JP2008211132A - Light-emitting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting component that reduces the dispersion in the luminous intensity of the light-emitting component and has a natural light-emitting state, even if a plurality of light-emitting components are arranged and used. <P>SOLUTION: An LED 2 and one portion of circuit members for driving the LED 2, namely transistors 5A, 5B, a conductor 15, pads 15Ca-15Cf, and a gold wire 16, are arranged on the surface of a substrate 4. The LED 2 is arranged at the center on the surface of the substrate 4. A partial or entire circuit member for drive is arranged over not less than 180 degrees around a light-emitting element on a substrate surface. In the circuit members for drive arranged around the LED 2, the transistors 5A, 5B are higher than the LED 2. A recess 13 is provided, and on the bottom surface of the recess 13, one portion of the circuit members for drive, namely the transistor 5A, 5B, the conductor 15, a pad 15Ca, or the like, and the gold wire 16, is arranged. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting component.

  The range of applications of light-emitting components typified by light-emitting diodes (LEDs) is expanding. This LED has a variation in the forward voltage (Vf) of the LED itself, and it is difficult to accurately control the brightness of each LED even if they are produced at the same time. In view of this, a technique has been proposed in which an LED and its driving integrated circuit chip are packaged together on a substrate and accurately controlled so that the luminance of each LED matches with the driving integrated circuit chip (see Patent Document 1). ).

JP 2005-64445 A

  However, since the light emitting component has members other than the LED, it may be insufficient to simply control the luminance of the LED in order to make the light intensity uniform. Such light emitting components are often used as a group of light emitting components arranged in a plurality. Therefore, even if the luminous intensity of each light emitting component is made uniform, it is desirable to eliminate as much as possible the unnaturalness of the light emitting state when used as a light emitting component group.

  Therefore, the problem to be solved by the present invention is to provide a light-emitting component having a natural light emission state even when used as a group of light-emitting components arranged in a plurality, while reducing variations in luminous intensity of the light-emitting components.

  In order to solve the above-described problems, a light-emitting component of the present invention includes a light-emitting element that emits light on a substrate surface and a circuit member for driving the light-emitting component, and the light-emitting element is disposed in the center of the substrate surface. The part or the whole is arranged around the light emitting element on the substrate surface.

  According to the present invention, since the light emitting element is arranged at the center of the substrate surface, even when a plurality of light emitting components are used side by side, the light emission position can be prevented from shifting, and a natural light emitting state can be realized. Further, by disposing a part or all of the driving circuit member around the light emitting element on the substrate surface, the light emitted from the light emitting element is reflected to the driving circuit member, and the light is dispersed without being unevenly distributed, The light emission state can be stabilized, and as a result, the variation in luminous intensity of the light emitting component can be reduced.

  In order to solve the above-described problems, a light-emitting component of the present invention includes a light-emitting element that emits light on a substrate surface and a circuit member for driving the light-emitting element, and part or all of the circuit member for driving is around the light-emitting element on the substrate surface. It is arranged over 180 degrees.

  According to the present invention, by arranging a part or all of the driving circuit member around the light emitting element on the substrate surface, the light emitted from the light emitting element is reflected to the driving circuit member, and the light is not unevenly distributed. To stabilize the light emitting state, and as a result, the variation in luminous intensity of the light emitting component can be reduced. Further, since the arrangement extends over 180 degrees around the light emitting element on the substrate surface, the light can be dispersed in a state in which the uneven distribution of the light is further suppressed. Therefore, in the present invention, even if the light emitting element is not arranged in the center of the substrate surface, the dispersed light expands the light emitting position. As a result, when used as a group of a plurality of light emitting components, the light emission state becomes natural.

  In another invention, in addition to the above-described invention of the light emitting component, the substrate has a recess, and the light emitting element and a part or all of the driving circuit member are arranged on the bottom surface of the recess. By adopting this configuration, the light emitted from the light-emitting element is reflected on the inner wall surface of the recess, and the light is dispersed without being unevenly distributed to stabilize the light emission state. Can be reduced.

  In another invention, in addition to the above-described light-emitting component invention, the light-emitting component has a penetrating member having a through-hole, and the penetrating member is fixed to the substrate surface so that the opening of the through-hole faces the substrate surface. The light emitting element and a part or all of the driving circuit member are accommodated in the through hole. By adopting this configuration, the light emitted from the light emitting element is reflected on the inner wall surface of the through hole, and the light is dispersed without being unevenly distributed, and the light emitting state is stabilized. Variations can be reduced.

  In another invention, in addition to the above-described invention of the light-emitting component, the inside of the recess or the through hole is filled with a translucent resin, and the translucent resin exists only in the inside of the recess or the through hole. Yes. By adopting this configuration, the translucent resin does not overflow from the recess or the through hole. Therefore, the light emission state stabilized inside the concave portion or the through hole is not disturbed by the translucent resin overflowing from the concave portion or the through hole and having a difficult shape.

  In another invention, in addition to the above-described invention of the light-emitting component, the driving circuit member has a plurality of resistance elements, and the plurality of resistance elements are arranged on the substrate surface opposite to the side where the light-emitting elements are arranged. ing. By adopting this configuration, the driving circuit member can be arranged on both surfaces of the substrate, and the light-emitting component can be reduced in size by effectively utilizing the substrate surface.

  In another aspect of the invention, in addition to the above-described invention of the light-emitting component, the drive circuit member constitutes a constant current circuit by a part or all of the drive circuit member, and the constant current circuit has a plurality of resistance elements. Two or more of them are arranged on the substrate surface opposite to the side where the light emitting element is arranged, and the resistance value is adjusted so that the luminous intensity of the light emitting element falls within a predetermined range. By adopting this configuration, the driving circuit member can be arranged on both surfaces of the substrate, and the light-emitting component can be reduced in size by effectively utilizing the substrate surface. Moreover, the constant current characteristic which maintains a constant current of the constant current circuit having a plurality of resistance elements can be maintained high.

  According to the present invention, it is possible to provide a light emitting component having a natural light emitting state even when a plurality of light emitting components are arranged side by side, while reducing variation in luminous intensity of the light emitting component.

  Hereinafter, light-emitting components according to embodiments of the present invention will be described. In the description, each component member and the constant current circuit configuration will be described separately with reference to the drawings, and the function of the light-emitting component will be described together with the constant current circuit configuration. The method for manufacturing the light-emitting component will be described last.

  FIG. 1 shows a perspective view of the surface side of a light emitting component 1A according to an embodiment of the present invention. 2 shows a six-sided view of the light-emitting component 1A, where (A) is a plan view of the light-emitting component 1A, (B) is a front view, (C) is a right-side view, and (D) is a left-side view. (E) is a rear view, and (F) is a bottom view.

  The light emitting component 1A will be described. The light-emitting component 1A includes a light-emitting element (LED 2) that mainly emits light, a resistance element 3, a substrate 4 on which they are arranged, and a transistor 5. The LED 2 and a part of the driving circuit member (transistors 5A and 5B, the conductor 15, the pads 15Ca to 15Cf, and the gold wire 16) are disposed on the substrate 4, and the LED 2 is disposed in the center of the surface of the substrate 4 and is driven. A part or all of the circuit member for use is arranged over 180 degrees around the light emitting element on the substrate surface. Of the driving circuit members disposed around the LED 2, the transistors 5 </ b> A and 5 </ b> B are taller than the LED 2. Hereinafter, when the two transistors 5A and 5B are collectively referred to, or when the two transistors 5A and 5B and a field effect transistor 5C to be described later are collectively referred to, they are appropriately referred to as transistors 5. The light emitting component 1A has a concave portion 13, and the LED 2 and a part of the driving circuit member (transistors 5A and 5B, the conductor 15, the pad 15Ca, etc., the gold wire 16) are arranged on the bottom surface of the concave portion 13. Yes. The light emitting component 1 </ b> A has a through member 12 having a through hole 12 </ b> C that becomes the recess 13. The penetrating member 12 is fixed to the surface of the substrate 4 such that the opening of the through hole 12C faces the surface of the substrate 4, and a part of the driving circuit member (transistors 5A, 5B, conductor 15, pad). A gold wire 16) such as 15Ca is accommodated in the through hole 12C. And the inside of the through-hole 12C used as the recessed part 13 is filled with translucent resin (illustration omitted). This translucent resin exists only inside the through hole 12 </ b> C serving as the recess 13. The driving circuit member has a plurality of resistance elements 3. The plurality of resistance elements (resistance elements 3A and 3B in this embodiment) are arranged on the surface opposite to the side where the LED 2 is arranged. Hereinafter, when referring to the two resistance elements 3A and 3B together, or in some cases, when referring to the two resistance elements 3A and 3B and a third resistance element 3C to be described later, the resistance elements 3 are appropriately described. . And the circuit member for a drive comprises the constant current circuit in part or all. This constant current circuit has a plurality of resistance elements 3A and 3B. The resistance values of the plurality of resistance elements 3A and 3B are adjusted so that the luminous intensity of the LED 2 falls within a predetermined range.

(About each component)
The substrate 4 constituting the light emitting component 1A is made of alumina ceramic having a rectangular outer shape having semicircular cutout portions (in this embodiment, two cutout portions in total in this embodiment) on a pair of opposing sides. When the length of the pair of sides is y (2.8 mm) and the length of the other pair of opposite sides different from the pair of sides is x (3.5 mm), x / y The ratio value is 1.25. The thickness of the substrate 4 is 1.5 mm. The substrate 4 may be made of a ceramic other than alumina ceramic, such as aluminum nitride, or a resin type such as a glass fiber mixed epoxy resin molded body.

  The surface of the substrate 4 is covered with a penetrating member 12 constituting a part of the light emitting component 1A, a translucent resin (not shown) filled in the through hole 12C of the penetrating member 12, and the translucent resin. Of the bonding wire (gold wire 16) that electrically connects the member to be connected, that is, the transistor 5, the conductor 15, the pads 15Ca, 15Cb, 15Cc, 15Cd, 15Ce, 15Cf and the LED2 and the transistor 5 and the pads 15Ca-15Cf. Each member is formed or arranged. And on the back surface of the substrate 4, there are four back surface electrodes 15E disposed in semicircular cutouts on a pair of opposite sides of the substrate 4, and protrusions called bumps 21 disposed on each back surface electrode 15E. And two pairs of T-shaped resistance electrodes 15B derived from each back electrode 15E, a resistor film 18 disposed so as to overlap both of the pair of resistance electrodes 15B, and all of the resistor films 18 A glass film 19 that covers almost all of the resistance electrode 15B, a resistor 18 and a trimming groove 23 formed in the glass film 19 for adjusting the resistance value, and a glass film 19 on the glass film 19 to protect the trimming groove 23 A placed overcoat film 20 is disposed. On the side surface of the substrate 4, a side electrode 15 </ b> D that electrically connects the back electrode 15 </ b> E and the conductor 15 on the surface of the substrate 4 is disposed in a semicircular cutout.

  The penetrating member 12 having a cylindrical through-hole 12 </ b> C has a substantially rectangular shape when viewed from the upper surface where the x direction and the y direction have the same length with respect to the substrate 4. The penetrating member 12 is fixed to the surface of the substrate 4. This penetrating member 12 is a molded body of a liquid crystal polymer resin. This liquid crystal polymer is a resin having good heat dissipation, and is advantageous in releasing the heat generated by the resistance element 3 or the transistor 5 and maintaining the characteristics of the resistance element 3 and the transistor 5. In order to obtain the heat dissipation property, polyphenylene sulfide (PPS), polyphenylene ether (PPE) or the like can be used instead of the liquid crystal polymer resin.

  The penetrating member 12 is fixed to the substrate 4 such that the through hole 12 </ b> C faces the surface of the substrate 4. As a result, the through-hole 12 </ b> C portion becomes a cavity (concave portion) 13 whose bottom surface is the surface of the substrate 4. As another member corresponding to both the penetrating member 12 having such a recess 13 and the substrate 4, for example, LTCC (Low Temperature Co-fired Ceramics) in which glass or the like is included in ceramic powder is used. It is a member obtained by a method in which a portion corresponding to the substrate 4 and a portion corresponding to the penetrating member 12 including the recess 13 are integrally molded and fired under conditions of good moldability. At this time, the concave portion 13 is provided in the substrate 4. The shape of the recess 13 is appropriately determined from the viewpoint of the shape of the light emitting component 1A, the number of drive circuit members of the LED 2 housed in the recess 13 such as the transistor 5, or the specifications of the light emitting component 1A, the strength of the penetrating member 12, and the like. Its shape or size can be adopted. Speaking of the shape of the through hole 12C, a cylindrical shape, a truncated cone shape, a rectangular parallelepiped shape, or the like can be adopted.

  The penetrating member 12 has a cutout portion called a cathode mark 12A at one of the four corners of the upper surface. This cathode mark 12A plays a role of making the mounting direction known when mounting the light emitting component 1A on the mounting board. The cathode mark 12A is important for the light-emitting component 1A using the substrate 4 having a square shape or a rectangular shape close thereto. Further, the penetrating member 12 has a thin portion 12B on a pair of end sides in the longitudinal direction (x direction). The thin portion 12B plays a role of facilitating the division process described later.

  On the floating island-shaped conductor 15 that is formed at the center of the bottom surface of the recess 13 and is not connected to the other conductors 15 formed on the surface of the substrate 4, the LED 2 is located on the opening side of the recess 13. It arrange | positions so that it may light-emit toward. The arrangement of the LED 2 at the center of the recess 13 and the arrangement of the drive circuit member surrounding the LED 2 concentrate the light in the direction of the opening of the recess 13 and project light in an unintended direction. This is advantageous in that it can be suppressed. In addition, you may make it arrange | position LED2 not in the center of the recessed part 13, but in the position slightly decentered. The arrangement of the LED 2 at the center of the bottom surface of the concave portion 13 means that the LED 2 is arranged so as to cover the center of the circle on the bottom surface of the concave portion 13 having a circular shape in the plan view of FIG. With this arrangement, the light of the LED 2 can be uniformly reflected and dispersed on the inner wall surface of the recess 13 without being unevenly distributed. Further, by disposing the transistor 5 and the pads 15Ca to 15Cf so as to surround the LED 2, the reflected light to each member of the LED 2 is dispersed, and the dispersed light can be made uniform. As a result, the change in luminous intensity in the light emitting direction of the light emitting component 1A can be reduced, and the direction dependency of the luminous intensity of the light emitting component 1A, that is, the variation in luminous intensity depending on the mounting direction can be reduced.

  Moreover, when LED2 is arrange | positioned so that LED2 may light-emit toward the opening part side of the recessed part 13, it is preferable to provide a light reflection layer in the inner surface (side surface and / or bottom face) of the recessed part 13. FIG. The reason is that the light reflection layer can promote the reflection of the light applied to the inner surface of the recess 13 so as not to decrease the light amount of the light emitting component 1A. For the arrangement of the light reflecting layer, a thin film forming technique such as a plating method or a sputtering method, a technique for attaching a metal foil, or the like can be employed. The material of the light reflecting layer can be a metal such as nickel, copper, gold, silver, titanium, or platinum. Moreover, a light reflection layer can be formed by laminating two or more of these metals. Furthermore, a light reflection layer can be formed using an alloy composed of two or more of these metals.

  The LED 2 is disposed at the center of the substrate 4. The arrangement of the LED 2 at the center of the substrate 4 means that, for example, in the case of the rectangular substrate 4, the LED 2 is arranged so as to cover the intersection of two diagonal lines when viewed from the upper surface. Thus, the advantage of disposing the LED 2 in the center of the substrate 4 is that even when a plurality of light emitting components 1A are arranged and used, the LEDs 2 can be disposed at equal intervals and a natural light emitting state can be realized. This advantage, that is, the advantage of disposing the LED 2 in the center of the substrate 4 can be obtained regardless of whether the LED 2 is disposed on the bottom surface of the recess 13 described above. Here, as another method for obtaining this advantage, there is a method in which the arrangement positions of the LEDs 2 are set to the same positions on the substrate 4 for all the plurality of light emitting components 1A. This method may be adopted. However, when such a method is adopted, when mounting each light emitting component 1A on the mounting substrate, a burden of aligning the mounting direction occurs.

  The light emitting element according to the embodiment of the present invention is LED2. However, instead of the LED 2, for example, an EL element such as a semiconductor laser or organic EL (electro-luminescence), or another light emitting element such as a fluorescent display tube can be used.

  The driving circuit member of LED 2 comprising the transistor 5 constituting the light emitting component 1A, the conductor 15, the pads 15Ca to 15Cf in contact with the conductor 15 and the LED 2 and the gold wire 16 electrically connecting the transistor 5 and the pads 15Ca to 15Cf is It is arranged around. With such an arrangement, as described above, the light emitted from the LED 2 is reflected to the transistor 5, the conductor 15, and the pads 15Ca to 15Cf to disperse the light without being unevenly distributed. As a result, the light emitting component 1A Variation in luminous intensity can be reduced. In addition, by adopting this configuration, even when the LED 2 cannot be arranged at the center of the bottom surface of the recess 13, it is possible to promote the dispersion of light and reduce the change in luminous intensity in the light emitting direction of the light emitting component 1 </ b> A. Furthermore, since the dispersed light expands the light emitting point, the light emission state becomes more natural when used as a light emitting component group in which a plurality of light emitting components 1A are arranged.

  In addition, the reflection of this light is caused by diodes 11A and 11B (hereinafter referred to as the two diodes together as the drive circuit member of the LED 2 of the light emitting components 1B and 1C described later). When the diode 11C is also referred to, the diode 11 can be obtained by arranging the diode 11 around the LED 2 when the diode 11C is included (FIGS. 4, 5, 6, and 7). See). Similarly, when the electrolytic effect type transistor 5C is included as a driving circuit member of the LED 2 of the light emitting component 1D to be described later, the electrolytic effect type transistor 5C can also be obtained by arranging it around the LED 2 (FIG. 8). And see FIG. 9). Moreover, like the light-emitting components 1A, 1B, 1C, 1D, by disposing the drive circuit member over 180 degrees around the LED 2, the light is dispersed in a state in which the uneven distribution of light is further suppressed. it can.

  Here, it is preferable that the transistor 5 and / or the diode 11, which is a part of the driving circuit member of the LED 2, disposed around the LED 2 have a smaller height than the LED 2. By doing so, the light emitted from the LED 2 can be easily calculated, and the dependence of the luminous intensity on the emission direction is reduced. That is, the variation in luminous intensity of the LED 2 can be further reduced. However, even if the height of the transistor or the like is increased, if the LED 2 is disposed so as to surround it, the direction of light is dispersed, which is preferable. Similarly, the inner wall surface of the recess 13 of the penetrating member 12 has an effect of reflecting / dispersing the light emitted from the LED 2 as described above. In addition, by arranging the transistor 5 and / or the diode 11 around the LED 2, when they are electrically connected to each other by wire bonding or the like using the gold wire 16, the workability is good and advantageous.

  All of the transistor 5 and the LED 2 constituting the light emitting component 1 </ b> A are disposed in the recess 13. However, part or all of the transistor 5 and other driving circuit members may be arranged avoiding the recess 13. The same applies to the case where the diode 11 or the field effect transistor 5C is included as a circuit member for driving the LED 2 of the light emitting components 1B, 1C, 1D described later.

  The transistor 5 and the LED 2 constituting the light emitting component 1A are electrically connected using a gold wire 16 by a so-called wire bonding technique. However, this electrical connection may be realized by so-called flip chip bonding. In flip-chip bonding, a protrusion called a bump (electrode terminal) for wiring between the transistor 5 and the LED 2 is provided on the lower surface of the light emitting component 1A, and the bump is connected to the land of the mounting substrate on which the light emitting component 1A is mounted. The land pattern is used to realize electrical connection.

  The recess 13 is filled with a translucent resin (not shown). This translucent resin also plays a role of maintaining an electrical connection state between the LED 2, the transistor 5, the gold wire 16, and the like. This translucent resin exists only inside the recess 13. Silicone resin is used as the translucent resin. This silicone-based resin can suppress deterioration of the sealing resin when many components in the ultraviolet region are included among the light components emitted from the LED 2. However, other materials (for example, epoxy resin) can be used depending on the specification, application, luminous intensity, etc. of the light emitting component 1A. The translucency of the translucent resin can be changed / adjusted depending on the specification, application, luminous intensity, etc. of the light emitting component 1A. Further, the translucent resin may be filled only inside the recess 13 like the light emitting component 1A, or may be filled in a state of overflowing from the inside of the recess 13 to the outside. However, when the translucent resin overflows from the inside of the recess 13 to the outside, the light emitting state of the light emitting component 1A tends to become unstable. The reason is that the translucent resin in the portion overflowing from the concave portion 13 is difficult to be fixed in shape, and it is considered that the light emitting state of the light emitting component 1A may be disturbed. Note that the light emission state of the light-emitting component 1 </ b> A can be stabilized by adjusting the shape such that the translucent resin overflows from the recess 13 and has a uniform height over the entire upper surface of the penetrating member 12. Further, a translucent resin may be provided so as to protrude spherically from the concave portion 13, that is, a translucent resin may be provided so as to fulfill the function of a convex lens. In this way, the light emitted from the LED 2 becomes light that is focused at a predetermined distance, which is effective when it is desired to increase the luminous intensity. Conversely, if the upper surface of the translucent resin is made to be a concave mirror, the light from the LED 2 diverges, which is advantageous when it is desired to make the amount of light uniform.

Two thick film resistive elements 3 are arranged on the back surface of the substrate 4. Instead of this thick film, a thin film may be used. The resistance element 3 is derived from the back electrode 15E which is a part of the conductor 15, and is integrated with the resistor film 18 which contacts both of the paired T-shaped resistance electrodes 15B and a resistance value adjusting resistor. A trimming groove 23 is provided as a constituent element.
Further, only one resistive element 3 having the resistive film 18 may be sufficient as in a light emitting component 1D described later (see FIGS. 3D, 8 and 9). Further, the number of the resistive elements 3 having the resistive film 18 may be increased to three, four, or five or more. Further, instead of the thick resistor film 18, a chip-type trimmable chip resistor capable of trimming (resistance value adjustment) may be used.

  A thick glass film 19 for covering and protecting the thick resistor film 18 and the resistance electrode 15B is exposed on the back surface of the substrate 4 while exposing the back electrode 15E and the trimming groove 23. 4 is arranged in substantially the entire region except for both ends in the x direction on the back surface. An epoxy resin-based overcoat film 20 for covering and protecting the trimming groove 23 remaining when trimmed from above the glass film 19 is formed between the pair of resistance electrodes 15B and the glass film 19. It arrange | positions at strip | belt shape so that the x direction center part may be covered in a line form in the y direction. Then, two bumps 21 that are protruding conductive members are arranged on each back electrode 15E. Although the glass film 19 covers substantially the entire back surface of the substrate 4 to the extent that the back electrode 15E is exposed, the glass film 19 may cover a part or all of the resistor film 18.

  Here, the resistive element 3 having the resistive film 18 has a portion where the thick resistive film 18 is in contact with both the thick resistive electrode 15B. The thick overcoat film 20 that protects the resistance element 3 is disposed so as not to overlap the contact portion. This contact portion is usually a portion where the resistance electrode 15B and the resistor film 18 overlap, and is a convex portion whose thickness is larger than other portions. If there is a large convex portion in the shape of the light-emitting component 1A, it is difficult to bulk supply a large number of light-emitting components 1A in a bag and arrange and supply them in a predetermined direction with a parts feeder. Further, when the convex portion is at a position facing the mounting substrate surface on which the light emitting component 1A is mounted, external terminal electrodes (a side electrode 15D, a back electrode 15E, which will be described later, and a bump 21 are used as constituent elements. .) And the land on the mounting substrate surface may be obstructed by solder or the like. Therefore, it is preferable that the overcoat film 20 be disposed so as to avoid the convex portions as in the light emitting component 1A and the light emitting components 1B, 1C, and 1D described later (FIGS. 2F and 5F). FIG. 7 (F) and FIG. 9 (F)). Further, the bumps 21 have a role for ensuring the adhesion between the external terminal electrodes and the lands on the mounting substrate surface. However, the resistive element 3 having the resistor film 18 is mainly composed of a thin film, and when the height of the convex portion is low, the overcoat film 20 is not disposed avoiding the convex portion, and the substantially entire back surface of the substrate 4 is not disposed. It may be covered. However, in this case, it is necessary to expose at least the bump 21, and it is preferable to expose the back electrode 15E portion.

  A resistive element 3 disposed on the back side of the substrate 4 and constituting the light emitting component 1A, and an LED 2 and a driving circuit member (conductor 15, pads 15Ca to 15Cf, transistor 5 on the surface of the substrate 4 opposite to the resistive element 3) Are connected through four side electrodes 15D which are conductors arranged on the side surfaces of the four semi-cylindrical spaces exposed on the end face of the substrate 4. With this configuration, the electrical connection between the resistance element 3 on the back surface of the substrate 4 and the LED 2 or the driving circuit member (for example, the transistor 5 and / or the diode 11) on the front surface of the substrate 4 is made without providing an extra hole in the substrate 4. Has advantages that can be realized. However, the electrical connection is realized through an end face of the substrate 4 which is not a side surface of the semi-cylindrical space, through a through hole provided inside the substrate 4 or through an electric wire such as a gold wire 16. Also good.

  Another advantage of arranging the side electrode 15D on the inner side surface of the semi-cylindrical space is that the light emitting component 1A may be easily manufactured. That is, when the side electrode 15D is formed by a through-hole printing method to be described later, it can be formed at the same time as the electrodes constituting the resistance element 3. Therefore, there is no need to bother to form the side electrode 15D only on the end surface of the substrate 4 in a separate process. Then, by performing a subsequent dividing step described later, the large insulating substrate is divided along a straight line passing through the center of the circular through hole, and the side surface of the semi-cylindrical space in which the side electrode 15D is disposed can be obtained. . In this embodiment, the place where the side electrode 15D is disposed is the side surface of the semi-cylindrical space. However, if the through-hole printing method, which will be described later, can be used, a rectangular parallelepiped space, a semi-cylindrical space can be used instead of the semi-cylindrical space. Other space shapes such as an elliptical column space may be used, and the side electrode 15D may be disposed on the inner side surface thereof.

  In addition, in order to improve the solder wettability of the external terminal electrodes 15Fa to 15Fd for soldering to the land of the mounting substrate on which the light emitting component 1A is mounted, the external terminal electrodes 15Fa to 15Fd including the side electrode 15D are provided. Usually, a nickel plating layer and a solder plating layer (not shown) are arranged in this order by a barrel plating method in a plating process described later. Here, each of the external terminal electrodes 15Fa to 15Fd has a side electrode 15D, a back electrode 15E, and a bump 21, and performs electrical connection with the outside. In the barrel plating method, a large number of light-emitting components 1A are put together with metal particles called dummy balls into a housing immersed in a plating bath, and the housing is rotated or vibrated and energized. To do. Here, as the probability that the dummy ball and the external terminal electrodes 15Fa to 15Fd come into contact with each other increases, the formation speed of the plating layer increases. The probability tends to increase when the shape of the external terminal electrodes 15Fa to 15Fd is complicated. When the side electrode 15D is formed on the side surface of the semi-cylindrical space, the overall shape of the external terminal electrodes 15Fa to 15Fd becomes complicated. Therefore, when the side electrode 15D is disposed on the side surface of the semi-cylindrical space, there is an advantage that the plating rate on the external terminal electrodes 15Fa to 15Fd is increased.

  Further, since the side electrode 15D is disposed on the side surface of the semi-cylindrical space, the side electrode 15D is disposed on the recessed portion of the side surface of the light emitting component 1A. Therefore, when the light emitting component 1A is handled, for example, when the light emitting component 1A is lifted and moved to be mounted on the mounting substrate using the chip mounter, the side electrode 15D is moved to another object (for example, a component lifting member of the chip mounter). Etc.) are less susceptible to damage. This effect can be obtained more conspicuously by the presence of the penetrating member 12, that is, a resin member that does not have a recessed portion on the side surface of the substrate 4 on which the side electrode 15D is formed. The reason is that when the penetrating member 12 comes into contact with another object first, the thing and the side electrode 15D are prevented from approaching, and the probability that the side electrode 15D comes into contact with the other object is reduced. Moreover, it is because the side electrode 15D is protected from an impact by the elasticity of the resin (penetrating member 12). Another reason is that a portion along the surface of the substrate 4 serving as one end of the semi-cylindrical space is closed by the bottom surface of the penetrating member 12, and the penetrating member 12 covers the side electrode 15D as described above. This is because they are shielded from other objects. In particular, in the case where the side electrode 15D is arranged by a through-hole printing method to be described later, this structure is preferable because the film thickness becomes thin and is easily damaged.

  The nickel plating layer and the solder plating layer described above are arranged in this order on the surfaces of the external terminal electrodes 15Fa to 15Fd (not shown). The solder plating layer plays a role of improving solder wettability when mounted using solder on a mounting substrate on which the light emitting component 1A is mounted. The nickel plating layer plays a role of preventing the external terminal electrodes 15a to 15Fd from being alloyed and melting the external terminal electrodes 15a to 15Fd. The thicknesses of both plating layers are preferably between 3 μm and 12 μm. If the layer thickness is less than 3 μm, the formation of the plating layer may be insufficient. If the layer thickness exceeds 12 μm, the outer dimensions of the light emitting component 1A may differ from the intended one. In particular, when the light emitting component 1A is downsized, the influence of the external dimensions becomes large.

(About constant current circuit)
Next, a constant current circuit which is a component of the light emitting component 1A will be described.

  A circuit configuration of the constant current circuit 6A illustrated in FIG. The constant current circuit 6 </ b> A has a + input terminal 7 and a − input terminal 8. Between the + input terminal 7 and the − input terminal 8, a first transmission path 9A and a second transmission path 9B branch off. The LED 2, the first NPN transistor 5A, and the first resistance element 3A are connected to the first transmission line 9A in this order from the + input terminal 7 side. The first NPN transistor 5A is arranged such that the emitter is positioned closer to the negative input terminal 8 than the collector. A second resistance element 3B and a second NPN transistor 5B are connected to the second transmission line 9B in this order from the + input terminal 7 side. The second NPN transistor 5B is arranged such that its emitter is positioned closer to the negative input terminal 8 than the collector. The first contact 10A between the second resistance element 3B of the second transmission path 9B and the second NPN transistor 5B and the base of the first NPN transistor 5A are the third transmission path 9C. Connected by. The second contact 10B between the first NPN transistor 5A and the first resistance element 3A of the first transmission path 9A and the base of the second NPN transistor 5B are the fourth transmission path. Connected by 9D.

  The operation of the constant current circuit 6A will be described.

When a voltage is applied between the + input terminal 7 and the − input terminal 8, a voltage is applied to the base of the first NPN transistor 5A by the bias resistance of the second resistance element 3B, and the first NPN transistor 5A is turned on. Then, conduction between the collector and emitter of the first NPN transistor 5A becomes possible, and current is supplied to the LED2. At that time, a current flows from the positive input terminal 7 to the negative input terminal 8. At that time, a current flows through the first resistance element 3A, and a voltage is applied to the base of the second NPN transistor 5B. When the current flowing through the first transmission line 9A increases and the base voltage value of the second NPN transistor 5B becomes equal to or higher than a predetermined voltage value that turns on the second NPN transistor 5B, Conduction between the collector and emitter of the NPN transistor 5B becomes possible. Then, the base of the second NPN-type transistor 5B - voltages V ₁ between the emitter is kept constant. Therefore, the current I ₁ flowing through the first resistance element 3A is constant as I ₁ = V ₁ / R _{1 where} the resistance value is R ₁ . The current I1 flowing through the first resistance element 3A is the same as the current flowing through the LED 2, and the current flowing through the LED 2 is constant at “I ₁ ”. In this way, the current flowing to the LED 2, that is, the current flowing through the first transmission path 9 </ b> A is made constant, and the variation in luminous intensity of the LED 2 is reduced.

  Next, a specific operation of the constant current circuit 6A will be described.

  When the current flowing to the first resistance element 3A having a resistance value R1 reaches a preset limit current (I = Vt / R1), the base voltage (= Vt = 0.65V) of the second NPN transistor 5B Thus, the second NPN transistor 5B is turned on. At that time, the base voltage of the first NPN transistor 5A is held at about 1.3V. In this way, a constant current operation is performed to keep the current flowing to the LED 2 constant.

  Here, the correspondence between FIG. 3A and FIG. 2 will be described.

  The positions of the + input terminal 7, the −input terminal 8, the first contact 10A, and the second contact 10B shown in FIG. 3A are the positions of the external terminal electrode 15Fa in the bottom view of the light emitting component 1A shown in FIG. Corresponds to a position of ~ 15Fd. The external terminal electrode 15Fb corresponds to the positive input terminal 7. The external terminal electrode 15Fc corresponds to the input terminal 8. The external contact electrode 15Fa corresponds to the first contact 10A, and the external contact electrode 15Fd corresponds to the second contact 10B. The first transmission path 9A corresponds to the conductor 15 from the external terminal electrode 15Fb (corresponding to the + input terminal 7) to the pad 15Ca, the pad 15Ca, the gold wire 16 connecting the pad 15Ca and the anode terminal of the LED 2, and LED2 The gold wire 16 connecting the cathode terminal of the LED 2 and the pad 15Cb, the pad 15Cb, the first NPN transistor 5A, the gold wire 16 connecting the emitter terminal of the first NPN transistor 5A and the pad 15Cc, the pad 15Cc, the pad The conductor 15 from 15Cc to the external terminal electrode 15Fd, the external terminal electrode 15Fd (corresponding to the second contact 10B), one resistance electrode 15B of the first resistance element 3A, the resistor film 18, and the other resistance electrode 15B To the external terminal electrode 15Fc and the external terminal electrode 15Fc (corresponding to the negative input terminal 8). .

  The second transmission path 9B corresponds to the external terminal electrode 15Fb (corresponding to the + input terminal 7), one resistance electrode 15B of the second resistance element 3B, the resistor film 18, and the other resistance electrode 15B. The conductor 15 from the other resistance electrode 15B to the external terminal electrode 15Fa, the external terminal electrode 15Fa, the conductor 15 from the external terminal electrode 15Fa to the pad 15Cd, the pad 15Cd, and the second NPN transistor 5B are mounted. The floating island-shaped conductor 15, the second NPN transistor 5B, the gold wire 16 connecting the emitter terminal of the second NPN transistor 5B and the pad 15Ce, the pad 15Ce, the conductor 15 from the pad 15Ce to the external terminal electrode 15Fc, and the outside The terminal electrode 15Fc (corresponding to the negative input terminal 8). The external terminal electrode 15Fa and the pad 15Cd correspond to the first contact 10A. Corresponding to the third transmission line 9C is a gold wire 16 connecting the pad 15Cd and the base terminal of the first transistor 5A. Corresponding to the second contact 10B is the external terminal electrode 15Fd, and the pad 15Cc, the conductor 15 that conducts the pad 15Cc and the pad 15Cf, and the pad 15Cf. Corresponding to the fourth transmission path 9D is a gold wire 16 that connects the pad 15Cf and the base terminal of the second NPN transistor 5B.

  In addition to the light emitting component 1A using the constant current circuit 6A, the light emitting component according to the embodiment of the present invention, for example, the light emitting component 1B using the constant current circuit 6B shown in FIG. 3 described below (FIGS. 4 and 5). 3), a light emitting component 1C using the constant current circuit 6C shown in FIG. 3 (see FIGS. 6 and 7), a light emitting component 1D using the constant current circuit 6D shown in FIG. 3 (see FIGS. 8 and 9), etc. can do.

  A circuit configuration of the constant current circuit 6B illustrated in FIG. Note that the same members and members having the same functions as the components of the constant current circuit 6A are denoted by the same reference numerals as those in the constant current circuit 6A.

  The constant current circuit 6 </ b> B has a + input terminal 7 and a −input terminal 8. Between the + input terminal 7 and the − input terminal 8, a first transmission path 9A and a second transmission path 9B branch off. The first transmission line 9A is connected to the LED 2, the NPN transistor 5A corresponding to the first NPN transistor 5A of the constant current circuit 6A, and the first resistance element 3A in this order from the + input terminal 7 side. ing. The NPN transistor 5A is arranged such that the emitter is positioned closer to the negative input terminal 8 than the collector. In the second transmission line 9B, the second resistance element 3B and the diodes 11A and 11B are sequentially provided from the positive input terminal 7 side to the anode to the cathode and from the positive input terminal 7 to the negative input terminal 8. It is connected in series so that the direction of The first contact 10A between the second resistance element 3B and the diode 11 of the second transmission path 9B and the base of the NPN transistor 5A are connected by the third transmission path 9C.

  Next, the operation of the constant current circuit 6B will be described.

When a voltage is applied between the + input terminal 7 and the − input terminal 8, a voltage is applied to the base of the NPN transistor 5A by the bias resistance of the second resistance element 3B, and the NPN transistor 5A is turned on. Become. Then, conduction between the collector and the emitter of the NPN transistor 5A becomes possible, and current is supplied to the LED2. At that time, a current flows from the positive input terminal 7 to the negative input terminal 8. At that time, a current also flows through the first resistance element 3A. On the other hand, a current also flows through the diode 11 of the second transmission path 9B. When a current is passed through the diode 11 in the forward direction, the voltage drops due to the resistance of the diode 11 itself. Then, since the resistance value of the diode 11 itself decreases rapidly, the surplus current passes through the second transmission path 9B. The voltage drop of the diode 11 is constant at about 0.5V to 1V, and the voltage drop of about 1V to 2V is generated by the two diodes 11A and 11B. This voltage drop is equal to the sum of the voltage drop between the base and the emitter of the first NPN transistor 5A and the voltage drop due to the first resistance element 3A. As a result, the resistance of the first resistor element 3A and _{R 1,} when the voltage of the first contact 10A was _{V 2,} the current _{I 2} flowing through the first resistor element 3A _is, V 2 / _{R 1} becomes It becomes constant. In this way, the current flowing to the LED 2 is made constant, and the variation in luminous intensity of the LED 2 is reduced. Here, the reason why the diodes 11A and 11B are connected in series is to adjust the voltage drop of the diode 11. The number of diodes 11 connected in series can be changed as appropriate depending on how much the voltage drops.

  Next, a specific operation of the constant current circuit 6B will be described.

When the power is supplied from the + input terminal 7, the base voltage (VB) of the NPN transistor 5A is (Vf) by the forward voltage of the two diodes 11A and 11B having the same characteristics (Vf = 0.54V in this embodiment). × 2 = 1.08V), and the NPN transistor 5A is turned on. The emitter voltage (VE) of the NPN transistor 5A is (Vf × 2−Vbe). Here, Vbe is a base-emitter voltage of the NPN transistor 5A and is 0.65V. At that time, the current (I ₂ ) flowing through the first transmission line 9A having the first resistance element 3A in which the resistance value R ₁ of the first resistance element 3A is 21.5Ω is (VE / R ₁ = ( 0.54 × 2−0.65) /21.5) and a constant current (20 mA).

  Here, the correspondence between the constant current circuit 6B shown in FIG. 3B and the structure of the light emitting component 1B in which the constant current circuit is realized will be described. The positions of the + input terminal 7, the −input terminal 8 and the first contact 10A shown in FIG. 5A correspond to the positions of the external terminal electrodes 15Fe to 15Fg in the bottom view of the light emitting component 1B shown in FIG. To do. The external terminal electrode 15Ff corresponds to the positive input terminal 7. The external terminal electrode 15Fg corresponds to the input terminal 8. The external terminal electrode 15Fe corresponds to the first contact 10A. The first transmission path 9A corresponds to the conductor 15 from the external terminal electrode 15Ff (corresponding to the + input terminal 7) to the pad 15Cg, the pad 15Cg, the gold wire 16 connecting the pad 15Cg and the anode terminal of the LED 2, and LED2 , The gold wire 16 connecting the cathode terminal of the LED 2 and the pad 15Ch, the pad 15Ch, the floating island-shaped conductor 15 connecting to the pad 15Ch, the first NPN transistor 5A, the emitter terminal of the first NPN transistor 5A and the pad 15Ci Gold wire 16 connecting pad 15, pad 15Ci, conductor 15 from pad 15Ci to external terminal electrode 15Fh, external terminal electrode 15Fh and one resistance electrode 15B of first resistance element 3A, resistor film 18, and the other resistance Conductor 15 and external terminal electrode 15Fg (-input) from electrode 15B to external terminal electrode 15Fg Which is equivalent to the terminal 8).

  The second transmission line 9B corresponds to one resistance electrode 15B of the second resistance element 3B, the resistor film 18, the other resistance electrode 15B, and the other resistance electrode 15B to the external terminal electrode 15Fe. Conductor 15, external terminal electrode 15Fe, conductor 15 from external terminal electrode 15Fe to pad 15Cj, pad 15Cj, pad 15Cj and gold wire 16 to the anode terminal of first diode 11A, first diode 11A, first diode The floating island-shaped conductor 15 connected to the cathode terminal of the diode 11A, the pad 15Ck connected to the floating island-shaped conductor 15, the pad 15Ck, the gold wire 16 connecting the pad 15Ck and the anode terminal of the second diode 11B, the second The floating island-shaped conductor 15 connected to the cathode terminal of the diode 11B, the second diode 11B, and the floating island-shaped conductor 15 Luo external terminal electrodes 15Fg to the conductor 15 and the external terminal electrodes 15Fg - (corresponding to the input terminal 8). The first contact 10A corresponds to the external terminal electrode 15Fe and the pad 15Cj. Corresponding to the third transmission line 9C is a gold wire 16 connecting the pad 15Cj and the floating island-shaped conductor 15 connected to the base terminal of the first transistor 5B and the floating island-shaped conductor 15.

  Next, a circuit configuration of the constant current circuit 6C illustrated in FIG. Note that the same members and members having the same functions as the components of the constant current circuit 6A are denoted by the same reference numerals as those in the constant current circuit 6A.

  The constant current circuit 6 </ b> C has a + input terminal 7 and a − input terminal 8. Between the + input terminal 7 and the − input terminal 8, a first transmission path 9A and a second transmission path 9B branch off. The LED 2, the NPN transistor 5A, and the first resistance element 3A are connected to the first transmission path 9A in this order from the + input terminal 7 side. The NPN transistor 5A is arranged such that the emitter is positioned closer to the negative input terminal 8 than the collector. The second transmission line 9B includes, in order from the + input terminal 7 side, a second resistance element 3B and a Zener diode 11C that is a diode, in the direction from the anode to the cathode and from the −input terminal 8 to the + input terminal. 7 are connected so that the direction to 7 coincides. The first contact 10A between the second resistance element 3B of the second transmission path 9B and the Zener diode 11C and the base of the NPN transistor 5 are connected by the third transmission path 9C.

  Next, the operation of the constant current circuit 6C will be described.

When a voltage is applied between the + input terminal 7 and the − input terminal 8, a voltage is applied to the base of the NPN transistor 5A by the bias resistance of the second resistance element 3B, and the NPN transistor 5A is turned on. Become. Then, conduction between the collector and the emitter of the NPN transistor 5A becomes possible, and current is supplied to the LED2. At that time, a current flows from the positive input terminal 7 to the negative input terminal 8. At that time, a current also flows through the first resistance element 3A. On the other hand, a current also flows through the Zener diode 11C of the second transmission path 9B. When a current is passed through the Zener diode 11C in the reverse direction, the resistance value of the Zener diode 11C decreases rapidly, so that the surplus current flows through the second transmission line 9B. The voltage drop depending on the Zener voltage of the Zener diode 11C is equal to the sum of the voltage drop between the base and the emitter of the NPN transistor 5A and the voltage drop due to the first resistance element 3A. As a result, the resistance of the first resistor element 3A and _{R 1,} when the voltage of the first contact 10A and the _{V 3,} the current _{I 3} flowing through the first resistor element 3A _is, V 3 / _{R 1} becomes It becomes constant. In this way, the current flowing to the LED 2 is made constant, and the variation in luminous intensity of the LED 2 is reduced.

  Next, a specific operation of the constant current circuit 6C will be described.

When a voltage is applied between the positive input terminal 7 and the negative input terminal 8, the base voltage (VB) of the NPN transistor 5A becomes Vz due to the Zener voltage (Vz = 2.0V) of the Zener diode 11C, and the NPN transistor 5A is turned on. The emitter voltage (VE) of the NPN transistor 5A is (Vz−Vbe). Here, Vbe is a base-emitter voltage of the NPN transistor 5A and is 0.65V. Then, the current flowing through the first transmission line 9A having a first resistor element 3A to the first resistive element 3A resistance _{R 1 67.5Ω} (IE) is, (VE / R1 = (2.0 -0.65) /67.5) and becomes a constant current (20 mA).

  The constant current circuits 6A, 6B, and 6C shown in FIGS. 3A, 3B, and 3C have two resistance elements 3, and both of the two resistance elements 3 are trimmed. ing. By doing so, stable constant current circuits 6A, 6B, 6C having a plurality of resistance elements 3 can be configured.

  Here, a correspondence relationship between the constant current circuit 6C shown in FIG. 3C and the structure of the light emitting component 1C in which the constant current circuit 6C is realized will be described. The positions of the + input terminal 7, the −input terminal 8, and the first contact 10A shown in FIG. 7A correspond to the positions of the external terminal electrodes 15Fi to 15Fk in the bottom view of the light emitting component 1B shown in FIG. To do. The positions of the external terminal electrodes 15Fi, 15Fj, 15Fk, and 15Fl shown in FIG. 7A correspond to the positions of the external terminal electrodes in the bottom view of the light emitting component 1C shown in FIG. The external terminal electrode 15Fj corresponds to the positive input terminal 7. The external terminal electrode 15Fk corresponds to the input terminal 8. The external terminal electrode 15Fi corresponds to the first contact 10A. The first transmission path 9A corresponds to the conductor 15 from the external terminal electrode 15Fj (corresponding to the + input terminal 7) to the pad 15Cl, the pad 15Cl, the gold wire 16 connecting the pad 15Cl and the anode terminal of the LED 2, LED2 The gold wire 16 that connects the cathode terminal of the LED 2 and the pad 15Cm, the pad 15Cm, the floating island-shaped conductor 15 that connects to the pad 15Cm, the gold wire 16 that connects the emitter terminal of the NPN transistor 5A and the pad 15Cn, the pad 15Cn, the pad The conductor 15 from 15Cn to the external terminal electrode 15F1, the external terminal electrode 15Fl and one resistance electrode 15B of the first resistance element 3A, the resistor film 18, and the conductor 15 from the other resistance electrode 15B to the external terminal electrode 15Fk And the external terminal electrode 15Fg (corresponding to the negative input terminal 8).

  The second transmission path 9B corresponds to one resistance electrode 15B, the resistor film 18, the other resistance electrode 15B, and the other resistance electrode 15B to the external terminal electrode 15Fi of the second resistance element 3B. Conductor 15, external terminal electrode 15Fi, conductor 15 from external terminal electrode 15Fi to pad 15Co, pad 15Co, gold wire 16 connecting pad 15Co and the cathode terminal of Zener diode 11C, and floating island connecting to the anode terminal of Zener diode 11C Conductor 15, conductor 15 from floating island conductor 15 to external terminal electrode 15 Fk, and external terminal electrode 15 Fg (corresponding to −input terminal 8). The pad 15Co corresponds to the first contact 10A. Corresponding to the third transmission line 9C is the gold wire 16 connecting the pad 15Co and the floating island-shaped conductor 15 connected to the base terminal of the first transistor 5B and the floating island-shaped conductor 15.

  Up to now, an example in which two resistance elements 3 are arranged has been shown. However, depending on the type of constant current circuit, there may be cases where the number of resistance elements 3 is not two. For example, a constant current circuit 6D shown in FIG. The circuit configuration of the constant current circuit 6D will be described. The constant current circuit 6 </ b> D has a + input terminal 7 and a −input terminal 8. Between the + input terminal 7 and the − input terminal 8, an LED 2 and an n-channel field effect transistor 5C, which is a kind of transistor, are arranged in this order from the + input terminal 7 side. The gate and drain of the field effect transistor 5C are short-circuited through one third resistance element 3C.

  Details of the constant current circuit 6D will be described.

  The constant current circuit 6D uses an n-channel junction field-effect transistor (JFET) 5C. The JFET 5C is an element that can control the current flowing between the drain and the source by the voltage (VGS) between the gate and the source. When VGS is zero V, the drain current becomes the maximum current (IDSS). When VGS is zero, that is, when the gate and the source are short-circuited, current exceeding IDSS cannot flow. Moreover, if the voltage of the power supply is sufficient, the current is not lower than IDSS. The constant current circuit 6D is configured using this characteristic, and the variation in luminous intensity of the LED 2 is reduced. Here, a trimming groove 23 for adjusting the IDSS, that is, adjusting the luminous intensity of the LED 2 is formed in one third resistance element 3C connected between the gate and the source.

  In the constant current circuit 6D, the resistance value R3 is adjusted by trimming the third resistance element 3C. Based on the expression “IDSS = VGS / R3”, the IDSS can be adjusted along with the adjustment of the resistance value R3.

  Here, the correspondence between the constant current circuit 6D shown in FIG. 3D and the structure of the light emitting component 1D in which the constant current circuit is realized will be described. The positions of the + input terminal 7 and the − input terminal 8 shown in FIG. 9A correspond to the positions of the external terminal electrodes 15Fn to 15Fo in the bottom view of the light emitting component 1B shown in FIG.

  The external terminal electrode 15Fn corresponds to the positive input terminal 7. -Corresponding to the input terminal 8 is the external terminal electrode 15Fo or the external terminal electrode 15Fm. The external terminal electrode 15Fo and the external terminal electrode 15Fm are electrically connected by the conductor 15 on the surface of the substrate 4 (see FIG. 9A). The transmission path from the + input terminal 7 to the anode terminal of the LED 2 is a conductor 15 from the external terminal electrode 15Fn (corresponding to the + input terminal 7) to the pad 15Cp, the pad 15Cp, the pad 15Cp, and the gold wire connecting the anode terminal of the LED 2 16.

  The transmission path from the cathode terminal of the LED 2 to the drain terminal of the field effect transistor 5C is a floating wire from the cathode terminal of the LED 2 and the pad 15Cq, the pad 15Cq, the pad 15Cq to the drain terminal of the field effect transistor 5C. This is a conductor 15. The transmission path from the source terminal of the field effect transistor 5C to the third resistance element 3C is from the gold wire 16 connecting the source terminal of the field effect transistor 5C and the pad 15Cs, the pad 15Cs, the pad 15Cs to the external terminal electrode 15Fp. Conductor 15, external terminal electrode 15Fp, conductor 15 from external terminal electrode 15Fp to resistance electrode 15B, and resistance electrode 15B. The transmission path from the third resistance element 3C to the gate terminal of the field effect transistor 5C is the conductor 15 from the external terminal electrode 15Fo (corresponding to the −input terminal 8) to the resistance electrode 15B and its resistance electrode 15B, external The conductor 15 from the terminal electrode 15Fo to the pad 15Cr, the pad 15Cr, the pad 15Cr, and the gold wire 16 connecting the gate terminal of the field effect transistor 5C.

  In addition, it can replace with one 3rd resistive element 3C of constant current circuit 6D, and can use what connected the several resistive element in series. Then, trimming can be performed on one or more of the plurality of resistance elements. Further, by trimming two or more resistance elements, even if the resistance elements are damaged by the trimming, the two or more resistance elements are not concentrated on one third resistance element 3C. It can be dispersed in the element.

  The constant current circuit 6A is advantageous in that the component cost can be kept low. The constant current circuit 6B is advantageous in that the temperature change before and after energization is small. The constant current circuit 6C is advantageous in that the temperature change before and after energization is further small. In the constant current circuit 6D, only one resistance element is required, and the cost of parts can be reduced. In addition, the manufacturing cost such as the cost for manufacturing the third resistance element 3C and the cost for wire bonding described later can be kept low. This is advantageous in terms of points.

  4 shows a perspective view of the light emitting component 1B when the constant current circuit 6B is used, and FIG. 5 shows a six-sided view of the light emitting component 1B. 6 shows a perspective view of the light emitting component 1C when the constant current circuit 6C is used, and FIG. 7 shows a six-face view of the light emitting component 1C. FIG. 8 shows a perspective view of the light emitting component 1D when the constant current circuit 6D is used, and FIG. 9 shows a six-face view of the light emitting component 1D. In each of these six views, (A) is a plan view, (B) is a front view, (C) is a right side view, (D) is a left side view, (E) is a rear view, and (F) is a bottom view. Each figure is shown.

  Next, a method for manufacturing the light emitting components 1A, 1B, 1C, 1D according to the embodiment of the present invention will be described below with reference to the drawings. The light emitting component 1A will be described in detail as a representative example, and only the differences will be described for the light emitting components 1B, 1C, and 1D.

(Method for manufacturing light-emitting component 1A)
In the manufacture of the light emitting component 1A according to the embodiment of the present invention, the vertical and horizontal directions of each of the unit insulating substrates 4A having the linear divided portions 4B intersecting the vertical and horizontal directions on the surface and surrounded by the linear divided portions 4B. When the length of one side is x and the length of the other side is y, the large-sized insulation with divided portions having a plurality of unit insulating substrates 4A in which the ratio of x / y is 1 or more and 1.5 or less A substrate 4C is used. And the manufacturing method of 1 A of light-emitting components is the back surface of this large insulated substrate 4C, Comprising: The resistance formation process which arrange | positions resistance element work-in-process 3 'by which resistance value adjustment is not carried out to each back surface of unit insulating substrate 4A, In each of the insulating substrates 4A, the LED 2 and the transistor 5 are disposed so as to be disposed on the surface of the large insulating substrate 4C with a dividing portion, and the constant current circuit 6A is configured for each unit insulating substrate 4A. The conductor forming step of arranging a conductor connecting the resistor element work 3 ′, the LED 2 and the transistor 5, and the luminous intensity of each LED 2 arranged on the unit insulating substrate 4A after the arrangement step and the conductor forming step are predetermined. After the trimming step for adjusting the resistance value of each resistance element work piece 3 ′ so as to be within the range and the trimming step are finished, the large-sized insulating substrate 4C with divided portions is individually separated along the linear divided portions 4B. Having a dividing step of dividing into position the insulating substrate 4A

  Furthermore, in the method of manufacturing the light emitting component 1A according to the embodiment of the present invention, before the placement step, the large through member 12D having a large number of through holes 12C is provided on the surface of each unit insulating substrate 4A. A fixing process is provided for fixing the surface of the large insulating substrate 4C with the dividing portion so that the portions face each other, and the large penetrating member 12D is divided into individual penetrating members 12 together with the large insulating substrate 4C with the dividing portion in the dividing step. To do.

  The manufacturing method of the light emitting component 1A will be described separately for each process.

  10 and 11 are diagrams showing a process of manufacturing the light emitting component 1A. In description of each process, FIG. 10 (B) (C) (D) (E) (F) (G) (H), FIG. 11 (A) (B) (C) (D) (E) (F) In this figure, the entire large-sized insulating substrate 4C with divided portions is supposed to be shown as a whole, but for the convenience of explanation, it is shown in the size of the unit insulating substrate 4A (corresponding to the substrate 4 shown above). 10 shows the back surface side of the large insulating substrate 4C (substrate 4), and FIG. 11 shows the front surface side of the large insulating substrate 4C (substrate 4).

(Resistance formation process)
First, a large-sized insulating substrate 4C with a divided portion made of alumina ceramic is prepared (FIG. 10A). The large insulating substrate 4C with divided portions has linear divided portions 4B (dividing grooves) and through holes 22 in the vertical and horizontal directions intersecting the surface in the vertical and horizontal directions. The resistance forming step is performed on the large insulating substrate 4C with the divided portions.

  Next, the conductor 15 is formed on the large insulating substrate 4 </ b> C with a dividing portion. 10C and 11B show a state where the conductor 15 is formed on the front and back surfaces of the substrate 4 (FIGS. 10B and 11A). A part of the conductor 15 becomes a resistance electrode 15B of the resistance element 3 to be arranged. Further, a part of the conductor 15 becomes a part of the various transmission lines 9A, 9B, 9C, 9D shown in FIG. 3, the arrangement surface of the bump 21, the resistance electrode 15B, the side electrode 15D, and the back electrode 15E. In addition, the floating island-shaped conductor 15 formed on the surface side of the substrate 4 also serves as a mark of an arrangement position when the LED 2 or the like is arranged.

  A method for forming the conductor 15 will be described.

  First, a metal glaze paste (ink) of silver-palladium alloy powder is disposed on the back surface of the large insulating substrate 4C with a divided portion by a through-hole printing method, and fired to form a conductor 15 (FIG. 10C )). Then, the same through-hole printing is performed on the surface of the large insulating substrate 4C with the divided portions, and baked (FIG. 11B). Here, the through-hole printing method is to perform screen printing while suctioning from the surface of the substrate 4 opposite to the printing surface through the through-hole 22. By this through-hole printing method, the ink covers a part or all of the inner wall surface of the through-hole 22 of the large-sized insulating substrate 4C with a divided portion. Therefore, through-hole printing is performed on both surfaces of the large insulating substrate 4C with the division part, and the inner wall surface (= the outer peripheral surface of the through hole) of the through hole 22 is formed on both front and back surfaces of the large insulating substrate 4C with the division part. Conductor 15 is connected.

  Here, bumps 21 are formed on the back surface of the large insulating substrate 4C with divided portions as shown in FIG. By doing so, it is possible to form the external terminal electrodes 15Fa to 15Fd having a height higher than that of the resistor film 18 even after the resistor film 18 of the resistor element 3 is formed on the back surface. When the bumps 21 are formed, through-hole printing is not performed, and among the conductors 15 formed earlier, a substrate that will later become external terminal electrodes 15Fa to 15Fd (electrode portions facing the mounting surface when surface-mounted) 4 are formed so as to be scattered at the ends of the four. The formation time of the bumps 21 is not the current formation time of the conductor 15, but after the formation of the resistor film 18, the formation of the glass film 19, the formation of the overcoat film 20, and the trimming process. It can be later.

  Note that the distance between the two pairs of resistance electrodes 15B of the two resistance elements 3A and 3B formed on the back surface of the substrate 4 is different. The reason is that the resistance values of the two resistance elements 3A and 3B are required to be greatly different, and it is difficult to obtain appropriate resistance values only by changing the type of resistor paste described later. Because there is. Needless to say, the distance between the two pairs of resistance electrodes 15B may be equal.

  Next, pads 15Ca, 15Cb, 15Cc, 15Cd, 15Ce, and 15Cf are formed on the surface. Here, screen printing using a gold paste is performed on the surface of the large insulating substrate 4 </ b> C with a divided portion. This gold paste is printed and arranged at a position in contact with the conductor 15. The pads 15Ca, 15Cc, 15Ce, and 15Cf are arranged so as to be in contact with the front end portion of the conductor 15 on the front surface side that is electrically connected from the back surface to the front surface of the substrate 4. The pad 15Cd is connected to the floating island-like conductor 15 where the first NPN transistor 5A is disposed later, and the pad 15Cd is connected to the front end portion of the conductor 15 electrically connected from the back surface to the surface of the substrate 4 and The printed arrangement is made so as to come into contact with the floating island-like conductor 15 where the second NPN transistor 5B is arranged later. Thereafter, the large insulating substrate 4C with divided portions is baked to fix the pads 15Ca to 15Cf (see FIG. 11C). The pads 15Ca to 15Cf play a role of ensuring the connection between the conductor 15 and the gold wire 16 serving as a bonding wire.

  Next, the resistor film 18 is formed on the back surface. Therefore, a metal glaze paste (ink) of a mixed powder of ruthenium oxide and metal is used and is arranged by screen printing so as to come into contact with both of the pair of resistance electrodes 15B on the back surface of the large insulating substrate 4C with a divided portion. Then, it is baked to form (see FIG. 10E). As a result, the resistor element work product 3 ′ formed so that the resistor film 18 is in contact with both the pair of resistance electrodes 15 </ b> B is formed. The resistor film 18 is formed again by changing the type of ink. By doing so, the resistance values of the two resistance element work-in-progress 3 'are made different.

  Next, a glass film 19 is formed. Here, glass paste (ink) is used, and not only the resistor film 18 previously formed, but also the back surface of the substrate 4 (large insulating substrate 4C with a divided portion) is a portion of the back electrode 15E, the side electrode 15D and the bump 21. It is arranged by screen printing so as to cover except for and fired to form (see FIG. 10F). Here, the glass film 19 is also formed in a portion where the resistance electrode 15B and the resistor film 18 overlap. Therefore, this part is the thickest part among the constituent parts of the resistance element work-in-process 3 '. However, the glass film 19 mainly protects the portion of the resistor film 18 that is not trimmed when the trimming groove 23 is formed. Therefore, the glass film 19 may be formed only in a region where the trimming groove 23 can be assumed to be formed.

(Arrangement process)
Next, LED 2 and two transistors 5 having a height equal to or higher than that of LED 2 are arranged on the surface of the large insulating substrate 4C with a divided portion. At that time, as shown in FIG. 11D, the LED 2 is arranged on the floating island-shaped conductor 15 in the center of the substrate 4 (unit insulating substrate 4A). Then, the transistor 5 (specifically, the first and second transistors 5A and 5B) is disposed on the floating island-shaped conductor 15 around the LED 2. A chip mounter is used for these placement operations. A thermosetting conductive resin adhesive (die bonding paste) is used for fixing the LED 2 and the transistor 5 to the surface of the large insulating substrate 4 </ b> C with a divided portion. This adhesive is supplied by attaching it to the needle tip and bringing the needle tip into contact with the floating island-like conductor 15 arranged at the center position of the surface of the large insulating substrate 4C with a split portion. Alternatively, the conductive resin adhesive may be supplied using a syringe such as a syringe. In this step, the collector terminal on the bottom surface of the transistor 5 and the floating island-shaped conductor 15 are electrically connected.

  The above resistance forming step and arrangement step can be similarly performed for the light emitting component 1B shown in FIGS. 4 and 5, the light emitting component 1C shown in FIGS. 6 and 7, and the light emitting component 1D shown in FIGS. . The formation patterns of the conductor 15, the pads 15Cg, 15Ch, 15Ci, 15Cj, 15Ck, 15Cl, 15Cm, 15Cn, 15Co, 15Cp, 15Cq, 15Cr, 15Cs and the resistor film 18 are shown in FIGS. 5, 7, and 9, respectively. Like that. In the case of the light emitting component 1B, the LED 2, the two diodes 11, and the transistor 5A are arranged on the surface of the substrate 4. In the case of the light emitting component 1C, the LED 2, the Zener diode 11C, and the transistor 5A are arranged on the surface of the substrate 4. In the case of the light emitting component 1D, the LED 2 and the field effect transistor 5C are arranged on the surface of the substrate 4.

(Conductor formation process)
In this conductor forming step, the conductor 15, the pad 15C, the resistor element work product 3 ′, the LED 2 and the transistor 5 formed in the resistance forming step and the arranging step constitute the constant current circuit 6A shown in FIG. Then, wire bonding using six gold wires 16 is performed (see FIG. 11E).

  The above conductor formation process can be similarly performed for the light-emitting component 1B shown in FIGS. 4 and 5, the light-emitting component 1C shown in FIGS. 6 and 7, and the light-emitting component 1D shown in FIGS. In order to form the constant current circuit 6B, the LED 2 and the two diodes (11A, 11B) are arranged on the bottom surface of the recess 13 in the arranging step, and the gold wire is formed so as to have the circuit configuration of FIG. 16 is used to perform wire bonding. In order to form the constant current circuit 6C, the LED 2 and the Zener diode 11C are arranged on the bottom surface of the recess 13 in the arranging step, and the wire is formed using the gold wire 16 so that the circuit configuration of FIG. Bonding is performed. In order to form the constant current circuit 6D, one resistance element work-in-process 3 ′ is formed in the resistance forming step, and in the arranging step, the LED 2 and the field effect transistor 5C are arranged on the bottom surface of the recess 13, and the conductor forming step Then, wire bonding is performed using the gold wire 16 so as to obtain the circuit configuration of FIG.

  A conductor forming process using the gold wire 16 for forming a specific constant current circuit 6A of the light emitting component 1A will be described with reference to FIG. The anode terminal of LED2 and the pad 15Ca are connected. With this connection, the anode terminal of the LED 2 and the external terminal electrode 15Fb corresponding to the + input terminal 7 are connected. Then, the cathode terminal of the LED 2 and the pad 15Cb are connected. With this connection, the cathode terminal of the LED 2 and the collector of the first NPN transistor 5A are connected. Then, the emitter terminal of the first NPN transistor 5A and the pad 15Cc are connected. With this connection, the emitter terminal of the first NPN transistor 5A and the resistor element work product 3 '(first resistor element 3A before trimming) related to the first resistor element 3A are connected. Then, the base terminal of the first NPN transistor 5A and the pad 15Cd are connected. With this connection, the base terminal of the first NPN transistor 5A and the resistor element work product 3 '(second resistor element 3B before trimming) related to the second resistor element 3B are connected. Then, the emitter terminal of the second NPN transistor 5B and the pad 15Ce are connected. With this connection, the emitter terminal of the second NPN transistor 5B and the external terminal electrode 15Fc corresponding to the negative input terminal 8 are connected. Then, the base terminal of the second NPN transistor 5B and the pad 15Cf are connected. With this connection, the base terminal of the second NPN transistor 5B and the first resistance element 3A are connected.

  A specific conductor forming process using the gold wire 16 for forming the constant current circuit 6B of the light emitting component 1B will be described with reference to FIG. The anode terminal of LED2 and the pad 15Cg are connected. With this connection, the anode terminal of the LED 2 and the external terminal electrode 15Ff corresponding to the + input terminal 7 are connected. Then, the cathode terminal of the LED 2 and the pad 15Ch are connected. With this connection, the cathode terminal of the LED 2 and the collector terminal of the NPN transistor 5A are connected. Then, the emitter terminal of the NPN transistor 5A and the pad 15Ci are connected. With this connection, the emitter terminal of the NPN transistor 5A and the resistance element work product 3 'related to the first resistance element 3A (first resistance element 3A before trimming) are connected. Then, the anode terminal of the diode 11A and the pad 15Cj are connected. With this connection, the anode terminal of the diode 11A and the resistance element work-in-process 3 'related to the second resistance element 3B are connected. Then, the base terminal of the NPN transistor 5A and the pad 15Cj are connected. With this connection, the base terminal of the NPN transistor 5A and the resistor element work product 3 'related to the second resistor element 3B are connected. Then, the anode terminal of the diode 11B and the pad 15Ck are connected. With this connection, the cathode terminal of the diode 11A and the anode terminal of the diode 11B are connected.

  Next, a specific conductor forming process using the gold wire 16 for forming the constant current circuit 6C of the light emitting component 1C will be described with reference to FIG. The anode terminal of LED2 and the pad 15Cl are connected. With this connection, the anode terminal of the LED 2 and the external terminal electrode 15Fj corresponding to the + input terminal 7 are connected. Then, the cathode terminal of the LED 2 and the pad 15Cm are connected. With this connection, the cathode terminal of the LED 2 and the collector terminal of the NPN transistor 5A are connected. Then, the emitter terminal of the NPN transistor 5A and the pad 15Cn are connected. With this connection, the emitter terminal of the NPN transistor 5A and the resistance element work product 3 'related to the first resistance element 3A are connected. Then, the cathode terminal of the Zener diode 11C and the pad 15Co are connected. With this connection, the cathode terminal of the Zener diode 11C and the resistance element work product 3 'related to the second resistance element 3B are connected. Then, the base terminal of the NPN transistor 5A and the pad 15Co are connected. With this connection, the base terminal of the transistor 5A and the resistor element work product 3 'related to the second resistor element 3B are connected.

  A specific conductor forming process using the gold wire 16 for forming the constant current circuit 6D of the light emitting component 1D will be described with reference to FIG. The anode terminal of LED2 and the pad 15Cp are connected. With this connection, the anode terminal of the LED 2 and the external terminal electrode 15Fn corresponding to the + input terminal 7 are connected. Then, the cathode terminal of the LED 2 and the pad 15Cq are connected. With this connection, the cathode terminal of the LED 2 and the drain terminal of the field effect transistor 5C are connected. Then, the gate terminal and the source terminal of the field effect transistor 5C are connected to the pad 15Cr and the pad 15Cs, respectively. With this connection, the gate terminal and the source terminal of the field effect transistor 5C are short-circuited via the resistor element work product 3 'related to the third resistor element 3C.

(Fixing process)
Next, the adhering process to be performed will be described. First, a plan view of the substrate 4 after the fixing step is shown in FIG. A plan view of the large penetrating member 12D used in the fixing step is shown in FIG. Large penetration member 12D forms a plurality of penetration members 12 by being divided into many. The large penetrating member 12D is a liquid crystal polymer molded body. On the back surface of the large penetrating member 12D, penetrating member dividing lines 12E are formed vertically and horizontally at the same intervals as the linear dividing portions 4B. The large penetrating member 12D is formed with a thin portion 12B (corresponding to the thin portion 12 of the penetrating member 12) on the back side of the portion where the penetrating member dividing line 12E in the horizontal direction is formed. Further, the large penetrating member 12D has a portion corresponding to the cathode mark 12A shown in FIGS.

  In the adhering step, the surface of the large insulating substrate 4C with the dividing portion after the disposing step (the surface on the side where the LED 2 is disposed) and the back surface of the large penetrating member 12D (the side on which the penetrating member dividing line 12E is formed) Are fixed using a thermosetting adhesive (epoxy system). At the time of fixing, the linear dividing portion 4B and the penetrating member formed so that one of the plurality of through holes 12C of the large penetrating member 12D surrounds one LED 2 and the two transistors 5 and which both have vertically and horizontally. The dividing line 12E is fixed so as to overlap. As a result, a large number of recesses 13 are formed between the through-holes 12C and the surface of the large insulating substrate 4C with divided portions.

  The fixing process may be performed immediately after the resistor element work-in-process 3 'is formed or after trimming. However, by performing the adhering process after the arrangement process and the connection process are completed, it is possible to avoid placing the LED 2 and the transistor 5 and performing wire bonding in a state where the through-hole 12C is formed. Becomes better. Note that, after performing trimming, which will be described later, it is slightly inferior in terms of reducing variations in luminous intensity.

(Resin sealing process)
Next, the resin sealing process to be performed will be described. Translucent resin (not shown) is supplied only into the recess 13 to seal the gold wire 16, the LED 2, and the transistors 5A and 5B. A silicone-based adhesive is used for the translucent resin. A screen printing method is used to supply the translucent resin. After the supply, the large insulating substrate 4C with the divided portions is heated to cure the translucent resin. Thus, by arranging the translucent resin only in the recess 13, the translucent resin does not exist in the substrate region along the linear division part 4 </ b> B. Therefore, in the dividing process described later, the division of the large insulating substrate 4C with the dividing portion is not hindered. As described above, the translucent resin may be formed so as to overflow the concave portion 13, or the surface side may be convex or concave.

(Trimming process)
Next, the trimming process to be performed will be described. In the trimming step, the resistance value is adjusted with a different index (target value) for each of the two resistance element work-in-process 3 '. That is, the trimming process proceeds as follows. First, with respect to one resistor element work 3 ′ (to be later referred to as a second resistor element 3B shown in FIG. 3A) related to the second resistor element 3B shown in FIG. The trimming probe is brought into contact with the external terminal electrode 15Fa and the external terminal electrode 15Fb) in 2 (A), and the resistance film 18 is locally measured by laser irradiation with the glass film 19 while measuring the resistance value of the work piece 3 '. The trimming groove 23 is formed by evaporation (see FIG. 10G). Thereby, the current flow path of the resistance element work-in process 3 ′ is narrowed until the target resistance value is reached.

  By performing this trimming, the bias current of the first NPN transistor 5A shown in FIG. 3A is adjusted. As a result, it is possible to cause the light emitting component 1A to emit light by flowing a current through the first transmission path 9A. As a result, the resistor element work 3 ′ related to the second resistor element 3 </ b> B becomes the completed second resistor element 3 </ b> B. Here, the glass film 19 acts to suppress excessive destruction of the resistor film 18 when the trimming groove 23 is formed. Similarly, in the case of the light-emitting components 1B and 1C, trimming is performed on the resistor element work product 3 'related to the second resistor element 3B. At this time, the external terminal electrodes with which the trimming probe is brought into contact are the external terminal electrode 15Fe and the external terminal electrode 15Ff in FIG. 5A, respectively, and the external terminal electrode 15Fi and the external terminal electrode 15Fj in FIG. .

  After that, trimming is performed on the resistor element work product 3 ′ related to the other first resistor element 3 </ b> A (to be the first resistor element 3 </ b> A shown in FIG. 3A). At the time of trimming, the trimming probe is brought into contact with both ends (external terminal electrode 15Fc and external terminal electrode 15Fc in FIG. 2A) of the resistor element work product 3 ′ related to the first resistor element 3A, and the + input terminal 7 and the input terminal 8 are passed through to measure the voltage value flowing through the resistor element work piece 3 ′, and the resistor film 18 of the resistor element work piece 3 ′ is locally irradiated with the glass film 19 by laser irradiation. The trimming groove 23 is formed by evaporation (see FIG. 10G). Then, the current flow path of the resistor element work product 3 ′ is narrowed until the target voltage value is reached.

  By trimming the resistance element work-in-process 3 ′ related to the first resistance element 3 </ b> A, the current value supplied mainly to the LED 2 by the constant current circuit 6 </ b> A is adjusted to be within a predetermined range (for example, 20 mA). As a result, the resistor element work 3 ′ relating to the first resistor element 3 </ b> A relating to the first resistor element 3 </ b> A becomes the completed first resistor element 3 </ b> A. Further, when trimming the first resistance element 3A, the resistance value may be adjusted using a specific current value when a constant voltage is applied to the first resistance element 3A as a target value.

  The same trimming is performed for the light emitting components 1B, 1C, and 1D. At that time, the external terminal electrodes that are brought into contact with the trimming probe with respect to the resistive element work 3 ′ related to the second resistive element 3B of the light emitting components 1B and 1C are the external terminal electrode 15Ff and the external terminal electrode 15Ff in FIG. The external terminal electrode 15Fe is the external terminal electrode 15Fj and the external terminal electrode 15Fi in FIG. Further, the external terminal electrodes with which the trimming probe is brought into contact with the resistance element work 3 ′ according to the first resistance element 3A are the external terminal electrode 15Fh and the external terminal electrode 15Fg in FIG. The external terminal electrode 15Fl and the external terminal electrode 15Fk in A). In addition, the external terminal electrodes with which the trimming probe is brought into contact with the resistor element work product 3 'related to the third resistor element 3C of the light emitting component 1D are the external terminal electrode 15Fp and the external terminal electrode 15Fo.

  The constant current circuit 6A changes its characteristics due to heat generation of the first and second NPN transistors 5A and 5B and the LED 2 when energized or irradiated with light. However, in the trimming process according to the embodiment of the present invention, trimming is performed while a current is passed between the + input terminal 7 and the − input terminal 8 shown in FIG. . Therefore, since the first resistance element 3A is trimmed in consideration of the characteristic change, trimming with high accuracy can be performed in consideration of a state in actual use.

  The trimming process is performed while measuring the value of the current flowing through the first resistance element 3A. Instead of this current value, the trimming process can be performed while measuring the luminous intensity of the LED 2. That is, the index of the end of the trimming process is the luminous intensity of the LED 2. A simplified diagram showing an example of the trimming process while measuring the luminous intensity of the LED 2 is shown in FIG. Although FIG. 12 shows one light-emitting component 1A that has not undergone the trimming process, the trimming process is actually performed in a state before the division process described later.

  In FIG. 12, while operating the light emitting component 1A that has not undergone the trimming process (work in progress, the same applies to the description of FIG. 12 below), the laser light 25 emitted from the trimming device 24 is applied to the resistor of the resistance element work in progress 3 ′. The glass film 19 is broken and irradiated to the film 18 portion to form a trimming groove 23 in the glass film 19 and the resistor film 18. Then, a change in luminous intensity of light emission (indicated by reference numeral 27) of the LED 2 accompanying the formation of the trimming groove 23 is measured by a photometer 26. When the target light intensity can be obtained, the irradiation of laser light (indicated by reference numeral 25) is stopped.

  In the trimming step while measuring the luminous intensity of the LED 2 and the trimming step according to the above-described embodiment of the present invention, the substrate surface on the side opposite to the surface side of the large insulating substrate 4C with the divided portion on the side where the LED 2 is disposed. It is preferable to provide a shielding means (for example, a shielding plate 28 shown in FIG. 12) that prevents light from the side from entering. The reason is that when light such as the laser beam 25 is mixed into the light emitted from the LED 2, it is difficult to measure the light intensity of the LED 2 with high accuracy. Further, the evaporated resistor film 18 and the glass film 19 are cooled to become powdery, which adheres to the light emitting surface of the LED 2 and blocks inconveniences such as affecting the luminous intensity of the light emitting members 1A, 1B, 1C, 1D. This is because it can be suppressed by means. The effect of preventing the powder from adhering to the light emitting surface of the LED 2 can also be obtained in a trimming step performed while measuring the resistance value of the second resistance element 3B. In addition, as shown in FIG. 12, this adhesion prevention effect is that the arrangement surface of the LED 2 on the substrate 4 and the arrangement surface of the resistor element work piece 3 ′ are different, that is, the surfaces opposite to each other. Since the distance between the LED 2 and the resistance element work-in-process 3 'is large, it is obtained not a little. As the shielding means, without providing the shielding plate 28, or in addition to providing the shielding plate 28, a means for sucking the powder or blowing the powder away from the LED 2 can be used. Further, the shielding means may be a cylindrical shape instead of the flat rectangular box shape as shown in the figure, or may be only the bottom portion 28a without providing the side surface 28b of the shielding plate.

  In addition, it is preferable to perform the trimming process while measuring the luminous intensity of the LED 2 as compared to performing the trimming process while measuring the luminance of the LED 2 (see Patent Document 1). Luminous intensity is the intensity of light emitted from a light emitter, and is the magnitude of a light beam included in a unit solid angle from a light source in a certain direction. Luminance is the brightness per unit area of the light emitter. Therefore, the luminance value varies depending on the distance from the light source, but the luminous intensity does not vary depending on the distance from the light source. In the trimming process, it can be assumed that the distance from the light source to the photometer changes. Therefore, it is preferable to perform the trimming process while measuring the luminous intensity of the LED 2.

(Overcoat formation process)
In this step, a resin film using an epoxy resin paste is formed so as to cover the trimming groove 23 formed in the trimming step, and the overcoat 20 is disposed. For this purpose, an epoxy resin is disposed in a band shape by screen printing so as to cover both the trimming grooves 23 of the two resistance elements 3 formed earlier, and is thermally cured (see FIG. 10H). Here, the overcoat 20 does not reach the overlapping portion of the resistor film 18 and the resistance electrode 15B. The reason is that if the overlapping portion of the resistor curtain 18 and the resistor electrode 15B is covered, the film of that portion becomes taller than the portion where the bump 21 is formed, and the mountability may not be good. is there.

(Division process)
Next, the division process to be performed will be described. First, stress is applied in the direction of opening one of the vertical or horizontal dividing grooves of the linear dividing section 4B (dividing grooves) intersecting the vertical and horizontal directions of the large insulating substrate 4C with divided sections. In this embodiment, a stress is applied along the dividing groove along the thin wall portion 12B. Then, the alumina ceramic breaks along the line of the linear division part 4B. Along with this, the penetrating member dividing line 12E (dividing groove) of the large penetrating member 12D at the position overlapping the broken linear dividing portion 4B is also destroyed. As a result, a large number of strip-shaped substrates 4E can be obtained (see FIG. 11H). Hereinafter, this process is referred to as a primary division process. In FIG. 11 (H), the strip-shaped substrate 4E is drawn only on the penetrating member 12 side for convenience of drawing, and the components in the through hole 12C are omitted.

  Next, stress is applied in the direction of opening the large through-hole insulating substrate 4C with divided portions and the other penetrating member dividing line 12E (dividing groove) remaining on the strip-shaped substrate 4E. Then, the alumina ceramic is broken along the line of the linear division part 4B. At the same time, the dividing groove of the large penetrating member 12D at the position overlapping the broken linear dividing portion 4B is also destroyed. As a result, a large number of unit insulating substrates 4A with penetrating members 12, that is, light-emitting components 1A can be obtained (see FIG. 11I). Hereinafter, this process is referred to as a secondary division process. In FIG. 11 (I), for convenience of drawing, the light emitting component 1A is drawn only on the penetrating member 12 side without drawing the components in the through hole 12C. This completes the dividing step.

  Here, the linear dividing portion 4B can be cut (divided) vertically and horizontally along the linear dividing portion 4B and the penetrating member dividing line 12E by using a dicing saw instead of the dividing groove. The division using the dicing saw can be performed for primary and secondary division. Moreover, the division | segmentation using a dicing saw is performed only about primary division | segmentation, and the method of giving stress so that the groove | channel for division | segmentation may be employ | adopted about secondary division | segmentation. The method of applying stress so as to open the dividing grooves has an advantage that the manufacturing cost can be kept low. In addition, the division using the dicing saw has an advantage that the division position accuracy is high and that the light emitting components 1A, 1B, 1C, and 1D can be easily dealt with even if they are downsized. Further, when the division using a dicing saw is performed, the linear dividing portion 4B and the penetrating member dividing line 12E may not be grooves, and the linear dividing portion 4B and the penetrating member dividing line 12E are invisible. It may be.

  Moreover, the thin part 12B is provided along only the horizontal direction of the linear dividing part 4B and the dividing line 12E for penetrating member formed vertically and horizontally. However, in order to perform the dividing step with higher accuracy, it is preferable to provide not only in the horizontal direction but also in the vertical direction. However, since the thin portion 12B does not contribute to the light emitting function of the light emitting component 1A, it is preferable not to provide the thin portion 12B as much as possible in order to reduce the size of the light emitting component 1A.

(Plating process)
Next, nickel plating and solder plating are performed in this order on the surfaces of the external terminal electrodes 15Fa to 15Fd of the many unit insulating substrates 4A obtained. A nickel plating layer and a solder plating layer are respectively formed on the surfaces of the external terminal electrodes 15Fa to 15Fd by the barrel plating method described above. The thickness of the nickel plating layer and the solder plating layer is adjusted by adjusting the plating conditions such as the plating time and the temperature of the plating bath so as to be 3 μm to 12 μm, respectively. This completes the plating process. Further, the manufacturing method of the light emitting component 1A is completed. Similarly, the light emitting components 1B, 1C, and 1D are manufactured.

  The light emitting components 1A, 1B, 1C, 1D and the manufacturing method thereof according to the embodiment of the present invention have been described above, but various modifications can be made without departing from the gist of the present invention. For example, the value of the x / y ratio of the unit insulating substrate 4A can be 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, or the like. In addition, since it is preferable that the plurality of light emitting components 1A, 1B, 1C, and 1D are arranged closely and accordingly the LEDs 2 that are a plurality of light emitting elements can be arranged densely, the value of x / y is 1.0 to 1.. Between 3 is preferred.

  Moreover, the light emitting components 1A, 1B, 1C, and 1D according to the embodiment of the present invention have one LED 2. However, the light emitting components 1A, 1B, 1C, and 1D can be configured by using a plurality of LEDs 2 and connecting them in series and / or in parallel.

  Constant current circuits 6A, 6B, 6C, 6D, penetrating member 12, pad 15C, translucent sealing resin 17, overcoat film 20 of light emitting components 1A, 1B, 1C, 1D according to the embodiment of the present invention, The bump 21, the nickel plating layer, and the solder plating layer are not essential. Therefore, one or more of these may be omitted or changed. For example, instead of the constant current circuits 6A, 6B, 6C, 6D, a constant voltage circuit can be used as a component of the light emitting components 1A, 1B, 1C, 1D. Moreover, in the manufacturing method of the light emitting components 1A, 1B, 1C, and 1D according to the embodiment of the present invention, the resin sealing step and the plating step are not essential, and one or both may be omitted. Since the fixing process is not essential when used, it may be omitted. The conductor 15 may be formed with a thick film by a screen printing method or the like, and then subjected to sheet plating such as a nickel-gold alloy on the surface thereof.

  The fixing process, resin sealing process, trimming process, overcoat forming process, dividing process, and plating process in the method of manufacturing the light emitting component 1A according to the embodiment of the present invention include the light emitting component 1B shown in FIGS. The manufacturing method of the light emitting component 1C shown in FIGS. 6 and 7 and the light emitting component 1D shown in FIGS. 8 and 9 can be similarly performed. Further, as described above, some of the steps may be omitted.

  In the manufacturing method described above, the components such as the LED 2 are arranged after the conductor 15 is formed. However, after the components such as the LED 2 are arranged, the components are connected by the gold wire 16 and the constant current circuits 6A, 6B, 6C. , 6D may be formed. Further, the parts may be connected by the conductor 15 without using the gold wire 16.

  In this embodiment, a part or all of the driving circuit member is arranged around the LED 2 serving as the light emitting element, but the arrangement is arranged from 180 degrees or more to 360 degrees around the LED 2. It is preferable in terms of dispersion of light and easy connection of components. Further, the NPN transistors 5A and 5B are arranged approximately 120 degrees apart from each other in the same direction with the LED 2 as the center. In terms of light dispersion and the like, it is preferable that the arrangement be separated within a range of 90 ° to 180 °.

  Furthermore, when three or more parts having high height are arranged around the LED 2, when an area divided into three parts by 120 degrees around the light emitting part is assumed, one or more parts are arranged in each of the three divided areas. Is preferred. In addition, as shown in each embodiment, the arrangement of the gold wire 16 is preferably arranged over 180 degrees around the LED 2 serving as a light emitting element in terms of light dispersion, the connectivity of the gold wire 16, and the like. . Since this effect is further improved when the arrangement of the gold wire 16 is 240 degrees or more, the gold wire 16 may be arranged so that the circumference of the LED 2 is 240 degrees or more. The arrangement relationship of the driving circuit member and the gold wire 16 can be applied to a light emitting component in which the concave portion 13 does not exist.

  Further, the external terminal electrodes 15Fa to 15Fd of the light emitting component 1A according to the embodiment of the present invention, the external terminal electrodes 15Fe to 15Fg of the light emitting component 1B, the external terminal electrodes 15Fi to 15Fk of the light emitting component 1C, and the external terminal electrodes of the light emitting component 1D. The functions of 15Fn to 15Fo can be appropriately changed depending on the electrical connection method of components. For example, the positions of the + input terminal and the − input terminal and the position where the trimming probe is brought into contact in the trimming process can be appropriately changed.

It is a perspective view of the light emitting component which concerns on embodiment of this invention. FIG. 6 is a six-sided view of a light-emitting component according to an embodiment of the present invention, where (A) is a plan view of the light-emitting component, (B) is a front view, (C) is a right-side view, (D) is a left-side view, E) is a rear view, and (F) is a bottom view. It is a circuit diagram of the constant current circuit used for the light emitting component which concerns on embodiment of this invention. It is a perspective view of the light emitting component which concerns on embodiment of this invention. FIG. 6 is a six-sided view of a light-emitting component according to an embodiment of the present invention, where (A) is a plan view of the light-emitting component, (B) is a front view, (C) is a right-side view, (D) is a left-side view, E) is a rear view, and (F) is a bottom view. It is a perspective view of the light emitting component which concerns on embodiment of this invention. FIG. 6 is a six-sided view of a light-emitting component according to an embodiment of the present invention, where (A) is a plan view of the light-emitting component, (B) is a front view, (C) is a right-side view, (D) is a left-side view, E) is a rear view, and (F) is a bottom view. It is a perspective view of the light emitting component which concerns on embodiment of this invention. FIG. 6 is a six-sided view of a light-emitting component according to an embodiment of the present invention, where (A) is a plan view of the light-emitting component, (B) is a front view, (C) is a right-side view, (D) is a left-side view, E) is a rear view, and (F) is a bottom view. It is a figure which shows the process of the manufacturing method of the light emitting component which concerns on embodiment of this invention. It is a figure which shows the process of the manufacturing method of the light emitting component which concerns on embodiment of this invention. It is a simplified diagram showing a state of an example of a trimming step in a method for manufacturing a light emitting component according to an embodiment of the present invention.

Explanation of symbols

1A, 1B, 1C, 1D Light emitting component 2 LED
3, 3A. 3B, 3C Resistance element 4 Substrate 6, 6A, 6B, 6C, 6D Constant current circuit 12 Through member 12C Through hole 13 Recess

Claims (7)

In a light-emitting component in which a light-emitting element that emits light on a substrate surface and a circuit member for driving the light-emitting element are arranged,
The light emitting element is disposed in the center of the substrate surface, and a part or all of the driving circuit member is disposed around the light emitting element on the substrate surface. In a light-emitting component in which a light-emitting element that emits light on a substrate surface and a circuit member for driving the light-emitting element are arranged,
A part or all of the driving circuit member is disposed over 180 degrees or more around the light emitting element on the substrate surface.   The light-emitting component according to claim 1, wherein the substrate has a recess, and the light-emitting element and a part or all of the driving circuit member are disposed on a bottom surface of the recess.   The light emitting component includes a penetrating member having a through hole, and the penetrating member is fixed to the substrate surface such that an opening of the through hole faces the substrate surface. The light emitting component according to claim 1 or 2, wherein a part or all of the circuit member is accommodated in the through hole.   The inside of the recess or the through hole is filled with a translucent resin, and the translucent resin does not exist from the inside of the recess or the through hole to the outside, but the recess or the through hole. The light-emitting component according to claim 3, wherein the light-emitting component is present only inside the hole.   The drive circuit member includes a plurality of resistance elements, and the plurality of resistance elements are disposed on a substrate surface opposite to the substrate surface on which the light emitting elements are disposed. The light-emitting component according to any one of 1, 2, 3, 4, and 5.   The driving circuit member constitutes a constant current circuit by part or all of the driving circuit member, and the constant current circuit includes a plurality of resistance elements, and two or more of the plurality of resistance elements are arranged with the light emitting elements. The light-emitting component according to claim 6, wherein the light-emitting component is disposed on a substrate surface opposite to the substrate surface, and the resistance value is adjusted so that the luminous intensity of the light-emitting element is within a predetermined range.

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