emitting elements 30 along the ridges. Further, the imaginary line in the ® diagram shows the mounting position of the light-emitting element 30. Such a rib can also be provided with a plurality of columns. The heat pipe 40 has a structure in which a heat medium is sealed inside a tube formed of a heat transfer material such as metal, and has a function of rapidly transferring local heat to another portion by evaporation and condensation of the heat medium. Such heat pipes 40 are available in a variety of sizes and shapes on the market. The ridges 41 of the heat pipe 40 can be joined by welding or the like, or by using a heat transfer adhesive. 201019514 Further, the heat pipe 40 may be made of metal having the ridges 41 in advance. Although the ridges 41 of the heat pipe 40 may have any cross-sectional shape such as a semicircle or a quadrangle, it is preferably in a shape that can be inscribed in the groove portion 10b of the metal plate 10, and the shape is substantially in full contact. In the case where there is a gap between the ridge 41 and the groove portion 10b, it is preferable to insert a heat transfer material such as a hot plate. In the light-emitting element mounting substrate of the present invention, as shown in Fig. 1(c), a dam body 201 having a reflector function can be formed around the mounting position of the light-emitting element 30. In this example, the bare crystal belonging to the light-emitting element 30 is bonded to the upper surface of the 'φ heat-dissipating pattern 20b, and is further electrically connected to the power supply pattern 20a by wire bonding. In the case of wire bonding, it is possible to use a metal thin wire or a ribbon lead wire of gold or the like, and it is possible to perform ultrasonic connection by ultrasonic waves or a combination thereof. Further, in the present invention, in the case where the upper surface of the convex portion 10a is not in contact with the heat radiation pattern 20b, the resin constituting the insulating layer 16 may be interposed. The dam 201 is next to the power supply pattern 20a by the adhesive 202. The dam body 201 can be formed, for example, by applying a hole shape of a dam body to an A1 plate of a predetermined thickness. The reflecting surface of the dam body 202 can be further applied as plating of Ni, Ag, Cu or the like. Thereafter, the inside of the dam 201 can be covered with a transparent resin, a fluorescent resin or the like. Further, a transparent resin lens having a convex surface may be disposed above it. By providing the transparent resin lens with a convex surface, it is possible to efficiently emit light from the substrate to the upper side. Further, the transparent resin lens may also be a colorant. The transparent resin lens or the like is not provided on the dam body 201, and may be formed by a known method such as embedding molding or bonding, or formed directly on the substrate. According to this, a transparent resin lens is coated (sealed) inside the dam 201, and a transparent resin lens is provided to constitute a light-emitting element package or a light-emitting element panel 201019514. A light-emitting element package is generally attached to a substrate on which a wiring pattern is formed. The package structure is such that the light emitting element package is mounted on a circuit substrate. Further, the light-emitting element package generally has a configuration in which a plurality of light-emitting elements are adhered to a substrate on which a wiring pattern is formed. Further, by interposing an adhesive on the upper surface of the power supply pattern 20a, it is possible to form a dam made of an insulating resin, and it is preferable to use a plating surface such as Ni or Ag to treat the reflecting surface, and to function as a reflector. The dam made of an insulating resin can be formed by applying a hole shape of a dam shape to an insulating resin plate having a predetermined thickness. As the substrate of the insulating resin sheet, a circuit board of an insulating resin can also be used. Next, an example of the substrate for mounting a light-emitting element of the present invention and a method for producing the same will be described based on the flow of the manufacturing steps shown in Figs. 2 to 4 . (1) The step of forming the convex portion 10a at least at the mounting position of the light-emitting element 30 by press-working the metal plate 10 (step S1). First, as shown in Fig. 3(a), the metal plate 10 is prepared. The metal plate 10 may be any one of a single layer or a laminate, and the metal may be any metal, and for example, copper, copper alloy, aluminum, stainless steel, nickel, iron, or an alloy thereof may be used. Among them, copper, copper alloy, and aluminum are preferred from the viewpoint of thermal conductivity or electrical conductivity. As described above, by providing the metal substrate having good heat dissipation, the temperature of the light-emitting element 30 can be prevented from rising. Therefore, the thermal resistance can flow in a large amount with a small driving current, and the amount of light emission can be increased. The thickness of the metal plate 10 is preferably 70 to 3 000 μm, and more preferably 70 to ΙΟΟΟμηη from the viewpoint of further improving heat dissipation. However, in the step shown in Fig. 3(f), in the case where a flat lower mold is used, the strength of the convex portion 10a of the metal plate 10 is preferably high, and at this time, the thickness of the metal plate 10 is 10 · 201019514 100~1000μιη is preferred. Next, as shown in Fig. 3(b), it is prepared to have the convex portion 42a lower mold 42 at a position facing at least the mounting position of the hair 30, and a concave portion 41a upper mold 41 at a position at the mounting position. When the lower die 42 41 is used to actuate the press device, it may be used as an accessory device as long as the convex portion 42a and the recessed portion 41a are possible, and may be used by interposing the press surface. Further, the lower mold 42 and the upper mold 41 can also be rotated, and at this time, a convex convex portion 10a is formed on the lower side. The convex portion 10a of the metal plate 10 obtained by e is determined by the shape and size of the upper mold 41 41a and the convex portion 42a of the lower mold '42. The height of the convex portion 10a (calculated from the upper surface of the metal plate 10) is preferably 60 to 150 μm from the viewpoint of heat dissipation from the convex portion 10a or thickness and properties of the insulating layer, and 60 to 100 μm is More preferably, the size of the upper surface of the convex portion l〇a may be smaller or larger than the hair 30 of the structure. For example, when it is circular, 400 μπι 10 10 ηηη on the upper surface is preferable. The shape of the upper surface of the convex portion 10a may be any one of a shape of a shape, a circle, or an ellipse, or may be formed continuously. Next, as shown in FIG. 3(c), the metal plate 10 is subjected to at least illumination. The mounting position of the element 30 forms the convex portion 10a. The conditions at this time are the same as those in the normal metal processing. Next, as shown in Fig. 3(d), demolding is performed, and when the lower mold 42 having the convex portion 42a is used later, only the upper mold 41 is preferably used. In the subsequent steps, the lower jaw 42 is released from the upper mold 41 without using the lower mold having the convex portion 42a. Positioning of the optical element opposite to the upper mold, the concave part of the upper and lower reverse stamping; the shape and the height of the heat conduction 〇 light element is a four-corner convex strip. I, the stamping step, and the stripping step 42, -11 - 201019514 (2) The step of forming the insulating layer 16 at least in the vicinity of the above-mentioned convex portion 10a (step S2). In the present embodiment, the laminate including the gold plate 10, the insulating layer forming material 16a, and the metal layer forming material 19a is heated and pressed, and a metal formed on the surface through the insulating layer 16 is obtained. The layer 19 is a step of a laminate having the convex portion A, and shows an example of implementation. In the example shown in Fig. 3(e), the insulating resin material belonging to the insulating layer forming material 16a and the copper foil belonging to the metal layer forming material 19a are copper foil to which the laminated integrated resin ® is applied. As shown in Fig. 3(f), the metal plate 10 is subjected to hot stamping from the press surface, whereby the insulating layer 16 and the metal layer 19 are simultaneously laminated, and at the same time, the position corresponding to the convex portion 10a of the metal plate 10 is formed. The laminated body of the convex portion A. At this time, it is preferable to arrange a plate material (for example, a cushioning material) that allows concave deformation between the pressing surface and the layered body. Further, a pressing surface having a concave portion may be used at a position corresponding to the convex portion 10a of the metal plate 10. The above-mentioned insulating resin materials and copper foils are available in various products on the market, and can be used in any of them. Further, the forming material of the insulating resin material and the forming material of the copper foil may be disposed separately. In this step, the sheet material is concavely deformed by the presence of the convex portion 10a of the metal plate 10 at the time of hot stamping, and thus the convex portion A corresponding thereto is formed on the laminated body. The method of heating and pressing can be carried out by using a heating and pressurizing device (vacuum hot stamping press, heat bonding device, heating press), etc., in this case, in order to avoid the incorporation of air, the environment can be made into a vacuum (vacuum bonding device, etc.) ). The conditions such as heating temperature and pressure can be appropriately set according to the material of the insulating layer forming material and the metal layer -12- 201019514, but the pressure should be 0.5 to 30 MPa. The insulating layer forming material 16a may be any material as long as it is cured by heating or the like at the time of lamination, and has heat resistance required for the wiring base. Specific examples thereof include various reaction-hardening resins such as polyamidoamine, phenol resin, and epoxy resin, or a composite (prepreg) such as glass fiber, ceramic fiber, or aromatic polyamide fiber (prepreg). . Further, the insulating layer forming material of the insulating layer 16 is preferably made of a material having high thermal conductivity, and for example, a resin containing a thermally conductive filler is exemplified. Φ The insulating layer 16 at this time has a thermal conductivity of 1.0 W/mK or more, but has a thermal conductivity of 1.2 W/mK or more, and a thermal conductivity of 1.5 W/mK or more. Thereby, the heat from the convex portion 10a can be efficiently radiated to the side of the metal plate 10. Here, the thermal conductivity of the insulating layer 16 can be appropriately selected in consideration of the blending amount and the particle size distribution of the thermally conductive filler, but when considering the coating property of the insulating adhesive before curing, generally, l〇W The upper limit of /mK is appropriate. The insulating layer 16 described above is preferably composed of a thermally conductive filler and a resin (insulating adhesive) which are metal oxides and/or metal nitrides. The metal oxide and the metal nitride are excellent in thermal conductivity and electrical insulation. The gold ruthenium oxide may be selected from the group consisting of alumina, yttria, yttria, and magnesia, and the metal nitride may be selected from boron nitride, tantalum nitride, or aluminum nitride, or may be used in combination of two or more kinds thereof. . In particular, among the above-mentioned metal oxides, alumina is preferable because an insulating adhesive layer having excellent electrical insulating properties and excellent thermal conductivity can be easily obtained, and the metal nitride can be easily obtained. Boron nitride is preferred for electrical insulation, 13-201019514, excellent thermal conductivity, and further lower dielectric constant. Thermally conductive fillings are suitable for inclusion of small-diameter fillings and large-diameter fillings. Accordingly, by using two or more kinds of dissimilar particles (particles having different particle size distributions), the heat transfer function of the large-diameter filling material and the large-diameter filling and the large-diameter filling are improved. The function of heat transfer between the resins can thereby increase the thermal conductivity of the insulating layer 16. From such a viewpoint, the average diameter of the small-diameter filler is preferably 0.5 to 2 μηη, more preferably 0.5 to Ιμηη. Further, the average diameter of the large-diameter filling material is preferably from 1 〇 to 40 μm, and more preferably from 15 to 20 μm. The resin constituting the insulating layer 16 described above is selected from the group consisting of metal oxides and metal nitrides, and is excellent in bonding strength with the metal plate 10 in a hardened state without impairing withstand voltage characteristics. In addition to the epoxy resin, the phenol resin, and the polyamidene, the various types of engineering plastics may be used alone or in combination of two or more. However, the epoxy resin is preferably excellent in bonding strength to metal. In particular, in the epoxy resin, a bisphenol aldehyde A type epoxy resin, a bisphenol aldehyde type F epoxy resin, and a water bisphenol aldehyde A type ring which are excellent in fluidity and excellent in miscibility with the above metal oxide and metal nitride. Oxygen® resin, water-added bisphenol aldehyde F-type epoxy resin, three-chain copolymer with water-added bisphenol aldehyde A-type epoxy resin at both ends, and water-filled bisphenol aldehyde F-type epoxy resin at both ends Segmented copolymers are better resins. The sheet material may be a material that allows concave deformation during heating and pressing, and examples thereof include cushion paper, rubber sheet, elastomer sheet, non-woven fabric, woven fabric, porous sheet, foam sheet, metal foil, and the like. Such as complexes and so on. In particular, a flexible material such as a cushioning paper, a rubber sheet, an elastomer sheet, a foam sheet, or the like is preferably elastically deformed. -14- 201019514 (3) A power supply pattern is formed on the insulating layer 16 (step S3). This step can be carried out, for example, by removing the convex portion A of the convex portion of the metal plate 10 to expose the convex portion 10a, and performing a step of etching the metal foil (metal layer 19). In the example shown in Fig. 3(g), the convex portion A is removed to expose the flat surface B. At the time of removal of the convex portion A, it is preferable that the height of the system { is the same as the height of the convex portion 10a. The method of removing the convex portion A is a method of honing or wheel grinding: a method, a belt sand blaster, and a wheel using a honing device having a hard rotary blade in the radial direction which is dominated by a hard blade such as a diamond. Grinding machines, plane honing machines, hard products, etc. When the honing device is used, the upper surface can be flattened by rotating the blade while fixing the supported wiring substrate. Further, the method of honing may be a method of performing light honing by a sand blaster or a semi-honing. When the laminated body is formed into the convex portion A, only this portion can be more reliably performed by the flattening of the honing system. Next, etching of the metal layer 19 is carried out, and before the third (h) pattern, the exposed convex portion 10a and the metal layer 19 are preferably formed to form the metal plating layer 20. Further, at least the method of plating the exposed metal is also possible. Metal-plated metal species, silver, nickel, etc. are preferred. The method of forming the metal plating layer 20, the predetermined pattern of the step portion 10a of the example 2a, the convex portion 10a, the metal layer 19 is removed and the flat is preferable, and can be placed on the rotating plate or used. The blasting grinding wheel granules move the hard spheroid on the top: using the belt to invent, when it is easy, so as shown in the whole, in the etched metal ore cover 'protrusion l〇a into, for example, copper, I can be cited as: -15- 201019514 A panel plating method in which a pattern is formed using an anti-corrosion agent, a pattern plating method in which plating is performed using a resist for pattern plating, and the like. Next, as shown in the fourth (i) to (j) diagram, the metal plating layer 20 and the metal layer 19' are etched in a predetermined pattern by using an anti-corrosive agent, thereby forming the spacer 20b and the power supply pattern 20a. The upper metal layer. Although the size of the spacer 20b may be larger or smaller than the size of the light-emitting element 30, for example, the diameter thereof is 400 μm to 10 mm. The shape of the upper surface of the spacer 20b may be any of a quadrangular shape and a circular shape. 0 The removal of the anti-corrosive agent , can be carried out by selecting the agent removal, peeling off, etc. depending on the type of the anti-corrosion agent Μ. For example, in the case of using a photosensitive ink formed by screen printing, it can be removed using a drug such as alkali. Further, in order to improve the reflection efficiency and the bonding property in the spacer 20b and the power supply pattern 20a, it is preferable to perform plating using a noble metal such as gold, nickel or silver. Further, a solder resist may be formed in the same manner as a conventional wiring board, or solder plating may be partially performed. (Another embodiment of the present invention) φ The method for manufacturing a substrate for mounting a light-emitting element according to the present invention includes, as shown in Fig. 5, a metal plate 1 , an insulating layer forming material 16a, and a metal. The laminate of the layer forming material 19a is subjected to hot stamping, and at least the convex portion i〇a is formed at the mounting position of the light-emitting element 30 of the metal plate 10, and the metal layer 19 formed on the surface through the insulating layer 16 is provided with the convex portion A. a step of laminating the body; a step of removing the convex portion a of the laminated body; and a step of etching the metal layer 19 to form the power supply pattern 2a. That is, 'the other manufacturing method of the present invention is different from the manufacturing method shown in Fig. 3'. The latter is stamped twice, and the first stamping processing system-16-201019514 forms a convex portion on the metal plate 10 a, in the second press working, the convex portion A is formed on the metal layer 19 on the surface. On the other hand, in the other manufacturing method of the present invention shown in Fig. 5, the first press working is performed on the metal plate 10. The convex portion l〇a is different at the same time as the convex portion A is formed on the metal layer 19 on the surface. Therefore, the steps from the steps shown in the fifth (d) diagram are the same. Hereinafter, only the differences will be described, and the other portions will be the same as those of the method of manufacturing the substrate for mounting a light-emitting element shown in Figs. 2 to 4 . First, as shown in Fig. 5(a), the metal plate 10, the insulating layer forming the e-material 16a, and the metal layer forming material 19a are prepared. Next, as shown in Fig. 5(b), it is prepared to have a convex portion 42a lower mold 42 at a position facing at least the mounting position of the light-emitting element 30, and a concave portion 41a at a position opposite to the mounting position. 41. The convex portion 42a of the lower mold 42 is designed to match the shape and size of the convex portion 10a of the formed metal plate 10. also. The concave portion 41a of the upper mold 41 is designed to match the shape and size of the convex portion A of the metal layer 19. Instead of using the upper mold 41 having the concave portion 41a, the upper mold 41, which is flat below, may be used, and the cushioning material may be interposed. Further, instead of a single-layer cushioning material, a metal plate (for example, a stainless steel plate) held by a cushioning material may be used. According to this, it is not necessary to produce the upper mold 41 having the concave portion 41a by using the cushioning material, and the formation of the convex portion and the formation of the insulating layer can be integrally performed by one-time hot stamping, and the problem of positional alignment is less likely to occur. Then, as shown in Fig. 5(c), the laminate including the metal plate 10, the insulating layer forming material 16a, and the metal layer forming material 19a is subjected to hot stamping, and at least the light emitting element 30 of the metal plate 10 is mounted. The metal layer 19 formed at the position of the convex portion 10a' at the same time as the transparent insulating layer 16 is obtained is a laminated body having a convex portion A from -17 to 201019514. Further, as shown in FIG. 5(d), the step of exposing the convex portion l〇a by removing the convex portion a above the convex portion 10a of the metal plate 1〇, and the metal in a predetermined pattern The foil (metal layer 19) is etched to form the power supply pattern 20a. These steps are the same as those shown in Figures 3-4. (Embodiment) (1) In the above embodiment, the lower side metal plate is an example of a panel-shaped lower side metal plate in which the zigzag pattern is not formed, but the metal plate can also be formed in a predetermined pattern. . In this case, it is also possible to form a pattern of indirect continuations of the layers below the adjacent illuminating elements by arranging a plurality of illuminating elements to make the series connection possible. At this time, the connection portion between the layers is connected to the cathode side electrode, and the other layer is indirectly connected to the anode side electrode. Moreover, the series connection and the connection may be used in combination. (2) In the above embodiment, the light-emitting element mounting substrate is an example of a light-emitting element mounting substrate and an electrode. However, the present invention can also form another electronic circuit on the same substrate. For example, a driver circuit or the like for forming a light-emitting diode is preferable. At this time, wiring, island portions, bonding pads, external electrical pads, and the like are patterned around the substrate, particularly at the corners and in the vicinity thereof, and wafer capacitors and chip resistors can be disposed between the wirings. And parts such as printed resistors, transformers, diodes, 1C, etc. (3) In the above embodiment, although the plating is performed on the upper surface of the metal layer 19, the present invention may not perform the plating on the metal layer 19, and the metal layer 19 may be uranium-engraved as it is. Therefore, it is possible to form a power supply diagram -18 - 201019514 case 20 a etc. (4) In the above embodiment, the insulating layer is formed by laminating an insulating layer forming material to form an insulating layer. However, the insulating layer may be formed by applying a resin such as a curtain coating material. At this time, by cutting or honing the entire surface or a part of the surface of the formed resin layer, the upper surface of the convex portion 10a of the metal plate 10 can be exposed. Thereafter, a metal layer is formed by plating or the like, and this is etched to form a power supply pattern 20a. (5) In the present invention, after the light-emitting element is mounted on the substrate or after the reflector is formed, one or more layers of the light-resistant film may be used to coat or encapsulate the surface. As the light-resistant film, a resin composition containing a fluorine-based resin or a methacrylate-based resin can be used. The fluorine-based resin may, for example, be a homopolymer or a copolymer of polyvinyl fluoride, polytetrafluoroethylene, polychlorotrifluoroethylene, polyhexafluoropropylene or polyvinyl fluoride. The methacrylate resin refers to a homopolymer of methacrylic acid (MMA), a copolymer of a single amount copolymerizable with methacrylic acid, a mixture of methyl acrylate and propylene rubber, and the like. The copolymerizable monomer can be a methacrylate having a carbon number of 2 to 4 and a butyl methacrylate as the first acrylate having a carbon number of 1 to 8, styrene, α-methylstyrene, and propylene. Nitrile, acrylic acid, other ethylenically unsaturated monomers. The phosphor may be contained in at least one layer of the light-resistant film. The phosphor may be a YAG: Ce phosphor which introduces an activator ruthenium into the phosphor precursor, and an activator 铕 is introduced into the phosphor precursor 矽 Ba•钡 Sr, Ba) 2Si〇4: Eu Oxide crabs such as luminescence, α-sialon (nitride sand) -19- 201019514 Nitride phosphors such as phosphors, β-Sialon phosphors, and copper, used Copper, aluminum, magnesium activated zinc sulfide, and the like. The particle diameter of the phosphor can be varied, for example, in the range of 0.001 to 20 μm, and since the light scattering can be increased in proportion to the particle diameter, it is preferable to use particles having a size of 1 to 2 μm or less, preferably 0.01 to 0.4 μm. Particles of the following sizes are preferred. An ultraviolet absorber, an oxidation inhibitor, a dispersant, a coupling agent, or the like may be used in at least one layer of the light-resistant film. (6) In the present invention, instead of using a heat pipe, a thicker gold φ plate may be laminated on the back side, and a layer formed of a heat conductive material may be formed on the back side. At this time, a structure in which the material is filled may be formed in the concave portion on the back side of the convex portion. A material having high thermal conductivity is preferably a metal matrix composite (MMC) which can improve heat transfer and radiation effects. The MMC may, for example, be a composite of aluminum and tantalum carbide, or a composite of aluminum and carbon. (7) In the present invention, instead of using a flat metal plate on the convex portion, as shown in Fig. 7(a) or Fig. 7(b), a convex portion having a sharp φ sharpened shape at the front end may be used. L〇a metal plate 10. The convex portion 10a having a sharpened shape at the tip end can be formed such that resin or the like does not easily remain on the upper surface of the convex portion 10a when the insulating layer 16 is formed. Specifically, a method of performing hot stamping by laminating the insulating layer forming material 16a or a method of applying a resin such as a curtain coating can form a sharp-shaped convex portion when the insulating layer 16 is formed on the metal plate 10. The front end of 10a is exposed or substantially exposed from the insulating layer 16. Then, the tip end of the convex portion 10a is cut or honed, and the convex portion 10a of the metal plate 10 can be flattened, and the light-emitting element can be mounted or the like in this portion. -20- 201019514 [Brief Description of the Drawings] Fig. 1 is a view showing an example of a substrate for mounting a light-emitting element of the present invention. Fig. 2 is a view showing an example of a flow of a manufacturing step of the substrate for mounting a light-emitting element of the present invention. The third embodiment shows an example of the flow of the manufacturing steps of the substrate for mounting a light-emitting element of the present invention. Fig. 4 is a view showing an example of a flow of a manufacturing step of the substrate for mounting a light-emitting element of the present invention. Fig. 5 is a view showing another example of the flow of the manufacturing steps of the substrate for mounting a light-emitting element of the present invention. Fig. 6 is a view showing another example of the main part of the substrate for mounting a light-emitting element of the present invention. [Main component symbol description] 10 metal plate 10a convex portion 10b groove portion 16 insulating layer 16a insulating layer forming material 19 metal layer 19a metal layer forming material 20 metal plating layer 20a for electricity use pattern 20b lining -21- 201019514
30 發光元件 3 1 電極 32 散熱用襯墊 40 熱管 4 1 上模 4 1a 凹部 42 下模 42a 凸部 20 1 壩體 202 接著劑 A 凸部 B 平坦面30 Light-emitting element 3 1 Electrode 32 Heat-dissipating pad 40 Heat pipe 4 1 Upper die 4 1a Recessed part 42 Lower die 42a Projection 20 1 Dam body 202 Adhesive A Convex B Flat surface
-22-twenty two