TWI462351B - Led light module and manufacturing method thereof - Google Patents
Led light module and manufacturing method thereof Download PDFInfo
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Description
本發明是有關於一種發光二極體發光模組及其製造方法。The invention relates to a light emitting diode light emitting module and a manufacturing method thereof.
目前許多電子產品皆是將電子元件安裝至印刷電路板而組成的。電子產品設計趨向於輕薄短小,內部的印刷電路板或電子元件的體積也需要相對的縮小。由於電子元件的體積已小到無法以人工方式焊在印刷電路板上。目前以錫膏印刷機將錫膏印刷於印刷電路板上預定的位置,再利用插件著裝機撿取電子零件並插於印刷電路板上。為求插裝之精確,插裝機上都會配備視覺系統來輔助定位,最後是經過迴焊爐加溫來熔化焊錫使電子零件黏著固定。Many electronic products are currently composed of electronic components mounted on a printed circuit board. Electronic product design tends to be thin and light, and the size of internal printed circuit boards or electronic components needs to be relatively reduced. Because the size of the electronic components is too small to be soldered to the printed circuit board manually. At present, the solder paste is printed on a predetermined position on the printed circuit board by a solder paste printing machine, and then the electronic component is taken by the plug-in dressing machine and inserted into the printed circuit board. In order to ensure the accuracy of the insertion, the visual system is equipped with a vision system to assist the positioning. Finally, the solder is heated by a reflow oven to melt the solder to fix the electronic components.
上述的迴焊製程是目前量產上將電子零件黏著於電路板上最常使用的方式。然而,因為迴焊製成需要加熱整個電子模組,即使迴焊製程的溫度不高,對某些電子模組而言,還是可能造成電子模組的損壞或變形,或是對電子模組的設計產生限制。The reflow process described above is currently the most commonly used method of mass-applying electronic components to a circuit board. However, because the reflow process needs to heat the entire electronic module, even if the temperature of the reflow process is not high, for some electronic modules, the electronic module may be damaged or deformed, or the electronic module may be Design creates limits.
有鑑於上述的問題,需要針對這些不適合使用迴焊製程的電子模組設計改良的製造流程。In view of the above problems, it is necessary to design an improved manufacturing process for these electronic modules that are not suitable for the reflow process.
因此,本發明之目的是在提供一種不使用迴焊製程發光二極體發光模組及其製造方法,藉以解決上述的問題。Accordingly, it is an object of the present invention to provide a light-emitting diode light-emitting module that does not use a reflow process and a method of fabricating the same, thereby solving the above problems.
根據上述的目的,提供一種不使用迴焊製程發光二極體發光模組製造方法,其基本上由以下步驟組成。提供一模組基板,其具有一導熱底板。將驅動積體電路裸晶粒與發光二極體裸晶粒依序固晶及打線於模組基板。將驅動積體電路裸晶粒與發光二極體裸晶粒一起封膠於模組基板上。According to the above object, a method for manufacturing a light-emitting diode light-emitting module without using a reflow process is provided, which basically consists of the following steps. A module substrate is provided having a thermally conductive substrate. The bare die of the integrated circuit and the bare die of the LED are sequentially crystallized and wired on the module substrate. The bare die of the driving integrated circuit is sealed on the module substrate together with the bare die of the LED.
依據本發明一實施例,導熱底板包含一鋁底板、銅底板或陶瓷底板。According to an embodiment of the invention, the thermally conductive substrate comprises an aluminum substrate, a copper substrate or a ceramic substrate.
依據本發明另一實施例,驅動積體電路裸晶粒為一線性定電流驅動電路。According to another embodiment of the present invention, the bare die of the driving integrated circuit is a linear constant current driving circuit.
依據本發明另一實施例,模組基板更包含絕緣層、銅箔層、防焊漆以及增高層。絕緣層覆蓋於導熱底板上。銅箔層覆蓋於絕緣層。防焊漆覆蓋於銅箔層。增高層覆蓋於防焊漆上,其中增高層具有複數凹陷裸露出銅箔層,藉以供驅動積體電路裸晶粒與發光二極體裸晶粒於該些凹陷內固晶及打線。According to another embodiment of the present invention, the module substrate further includes an insulating layer, a copper foil layer, a solder resist paint, and a high-rise layer. The insulating layer covers the thermally conductive substrate. The copper foil layer covers the insulating layer. The solder mask is covered on the copper foil layer. The high-rise layer is covered on the solder resist paint, wherein the upper layer has a plurality of recessed exposed copper foil layers, so as to drive the bare crystal grains of the integrated circuit and the bare crystal grains of the light-emitting diode to be fixed and lined in the recesses.
依據本發明另一實施例,此製造方法更包含裝設一光學透鏡於發光二極體裸晶粒上。According to another embodiment of the present invention, the manufacturing method further includes mounting an optical lens on the bare die of the light emitting diode.
根據上述的目的,提供一種不使用迴焊製程的發光二極體發光模組,其基本上由以下元件組成。一模組基板具有一導熱底板。複數發光二極體裸晶粒以金線連接至模組基板。複數驅動積體電路裸晶粒以金線連接至模組基板。一封膠材料封裝該些發光二極體裸晶粒與該些驅動積體電路裸晶粒於模組基板上。In accordance with the above objects, a light-emitting diode lighting module that does not use a reflow process is provided, which basically consists of the following components. A module substrate has a thermally conductive substrate. The bare LEDs of the plurality of LEDs are connected to the module substrate by gold wires. The bare die of the complex drive integrated circuit is connected to the module substrate by a gold wire. An adhesive material encapsulates the bare die of the LED and the bare die of the driving integrated circuit on the module substrate.
依據本發明一實施例,導熱底板包含一鋁底板、銅底板或陶瓷底板。According to an embodiment of the invention, the thermally conductive substrate comprises an aluminum substrate, a copper substrate or a ceramic substrate.
依據本發明另一實施例,驅動積體電路裸晶粒為一線性定電流驅動電路。According to another embodiment of the present invention, the bare die of the driving integrated circuit is a linear constant current driving circuit.
依據本發明另一實施例,模組基板更包含絕緣層、銅箔層、防焊漆以及增高層。絕緣層覆蓋於導熱底板上。銅箔層覆蓋於絕緣層。防焊漆覆蓋於銅箔層。增高層覆蓋於防焊漆上,其中增高層具有複數凹陷裸露出銅箔層,藉以供驅動積體電路與發光二極體之裸晶粒於該些凹陷內固晶及打線。According to another embodiment of the present invention, the module substrate further includes an insulating layer, a copper foil layer, a solder resist paint, and a high-rise layer. The insulating layer covers the thermally conductive substrate. The copper foil layer covers the insulating layer. The solder mask is covered on the copper foil layer. The high-rise layer is covered on the solder resist paint, wherein the upper layer has a plurality of recessed exposed copper foil layers, so as to drive the integrated circuit and the bare die of the light-emitting diode to solidify and wire in the recesses.
依據本發明另一實施例,此發光二極體發光模組更包含一光學透鏡位於發光二極體裸晶粒上。According to another embodiment of the invention, the LED module further includes an optical lens on the bare die of the LED.
本發明提出一種不使用迴焊製程的發光二極體光源模組及其製造方法。因發光二極體光源模組具有部份較易受到迴焊製程的加溫而造成變形或損壞,因此不使用迴焊製程能夠讓發光二極體光源模組的製造良率提昇且製程的設計能更彈性。請參照以下實施例與說明,藉以了解本發明之細節。The invention provides a light-emitting diode light source module without using a reflow soldering process and a manufacturing method thereof. Since the light-emitting diode light source module is partially deformed or damaged by the heating of the reflow process, the use of the reflow process can improve the manufacturing yield of the light-emitting diode light source module and the design of the process. Can be more flexible. Please refer to the following examples and descriptions to understand the details of the present invention.
請參照第1圖,其繪示依照本發明一實施方式的一種發光二極體光源模組。發光二極體光源模組100利用將發光二極體與驅動積體電路的裸晶粒直接封裝於其模組基板100a上,藉以省去迴焊製程。驅動積體電路用以將外部電源轉換成能夠驅動發光二極體的電源。在本實施例中,驅動積體電路可以是不同種類的驅動電路,但以線性定電流驅動電路在實務上較為便利,因使用線性定電流驅動電路,可以不需要增加被動元件(例如電感或電容),較容易實現省去迴焊製程的目的。舉例而言,發光二極體的裸晶粒可以固晶、打線並封膠於封裝區102a內,而驅動晶片的裸晶粒可以固晶、打線並封膠於封裝區102b內。此方式的優點是發光二極體與驅動晶片的裸晶粒不需要「先封裝在導線架上,再以迴焊製程固定在模組基板100a上」,因此不但避免了「迴焊製程」的缺點,也節省了『發光二極體與驅動晶片的裸晶粒先封裝在導線架上』的成本。本發光二極體光源模組不需再組裝到任何電路板,只要供應市電即可使封裝於其內的發光二極體發光。Please refer to FIG. 1 , which illustrates a light emitting diode light source module according to an embodiment of the invention. The light-emitting diode light source module 100 directly encapsulates the bare die of the light-emitting diode and the driving integrated circuit on the module substrate 100a, thereby eliminating the reflow process. The integrated circuit is driven to convert the external power source into a power source capable of driving the light emitting diode. In this embodiment, the driving integrated circuit may be different types of driving circuits, but the linear constant current driving circuit is convenient in practice, and the use of the linear constant current driving circuit does not require the addition of passive components (such as inductors or capacitors). ), it is easier to achieve the purpose of eliminating the reflow process. For example, the bare die of the light emitting diode can be crystallized, wired, and encapsulated in the package region 102a, and the bare die of the driving die can be crystallized, wired, and encapsulated in the package region 102b. The advantage of this method is that the bare die of the LED and the driving chip do not need to be “first packaged on the lead frame and then fixed on the module substrate 100a by a reflow process”, thereby avoiding the “reflow process”. Disadvantages also save the cost of "the bare die of the light-emitting diode and the driver chip are first packaged on the lead frame". The light-emitting diode light source module does not need to be assembled to any circuit board, and the light-emitting diode packaged therein can be illuminated as long as the commercial power is supplied.
眾所周知的,晶片構裝體的其中之一功用就是可以保護晶片免於受外界各種因素(例如外力、水、濕氣、化學物之破壞或腐蝕等),另一功能就是架構一完整的電流路徑來提供電流以推動晶片的電路運作。就上述兩功用而言,「構裝於導線架上」或「構裝於本案的模組基板上」都能達成所需的目的。As is well known, one of the functions of the wafer structure is to protect the wafer from various external factors (such as external force, water, moisture, chemical damage or corrosion), and another function is to construct a complete current path. To provide current to drive the circuit operation of the wafer. For the above two functions, "constructed on the lead frame" or "constructed on the module substrate of the present invention" can achieve the desired purpose.
請參照第2圖,其繪示沿第1圖之2-2’剖面線之剖面圖。此圖中只繪一顆發光二極體裸晶粒與一顆驅動晶片裸晶粒的封裝剖面。發光二極體裸晶粒108a封裝於模組基板的一凹陷114a內,而驅動晶片裸晶粒108b封裝於模組基板的另一凹陷114b內。Please refer to Fig. 2, which is a cross-sectional view taken along line 2-2' of Fig. 1. In this figure, only one exposed die of a light-emitting diode and a package profile of a bare die of a driving die are drawn. The LED die 108a is packaged in a recess 114a of the module substrate, and the driver die die 108b is packaged in another recess 114b of the module substrate.
模組基板的組成包含導熱底板101、絕緣層103、銅箔層105、防焊漆107以及增高層109(由下而上)。導熱底板101可以是鋁底板、銅底板或陶瓷底板,藉以增大發光二極體光源模組的散熱面積。銅箔層105用以構成發光二極體光源模組的電流路徑,藉以提供電流以推動晶片的電路運作。絕緣層103介於銅箔層105與導熱底板101之間,藉以電性阻絕兩者。防焊漆107位於銅箔層105上,藉以保護銅箔層105。凹陷114a、114b係形成於不透光的增高層109上,凹陷114a、114b的側壁具有反光的功能,藉以提昇光源模組整體發光的效能。The composition of the module substrate includes a thermally conductive substrate 101, an insulating layer 103, a copper foil layer 105, a solder resist 107, and a raised layer 109 (from bottom to top). The heat conducting base plate 101 can be an aluminum bottom plate, a copper bottom plate or a ceramic bottom plate, thereby increasing the heat dissipation area of the light emitting diode light source module. The copper foil layer 105 is used to form a current path of the light emitting diode light source module, thereby providing current to drive the circuit operation of the wafer. The insulating layer 103 is interposed between the copper foil layer 105 and the thermally conductive substrate 101, thereby electrically blocking both. The solder resist 107 is placed on the copper foil layer 105 to protect the copper foil layer 105. The recesses 114a and 114b are formed on the opaque upper layer 109. The sidewalls of the recesses 114a and 114b have a reflective function, thereby improving the overall light-emitting efficiency of the light source module.
發光二極體裸晶粒108a以固晶膠106固晶於凹陷114a內的銅箔層105上,而驅動積體電路裸晶粒108b以固晶膠106固晶於凹陷114b內的銅箔層105上,兩者分別以金線113打線連接至銅箔層105。最後,發光二極體裸晶粒108a與驅動積體電路裸晶粒108b再分別以封膠材料110封裝於凹陷114a/114b內。在發光二極體裸晶粒108a,可於封裝的同時加上光學透鏡112,藉以提昇光源的光通量與出光率。The LED die 108a is solidified on the copper foil layer 105 in the recess 114a by the die bonding glue 106, and drives the integrated circuit bare die 108b to be solidified in the copper foil layer in the recess 114b by the die bonding glue 106. At 105, the two are respectively connected to the copper foil layer 105 by a gold wire 113. Finally, the LED die 108a and the driver integrated circuit die 108b are respectively encapsulated in the recess 114a/114b with the encapsulant 110. In the LED die 108a, the optical lens 112 can be added at the same time as the package, thereby increasing the luminous flux and the light extraction rate of the light source.
晶片構裝體的另之一功用『有效帶走內部晶片電路在運作時所產生的熱能』。就本發光二極體光源模組而言,裸晶粒直接封裝於模組基板的凹陷內,其所產生的熱會以最短的路徑傳導至導熱底板101,藉其大面積的底面快速散熱。無論是發光二極體裸晶粒108a或驅動積體電路裸晶粒108b,本實施例中的設計之散熱的效果一定優於習知「先封裝於導線架,再焊接於電路基板」的設計。積體電路若「封裝於導線架內,再焊接於電路基板」,即使封裝材料的導熱效能再好,總是加長了傳熱路徑,因此散熱效能會變差。因此,對於高功率的發光二極體而言,本實施例之設計有助於發光二極體的散熱,使發光二極體使用壽命能有效加長。Another function of the wafer structure is to "effectively remove the thermal energy generated by the internal wafer circuit during operation". In the case of the light-emitting diode light source module, the bare die is directly encapsulated in the recess of the module substrate, and the heat generated by the bare die is transmitted to the heat-conductive substrate 101 in the shortest path, and the heat is quickly dissipated by the large-area bottom surface. The heat dissipation effect of the design in this embodiment is better than that of the conventional "first packaged on the lead frame and then soldered to the circuit substrate", whether it is the light emitting diode bare die 108a or the driving integrated circuit bare die 108b. . If the integrated circuit is "packaged in the lead frame and then soldered to the circuit substrate", even if the thermal conductivity of the package material is good, the heat transfer path is always lengthened, so the heat dissipation performance is deteriorated. Therefore, for the high-power light-emitting diode, the design of the embodiment contributes to the heat dissipation of the light-emitting diode, so that the service life of the light-emitting diode can be effectively lengthened.
請參照第3圖,其繪示依照本發明的一種使用迴焊製程的發光二極體發光模組製造方法300之流程圖。在步驟302中,先提供一模組基板,較佳的基板為具有良好散熱設計的模組基板(例如具有鋁底板、銅底板或陶瓷底板的模組基板)。在步驟304中,將驅動積體電路裸晶粒與發光二極體裸晶粒直接固晶及打線於模組基板上,此方式不先封裝晶粒於「導線架」,因此不需迴焊製程焊接晶粒的構裝體。在最後的步驟306中,將驅動積體電路裸晶粒與發光二極體裸晶粒封膠於模組基板上。模組基板上是以銅箔層構成電流路徑,因此不需要類似導線架的結構。本發光二極體光源模組不需再組裝到任何電路板,只要供應市電即可使封裝於其內的發光二極體發光運作。Please refer to FIG. 3, which is a flow chart of a method 300 for fabricating a light-emitting diode light-emitting module using a reflow process in accordance with the present invention. In step 302, a module substrate is first provided. The preferred substrate is a module substrate having a good heat dissipation design (for example, a module substrate having an aluminum substrate, a copper substrate, or a ceramic substrate). In step 304, the bare die of the integrated circuit and the bare die of the LED are directly crystallized and wired on the module substrate. This method does not package the die on the lead frame, so no reflow is required. The structure of the process welding die. In the final step 306, the bare die of the integrated circuit and the bare die of the LED are mounted on the module substrate. The copper foil layer forms a current path on the module substrate, so a structure like a lead frame is not required. The light-emitting diode light source module does not need to be assembled to any circuit board, and the light-emitting diode packaged therein can be operated as long as the utility power is supplied.
由上述本發明實施方式可知,應用本發明之發光二極體光源模組及其製造方法,不但能避免使用「迴焊製程」於發光二極體光源模組上。對於發光二極體的散熱效能而言,本發明之發光二極體光源模組也優於「發光二極體先封裝於導線架內,再焊接於電路基板」的設計。It can be seen from the above embodiments of the present invention that the LED light source module and the manufacturing method thereof of the present invention can avoid the use of a "reflow process" on the light emitting diode light source module. For the heat dissipation performance of the light-emitting diode, the light-emitting diode light source module of the present invention is also superior to the design that the light-emitting diode is first packaged in the lead frame and then soldered to the circuit substrate.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.
100‧‧‧發光二極體光源模組100‧‧‧Lighting diode light source module
100a‧‧‧模組基板100a‧‧‧Module substrate
102a‧‧‧封裝區102a‧‧‧Packing area
102b‧‧‧封裝區102b‧‧‧Packing area
101‧‧‧導熱底板101‧‧‧ Thermal base plate
103‧‧‧絕緣層103‧‧‧Insulation
105‧‧‧銅箔層105‧‧‧copper layer
106‧‧‧固晶膠106‧‧‧solid glue
107‧‧‧防焊漆107‧‧‧Anti-welding paint
108a‧‧‧發光二極體裸晶粒108a‧‧‧Lighting diode bare die
108b‧‧‧驅動積體電路裸晶粒108b‧‧‧Drive integrated circuit bare die
109‧‧‧增高層109‧‧‧
110‧‧‧封膠材料110‧‧‧ Sealing material
112‧‧‧光學透鏡112‧‧‧ optical lens
113‧‧‧金線113‧‧‧ Gold wire
114a‧‧‧凹陷114a‧‧‧ dent
114b‧‧‧凹陷114b‧‧‧ dent
300‧‧‧製造方法300‧‧‧Manufacture method
302-306‧‧‧步驟302-306‧‧‧Steps
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:第1圖係繪示依照本發明一實施方式的一種發光二極體光源模組。The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; group.
第2圖係繪示沿第1圖之2-2’剖面線之剖面圖。Fig. 2 is a cross-sectional view taken along line 2-2' of Fig. 1.
第3圖係繪示依照本發明的一種使用迴焊製程的發光二極體發光模組製造方法之流程圖。3 is a flow chart showing a method of manufacturing a light-emitting diode light-emitting module using a reflow process according to the present invention.
300...製造方法300. . . Production method
302-306...步驟302-306. . . step
Claims (10)
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US10208935B2 (en) | 2015-12-15 | 2019-02-19 | Wangs Alliance Corporation | LED lighting apparatus with adjustable beam angle lens |
US11686459B2 (en) | 2015-12-15 | 2023-06-27 | Wangs Alliance Corporation | LED lighting methods and apparatus |
CN110985903B (en) | 2019-12-31 | 2020-08-14 | 江苏舒适照明有限公司 | Lamp module |
US11598517B2 (en) | 2019-12-31 | 2023-03-07 | Lumien Enterprise, Inc. | Electronic module group |
CN111503556B (en) | 2020-04-23 | 2020-11-27 | 江苏舒适照明有限公司 | Spotlight structure |
TWI829077B (en) * | 2021-06-04 | 2024-01-11 | 群創光電股份有限公司 | Electronic device |
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JP2002040955A (en) * | 2000-07-25 | 2002-02-08 | Sanyo Electric Co Ltd | Display device |
JP2006332618A (en) * | 2005-04-25 | 2006-12-07 | Naoya Yanase | Electronic component mounting substrate, and manufacturing method thereof |
JP2008211132A (en) * | 2007-02-28 | 2008-09-11 | Koa Corp | Light-emitting component |
WO2010035788A1 (en) * | 2008-09-25 | 2010-04-01 | デンカAgsp株式会社 | Substrate for mounting light-emitting element and method for producing same |
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JP2002040955A (en) * | 2000-07-25 | 2002-02-08 | Sanyo Electric Co Ltd | Display device |
JP2006332618A (en) * | 2005-04-25 | 2006-12-07 | Naoya Yanase | Electronic component mounting substrate, and manufacturing method thereof |
JP2008211132A (en) * | 2007-02-28 | 2008-09-11 | Koa Corp | Light-emitting component |
WO2010035788A1 (en) * | 2008-09-25 | 2010-04-01 | デンカAgsp株式会社 | Substrate for mounting light-emitting element and method for producing same |
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