TWI612296B - 資料修正裝置、描繪裝置、檢查裝置、資料修正方法、描繪方法、檢查方法及記錄有程式之記錄媒體 - Google Patents
資料修正裝置、描繪裝置、檢查裝置、資料修正方法、描繪方法、檢查方法及記錄有程式之記錄媒體 Download PDFInfo
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- TWI612296B TWI612296B TW105119616A TW105119616A TWI612296B TW I612296 B TWI612296 B TW I612296B TW 105119616 A TW105119616 A TW 105119616A TW 105119616 A TW105119616 A TW 105119616A TW I612296 B TWI612296 B TW I612296B
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/72—Repair or correction of mask defects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/80—Etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/706835—Metrology information management or control
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-147785 | 2015-07-27 | ||
| JP2015147785A JP6466277B2 (ja) | 2015-07-27 | 2015-07-27 | データ補正装置、描画装置、検査装置、データ補正方法、描画方法、検査方法およびプログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201710674A TW201710674A (zh) | 2017-03-16 |
| TWI612296B true TWI612296B (zh) | 2018-01-21 |
Family
ID=57945844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105119616A TWI612296B (zh) | 2015-07-27 | 2016-06-22 | 資料修正裝置、描繪裝置、檢查裝置、資料修正方法、描繪方法、檢查方法及記錄有程式之記錄媒體 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6466277B2 (ja) |
| KR (1) | KR20170013162A (ja) |
| TW (1) | TWI612296B (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108197658B (zh) * | 2018-01-11 | 2020-08-14 | 阿里巴巴集团控股有限公司 | 图像标注信息处理方法、装置、服务器及系统 |
| JP7214452B2 (ja) * | 2018-12-03 | 2023-01-30 | 株式会社エスケーエレクトロニクス | フォトマスクの製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201118629A (en) * | 2009-11-18 | 2011-06-01 | I-Yun Leu | Method for utilizing fabrication defect of an article |
| TW201207356A (en) * | 2010-06-04 | 2012-02-16 | Asml Netherlands Bv | Method & apparatus for measuring a structure on a substrate, method & apparatus for generating a model recipe, and computer program products for implementing such methods & apparatus |
| TW201511154A (zh) * | 2013-06-19 | 2015-03-16 | Kla Tencor Corp | 以運行時設計資料之使用偵測晶圓上之缺陷 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2830330B2 (ja) * | 1989-04-04 | 1998-12-02 | 松下電器産業株式会社 | 近接効果補正方法 |
| JP4274784B2 (ja) * | 2002-05-28 | 2009-06-10 | 新光電気工業株式会社 | 配線形成システムおよびその方法 |
| JP4515184B2 (ja) * | 2003-07-31 | 2010-07-28 | 富士フイルム株式会社 | パターン製造システム、露光装置および露光方法 |
| JP4493391B2 (ja) * | 2004-04-20 | 2010-06-30 | 新光電気工業株式会社 | パターン形成方法およびその装置ならびに設計データの補正方法およびその装置 |
| JP2006303229A (ja) * | 2005-04-21 | 2006-11-02 | Toray Eng Co Ltd | 回路形成システム |
| JP2009014830A (ja) * | 2007-07-02 | 2009-01-22 | Dainippon Screen Mfg Co Ltd | パターンデータ生成装置、露光システム、パターンデータ生成方法、およびプログラム |
| JP5826707B2 (ja) * | 2012-05-31 | 2015-12-02 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板検査装置および基板検査方法 |
-
2015
- 2015-07-27 JP JP2015147785A patent/JP6466277B2/ja active Active
-
2016
- 2016-06-22 TW TW105119616A patent/TWI612296B/zh active
- 2016-07-20 KR KR1020160092073A patent/KR20170013162A/ko not_active Application Discontinuation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201118629A (en) * | 2009-11-18 | 2011-06-01 | I-Yun Leu | Method for utilizing fabrication defect of an article |
| TW201207356A (en) * | 2010-06-04 | 2012-02-16 | Asml Netherlands Bv | Method & apparatus for measuring a structure on a substrate, method & apparatus for generating a model recipe, and computer program products for implementing such methods & apparatus |
| TW201511154A (zh) * | 2013-06-19 | 2015-03-16 | Kla Tencor Corp | 以運行時設計資料之使用偵測晶圓上之缺陷 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201710674A (zh) | 2017-03-16 |
| KR20170013162A (ko) | 2017-02-06 |
| JP6466277B2 (ja) | 2019-02-06 |
| JP2017026942A (ja) | 2017-02-02 |
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