TWI610820B - 元件基板及液體噴出頭 - Google Patents
元件基板及液體噴出頭 Download PDFInfo
- Publication number
- TWI610820B TWI610820B TW105100394A TW105100394A TWI610820B TW I610820 B TWI610820 B TW I610820B TW 105100394 A TW105100394 A TW 105100394A TW 105100394 A TW105100394 A TW 105100394A TW I610820 B TWI610820 B TW I610820B
- Authority
- TW
- Taiwan
- Prior art keywords
- connection
- region
- heating resistance
- resistance element
- electrical wiring
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 92
- 239000000758 substrate Substances 0.000 title claims abstract description 84
- 238000010438 heat treatment Methods 0.000 claims abstract description 199
- 238000009429 electrical wiring Methods 0.000 claims abstract description 92
- 230000001681 protective effect Effects 0.000 claims abstract description 24
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000005187 foaming Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 44
- 238000009826 distribution Methods 0.000 description 25
- 238000011084 recovery Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 238000004088 simulation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000014509 gene expression Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- HWEYZGSCHQNNEH-UHFFFAOYSA-N silicon tantalum Chemical compound [Si].[Ta] HWEYZGSCHQNNEH-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
- B41J2/05—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers produced by the application of heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015013197 | 2015-01-27 | ||
| JP2015-013197 | 2015-01-27 | ||
| JP2015-233689 | 2015-11-30 | ||
| JP2015233689A JP6598658B2 (ja) | 2015-01-27 | 2015-11-30 | 液体吐出ヘッドの素子基板及び液体吐出ヘッド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201632362A TW201632362A (zh) | 2016-09-16 |
| TWI610820B true TWI610820B (zh) | 2018-01-11 |
Family
ID=56559802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105100394A TWI610820B (zh) | 2015-01-27 | 2016-01-07 | 元件基板及液體噴出頭 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6598658B2 (enExample) |
| CN (2) | CN108372722B (enExample) |
| RU (1) | RU2645565C2 (enExample) |
| SG (1) | SG10201600629QA (enExample) |
| TW (1) | TWI610820B (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018150830A1 (en) | 2017-02-17 | 2018-08-23 | Canon Kabushiki Kaisha | Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus |
| JP7037334B2 (ja) | 2017-02-17 | 2022-03-16 | キヤノン株式会社 | 液体吐出ヘッド用基板、その製造方法、液体吐出ヘッド及び液体吐出装置 |
| JP2018130942A (ja) * | 2017-02-17 | 2018-08-23 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
| JP6625158B2 (ja) * | 2017-06-05 | 2019-12-25 | キヤノン株式会社 | 液体吐出ヘッド |
| US10300698B2 (en) | 2017-06-05 | 2019-05-28 | Canon Kabushiki Kaisha | Liquid ejection head |
| JP6942537B2 (ja) * | 2017-06-29 | 2021-09-29 | キヤノン株式会社 | 液体吐出ヘッド |
| EP3470228B1 (en) * | 2017-10-11 | 2021-06-30 | Canon Kabushiki Kaisha | Element substrate, manufacturing method thereof, printhead, and printing apparatus |
| JP7005376B2 (ja) * | 2018-02-15 | 2022-01-21 | キヤノン株式会社 | 素子基板、記録ヘッド、及び記録装置 |
| JP6701255B2 (ja) | 2018-04-12 | 2020-05-27 | キヤノン株式会社 | 液体吐出ヘッド基板、液体吐出ヘッド、液体吐出装置、および、液体吐出ヘッド基板の製造方法 |
| JP7114380B2 (ja) * | 2018-07-20 | 2022-08-08 | キヤノン株式会社 | 素子基板および液体吐出ヘッド |
| CN112703597B (zh) * | 2018-09-24 | 2024-12-24 | 惠普发展公司，有限责任合伙企业 | 连接的场效应晶体管 |
| JP7171426B2 (ja) * | 2018-12-27 | 2022-11-15 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法と液体吐出装置 |
| JP7328787B2 (ja) | 2019-04-23 | 2023-08-17 | キヤノン株式会社 | 素子基板、液体吐出ヘッド、及び記録装置 |
| JP7344669B2 (ja) * | 2019-04-23 | 2023-09-14 | キヤノン株式会社 | 素子基板、液体吐出ヘッド、及び記録装置 |
| JP7465096B2 (ja) * | 2020-01-20 | 2024-04-10 | キヤノン株式会社 | 素子基板、液体吐出ヘッド、及び記録装置 |
| JP2021187121A (ja) | 2020-06-03 | 2021-12-13 | キヤノン株式会社 | 素子基板、液体吐出ヘッド、及び記録装置 |
| JP7543096B2 (ja) | 2020-11-13 | 2024-09-02 | キヤノン株式会社 | 液体吐出ヘッド用基板、及び液体吐出ヘッド |
| JP2022078883A (ja) | 2020-11-13 | 2022-05-25 | キヤノン株式会社 | 液体吐出ヘッド用基板、及び液体吐出ヘッド |
| US12064965B2 (en) | 2021-09-03 | 2024-08-20 | Canon Kabushiki Kaisha | Element substrate and print head |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0924080A2 (en) * | 1997-12-22 | 1999-06-23 | Canon Kabushiki Kaisha | Ink jet recording head, substrate used for such a head, ink jet head cartridge, and ink jet recording apparatus |
| US20100245486A1 (en) * | 2009-03-25 | 2010-09-30 | Canon Kabushiki Kaisha | Recording element substrate, method of manufacturing the recording element substrate, and liquid ejection head |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2708557B2 (ja) * | 1988-07-26 | 1998-02-04 | キヤノン株式会社 | 液体噴射記録ヘッド用素子基板，液体噴射記録ヘッド，ヘッドカートリッジおよび記録装置 |
| US6382782B1 (en) * | 2000-12-29 | 2002-05-07 | Eastman Kodak Company | CMOS/MEMS integrated ink jet print head with oxide based lateral flow nozzle architecture and method of forming same |
| JP2005067164A (ja) * | 2003-08-28 | 2005-03-17 | Sony Corp | 液体吐出ヘッド、液体吐出装置及び液体吐出ヘッドの製造方法 |
| JP2005205891A (ja) * | 2003-12-26 | 2005-08-04 | Canon Inc | インクジェットヘッド用の基体、インクジェットヘッド、該インクジェットヘッドの駆動方法およびインクジェット記録装置 |
| KR100553914B1 (ko) * | 2004-01-29 | 2006-02-24 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
| KR100717023B1 (ko) * | 2005-08-27 | 2007-05-10 | 삼성전자주식회사 | 잉크젯 프린트헤드 및 그 제조방법 |
| JP2008307828A (ja) * | 2007-06-15 | 2008-12-25 | Canon Inc | 記録ヘッド |
| JP2010023397A (ja) * | 2008-07-23 | 2010-02-04 | Canon Finetech Inc | 液体吐出ヘッド |
| JP5328608B2 (ja) * | 2008-12-15 | 2013-10-30 | キヤノン株式会社 | 液体吐出ヘッド用基板、液体吐出ヘッド及びそれらの製造方法 |
| JP5606213B2 (ja) * | 2009-09-04 | 2014-10-15 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
| JP6222968B2 (ja) * | 2013-04-09 | 2017-11-01 | キヤノン株式会社 | 液体吐出ヘッド、液体吐出ヘッドのクリーニング方法、液体吐出装置 |
| JP6289234B2 (ja) * | 2014-04-15 | 2018-03-07 | キヤノン株式会社 | 記録素子基板及び液体吐出装置 |
-
2015
- 2015-11-30 JP JP2015233689A patent/JP6598658B2/ja active Active
-
2016
- 2016-01-07 TW TW105100394A patent/TWI610820B/zh active
- 2016-01-22 CN CN201810154140.2A patent/CN108372722B/zh active Active
- 2016-01-22 CN CN201610045927.6A patent/CN105818537B/zh active Active
- 2016-01-26 RU RU2016102322A patent/RU2645565C2/ru active
- 2016-01-27 SG SG10201600629QA patent/SG10201600629QA/en unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0924080A2 (en) * | 1997-12-22 | 1999-06-23 | Canon Kabushiki Kaisha | Ink jet recording head, substrate used for such a head, ink jet head cartridge, and ink jet recording apparatus |
| US20100245486A1 (en) * | 2009-03-25 | 2010-09-30 | Canon Kabushiki Kaisha | Recording element substrate, method of manufacturing the recording element substrate, and liquid ejection head |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108372722B (zh) | 2020-04-21 |
| RU2016102322A (ru) | 2017-08-01 |
| CN105818537A (zh) | 2016-08-03 |
| RU2645565C2 (ru) | 2018-02-21 |
| CN108372722A (zh) | 2018-08-07 |
| SG10201600629QA (en) | 2016-08-30 |
| JP6598658B2 (ja) | 2019-10-30 |
| JP2016137705A (ja) | 2016-08-04 |
| CN105818537B (zh) | 2018-03-06 |
| TW201632362A (zh) | 2016-09-16 |
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