CN103764363B - 发光装置用反射件的压缩成形方法和装置 - Google Patents

发光装置用反射件的压缩成形方法和装置 Download PDF

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Publication number
CN103764363B
CN103764363B CN201280041513.6A CN201280041513A CN103764363B CN 103764363 B CN103764363 B CN 103764363B CN 201280041513 A CN201280041513 A CN 201280041513A CN 103764363 B CN103764363 B CN 103764363B
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China
Prior art keywords
mentioned
die cavity
workpiece
cavity recess
pushpin
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CN201280041513.6A
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English (en)
Chinese (zh)
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CN103764363A (zh
Inventor
池田正信
中山英雄
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Yamada Most Advanced Science & Technology Co Ltd
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Yamada Most Advanced Science & Technology Co Ltd
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/36Moulds for making articles of definite length, i.e. discrete articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
CN201280041513.6A 2011-08-25 2012-08-09 发光装置用反射件的压缩成形方法和装置 Active CN103764363B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011183501A JP5764821B2 (ja) 2011-08-25 2011-08-25 圧縮成形方法及び装置
JP2011-183501 2011-08-25
PCT/JP2012/070368 WO2013027601A1 (ja) 2011-08-25 2012-08-09 発光装置用リフレクタの圧縮成形方法及び装置

Publications (2)

Publication Number Publication Date
CN103764363A CN103764363A (zh) 2014-04-30
CN103764363B true CN103764363B (zh) 2016-09-14

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CN201280041513.6A Active CN103764363B (zh) 2011-08-25 2012-08-09 发光装置用反射件的压缩成形方法和装置

Country Status (6)

Country Link
JP (1) JP5764821B2 (ko)
KR (1) KR101927827B1 (ko)
CN (1) CN103764363B (ko)
SG (1) SG2014009468A (ko)
TW (1) TWI614109B (ko)
WO (1) WO2013027601A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6127660B2 (ja) * 2013-03-29 2017-05-17 株式会社カネカ 発光素子実装用リードフレーム、発光素子実装用樹脂成型体及びその製造方法、並びにトランスファ成型用金型
KR101504256B1 (ko) * 2013-12-11 2015-03-20 주식회사 루멘스홀딩스 발광 소자 패키지용 금형 장치
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Towa株式会社 樹脂封止装置及び樹脂封止方法
JP6546879B2 (ja) * 2016-05-26 2019-07-17 アピックヤマダ株式会社 樹脂成形金型および樹脂成形方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1971956A (zh) * 2005-11-21 2007-05-30 夏普株式会社 发光装置
CN101436558A (zh) * 2007-11-16 2009-05-20 东和株式会社 电子器件的压缩成形方法以及金属模具

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4484329B2 (ja) * 2000-07-21 2010-06-16 アピックヤマダ株式会社 樹脂封止方法及び樹脂封止装置
JP3897565B2 (ja) * 2001-10-25 2007-03-28 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2003291147A (ja) * 2002-04-03 2003-10-14 Apic Yamada Corp 成型金型および樹脂封止装置
JP2005219297A (ja) 2004-02-04 2005-08-18 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2006027098A (ja) * 2004-07-16 2006-02-02 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP4553944B2 (ja) * 2008-01-10 2010-09-29 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP5174630B2 (ja) * 2008-11-26 2013-04-03 Towa株式会社 光学成形品の圧縮成形方法
JP5419070B2 (ja) * 2009-03-13 2014-02-19 アピックヤマダ株式会社 樹脂封止装置
JP5327042B2 (ja) * 2009-03-26 2013-10-30 豊田合成株式会社 Ledランプの製造方法
KR101140961B1 (ko) 2009-10-26 2012-05-03 삼성전기주식회사 광학소자용 패키지 기판 및 제조방법
JP2011140550A (ja) * 2010-01-06 2011-07-21 Shin-Etsu Chemical Co Ltd 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置
JP5562273B2 (ja) * 2011-03-02 2014-07-30 Towa株式会社 光電子部品の製造方法及び製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1971956A (zh) * 2005-11-21 2007-05-30 夏普株式会社 发光装置
CN101436558A (zh) * 2007-11-16 2009-05-20 东和株式会社 电子器件的压缩成形方法以及金属模具

Also Published As

Publication number Publication date
SG2014009468A (en) 2014-04-28
JP5764821B2 (ja) 2015-08-19
TW201309457A (zh) 2013-03-01
WO2013027601A1 (ja) 2013-02-28
KR101927827B1 (ko) 2018-12-11
CN103764363A (zh) 2014-04-30
TWI614109B (zh) 2018-02-11
JP2013043391A (ja) 2013-03-04
KR20140053208A (ko) 2014-05-07

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