TWI614109B - 發光裝置用之反射體的壓縮成形方法與裝置 - Google Patents
發光裝置用之反射體的壓縮成形方法與裝置 Download PDFInfo
- Publication number
- TWI614109B TWI614109B TW101128863A TW101128863A TWI614109B TW I614109 B TWI614109 B TW I614109B TW 101128863 A TW101128863 A TW 101128863A TW 101128863 A TW101128863 A TW 101128863A TW I614109 B TWI614109 B TW I614109B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- pressing
- cavity
- reflector
- mold
- Prior art date
Links
- 238000000748 compression moulding Methods 0.000 title claims abstract description 53
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000003825 pressing Methods 0.000 claims abstract description 86
- 229920005989 resin Polymers 0.000 claims abstract description 84
- 239000011347 resin Substances 0.000 claims abstract description 84
- 238000000465 moulding Methods 0.000 claims abstract description 62
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 210000002445 nipple Anatomy 0.000 description 16
- 239000002585 base Substances 0.000 description 10
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000001721 transfer moulding Methods 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920002050 silicone resin Polymers 0.000 description 6
- 238000007373 indentation Methods 0.000 description 5
- -1 gallium sulfide compound Chemical class 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 229910052747 lanthanoid Inorganic materials 0.000 description 3
- 150000002602 lanthanoids Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP2011-183501 | 2011-08-25 | ||
| JP2011183501A JP5764821B2 (ja) | 2011-08-25 | 2011-08-25 | 圧縮成形方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201309457A TW201309457A (zh) | 2013-03-01 |
| TWI614109B true TWI614109B (zh) | 2018-02-11 |
Family
ID=47746348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101128863A TWI614109B (zh) | 2011-08-25 | 2012-08-10 | 發光裝置用之反射體的壓縮成形方法與裝置 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5764821B2 (ko) |
| KR (1) | KR101927827B1 (ko) |
| CN (1) | CN103764363B (ko) |
| SG (1) | SG2014009468A (ko) |
| TW (1) | TWI614109B (ko) |
| WO (1) | WO2013027601A1 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6127660B2 (ja) * | 2013-03-29 | 2017-05-17 | 株式会社カネカ | 発光素子実装用リードフレーム、発光素子実装用樹脂成型体及びその製造方法、並びにトランスファ成型用金型 |
| KR101504256B1 (ko) * | 2013-12-11 | 2015-03-20 | 주식회사 루멘스홀딩스 | 발광 소자 패키지용 금형 장치 |
| JP6298719B2 (ja) * | 2014-06-09 | 2018-03-20 | Ｔｏｗａ株式会社 | 樹脂封止装置及び樹脂封止方法 |
| JP6546879B2 (ja) * | 2016-05-26 | 2019-07-17 | アピックヤマダ株式会社 | 樹脂成形金型および樹脂成形方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011140550A (ja) * | 2010-01-06 | 2011-07-21 | Shin-Etsu Chemical Co Ltd | 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4484329B2 (ja) * | 2000-07-21 | 2010-06-16 | アピックヤマダ株式会社 | 樹脂封止方法及び樹脂封止装置 |
| JP3897565B2 (ja) * | 2001-10-25 | 2007-03-28 | アピックヤマダ株式会社 | 樹脂封止装置及び樹脂封止方法 |
| JP2003291147A (ja) * | 2002-04-03 | 2003-10-14 | Apic Yamada Corp | 成型金型および樹脂封止装置 |
| JP2005219297A (ja) | 2004-02-04 | 2005-08-18 | Apic Yamada Corp | 樹脂モールド方法および樹脂モールド装置 |
| JP2006027098A (ja) * | 2004-07-16 | 2006-02-02 | Apic Yamada Corp | 樹脂モールド方法および樹脂モールド装置 |
| JP2007142289A (ja) * | 2005-11-21 | 2007-06-07 | Sharp Corp | 発光装置 |
| JP2009124012A (ja) * | 2007-11-16 | 2009-06-04 | Towa Corp | 電子部品の圧縮成形方法及び金型 |
| JP4553944B2 (ja) * | 2008-01-10 | 2010-09-29 | アピックヤマダ株式会社 | 樹脂モールド方法および樹脂モールド装置 |
| JP5174630B2 (ja) * | 2008-11-26 | 2013-04-03 | Ｔｏｗａ株式会社 | 光学成形品の圧縮成形方法 |
| JP5419070B2 (ja) * | 2009-03-13 | 2014-02-19 | アピックヤマダ株式会社 | 樹脂封止装置 |
| JP5327042B2 (ja) * | 2009-03-26 | 2013-10-30 | 豊田合成株式会社 | Ｌｅｄランプの製造方法 |
| KR101140961B1 (ko) | 2009-10-26 | 2012-05-03 | 삼성전기주식회사 | 광학소자용 패키지 기판 및 제조방법 |
| JP5562273B2 (ja) * | 2011-03-02 | 2014-07-30 | Ｔｏｗａ株式会社 | 光電子部品の製造方法及び製造装置 |
-
2011
- 2011-08-25 JP JP2011183501A patent/JP5764821B2/ja active Active
-
2012
- 2012-08-09 WO PCT/JP2012/070368 patent/WO2013027601A1/ja active Application Filing
- 2012-08-09 KR KR1020147004330A patent/KR101927827B1/ko active IP Right Grant
- 2012-08-09 CN CN201280041513.6A patent/CN103764363B/zh active Active
- 2012-08-09 SG SG2014009468A patent/SG2014009468A/en unknown
- 2012-08-10 TW TW101128863A patent/TWI614109B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011140550A (ja) * | 2010-01-06 | 2011-07-21 | Shin-Etsu Chemical Co Ltd | 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| SG2014009468A (en) | 2014-04-28 |
| JP5764821B2 (ja) | 2015-08-19 |
| TW201309457A (zh) | 2013-03-01 |
| WO2013027601A1 (ja) | 2013-02-28 |
| KR101927827B1 (ko) | 2018-12-11 |
| CN103764363A (zh) | 2014-04-30 |
| JP2013043391A (ja) | 2013-03-04 |
| CN103764363B (zh) | 2016-09-14 |
| KR20140053208A (ko) | 2014-05-07 |
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