JP2008124203A - Cleaning apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning apparatus which can improve the cleaning efficiency when cleaning substrates, etc., using gas dissolution water. <P>SOLUTION: Gas is dissolved in water by a gas dissolution equipment 1, the gas dissolution water is introduced into a cleaning tub 4 which is a shell body, the substrates S, etc., as cleaning objects are cleaned. The gas dissolution water from the gas dissolution equipment 1 is introduced into the cleaning tub 4 through a piping 2 and a water pressure regulating valve 3. By being decompressed by the water pressure regulating valve 3, fine air bubbles arise in large quantity in the gas dissolution water introduced into the cleaning tub 4. By this water containing fine bubbles, the substrates are efficiently cleaned. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cleaning apparatus for cleaning an object to be cleaned such as an electronic substrate with gas-dissolved water.

  As a method for cleaning a semiconductor substrate or the like, it is well known to use gas-dissolved water in which a gas such as ozone, oxygen, or hydrogen is dissolved.

  For example, Japanese Patent Application Laid-Open No. 11-77021 uses hydrogen-dissolved water, Japanese Patent Application Laid-Open No. 2000-279902 uses oxygen-dissolved water, Japanese Patent Application Laid-Open No. 2002-23386 uses dissolved ozone water, In 281894, dissolved water of hydrogen and nitrogen is used.

As a cleaning method, a method in which a substrate is immersed in a tank, a method in which a cleaning liquid is sprayed from a nozzle toward the substrate, a method in which a liquid supply nozzle and a liquid suction nozzle are opposed to one surface of the substrate (Patent 3511441), etc. There are various things.
JP-A-11-77021 JP 2000-279902 A JP2002-23386 JP 2004-281894 A Patent 3511441

  An object of this invention is to provide the washing | cleaning apparatus which can improve the washing | cleaning efficiency at the time of wash | cleaning a board | substrate etc. using gas solution water.

  The cleaning apparatus of the present invention is a cleaning apparatus for cleaning an object to be cleaned with pressurized water in which a gas is dissolved under pressure, a gas dissolving apparatus for producing the pressurized water, a pipe for introducing pressurized water from the gas dissolving apparatus, and the pipe Having a chamber into which pressurized water is introduced through an introduction portion, and a chamber in which the object to be cleaned is accommodated or an opening for exposing the chamber to the object to be cleaned is provided, And a water pressure adjusting valve provided in the pressurized water introduction part or the pipe immediately adjacent thereto.

  In the cleaning apparatus of the present invention, the object to be cleaned is cleaned with the gas-dissolved water introduced into the shell. This gas-dissolved water is sent through a pipe from a gas-dissolving device that dissolves gas under pressure, but by reducing the water pressure with a water pressure adjusting valve provided in the shell or the nearest pipe. A large amount of fine bubbles are generated in the water. When water containing a large amount of fine bubbles comes into contact with the surface of the object to be cleaned, fine particles and dirt components on the surface of the object to be cleaned are efficiently removed from the surface.

  Hereinafter, embodiments will be described with reference to the drawings.

  FIG. 1 is a system diagram of a cleaning apparatus according to an embodiment of the present invention. In this embodiment, gas is dissolved in water by the gas dissolving apparatus 1, and the gas-dissolved water is introduced into the cleaning tank 4 serving as a shell to clean the substrate S as an object to be cleaned.

  The gas dissolving device 1 is a membrane gas dissolving device, and includes a gas chamber 1a and a water chamber 1b separated by a gas permeable membrane 1m. Gas is pressurized and supplied to the gas chamber 1a, and water is passed through the water chamber 1b by a pump (not shown). The gas that has permeated through the membrane 1 m is dissolved in the water in the water chamber 1 b, and the generated gas-dissolved water is introduced into the cleaning tank 4 through the pipe 2 and the water pressure adjustment valve 3.

  The washing tank 4 has a water inlet 4a on the lower side of the tank body and a drain outlet 4b on the upper side. In this embodiment, the water pressure adjusting valve 3 is attached to the inlet 4a. The substrate S is placed on a leg base 4c projecting upward from the bottom surface of the tank body. The cleaning tank 4 is configured to open and close the canopy 4d and put the substrate S in and out.

  In the cleaning apparatus configured as described above, the gas dissolved water sent from the gas dissolving apparatus 1 via the pipe 2 is decompressed by the water pressure adjusting valve 3 and introduced into the cleaning tank 4 to clean the substrate S. The The washing waste water flows out from the drain port 4b.

  By reducing the pressure by the water pressure adjusting valve 3, a large amount of fine bubbles are generated in the gas-dissolved water introduced into the cleaning tank 4. When the fine bubble-containing water comes into contact with the substrate S, the substrate S is efficiently cleaned. The cleaned substrate S is taken out by opening the canopy 4d, and the next substrate S is placed in the cleaning tank 4 and cleaned.

  In FIG. 1, the substrates S are put into and out of the cleaning tank 4 in a batch manner. However, the substrates S may be continuously passed through the cleaning tank 4 by being conveyed by a conveyor or the like.

  In FIG. 1, the water pressure adjusting valve 3 is attached to the introduction port 4a. However, the water pressure adjusting valve 3 may be provided in the middle of the pipe 2 at a position closest to the introduction port 4a (for example, within 50 mm from the introduction port 4a).

  In FIG. 1, the canopy 4d of the cleaning tank 4 is opened and closed. However, as shown in FIG. 2, the cleaning tank 7 is composed of two bodies, a lower half shell 7A and an upper half shell 7B that are substantially vertically symmetrical. The substrate S may be taken in and out by separating the upper half shell 7B and the lower half shell 7A.

  The lower half shell 7A has an inverted conical shape, and an introduction port 7a is provided at the bottom center. A water pressure adjusting valve 3 is attached to the introduction port 7 a, and the gas dissolved water from the pipe 2 is reduced in pressure by the water pressure adjusting valve 3 and then introduced into the cleaning tank 7. The introduced water contains a large amount of fine bubbles, and the substrate S is efficiently cleaned. The board | substrate S is mounted on the leg stand 7c.

  The upper half shell 7B has a regular conical shape, and a drain port 7b is provided at the upper center.

  FIG. 3A is a system diagram of a cleaning apparatus according to another embodiment, and FIG. 3B is an enlarged view of the nozzle portion.

  Also in this embodiment, the gas-dissolved water produced by the gas-dissolving device 1 is sent to the water pressure adjusting valve 3 via the pipe 2. In this embodiment, the water pressure adjusting valve 3 is attached to the inlet 5a of the nozzle 5 as a shell. The nozzle 5 has a bottomless container shape (downward cup shape) with an open bottom portion, and the introduction port 5 a is provided in the canopy portion of the nozzle 5.

  A substrate S as an object to be cleaned is disposed below the nozzle 5, and a slight gap (for example, about 1 to 3 mm) is provided between the lower end 5 b of the nozzle 5 and the substrate S. Since this gap is minute, the inside of the nozzle 5 is filled with water introduced from the inlet 5a.

  Also in this embodiment, a large amount of fine bubbles are generated in the cleaning water by reducing the pressure of the gas-dissolved water by the water pressure adjusting valve 3, and the substrate S is efficiently cleaned by the water containing fine bubbles. The cleaning water passes through the gap between the lower end 5 b of the nozzle 5 and the substrate S, and then flows down along the upper surface of the substrate S.

  When the substrate S is cleaned using such a downward cup-shaped nozzle 5, when the substrate S is disk-shaped, the substrate S is placed on the turntable 9 as shown in FIG. While rotating in the θ direction around the center, the nozzle 5 may be moved in the radial direction r of the substrate S, for example, reciprocated once or a plurality of times.

  In the present invention, as shown in FIG. 5, a gas discharge port 5d may be provided in the upper part of the nozzle 5, and the gas may flow out of the nozzle 5 through the gas discharge valve 5e. As a result, the inside of the nozzle 5 can be kept full and the substrate can be cleaned very efficiently.

  FIG. 6 is a cross-sectional view of the cleaning device portion of the cleaning device using the downward cup-shaped cleaning device 6 as a shell.

  The bottom of the cleaning device 6 is opened, and the substrate S is inserted into the bottom. An introduction port 6a is provided in the upper part of the cleaning device 6, and the water pressure adjusting valve 3 is attached to the introduction port 6a. Gas-dissolved water from the gas-dissolving device is introduced into the cleaning device 6 through the water pressure adjusting valve 3. There is a slight gap between the outer peripheral surface of the substrate S and the lower portion of the side peripheral wall 6b of the cleaning device 6. Since the gap is very small, the inside of the cleaning device 6 becomes full.

  Also in this embodiment, the gas-dissolved water from the pipe 2 is depressurized by the water pressure regulating valve 3 to become water containing a large amount of fine bubbles, and the substrate S is efficiently cleaned with the fine bubble-containing water. The cleaning waste water flows downward through the gap between the outer periphery of the substrate S and the side peripheral wall 6b.

  The substrate S is supported by the support member 8.

  FIG. 7 is a sectional view of a nozzle portion of a cleaning apparatus according to still another embodiment of the present invention.

  This nozzle 10 has a downward cup shape, and a water pressure adjusting valve 3 is attached to the upper inlet 10a, and the gas dissolved water from the pipe 2 is introduced into the nozzle 10 after being depressurized by the water pressure adjusting valve 3. Is done.

  A cover 11 is provided so as to cover the side periphery and the upper side of the nozzle 10. This cover 11 also has a downward cup shape, and a predetermined interval is provided between the outer periphery of the nozzle 10. A suction port 11 a is provided in the upper part of the cover 11, and a suction pump 13 is connected via a pipe 12. The lower end 11 b of the cover 11 is flush with the lower end 10 b of the nozzle 10.

  The substrate S is disposed on the nozzle lower end 5b and the cover lower end 11b so as to face each other with a predetermined gap. Since this gap is minute, the inside of the nozzle 10 is filled with water introduced from the inlet 10a.

  In the cleaning apparatus of FIG. 7, the gas-dissolved water from the pipe 2 is depressurized by the water pressure adjusting valve 3, water containing a large amount of fine bubbles is introduced into the nozzle 10, and the upper surface of the substrate S is cleaned. . This water goes around the lower end 10 b of the nozzle 10 and is sucked into the cover 11 and discharged through the suction port 11 a, the pipe 12 and the suction pump 13. For this reason, the cleaning waste water does not spread on the substrate S.

  Also in the cleaning apparatus of FIG. 7, the entire upper surface of the substrate S is cleaned by disposing the substrate S on the turntable as shown in FIG. 3 and moving the nozzle 10 in the radial direction of the turntable. can do.

  In the cleaning apparatus of FIG. 7, when the diameter of the nozzle 10 is large, the substrate S may be inserted into the bottom of the nozzle 10 for cleaning as shown in FIG. The substrate S is disposed on the base 14 via the support legs 15. There is a slight gap between the outer peripheral surface of the substrate S and the lower inner peripheral surface of the nozzle 10. There is a slight gap between the nozzle lower end 10 b and the cover lower end 11 b and the base 14.

  The substrate S is cleaned by the water containing fine bubbles introduced into the nozzle 10 through the water pressure adjusting valve 3, and the cleaning wastewater goes around the nozzle lower end 10 b, passes between the nozzle 10 and the cover 11, the suction port 11 a, and the piping 12, suctioned and discharged through the suction pump 13.

  Examples of the gas include, but are not limited to, nitrogen, carbon dioxide, argon, helium, hydrogen, oxygen, ozone, air, and ammonia.

  In the water pressure regulating valve 3, the pressure is preferably reduced to about 1/2 to 1/6 of the water pressure in the pipe 2.

  Examples of the substrate S include a silicon wafer, an FPD glass substrate, a photomask, and a hard disk. These substrates S may be finely processed.

  In the present invention, a water cooling device may be provided in the gas dissolving device 1 or a cooling device for cooling water introduced into the gas dissolving device 1 may be provided. By cooling the water with this cooling device, the gas solubility of the water is increased.

  In the present invention, there is provided a chemical injection means for adding a cleaning chemical to the water supply line to the gas dissolving apparatus 1, the gas dissolving apparatus 1, the pipe 2 or the shell (cleaning tanks 4, 7, nozzles 5, 10 or the cleaning device 6). May be. Examples of such cleaning chemicals include ammonia, ammonium compounds, alkalis such as alkali metal hydroxides, acids such as hydrochloric acid, nitric acid, sulfuric acid, and hydrofluoric acid, surfactants, chelating agents, and the like.

  In the present invention, an ultrasonic vibrator may be provided on the shell, and the cleaning action by ultrasonic waves may be superimposed.

  In the present invention, water heating means such as a heater may be provided in the pipe 2, the water pressure adjusting valve 3 or the shell to heat the gas-dissolved water. Thereby, gas solubility falls and the generation amount of a fine bubble increases. Moreover, the washing effect is improved by warm water. The flow direction of the gas-dissolved water may be either upward or downward, and in some cases may be the left-right direction.

It is a systematic diagram of the washing | cleaning apparatus which concerns on embodiment. It is sectional drawing of the nozzle part of the washing | cleaning apparatus which concerns on another embodiment. It is the systematic diagram and sectional drawing which show different embodiment. It is a perspective view which shows the washing | cleaning state of a board | substrate. It is sectional drawing of the nozzle part of another embodiment. It is sectional drawing of the washing | cleaning device part of another embodiment. It is sectional drawing of the nozzle part of another embodiment. It is sectional drawing which shows another embodiment.

Explanation of symbols

1 Gas dissolving device 2 Piping 3 Water pressure regulating valve 4, 7 Washing tank (shell)
5,10 Nozzle (shell)
6 Washer (shell)
11 Cover 13 Suction pump

Claims (8)

In a cleaning apparatus that cleans an object to be cleaned with pressurized water in which a gas is dissolved under pressure,
A gas dissolving device for producing the pressurized water;
Piping for introducing pressurized water from the gas dissolving device;
A shell having a chamber into which pressurized water is introduced from the pipe through an introduction portion, and containing an object to be cleaned or exposing the chamber to the object to be cleaned;
A cleaning apparatus comprising a pressurized water introduction part of the shell or a water pressure adjusting valve provided in the pipe immediately adjacent thereto. The shell according to claim 1, wherein the opening is provided on one surface of the shell,
A cleaning device, wherein a suction part for sucking water flowing out of the opening is provided around the opening.   The cleaning apparatus according to claim 2, wherein a cover that surrounds the shell is provided, and the suction portion is provided between the cover and the shell. In any one of Claims 1 thru | or 3, the said opening is provided in the lower surface of the said shell,
A cleaning apparatus, characterized in that a gas discharge part for discharging the gas in the shell is provided on the top of the shell.   The cleaning apparatus according to claim 1, wherein water cooling means is provided on the gas dissolving apparatus or upstream thereof.   6. The cleaning apparatus according to claim 1, wherein chemical addition means for adding a cleaning chemical is provided on the pipe or upstream thereof.   The cleaning apparatus according to claim 1, wherein an ultrasonic vibrator is provided in the shell body.   8. The cleaning apparatus according to claim 1, wherein a water heating means is provided in the shell or the pipe.

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