TWI619161B - 基板處理裝置 - Google Patents
基板處理裝置 Download PDFInfo
- Publication number
- TWI619161B TWI619161B TW105136115A TW105136115A TWI619161B TW I619161 B TWI619161 B TW I619161B TW 105136115 A TW105136115 A TW 105136115A TW 105136115 A TW105136115 A TW 105136115A TW I619161 B TWI619161 B TW I619161B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid flow
- processing
- substrate
- liquid
- dispersing member
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 90
- 239000007788 liquid Substances 0.000 claims abstract description 260
- 230000007246 mechanism Effects 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 23
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 polytetra-fluoroethylene Polymers 0.000 description 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-006971 | 2016-01-18 | ||
| JP2016006971A JP6617036B2 (ja) | 2016-01-18 | 2016-01-18 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201727733A TW201727733A (zh) | 2017-08-01 |
| TWI619161B true TWI619161B (zh) | 2018-03-21 |
Family
ID=59362654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105136115A TWI619161B (zh) | 2016-01-18 | 2016-11-07 | 基板處理裝置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6617036B2 (ja) |
| KR (1) | KR102126143B1 (ja) |
| CN (1) | CN108475628B (ja) |
| TW (1) | TWI619161B (ja) |
| WO (1) | WO2017126178A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6985957B2 (ja) | 2018-02-21 | 2021-12-22 | キオクシア株式会社 | 半導体処理装置 |
| JP7002969B2 (ja) * | 2018-03-19 | 2022-01-20 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM277765U (en) * | 2005-04-11 | 2005-10-11 | Bi-Jen Chen | Improvement of mounting of water draining flange on floor |
| TW200822207A (en) * | 2006-07-25 | 2008-05-16 | Dainippon Screen Mfg | Substrate processing apparatus and substrate processing method |
| TW200924044A (en) * | 2007-09-26 | 2009-06-01 | Dainippon Screen Mfg | Apparatus for and method of processing substrate |
| TW201250902A (en) * | 2011-03-25 | 2012-12-16 | Dainippon Screen Mfg | Substrate treatment apparatus and substrate treatment method |
| TW201324656A (zh) * | 2011-08-25 | 2013-06-16 | Dainippon Screen Mfg | 基板處理裝置 |
| TW201335989A (zh) * | 2011-12-28 | 2013-09-01 | Dainippon Screen Mfg | 基板處理裝置及基板處理方法 |
| TW201340232A (zh) * | 2012-01-27 | 2013-10-01 | Dainippon Screen Mfg | 基板處理裝置及基板處理方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06177030A (ja) * | 1992-12-02 | 1994-06-24 | Daido Steel Co Ltd | 成膜基盤処理装置 |
| JPH09171987A (ja) * | 1995-12-18 | 1997-06-30 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP3039494B2 (ja) | 1997-11-17 | 2000-05-08 | 日本電気株式会社 | Ｗｅｔ処理槽及びその給液方法 |
| JP4916382B2 (ja) | 2007-05-18 | 2012-04-11 | 株式会社ジェイ・イー・ティ | 基板処理方法及び基板処理装置 |
| JP5179282B2 (ja) * | 2007-09-27 | 2013-04-10 | 大日本スクリーン製造株式会社 | 基板処理装置及び基板処理方法 |
| JP2009141022A (ja) * | 2007-12-04 | 2009-06-25 | Tokyo Electron Ltd | 基板処理装置 |
| JP2009231669A (ja) * | 2008-03-25 | 2009-10-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
-
2016
- 2016-01-18 JP JP2016006971A patent/JP6617036B2/ja active Active
- 2016-10-21 KR KR1020187018334A patent/KR102126143B1/ko active IP Right Grant
- 2016-10-21 WO PCT/JP2016/081336 patent/WO2017126178A1/ja active Application Filing
- 2016-10-21 CN CN201680077170.7A patent/CN108475628B/zh active Active
- 2016-11-07 TW TW105136115A patent/TWI619161B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM277765U (en) * | 2005-04-11 | 2005-10-11 | Bi-Jen Chen | Improvement of mounting of water draining flange on floor |
| TW200822207A (en) * | 2006-07-25 | 2008-05-16 | Dainippon Screen Mfg | Substrate processing apparatus and substrate processing method |
| TW200924044A (en) * | 2007-09-26 | 2009-06-01 | Dainippon Screen Mfg | Apparatus for and method of processing substrate |
| TW201250902A (en) * | 2011-03-25 | 2012-12-16 | Dainippon Screen Mfg | Substrate treatment apparatus and substrate treatment method |
| TW201324656A (zh) * | 2011-08-25 | 2013-06-16 | Dainippon Screen Mfg | 基板處理裝置 |
| TW201335989A (zh) * | 2011-12-28 | 2013-09-01 | Dainippon Screen Mfg | 基板處理裝置及基板處理方法 |
| TW201340232A (zh) * | 2012-01-27 | 2013-10-01 | Dainippon Screen Mfg | 基板處理裝置及基板處理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201727733A (zh) | 2017-08-01 |
| CN108475628B (zh) | 2022-10-14 |
| JP6617036B2 (ja) | 2019-12-04 |
| KR102126143B1 (ko) | 2020-06-23 |
| KR20180086499A (ko) | 2018-07-31 |
| JP2017130483A (ja) | 2017-07-27 |
| CN108475628A (zh) | 2018-08-31 |
| WO2017126178A1 (ja) | 2017-07-27 |
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