TW200709291A - Cleaning device for substrate - Google Patents

Cleaning device for substrate

Info

Publication number
TW200709291A
TW200709291A TW095103950A TW95103950A TW200709291A TW 200709291 A TW200709291 A TW 200709291A TW 095103950 A TW095103950 A TW 095103950A TW 95103950 A TW95103950 A TW 95103950A TW 200709291 A TW200709291 A TW 200709291A
Authority
TW
Taiwan
Prior art keywords
substrate
cleaning liquid
cleaned
pure water
support means
Prior art date
Application number
TW095103950A
Other languages
Chinese (zh)
Inventor
Yosuke Naito
Masayuki Kato
Yasuyuki Harada
Original Assignee
Pre Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pre Tech Co Ltd filed Critical Pre Tech Co Ltd
Publication of TW200709291A publication Critical patent/TW200709291A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A cleaning device (1) for a substrate, having a substrate support means (3) with an annular shape for supporting a substrate (9), and a cleaning liquid supply means (2) for supplying cleaning liquid (6) composed of pure water or chemical liquid to the substrate supported by the substrate support means. The substrate support means has positioning pins (4) for positioning the substrate while supporting an end surface of the substrate at three or more points, and a protrusion portion (5) where long and short protrusions (5a, 5b) are continuously arranged along the circumference of the lower surface of the substrate positioned by the positioning pins. When the substrate is cleaned by supplying the pure water or chemical liquid from the cleaning liquid supply means, a gap formed between the lower surface of the substrate supported by the positioning pins and the protrusion portion being is by the pure water or chemical liquid. When a substrate requiring high cleanliness level such as a semiconductor substrate is cleaned, the cleaning liquid is prevented from flowing to the surface opposite to the surface to be cleaned, and also particles can be prevented from staying locally to cause contamination.
TW095103950A 2005-08-25 2006-02-06 Cleaning device for substrate TW200709291A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005243956A JP2007059664A (en) 2005-08-25 2005-08-25 Cleaning apparatus of substrate

Publications (1)

Publication Number Publication Date
TW200709291A true TW200709291A (en) 2007-03-01

Family

ID=37771335

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103950A TW200709291A (en) 2005-08-25 2006-02-06 Cleaning device for substrate

Country Status (3)

Country Link
JP (1) JP2007059664A (en)
TW (1) TW200709291A (en)
WO (1) WO2007023580A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102201878B1 (en) * 2018-09-07 2021-01-13 세메스 주식회사 Chuck pin and apparatus for treating substrate comprising thereof
KR102162260B1 (en) * 2018-10-22 2020-10-06 세메스 주식회사 Guide pin, unit for supporting photo mask with the guide pin, and apparatus for cleaning photo mask with the guide pin

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2903284B2 (en) * 1993-04-26 1999-06-07 東京エレクトロン株式会社 Processing device and processing method
EP1202326B1 (en) * 2000-10-31 2004-01-02 Sez Ag Apparatus for liquid treatment of wafers-like objects
JP2002359220A (en) * 2001-05-31 2002-12-13 Tokyo Electron Ltd Treatment apparatus for substrate
JP2004095870A (en) * 2002-08-30 2004-03-25 Toshiba Corp Method for manufacturing substrate processor and semiconductor device

Also Published As

Publication number Publication date
JP2007059664A (en) 2007-03-08
WO2007023580A1 (en) 2007-03-01

Similar Documents

Publication Publication Date Title
KR102124417B1 (en) Substrate supporting apparatus
TW200737298A (en) Substrate holding device, exposure device, exposure method, and device fabrication method
US7682457B2 (en) Frontside structure damage protected megasonics clean
TW200721363A (en) Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit
TW200731345A (en) Apparatus and method for reducing contamination in immersion lithography
TW200507979A (en) Substrate processing apparatus, substrate processing method, and substrate holding apparatus
TW200730759A (en) Socket of fluid transferring coupling device
MY159175A (en) Method and apparatus for cleaning a substrate using non-newtonian fluids
DE50305978D1 (en) HOLDERING FOR HOLDING SEMICONDUCTOR WAFERS IN A CHEMICAL-MECHANICAL POLISHING DEVICE
TW200703482A (en) Method and apparatus for cleaning electronic device
TW200638506A (en) Thermoelectric heating and cooling apparatus for semiconductor processing
ATE501286T1 (en) HOLDER SYSTEM FOR TREATMENT APPARATUS
TW200709291A (en) Cleaning device for substrate
TW449816B (en) Wet processing apparatus
JP2008124203A (en) Cleaning apparatus
KR102126143B1 (en) Substrate processing device
TW200721283A (en) Cleaning method and fabrication method of semiconductor device
JP4338612B2 (en) Substrate processing equipment
SG152197A1 (en) Cleaning apparatus and immersion lithographic apparatus
KR101213967B1 (en) Wafer cleaning apparatus
TWI265566B (en) Wafer protection system employed in chemical stations
TW200633046A (en) Semiconductor cleaning
JP2011071405A (en) Substrate processing apparatus, and cover member
JPH0458527A (en) Cleaning method
KR19980038993U (en) Electrolytic polishing device inside the gas pipe