KR101712960B1 - 구리 이온(i) 기반의 백색 청동용 시안화물이 없는 전기 도금조 - Google Patents

구리 이온(i) 기반의 백색 청동용 시안화물이 없는 전기 도금조 Download PDF

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Publication number
KR101712960B1
KR101712960B1 KR1020150136441A KR20150136441A KR101712960B1 KR 101712960 B1 KR101712960 B1 KR 101712960B1 KR 1020150136441 A KR1020150136441 A KR 1020150136441A KR 20150136441 A KR20150136441 A KR 20150136441A KR 101712960 B1 KR101712960 B1 KR 101712960B1
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KR
South Korea
Prior art keywords
dithia
copper
tin
electroplating
tetrazole
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KR1020150136441A
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English (en)
Korean (ko)
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KR20160038805A (ko
Inventor
포옛 아돌프
구베이 조나스
클라우스 마깃
Original Assignee
롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨
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Publication of KR20160038805A publication Critical patent/KR20160038805A/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020150136441A 2014-09-30 2015-09-25 구리 이온(i) 기반의 백색 청동용 시안화물이 없는 전기 도금조 KR101712960B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/503,389 2014-09-30
US14/503,389 US20160298249A1 (en) 2014-09-30 2014-09-30 Cyanide-free electroplating baths for white bronze based on copper (i) ions

Publications (2)

Publication Number Publication Date
KR20160038805A KR20160038805A (ko) 2016-04-07
KR101712960B1 true KR101712960B1 (ko) 2017-03-08

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150136441A KR101712960B1 (ko) 2014-09-30 2015-09-25 구리 이온(i) 기반의 백색 청동용 시안화물이 없는 전기 도금조

Country Status (6)

Country Link
US (1) US20160298249A1 (ja)
EP (1) EP3002350B1 (ja)
JP (1) JP6062010B2 (ja)
KR (1) KR101712960B1 (ja)
CN (1) CN105463528B (ja)
TW (1) TWI609102B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220071430A (ko) * 2020-11-24 2022-05-31 주식회사 호진플라텍 도금피막 내 은 함량의 분포 편차가 개선된 웨이퍼 범프용 주석-은 합금 전기 도금액

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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US9984895B1 (en) * 2017-01-31 2018-05-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten
CN110678583B (zh) * 2017-06-01 2022-09-30 巴斯夫欧洲公司 包含流平剂的锡合金电镀组合物
CN108166029A (zh) * 2017-12-28 2018-06-15 广东达志环保科技股份有限公司 无氰白铜锡电镀液和电镀方法
CN110117803B (zh) * 2019-05-14 2020-10-23 广州超邦化工有限公司 氯化钾无氰镉钛合金镀液、其制备方法和电镀工艺
US20210172082A1 (en) * 2019-12-10 2021-06-10 Rohm And Haas Electronic Materials Llc Acidic aqueous binary silver-bismuth alloy electroplating compositions and methods
EP4370732A1 (en) 2021-07-15 2024-05-22 Seolfor Aktiebolag Electroplating compositions and methods for preparing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234387A (ja) 2000-02-17 2001-08-31 Yuken Industry Co Ltd 錫系電気めっきのウィスカー発生防止剤および防止方法
EP2565297A2 (en) 2011-08-30 2013-03-06 Rohm and Haas Electronic Materials LLC Adhesion promotion of cyanide-free white bronze
EP2868778A2 (en) 2013-11-05 2015-05-06 Rohm and Haas Electronic Materials LLC Plating bath and method

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US7628903B1 (en) * 2000-05-02 2009-12-08 Ishihara Chemical Co., Ltd. Silver and silver alloy plating bath
WO2002024979A1 (de) * 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
EP1310582A1 (en) * 2001-11-07 2003-05-14 Shipley Company LLC Process for electrolytic copper plating
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
JP5642928B2 (ja) * 2007-12-12 2014-12-17 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 青銅の電気めっき
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
DE102011008836B4 (de) * 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
US8888984B2 (en) * 2012-02-09 2014-11-18 Rohm And Haas Electronic Materials Llc Plating bath and method
CN102605394B (zh) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 一种无氰酸性白铜锡电镀液

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001234387A (ja) 2000-02-17 2001-08-31 Yuken Industry Co Ltd 錫系電気めっきのウィスカー発生防止剤および防止方法
EP2565297A2 (en) 2011-08-30 2013-03-06 Rohm and Haas Electronic Materials LLC Adhesion promotion of cyanide-free white bronze
EP2868778A2 (en) 2013-11-05 2015-05-06 Rohm and Haas Electronic Materials LLC Plating bath and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220071430A (ko) * 2020-11-24 2022-05-31 주식회사 호진플라텍 도금피막 내 은 함량의 분포 편차가 개선된 웨이퍼 범프용 주석-은 합금 전기 도금액
KR102539397B1 (ko) * 2020-11-24 2023-06-02 주식회사 호진플라텍 도금피막 내 은 함량의 분포 편차가 개선된 웨이퍼 범프용 주석-은 합금 전기 도금액

Also Published As

Publication number Publication date
EP3002350B1 (en) 2017-11-22
JP6062010B2 (ja) 2017-01-18
EP3002350A1 (en) 2016-04-06
JP2016074979A (ja) 2016-05-12
TWI609102B (zh) 2017-12-21
CN105463528B (zh) 2017-12-08
TW201612363A (en) 2016-04-01
KR20160038805A (ko) 2016-04-07
US20160298249A1 (en) 2016-10-13
CN105463528A (zh) 2016-04-06

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