TWI609102B - 基於銅（ｉ）離子的用於白青銅之不含氰化物之電鍍浴 - Google Patents

基於銅（ｉ）離子的用於白青銅之不含氰化物之電鍍浴 Download PDF

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Publication number
TWI609102B
TWI609102B TW104131420A TW104131420A TWI609102B TW I609102 B TWI609102 B TW I609102B TW 104131420 A TW104131420 A TW 104131420A TW 104131420 A TW104131420 A TW 104131420A TW I609102 B TWI609102 B TW I609102B
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TW
Taiwan
Prior art keywords
copper
bath
tin
alloy
silver
Prior art date
Application number
TW104131420A
Other languages
English (en)
Chinese (zh)
Other versions
TW201612363A (en
Inventor
亞杜菲 弗尹特
喬納斯 蓋比
馬格特 克勞斯
Original Assignee
羅門哈斯電子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料有限公司 filed Critical 羅門哈斯電子材料有限公司
Publication of TW201612363A publication Critical patent/TW201612363A/zh
Application granted granted Critical
Publication of TWI609102B publication Critical patent/TWI609102B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW104131420A 2014-09-30 2015-09-23 基於銅（ｉ）離子的用於白青銅之不含氰化物之電鍍浴 TWI609102B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/503,389 US20160298249A1 (en) 2014-09-30 2014-09-30 Cyanide-free electroplating baths for white bronze based on copper (i) ions

Publications (2)

Publication Number Publication Date
TW201612363A TW201612363A (en) 2016-04-01
TWI609102B true TWI609102B (zh) 2017-12-21

Family

ID=54145685

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131420A TWI609102B (zh) 2014-09-30 2015-09-23 基於銅（ｉ）離子的用於白青銅之不含氰化物之電鍍浴

Country Status (6)

Country Link
US (1) US20160298249A1 (ja)
EP (1) EP3002350B1 (ja)
JP (1) JP6062010B2 (ja)
KR (1) KR101712960B1 (ja)
CN (1) CN105463528B (ja)
TW (1) TWI609102B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9984895B1 (en) * 2017-01-31 2018-05-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten
CN110678583B (zh) * 2017-06-01 2022-09-30 巴斯夫欧洲公司 包含流平剂的锡合金电镀组合物
CN108166029A (zh) * 2017-12-28 2018-06-15 广东达志环保科技股份有限公司 无氰白铜锡电镀液和电镀方法
CN110117803B (zh) * 2019-05-14 2020-10-23 广州超邦化工有限公司 氯化钾无氰镉钛合金镀液、其制备方法和电镀工艺
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
KR102539397B1 (ko) * 2020-11-24 2023-06-02 주식회사 호진플라텍 도금피막 내 은 함량의 분포 편차가 개선된 웨이퍼 범프용 주석-은 합금 전기 도금액
EP4370732A1 (en) 2021-07-15 2024-05-22 Seolfor Aktiebolag Electroplating compositions and methods for preparing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101194049A (zh) * 2005-04-14 2008-06-04 恩索恩公司 电沉积青铜的方法
CN101514465A (zh) * 2007-12-12 2009-08-26 罗门哈斯电子材料有限公司 电镀青铜

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JP2001234387A (ja) * 2000-02-17 2001-08-31 Yuken Industry Co Ltd 錫系電気めっきのウィスカー発生防止剤および防止方法
US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
WO2002024979A1 (de) * 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
EP1310582A1 (en) * 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
EP2565297A3 (en) * 2011-08-30 2013-04-24 Rohm and Haas Electronic Materials LLC Adhesion promotion of cyanide-free white bronze
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method
CN102605394B (zh) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 一种无氰酸性白铜锡电镀液
US20150122662A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101194049A (zh) * 2005-04-14 2008-06-04 恩索恩公司 电沉积青铜的方法
CN101514465A (zh) * 2007-12-12 2009-08-26 罗门哈斯电子材料有限公司 电镀青铜

Also Published As

Publication number Publication date
EP3002350B1 (en) 2017-11-22
JP6062010B2 (ja) 2017-01-18
KR101712960B1 (ko) 2017-03-08
EP3002350A1 (en) 2016-04-06
JP2016074979A (ja) 2016-05-12
CN105463528B (zh) 2017-12-08
TW201612363A (en) 2016-04-01
KR20160038805A (ko) 2016-04-07
US20160298249A1 (en) 2016-10-13
CN105463528A (zh) 2016-04-06

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