TWI616340B - 基板貼合裝置、顯示裝置用構件的製造裝置及製造方法 - Google Patents
基板貼合裝置、顯示裝置用構件的製造裝置及製造方法 Download PDFInfo
- Publication number
- TWI616340B TWI616340B TW103146425A TW103146425A TWI616340B TW I616340 B TWI616340 B TW I616340B TW 103146425 A TW103146425 A TW 103146425A TW 103146425 A TW103146425 A TW 103146425A TW I616340 B TWI616340 B TW I616340B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- adhesive layer
- bonding
- elastic sheet
- liquid crystal
- Prior art date
Links
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014001232A JP6235907B2 (ja) | 2014-01-07 | 2014-01-07 | 基板貼合装置、表示装置用部材の製造装置及び表示装置用部材の製造方法 |
JP2014-001232 | 2014-01-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201527117A TW201527117A (zh) | 2015-07-16 |
TWI616340B true TWI616340B (zh) | 2018-03-01 |
Family
ID=53647101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103146425A TWI616340B (zh) | 2014-01-07 | 2014-12-31 | 基板貼合裝置、顯示裝置用構件的製造裝置及製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6235907B2 (ja) |
KR (1) | KR101840902B1 (ja) |
CN (1) | CN104765167B (ja) |
TW (1) | TWI616340B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6558979B2 (ja) * | 2015-06-29 | 2019-08-14 | ユニ・チャーム株式会社 | 吸収性物品 |
JP2017120365A (ja) * | 2015-12-28 | 2017-07-06 | 株式会社ジャパンディスプレイ | 表示装置およびその製造方法 |
CN106094308B (zh) * | 2016-08-19 | 2019-02-19 | 中航华东光电有限公司 | 一种液晶屏与保护玻璃定位连接装置 |
CN106405947A (zh) * | 2016-10-27 | 2017-02-15 | 宁波视睿迪光电有限公司 | 液晶透镜膜及液晶透镜膜制造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001189553A (ja) * | 1999-12-28 | 2001-07-10 | Sharp Corp | 基板の接合装置及びその装置を用いた基板の接合方法 |
US6790300B2 (en) * | 2000-09-14 | 2004-09-14 | Hitachi Electronics Engineering Co., Ltd. | Method and apparatus for bonding substrate plates together through gap-forming sealer material |
KR20130104602A (ko) * | 2012-03-14 | 2013-09-25 | 시바우라 메카트로닉스 가부시끼가이샤 | 접합 장치 및 접합 방법 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4440599B2 (ja) * | 2002-12-04 | 2010-03-24 | 芝浦メカトロニクス株式会社 | 基板の貼り合わせ装置 |
JP4372757B2 (ja) * | 2006-01-26 | 2009-11-25 | 株式会社アルバック | 基板貼合せ装置 |
JP5639476B2 (ja) * | 2008-11-28 | 2014-12-10 | 三井化学株式会社 | 有機el素子の面封止剤、表示装置の製造方法および表示装置 |
MY166643A (en) * | 2010-06-15 | 2018-07-17 | Denka Company Ltd | Method for manufacturing translucent rigid substrate laminate |
CN202088635U (zh) * | 2011-05-18 | 2011-12-28 | 宸鸿科技(厦门)有限公司 | 透明多层板贴合装置 |
KR20130048393A (ko) * | 2011-11-02 | 2013-05-10 | 주식회사 탑 엔지니어링 | 패널 부착 장치 |
KR101337550B1 (ko) * | 2011-11-23 | 2013-12-06 | 엘아이지에이디피 주식회사 | 합착장치 |
CN103317816B (zh) * | 2012-03-23 | 2017-07-21 | 芝浦机械电子装置股份有限公司 | 粘合装置以及粘合基板的制造方法 |
-
2014
- 2014-01-07 JP JP2014001232A patent/JP6235907B2/ja active Active
- 2014-12-26 KR KR1020140190457A patent/KR101840902B1/ko active IP Right Grant
- 2014-12-30 CN CN201410841674.4A patent/CN104765167B/zh active Active
- 2014-12-31 TW TW103146425A patent/TWI616340B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001189553A (ja) * | 1999-12-28 | 2001-07-10 | Sharp Corp | 基板の接合装置及びその装置を用いた基板の接合方法 |
US6790300B2 (en) * | 2000-09-14 | 2004-09-14 | Hitachi Electronics Engineering Co., Ltd. | Method and apparatus for bonding substrate plates together through gap-forming sealer material |
KR20130104602A (ko) * | 2012-03-14 | 2013-09-25 | 시바우라 메카트로닉스 가부시끼가이샤 | 접합 장치 및 접합 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20150082100A (ko) | 2015-07-15 |
CN104765167A (zh) | 2015-07-08 |
KR101840902B1 (ko) | 2018-03-21 |
JP2015129851A (ja) | 2015-07-16 |
CN104765167B (zh) | 2019-09-20 |
JP6235907B2 (ja) | 2017-11-22 |
TW201527117A (zh) | 2015-07-16 |
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