TWI608900B - Plate body processing method and plate body processing device - Google Patents

Plate body processing method and plate body processing device Download PDF

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Publication number
TWI608900B
TWI608900B TW103131663A TW103131663A TWI608900B TW I608900 B TWI608900 B TW I608900B TW 103131663 A TW103131663 A TW 103131663A TW 103131663 A TW103131663 A TW 103131663A TW I608900 B TWI608900 B TW I608900B
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plate
resin
vermiculite
bonded
bonded vermiculite
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TW103131663A
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Chinese (zh)
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TW201511887A (en
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今里祐介
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旭硝子股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0023Other grinding machines or devices grinding machines with a plurality of working posts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds

Description

板狀體之加工方法以及板狀體之加工裝置 Method for processing plate body and processing device for plate body

本發明係關於一種樹脂黏合砥石之研磨用槽之製作方法及樹脂黏合砥石、以及板狀體之加工裝置及板狀體之加工方法。 The present invention relates to a method for producing a groove for polishing a resin-bonded vermiculite, a resin-bonded vermiculite, a processing device for a plate-shaped body, and a method for processing a plate-shaped body.

液晶顯示器、電漿顯示器等中所使用之作為板狀體之FPD(Flat Panel Display,平板顯示器)用玻璃板係將熔融玻璃成形為板狀,其後,藉由切斷裝置切斷成特定之矩形尺寸之玻璃板。然後,藉由專利文獻1等所揭示之倒角裝置(板狀體之加工裝置)之倒角用砥石,研削玻璃板之緣部對其進行倒角加工。 In a glass plate for an FPD (Flat Panel Display) which is a plate-like body used in a liquid crystal display or a plasma display, the molten glass is formed into a plate shape, and then cut into specific parts by a cutting device. Rectangular sized glass plate. Then, the chamfering device of the chamfering device (the processing device for the plate-like body) disclosed in Patent Document 1 or the like is chamfered, and the edge portion of the glass plate is ground and chamfered.

又,專利文獻2所記載之倒角裝置包括倒角用砥石及冷卻液(研削液)噴射噴嘴等。上述倒角用砥石係以與正交於玻璃板之主面之軸平行的軸為中心進行旋轉,並且其旋轉方向於玻璃板之研削部被設定為與玻璃板之搬送方向相對之方向。又,於倒角用砥石之成為研削面之外周面形成有圓弧狀之研削用槽,藉由該研削用槽而將玻璃板之緣部研削成剖面圓弧狀。 Further, the chamfering device described in Patent Document 2 includes a chamfering vermiculite, a cooling liquid (grinding fluid) injection nozzle, and the like. The chamfering vermiculite system rotates around an axis parallel to the axis orthogonal to the main surface of the glass sheet, and the direction of rotation of the chamfer is set to a direction opposite to the conveying direction of the glass sheet. Further, in the chamfered vermiculite, an arc-shaped grinding groove is formed on the outer peripheral surface of the grinding surface, and the edge portion of the glass plate is ground into a circular arc shape by the grinding groove.

進而,於板狀體之倒角裝置中,已知有如專利文獻3所示包括研削(粗加工)用之金屬黏合砥石與研磨(精密加工)用之樹脂黏合砥石者。根據該倒角裝置,藉由上述金屬黏合砥石對板狀體之緣部進行研削而於上述緣部形成倒角面,其後,藉由樹脂黏合砥石對上述倒角面進行研磨。 Further, in the chamfering device of the plate-like body, a metal-bonded vermiculite for grinding (roughing) and a resin for grinding (precision machining) bonded to a vermiculite are known as disclosed in Patent Document 3. According to the chamfering device, the edge portion of the plate-like body is ground by the metal-bonded vermiculite to form a chamfered surface on the edge portion, and then the chamfered surface is polished by resin-bonded vermiculite.

於專利文獻3之樹脂黏合砥石之外周面形成有供板狀體之倒角面抵接之研磨用槽。 A polishing groove for abutting the chamfered surface of the plate-like body is formed on the outer peripheral surface of the resin-bonded vermiculite of Patent Document 3.

[先前技術文獻] [Previous Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2002-160147號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-160147

[專利文獻2]日本專利特開2009-172749號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-172749

[專利文獻3]日本專利特開2001-71244號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2001-71244

近年來,於進行板狀體之緣部之倒角加工時,因品質要求之提高而進行精加工之需求提高。於利用專利文獻3所揭示之樹脂黏合砥石進行精加工之情形時,必須製作與板狀體之緣部之形狀一致之槽形狀。又,為高品質地進行精加工,必須正確地將精加工砥石之槽對準板狀體之緣部之位置。該調整作業需要熟練度,且耗費時間。 In recent years, in the chamfering process of the edge portion of the plate-shaped body, the demand for finishing is improved due to an improvement in quality requirements. In the case of finishing by the resin-bonded vermiculite disclosed in Patent Document 3, it is necessary to form a groove shape that matches the shape of the edge portion of the plate-like body. Further, in order to perform finishing with high quality, it is necessary to accurately align the groove of the finished vermiculite with the position of the edge portion of the plate-shaped body. This adjustment work requires proficiency and is time consuming.

本發明係鑒於此種情況而成者,其目的在於提供一種可將研磨板狀體之端部之研磨用槽製作成與板狀體之緣部之形狀一致之槽形狀的樹脂黏合砥石之研磨用槽之製作方法、藉由該製作方法而製造之樹脂黏合砥石、以及使用該樹脂黏合砥石之板狀體之加工裝置及板狀體之加工方法。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin-bonded vermiculite which can be formed into a groove shape in which the polishing groove of the end portion of the polishing plate-like body is formed to conform to the shape of the edge portion of the plate-like body. A method for producing a groove, a resin-bonded vermiculite produced by the production method, and a processing device for processing a plate-shaped body of the vermiculite using the resin, and a method for processing the plate-shaped body.

為達成上述目的,本發明提供一種樹脂黏合砥石之研磨用槽之製作方法,其特徵在於:將外周面扁平之樹脂黏合砥石與較上述樹脂黏合砥石之黏合劑更硬質之板狀體對齊配置,一面使上述樹脂黏合砥石繞中心軸旋轉,一面使上述樹脂黏合砥石之上述外周面與上述板狀體之緣部相對地按壓,而於上述樹脂黏合砥石之上述外周面製造轉印上述板狀體之上述緣部之形狀而成之環狀之研磨用槽。 In order to achieve the above object, the present invention provides a method for producing a groove for polishing a resin-bonded vermiculite, characterized in that a resin-bonded vermiculite having a flat outer peripheral surface is aligned with a plate-like body which is harder than the binder of the resin-bonded vermiculite, While the resin-bonded vermiculite is rotated around the central axis, the outer peripheral surface of the resin-bonded vermiculite is pressed against the edge of the plate-like body, and the plate-like body is transferred onto the outer peripheral surface of the resin-bonded vermiculite. An annular polishing groove formed by the shape of the edge portion.

根據本發明,將外周面扁平之樹脂黏合砥石與較樹脂黏合砥石之黏合劑(bond)更硬質之板狀體對齊配置。並且,一面使樹脂黏合砥石繞樹脂黏合砥石之中心軸旋轉,一面將樹脂黏合砥石之扁平之外周面與板狀體之緣部相對地按壓。藉此,樹脂黏合砥石之外周面被板狀體之緣部研削,因此,可於樹脂黏合砥石之外周面製作轉印板狀體之緣部之輪廓形狀而成之環狀之研磨用槽。又,根據本發明,無需如先前之樹脂黏合砥石般將該樹脂黏合砥石之既有之槽對準板狀體之緣部之位置的調整作業。即,本發明之一態樣可製作上述研磨用槽,同時對板狀體之緣部進行研磨加工。 According to the present invention, the resin-bonded vermiculite having a flat outer peripheral surface is aligned with the plate-like body which is harder than the bond of the resin-bonded vermiculite. Further, while the resin-bonded vermiculite is rotated around the central axis of the resin-bonded vermiculite, the flat outer peripheral surface of the resin-bonded vermiculite is pressed against the edge portion of the plate-like body. In this way, the outer peripheral surface of the resin-bonded vermiculite is ground by the edge portion of the plate-like body. Therefore, an annular polishing groove formed by transferring the contour shape of the edge portion of the plate-like body to the outer surface of the resin-bonded vermiculite can be produced. Further, according to the present invention, it is not necessary to adjust the position at which the groove of the resin-bonded vermiculite is aligned with the edge of the plate-like body as in the prior resin-bonded vermiculite. That is, in one aspect of the present invention, the polishing groove can be produced, and the edge portion of the plate-like body can be polished.

本發明之一態樣較佳為一面藉由金屬黏合砥石將上述板狀體之緣部研削加工成特定之形狀,一面使被研削加工成上述特定之形狀之上述板狀體之上述緣部與上述樹脂黏合砥石之上述外周面相對地按壓,而於上述樹脂黏合砥石之上述外周面製作上述研磨用槽。 In one aspect of the invention, it is preferable that the edge portion of the plate-like body is ground into a specific shape by metal-bonded vermiculite, and the edge portion of the plate-like body that has been ground into the specific shape is The outer peripheral surface of the resin-bonded vermiculite is relatively pressed, and the polishing groove is formed on the outer peripheral surface of the resin-bonded vermiculite.

根據本發明之一態樣,藉由金屬黏合砥石對板狀體之緣部進行研削而於上述緣部形成倒角面。並且,將上述倒角面與樹脂黏合砥石之扁平之外周面相對地按壓。藉此,可於樹脂黏合砥石之外周面製作與倒角面之輪廓形狀為相同形狀之研磨用槽。 According to an aspect of the present invention, the edge portion of the plate-like body is ground by the metal-bonded vermiculite to form a chamfered surface at the edge portion. Then, the chamfered surface is pressed against the flat outer peripheral surface of the resin-bonded vermiculite. Thereby, a polishing groove having the same shape as that of the chamfered surface can be formed on the outer surface of the resin-bonded vermiculite.

本發明之一態樣較佳為使上述樹脂黏合砥石之上述外周面按壓於上述板狀體之上述緣部中除角部以外之邊部而製作上述研磨用槽。 In one aspect of the invention, it is preferable that the outer circumferential surface of the resin-bonded vermiculite is pressed against a side portion of the edge portion of the plate-shaped body other than the corner portion to form the polishing groove.

若將板狀體之緣部之角部與樹脂黏合砥石之外周面相對地按壓,則因樹脂黏合砥石之旋轉而產生之外力作用於角部而應力集中於角部,從而有角部破損之情形。 When the corner portion of the edge portion of the plate-like body is pressed against the peripheral surface of the resin-bonded vermiculite, an external force acts on the corner portion due to the rotation of the resin-bonded vermiculite, and the stress concentrates on the corner portion, thereby causing the corner portion to be broken. situation.

相對於此,本發明之一態樣係將板狀體之緣部之邊部與樹脂黏合砥石之外周面相對地按壓,因此上述應力分散,藉此可防止板狀體之破損。 On the other hand, in one aspect of the present invention, since the side portion of the edge portion of the plate-like body is pressed against the outer peripheral surface of the resin-bonded vermiculite, the stress is dispersed, whereby the plate-shaped body can be prevented from being damaged.

本發明之一態樣較佳為上述樹脂黏合砥石之上述黏合劑為苯 酚、環氧樹脂、聚醯亞胺、聚胺基甲酸酯、聚矽氧、丁基橡膠、或天然橡膠,上述樹脂黏合砥石之砥粒為金剛石、立方晶氮化硼(CBN)、氧化鋁(Al2O3)、碳化矽(SiC)、浮石、或石榴石,且上述板狀體為玻璃板。 In one aspect of the invention, preferably, the binder of the resin-bonded vermiculite is phenol, epoxy resin, polyimine, polyurethane, polyoxymethylene, butyl rubber, or natural rubber, and the above resin The ruthenium of the bonded vermiculite is diamond, cubic boron nitride (CBN), alumina (Al 2 O 3 ), tantalum carbide (SiC), pumice, or garnet, and the above-mentioned plate-like body is a glass plate.

根據本發明之一態樣,藉由較樹脂黏合砥石之黏合劑更硬質之玻璃板之緣部而於樹脂黏合砥石之外周面製作研磨用槽。又,可藉由所製作之研磨用槽對玻璃板之緣部進行研磨。即,可於同一步驟中實施研磨用槽之製作與藉由所製作之研磨用槽對緣部之研磨。再者,玻璃板較樹脂黏合砥石之黏合劑更硬質。 According to an aspect of the present invention, the polishing groove is formed on the outer peripheral surface of the resin-bonded vermiculite by the edge of the glass plate which is harder than the binder of the resin-bonded vermiculite. Further, the edge portion of the glass plate can be polished by the polishing groove to be produced. That is, in the same step, the polishing groove can be produced and the edge of the polishing groove produced by the polishing can be polished. Furthermore, the glass sheet is harder than the binder of the resin bonded vermiculite.

為達成上述目的,本發明提供一種樹脂黏合砥石,其特徵在於:其係藉由本發明之樹脂黏合砥石之研磨用槽之製作方法而製造。 In order to achieve the above object, the present invention provides a resin-bonded vermiculite which is produced by a method for producing a polishing groove for a resin-bonded vermiculite according to the present invention.

為達成上述目的,本發明提供一種板狀體之加工裝置,其特徵在於包括:平台,其保持板狀體;本發明之樹脂黏合砥石,其對保持於上述平台之上述板狀體之緣部進行研磨;旋轉機構,其使上述樹脂黏合砥石以上述樹脂黏合砥石之中心軸為中心進行旋轉;移動機構,其使上述樹脂黏合砥石之研磨用槽與上述板狀體之緣部接觸,並使上述樹脂黏合砥石或上述板狀體沿上述板狀體之緣部移動;及噴射機構,其對上述樹脂黏合砥石之上述研磨用槽與上述板狀體之緣部之接觸部位噴射冷卻液。 In order to achieve the above object, the present invention provides a processing apparatus for a plate-shaped body, comprising: a platform for holding a plate-like body; and a resin-bonded vermiculite according to the present invention, which is held at an edge portion of the plate-like body of the platform Grinding, wherein the resin-bonded vermiculite rotates around a central axis of the resin-bonded vermiculite; and a moving mechanism that contacts the polishing groove of the resin-bonded vermiculite with the edge of the plate-like body, and causes The resin-bonded vermiculite or the plate-like body moves along an edge portion of the plate-like body, and an ejecting mechanism that ejects a cooling liquid to a contact portion between the polishing groove of the resin-bonded vermiculite and an edge portion of the plate-shaped body.

進而,本發明之一態樣提供一種板狀體之加工方法,其特徵在於:使用本發明之一態樣之上述加工裝置對板狀體之緣部進行加工。 Further, an aspect of the present invention provides a method of processing a plate-like body, characterized in that the edge portion of the plate-like body is processed by the above-described processing apparatus according to an aspect of the present invention.

根據本發明,藉由旋轉機構使樹脂黏合砥石進行旋轉。繼而,藉由移動機構,使樹脂黏合砥石之研磨用槽與保持於平台之板狀體之緣部接觸,並使樹脂黏合砥石或板狀體沿板狀體之緣部移動。並且,藉由噴射機構對樹脂黏合砥石之研磨用槽與板狀體之緣部之接觸部位噴射冷卻液。藉此,可藉由樹脂黏合砥石之研磨用槽順利地研磨板狀 體之緣部。 According to the invention, the resin is bonded to the vermiculite by a rotating mechanism for rotation. Then, by the moving mechanism, the polishing groove for the resin-bonded vermiculite is brought into contact with the edge portion of the plate-like body held by the platform, and the resin-bonded vermiculite or the plate-like body is moved along the edge portion of the plate-like body. Then, the cooling liquid is sprayed to the contact portion between the polishing groove of the resin-bonded vermiculite and the edge portion of the plate-like body by the spraying mechanism. Thereby, the plate can be smoothly polished by the grinding groove of the resin bonded vermiculite The edge of the body.

本發明之一態樣較佳為包括金屬黏合砥石,該金屬黏合砥石係研削保持於上述平台之上述板狀體之緣部對其進行倒角加工,且上述樹脂黏合砥石係研磨上述板狀體之經上述倒角加工之緣部對其進行鏡面加工。 An aspect of the present invention preferably includes a metal bonded vermiculite which is subjected to chamfering processing at an edge portion of the plate-like body of the platform, and the resin-bonded vermiculite is used to polish the plate-like body. It is mirror-finished by the edge of the chamfering process described above.

根據本發明之一態樣,藉由金屬黏合砥石對板狀體之緣部進行倒角加工而於上述緣部形成倒角面。並且,藉由樹脂黏合砥石研磨倒角面對其進行鏡面加工。 According to an aspect of the present invention, the edge portion of the plate-like body is chamfered by the metal-bonded vermiculite to form a chamfered surface at the edge portion. Moreover, it is mirror-finished by resin-bonded vermiculite grinding chamfers.

根據本發明,可將研磨板狀體之端部之研磨用槽製作成與板狀體之緣部之形狀一致之槽形狀。 According to the invention, the groove for polishing the end portion of the plate-like body can be formed into a groove shape that matches the shape of the edge portion of the plate-like body.

10‧‧‧倒角裝置 10‧‧‧Chamfering device

12‧‧‧玻璃板 12‧‧‧ glass plate

12A~12D‧‧‧玻璃板之緣部 12A~12D‧‧‧The edge of the glass plate

12E、12E'‧‧‧玻璃板之端面 End face of 12E, 12E'‧‧‧ glass plates

12F‧‧‧玻璃板之主面 12F‧‧‧ the main face of the glass plate

12G‧‧‧玻璃板之交界面 12G‧‧‧ glass plate interface

14‧‧‧平台 14‧‧‧ platform

16‧‧‧移動裝置 16‧‧‧Mobile devices

18、20‧‧‧金屬黏合砥石 18, 20‧‧‧Metal bonded meteorite

22、24‧‧‧馬達 22, 24‧‧ ‧ motor

26、28‧‧‧樹脂黏合砥石 26, 28‧‧‧ resin bonded meteorite

30、32‧‧‧馬達 30, 32‧‧‧ motor

34、36、38、40‧‧‧噴嘴 34, 36, 38, 40‧ ‧ nozzle

42、44‧‧‧環狀槽 42, 44‧‧‧ annular groove

43‧‧‧外周面 43‧‧‧ outer perimeter

C‧‧‧角部 C‧‧‧ corner

S‧‧‧邊部 S‧‧‧Edge

圖1係應用本發明之板狀體之加工裝置的倒角裝置之俯視圖。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing a chamfering device of a processing apparatus for a plate-shaped body to which the present invention is applied.

圖2係表示砥石、玻璃板及噴嘴之配置位置之立體圖。 Fig. 2 is a perspective view showing the arrangement position of vermiculite, glass plate and nozzle.

圖3A係金屬黏合砥石之研削用槽與玻璃板之緣部對向配置之說明圖。 Fig. 3A is an explanatory view showing the arrangement of the edge of the grinding groove and the glass plate of the metal bonded vermiculite.

圖3B係藉由金屬黏合砥石研削玻璃板之緣部之說明圖。 Fig. 3B is an explanatory view of the edge portion of the glass plate which is ground by metal-bonded vermiculite.

圖3C係經研削而形成有倒角面之玻璃板之緣部之放大圖。 Fig. 3C is an enlarged view of the edge portion of the glass plate having the chamfered surface formed by grinding.

圖4係金屬黏合砥石之側視圖。 Figure 4 is a side view of a metal bonded vermiculite.

圖5係樹脂黏合砥石之整體立體圖。 Figure 5 is an overall perspective view of a resin bonded vermiculite.

圖6A係表示於樹脂黏合砥石製作研磨用槽之製作方法之說明圖。 Fig. 6A is an explanatory view showing a method of producing a groove for polishing a resin-bonded vermiculite.

圖6B係表示於樹脂黏合砥石製作研磨用槽之製作方法之說明圖。 Fig. 6B is an explanatory view showing a method of producing a groove for polishing a resin-bonded vermiculite.

圖7係將樹脂黏合砥石按壓於玻璃板之緣部之角部之說明圖。 Fig. 7 is an explanatory view showing a state in which a resin-bonded vermiculite is pressed against a corner portion of a glass plate.

圖8係將樹脂黏合砥石按壓於玻璃板之緣部之邊部之說明圖。 Fig. 8 is an explanatory view showing a state in which a resin-bonded vermiculite is pressed against a side portion of a glass plate.

以下,根據隨附圖式對本發明之樹脂黏合砥石之研磨用槽之製作方法及樹脂黏合砥石、以及板狀體之加工裝置及板狀體之加工方法的較佳實施形態進行詳細說明。 Hereinafter, a preferred embodiment of a method for producing a polishing groove for a resin-bonded vermiculite according to the present invention, a resin-bonded vermiculite, a processing device for a plate-shaped body, and a method for processing a plate-shaped body will be described in detail with reference to the accompanying drawings.

圖1係應用本發明之板狀體之加工裝置的實施形態之倒角裝置10之俯視圖。該倒角裝置10係研削厚度為0.7mm以下之液晶顯示器用玻璃板(板狀體)12之緣部12A~12D對其進行倒角加工,並且研磨倒角加工而成之倒角面對其進行鏡面加工的裝置。 Fig. 1 is a plan view showing a chamfering device 10 of an embodiment of a processing apparatus for a plate-shaped body to which the present invention is applied. The chamfering device 10 is subjected to chamfering by grinding the edge portions 12A to 12D of the glass plate (plate-like body) 12 for a liquid crystal display having a thickness of 0.7 mm or less, and chamfering by grinding and chamfering A device for mirror processing.

再者,作為可應用於本發明之加工裝置之板狀體,並不限定於液晶顯示器用玻璃板。例如,可為電漿顯示器用玻璃板、LED(Light Emitting Diode,發光二極體)顯示器用玻璃板等FPD用玻璃板,亦可為太陽電池用、照明用、建材用或鏡面用等普通玻璃板。又,金屬製或樹脂製之板狀體亦可予以應用。板狀體之厚度亦不限定於0.7mm以下,可為超過0.7mm之厚度。 Further, the plate-like body which can be applied to the processing apparatus of the present invention is not limited to the glass plate for liquid crystal displays. For example, it may be a glass plate for FPD for glass plates for plasma display, glass plates for LED (Light Emitting Diode) display, or ordinary glass for solar cells, lighting, building materials, or mirrors. board. Further, a plate member made of metal or resin can also be used. The thickness of the plate-like body is not limited to 0.7 mm or less, and may be a thickness of more than 0.7 mm.

倒角裝置10包括:平台14,其吸附保持矩形狀之玻璃板12;移動裝置(移動機構)16,其使平台14沿箭頭A-B方向往返移動;圓盤狀或圓柱狀之一對金屬黏合砥石18、20,其等對玻璃板12之緣部12A~12D進行研削而於上述緣部形成倒角面;馬達22、24,其等使金屬黏合砥石18、20高速旋轉;圓盤狀或圓柱狀之樹脂黏合砥石26、28,其等研磨上述倒角面而進行鏡面加工;馬達(旋轉機構)30、32,其等使樹脂黏合砥石26、28高速旋轉;噴嘴(噴射機構)34、36,其等對利用金屬黏合砥石18、20之加工部(接觸部位)噴射冷卻液;及噴嘴(噴射機構)38、40,其等對利用樹脂黏合砥石26、28之加工部(接觸部位)噴射冷卻液。關於樹脂黏合砥石26、28之研磨用槽之製作方法於之後進行敍述。再者,金屬黏合砥石18、20及樹脂黏合砥石26、28之形狀並不限定於圓盤狀或圓柱狀,亦可為圓筒狀。 The chamfering device 10 includes a platform 14 that adsorbs and holds a rectangular glass plate 12, a moving device (moving mechanism) 16, which reciprocates the platform 14 in the direction of the arrow AB, and a disc-shaped or cylindrical one-to-metal bonded meteorite 18, 20, etc., grinding the edge portions 12A to 12D of the glass plate 12 to form a chamfered surface at the edge portion; the motors 22, 24, etc., rotate the metal-bonded vermiculite 18, 20 at a high speed; a disk or a cylinder The resin is bonded to the vermiculite 26, 28, and the mirrored surface is polished by grinding the chamfered surface; the motor (rotating mechanism) 30, 32, etc., the resin-bonded vermiculite 26, 28 is rotated at a high speed; the nozzle (ejection mechanism) 34, 36 Then, the coolant is sprayed to the processed portion (contact portion) of the metal-bonded vermiculite 18, 20; and the nozzles (ejection mechanism) 38, 40 are sprayed to the processed portion (contact portion) of the resin-bonded vermiculite 26, 28 Coolant. The method for producing the polishing groove for the resin-bonded vermiculite 26 and 28 will be described later. Further, the shape of the metal bonded vermiculite 18, 20 and the resin bonded vermiculite 26, 28 is not limited to a disk shape or a column shape, and may be a cylindrical shape.

實施形態之倒角裝置10係於使具有對向之2個主面之玻璃板12之緣部自平台14之上表面露出之狀態下,使玻璃板12之一主面吸附保持於平台14之上表面之吸附面,並藉由移動裝置16使平台14向箭頭A方向移動。於其移動中藉由向與玻璃板12之移動方向相對之方向旋轉之金屬黏合砥石18、20對玻璃板12之對向之緣部12A、12B進行研削而形成倒角面。並且,藉由向與玻璃板12之移動方向相對之方向旋轉之樹脂黏合砥石26、28對上述倒角面進行研磨。藉此,玻璃板12之緣部12A、12B於經倒角加工後被進行鏡面加工。 The chamfering device 10 of the embodiment is configured such that one of the main surfaces of the glass sheet 12 is adsorbed and held on the platform 14 in a state where the edge portion of the glass sheet 12 having the opposite main surfaces is exposed from the upper surface of the stage 14. The adsorption surface of the upper surface moves the platform 14 in the direction of arrow A by the moving device 16. During the movement, the opposite edge portions 12A and 12B of the glass plate 12 are ground by the metal-bonded vermiculite 18 and 20 which are rotated in the direction opposite to the moving direction of the glass plate 12 to form a chamfered surface. Then, the chamfered surface is polished by the resin-bonded vermiculite 26, 28 which is rotated in a direction opposite to the moving direction of the glass sheet 12. Thereby, the edge portions 12A and 12B of the glass plate 12 are mirror-finished after chamfering.

又,於倒角加工時,自噴嘴34將冷卻液噴射至金屬黏合砥石18與玻璃板12之緣部12A接觸之加工部,並且自噴嘴36將冷卻液噴射至金屬黏合砥石20與玻璃板12之緣部12B接觸之加工部。又,於鏡面加工時,自噴嘴38將冷卻液噴射至樹脂黏合砥石26與玻璃板12之緣部12A接觸之加工部,並且自噴嘴40將冷卻液噴射至樹脂黏合砥石28與玻璃板12之緣部12B接觸之加工部。 Further, at the time of chamfering, the coolant is sprayed from the nozzle 34 to the processed portion where the metal bonded vermiculite 18 is in contact with the edge portion 12A of the glass plate 12, and the coolant is sprayed from the nozzle 36 to the metal bonded vermiculite 20 and the glass plate 12 The processed portion where the edge portion 12B contacts. Further, at the time of mirror processing, the cooling liquid is ejected from the nozzle 38 to the processed portion where the resin-bonded vermiculite 26 is in contact with the edge portion 12A of the glass sheet 12, and the cooling liquid is ejected from the nozzle 40 to the resin-bonded vermiculite 28 and the glass sheet 12. The processed portion where the edge portion 12B contacts.

藉此,上述加工部藉由上述冷卻液而冷卻,因此產生於玻璃板12之緣部12A、12B之燒傷、缺損等之發生得以減少。又,產生於玻璃板12之上述2個主面各者與緣部12A、12B之端面之交界面的碎屑亦得以減少。再者,作為冷卻液,可例示純水、研削油、及該等之混合物。 As a result, the processed portion is cooled by the coolant, and the occurrence of burns, defects, and the like occurring in the edge portions 12A and 12B of the glass sheet 12 is reduced. Further, the amount of debris generated at the interface between the two main faces of the glass sheet 12 and the end faces of the edge portions 12A and 12B is also reduced. Further, as the cooling liquid, pure water, grinding oil, and a mixture thereof may be exemplified.

於倒角裝置10中,為對玻璃板12之對向之一對緣部12A、12B同時地進行倒角加工及鏡面加工,金屬黏合砥石18及樹脂黏合砥石26係與緣部12A對向配置,並且金屬黏合砥石20及樹脂黏合砥石28係與緣部12B對向配置。樹脂黏合砥石26、28相對於金屬黏合砥石18、20配置於玻璃板12之搬送方向下游側。 In the chamfering device 10, the opposite edge portions 12A and 12B of the glass plate 12 are simultaneously chamfered and mirror-finished, and the metal bonded vermiculite 18 and the resin bonded vermiculite 26 are aligned with the edge portion 12A. And the metal bonded vermiculite 20 and the resin bonded vermiculite 28 are arranged opposite to the edge portion 12B. The resin-bonded vermiculite 26 and 28 are disposed on the downstream side in the transport direction of the glass sheet 12 with respect to the metal-bonded vermiculite 18 and 20.

於圖1中,金屬黏合砥石18藉由馬達22而沿順時針方向旋轉,且金屬黏合砥石20藉由馬達24而沿逆時針方向旋轉。又,樹脂黏合砥石 26藉由馬達30而沿順時針方向旋轉,且樹脂黏合砥石28藉由馬達32而沿逆時針方向旋轉。該等砥石18、20、26、28之轉數較佳為設定為3000rpm以上。 In FIG. 1, the metal bonded vermiculite 18 is rotated in the clockwise direction by the motor 22, and the metal bonded vermiculite 20 is rotated in the counterclockwise direction by the motor 24. Also, resin bonded meteorite 26 is rotated in the clockwise direction by the motor 30, and the resin-bonded vermiculite 28 is rotated in the counterclockwise direction by the motor 32. The number of revolutions of the vermiculite 18, 20, 26, 28 is preferably set to 3000 rpm or more.

再者,於圖1中表示出一面使玻璃板12向箭頭A方向移動,一面藉由已固定之金屬黏合砥石18、20及樹脂黏合砥石26、28對緣部12A、12B進行加工的倒角裝置10,但並不限定於此。例如,亦可為將玻璃板12固定,且使金屬黏合砥石18、20及樹脂黏合砥石26、28沿玻璃板12之緣部12A、12B移動的倒角裝置。又,亦可為使金屬黏合砥石18、20及樹脂黏合砥石26、28與玻璃板12沿玻璃板12之緣部12A、12B朝相互靠近之方向移動的倒角裝置。進而,玻璃板12之另外之對向之緣部12C、12D亦可藉由配置於圖1之金屬黏合砥石18、20及樹脂黏合砥石26、28之後段的未圖示之金屬黏合砥石及樹脂黏合砥石進行加工。或者,亦可藉由平台14使玻璃板12向B方向移動而回到原本之位置之後,藉由平台14使玻璃板12以玻璃板12之主面方向之垂線為軸旋轉90度,繼而,一面藉由平台14使玻璃板12向A方向移動,一面藉由配合玻璃板12之緣部12A、12B之長度而變更間隔後之金屬黏合砥石18、20及樹脂黏合砥石26、28對緣部12C、12D進行加工。 Further, in Fig. 1, a chamfer for processing the edge portions 12A, 12B by the fixed metal-bonded vermiculite 18, 20 and the resin-bonded vermiculite 26, 28 while moving the glass sheet 12 in the direction of the arrow A is shown. The device 10 is not limited thereto. For example, it may be a chamfering device that fixes the glass sheet 12 and moves the metal-bonded vermiculite 18, 20 and the resin-bonded vermiculite 26, 28 along the edge portions 12A, 12B of the glass sheet 12. Further, a chamfering device for moving the metal-bonded vermiculite 18, 20 and the resin-bonded vermiculite 26, 28 and the glass sheet 12 in the direction in which the edge portions 12A, 12B of the glass sheet 12 move toward each other may be used. Further, the opposite edge portions 12C and 12D of the glass sheet 12 may be made of metal-bonded vermiculite and resin (not shown) disposed behind the metal-bonded vermiculite 18, 20 and the resin-bonded vermiculite 26, 28 of FIG. Bonded vermiculite for processing. Alternatively, after the glass plate 12 is moved in the B direction by the platform 14 and returned to the original position, the glass plate 12 is rotated by 90 degrees on the vertical line of the main surface direction of the glass plate 12 by the platform 14, and then, While the glass plate 12 is moved in the direction A by the platform 14, the metal bonded vermiculite 18, 20 and the resin bonded vermiculite 26, 28 are edge-changed by the length of the edge portions 12A, 12B of the glass plate 12. 12C, 12D for processing.

圖2係表示相對於玻璃板12之金屬黏合砥石18、樹脂黏合砥石26、及噴嘴34、38之配置位置之立體圖。金屬黏合砥石18、20及樹脂黏合砥石26、28係與玻璃板12之端面12E對向配置。此處所謂之端面12E為相對於玻璃板12之主面12F正交之方向之面且為加工前之面。將包含該端面12E與主面12F之交界面、及端面12E之部分稱為緣部12A~12D,藉由金屬黏合砥石18、20及樹脂黏合砥石26、28對緣部12A~12D進行加工。再者,亦可如專利文獻1所記載般,使金屬黏合砥石18、20及樹脂黏合砥石26、28之旋轉軸相對於與玻璃板12之主面12F垂直之垂線而傾斜特定角度。 2 is a perspective view showing the arrangement position of the metal-bonded vermiculite 18, the resin-bonded vermiculite 26, and the nozzles 34, 38 with respect to the glass sheet 12. The metal bonded vermiculite 18, 20 and the resin bonded vermiculite 26, 28 are disposed opposite to the end surface 12E of the glass sheet 12. Here, the end surface 12E is a surface that is orthogonal to the principal surface 12F of the glass sheet 12 and is a surface before processing. The portion including the interface between the end surface 12E and the main surface 12F and the end surface 12E is referred to as an edge portion 12A to 12D, and the edge portions 12A to 12D are processed by the metal-bonded vermiculite 18, 20 and the resin-bonded vermiculite 26, 28. Further, as described in Patent Document 1, the rotation axes of the metal-bonded vermiculite 18, 20 and the resin-bonded vermiculite 26, 28 may be inclined by a specific angle with respect to a perpendicular line perpendicular to the principal surface 12F of the glass sheet 12.

金屬黏合砥石18、20及樹脂黏合砥石26、28被同時旋轉驅動,且藉由利用圖1之移動裝置16使玻璃板12移動,玻璃板12之對向之緣部12A、12B同時被金屬黏合砥石18、20及樹脂黏合砥石26、28加工。 The metal bonded vermiculite 18, 20 and the resin bonded vermiculite 26, 28 are simultaneously rotationally driven, and the glass plate 12 is moved by the moving device 16 of Fig. 1, and the opposite edge portions 12A, 12B of the glass plate 12 are simultaneously bonded by metal. Vermiculite 18, 20 and resin bonded vermiculite 26, 28 are processed.

圖3A、圖3B係金屬黏合砥石18之外周面之局部放大剖面圖。再者,圖1所示之金屬黏合砥石18、20為相同構成,故而此處對金屬黏合砥石18進行說明,並省略金屬黏合砥石20之說明。 3A and 3B are partially enlarged cross-sectional views showing the outer peripheral surface of the metal bonded vermiculite 18. Further, since the metal bonded vermiculite 18 and 20 shown in Fig. 1 have the same configuration, the metal bonded vermiculite 18 will be described here, and the description of the metal bonded vermiculite 20 will be omitted.

於金屬黏合砥石18之外周面,沿水平方向(相對於圖4中以一點鏈線表示之旋轉軸正交之方向)形成有作為研削用槽之環狀槽42。該環狀槽42如圖4之金屬黏合砥石18之側視圖般沿上下方向平行地設有複數條。 On the outer peripheral surface of the metal bonded vermiculite 18, an annular groove 42 as a grinding groove is formed in the horizontal direction (the direction orthogonal to the rotation axis indicated by a one-dot chain line in Fig. 4). The annular groove 42 is provided in parallel with each other in the vertical direction as shown in the side view of the metal bonded vermiculite 18 of FIG.

再者,環狀槽42之金屬黏合砥石18之厚度方向之剖面形狀並不限定於圖3A、圖3B所示之U字狀,亦可為V字狀、凹狀(concave)。又,環狀槽42之條數可為1條,但為省略金屬黏合砥石18之更換作業,較佳為如圖4般於金屬黏合砥石18之厚度方向以特定之間隔包含複數條。由於金屬黏合砥石18包含複數條環狀槽42,故而於使用中之環狀槽42已達到耐用期限時,只要利用未圖示之控制裝置使金屬黏合砥石18以環狀槽42之節距為單位沿上下方向(金屬黏合砥石18之厚度方向)升降,則無需進行金屬黏合砥石18之更換作業便可利用新的環狀槽42對玻璃板12之緣部12A進行研削。又,環狀槽42之形狀可為具有單一之曲率半徑之形狀,亦可如圖3A般為對端面12E進行研削之部分、與對圖3C所示之玻璃板12之緣部12A之研削結束後之端面12E'和主面12F之交界面12G進行研削的部分具有不同之曲率半徑之形狀。 Further, the cross-sectional shape of the metal-bonded vermiculite 18 of the annular groove 42 in the thickness direction is not limited to the U-shape shown in FIGS. 3A and 3B, and may be V-shaped or concave. Further, the number of the annular grooves 42 may be one. However, in order to omit the replacement of the metal bonded vermiculite 18, it is preferable to include a plurality of strips at specific intervals in the thickness direction of the metal bonded vermiculite 18 as shown in FIG. Since the metal bonded vermiculite 18 includes a plurality of annular grooves 42, when the annular groove 42 in use has reached a durability period, the metal is bonded to the vermiculite 18 by a control device (not shown) at a pitch of the annular groove 42. When the unit is moved up and down in the vertical direction (the thickness direction of the metal bonded vermiculite 18), the edge portion 12A of the glass sheet 12 can be ground by the new annular groove 42 without replacing the metal bonded vermiculite 18. Further, the shape of the annular groove 42 may be a shape having a single radius of curvature, and the portion for grinding the end surface 12E as shown in Fig. 3A and the grinding of the edge portion 12A of the glass plate 12 shown in Fig. 3C may be completed. The portion to be ground by the interface 12G of the rear end face 12E' and the main face 12F has a shape having a different radius of curvature.

如圖3A所示,於水平方向上金屬黏合砥石18之環狀槽42與玻璃板12之端面12E對向,自該狀態將金屬黏合砥石18沿水平方向朝向端面12E移送。並且,即便金屬黏合砥石18之環狀槽42抵接於端面 12E,亦如圖3B般將金屬黏合砥石18朝向緣部12A移送相當於研削量的量。藉此,如圖3C般,緣部12A被環狀槽42研削,而於緣部12A形成倒角面。再者,如圖3A之虛線B所示,將金屬黏合砥石18以端面12E之於玻璃板12之厚度方向上之中心部抵接於環狀槽42之最深部之方式朝向緣部12A移送。 As shown in Fig. 3A, the annular groove 42 of the metal-bonded vermiculite 18 in the horizontal direction faces the end surface 12E of the glass sheet 12, and from this state, the metal-bonded vermiculite 18 is transferred in the horizontal direction toward the end surface 12E. Moreover, even if the annular groove 42 of the metal bonded vermiculite 18 abuts against the end face 12E, as shown in Fig. 3B, the metal bonded vermiculite 18 is transferred toward the edge portion 12A by an amount corresponding to the amount of grinding. Thereby, as shown in FIG. 3C, the edge portion 12A is ground by the annular groove 42, and the chamfered surface is formed at the edge portion 12A. Further, as shown by a broken line B in FIG. 3A, the metal bonded vermiculite 18 is transferred toward the edge portion 12A so that the center portion of the end surface 12E in the thickness direction of the glass sheet 12 abuts against the deepest portion of the annular groove 42.

繼而,對作為樹脂黏合砥石26、28之研磨用槽的圖2所示之環狀槽44之第1製作方法進行說明。再者,樹脂黏合砥石26與樹脂黏合砥石28為相同物體,故而此處對樹脂黏合砥石26進行說明,並省略樹脂黏合砥石28之說明。又,亦省略與樹脂黏合砥石28相關之說明。 Next, a first method of producing the annular groove 44 shown in FIG. 2 as a polishing groove for the resin-bonded vermiculite 26 and 28 will be described. Further, since the resin-bonded vermiculite 26 and the resin-bonded vermiculite 28 are the same object, the resin-bonded vermiculite 26 will be described here, and the description of the resin-bonded vermiculite 28 will be omitted. Further, the description relating to the resin-bonded vermiculite 28 is also omitted.

圖5係表示未形成環狀槽44之狀態之樹脂黏合砥石26之整體立體圖。樹脂黏合砥石26係構成為圓盤狀、圓柱狀或圓筒狀並且作為研磨面之外周面43扁平之砥石。圖6A、圖6B係表示於圖5之樹脂黏合砥石26製作環狀槽44之程序之說明圖。於圖6A、圖6B中表示出製作環狀槽44之玻璃板12。當然,玻璃板12較樹脂黏合砥石26之黏合劑更硬質。 Fig. 5 is an overall perspective view showing the resin-bonded vermiculite 26 in a state in which the annular groove 44 is not formed. The resin-bonded vermiculite 26 is formed into a disk shape, a columnar shape, or a cylindrical shape, and is a verdrite which is flat as the outer surface 43 of the polishing surface. 6A and 6B are explanatory views showing a procedure for forming the annular groove 44 in the resin bonded vermiculite 26 of Fig. 5. The glass plate 12 in which the annular groove 44 is formed is shown in Figs. 6A and 6B. Of course, the glass sheet 12 is harder than the adhesive of the resin-bonded vermiculite 26.

於製作環狀槽44時,採取如下方法:使經倒角裝置10之金屬黏合砥石18研削之玻璃板12之緣部12A之倒角面轉印至樹脂黏合砥石26之扁平之外周面43。 In the production of the annular groove 44, the chamfered surface of the edge portion 12A of the glass plate 12 ground by the metal-bonded vermiculite 18 of the chamfering device 10 is transferred to the flat outer peripheral surface 43 of the resin-bonded vermiculite 26.

即,使用包括平台14、移動裝置16、馬達30、32及噴嘴38、40之圖1之倒角裝置10,一面藉由金屬黏合砥石18對玻璃板12之緣部12A進行研削而形成倒角面,一面使樹脂黏合砥石26之扁平之外周面43按壓於該倒角面,而於樹脂黏合砥石26、28之外周面43製作環狀槽44。 That is, the chamfering device 10 of Fig. 1 including the platform 14, the moving device 16, the motors 30, 32, and the nozzles 38, 40 is used to form a chamfer by grinding the edge portion 12A of the glass plate 12 by the metal bonded vermiculite 18. On the surface, the flat outer peripheral surface 43 of the resin-bonded vermiculite 26 is pressed against the chamfered surface, and the annular groove 44 is formed on the outer peripheral surface 43 of the resin-bonded vermiculite 26 and 28.

根據上述製作方法,可於樹脂黏合砥石26之外周面43製作與玻璃板12之上述倒角面為相同輪廓形狀之環狀槽44。又,可一面製作環狀槽44,一面藉由所製作之環狀槽44對上述倒角面進行研磨。因此, 玻璃板12之倒角加工效率提高。 According to the above-described production method, the annular groove 44 having the same contour shape as the chamfered surface of the glass plate 12 can be formed on the outer peripheral surface 43 of the resin-bonded vermiculite 26. Further, the chamfered surface can be polished by the annular groove 44 formed while the annular groove 44 is formed. therefore, The chamfering processing efficiency of the glass sheet 12 is improved.

藉由上述製作方法製作出環狀槽44之樹脂黏合砥石26於倒角裝置10中繼續使用。並且,當第1條環狀槽44達到耐用期限時,使樹脂黏合砥石26上升特定量,並按上述程序於扁平之外周面43製作第2條新環狀槽44。於該情形時,環狀槽44係藉由利用平台14保持之玻璃板12之緣部12A而製作,因此無需相對於緣部12A之高度調整環狀槽44之高度。 The resin-bonded vermiculite 26 in which the annular groove 44 is formed by the above-described production method is continuously used in the chamfering device 10. When the first annular groove 44 reaches the endurance period, the resin-bonded vermiculite 26 is raised by a specific amount, and the second new annular groove 44 is formed on the flat outer peripheral surface 43 in accordance with the above procedure. In this case, since the annular groove 44 is formed by the edge portion 12A of the glass plate 12 held by the stage 14, it is not necessary to adjust the height of the annular groove 44 with respect to the height of the edge portion 12A.

即,預先形成有環狀槽44之專利文獻3之樹脂黏合砥石必須於每次將舊的環狀槽變更為新的環狀槽時進行上述高度調整,但上述製作方法如上述般無需進行高度調整。藉此,根據上述製作方法,可使倒角加工效率提高。 In other words, the resin-bonded vermiculite of Patent Document 3 in which the annular groove 44 is formed in advance must be adjusted in height when the old annular groove is changed to a new annular groove. However, the above-described manufacturing method does not require height as described above. Adjustment. Thereby, according to the above production method, the chamfering processing efficiency can be improved.

再者,於圖1之倒角裝置10中包括金屬黏合砥石18、20,但即便為不包括金屬黏合砥石18、20之倒角裝置,即僅藉由樹脂黏合砥石26、28對玻璃板12之緣部12A、12B進行研磨之倒角裝置亦可應用本發明。 Furthermore, the metal chamfered vermiculite 18, 20 is included in the chamfering device 10 of FIG. 1, but even if it is a chamfering device that does not include the metal bonded vermiculite 18, 20, the glass plate 12 is bonded only by the resin bonded vermiculite 26, 28. The present invention can also be applied to a chamfering device in which the edge portions 12A, 12B are ground.

另一方面,於製作環狀槽44之情形時,較佳為如圖2般使樹脂黏合砥石26之外周面43按壓於玻璃板12之緣部12A中除角部C以外之邊部S而製作。 On the other hand, in the case of producing the annular groove 44, it is preferable that the outer peripheral surface 43 of the resin-bonded vermiculite 26 is pressed against the side portion S other than the corner portion C of the edge portion 12A of the glass sheet 12 as shown in FIG. Production.

圖7、圖8係表示樹脂黏合砥石26對玻璃板12之緣部12A之按壓位置。 7 and 8 show the pressed position of the resin bonded vermiculite 26 to the edge portion 12A of the glass plate 12.

如圖7般,若將玻璃板12之緣部12A之角部C與樹脂黏合砥石26、28之外周面相對地按壓,則因樹脂黏合砥石26、28之旋轉而產生之外力作用於角部C而應力集中於角部C,從而有角部C破損之情形。 As shown in Fig. 7, when the corner portion C of the edge portion 12A of the glass sheet 12 is pressed against the outer peripheral surface of the resin-bonded vermiculite 26, 28, an external force acts on the corner portion due to the rotation of the resin-bonded vermiculite 26, 28. C, the stress is concentrated on the corner portion C, so that the corner portion C is broken.

相對於此,如圖8般,若將玻璃板12之緣部12A之邊部S與樹脂黏合砥石26之外周面相對地按壓,則上述應力分散,因此可防止玻璃板12之破損。 On the other hand, when the side portion S of the edge portion 12A of the glass sheet 12 is pressed against the outer peripheral surface of the resin-bonded vermiculite 26, the stress is dispersed, and the glass sheet 12 can be prevented from being damaged.

樹脂黏合砥石26係利用熱硬化性樹脂之黏合劑保持砥粒而成之砥石。作為上述黏合劑,可列舉苯酚、環氧樹脂、聚醯亞胺、聚胺基甲酸酯、聚矽氧、丁基橡膠、或天然橡膠。又,作為砥粒,可列舉金剛石、立方晶氮化硼(CBN:Cubic Boron Nitride)、氧化鋁(Al2O3),碳化矽(SiC)、浮石、或石榴石等。樹脂黏合砥石26之砥粒之粒度例如於砥粒為金剛石之情形時,較佳為200~1500號(JIS R6001:1998)。 The resin-bonded vermiculite 26 is a vermiculite which is obtained by using a binder of a thermosetting resin to hold the granules. Examples of the binder include phenol, an epoxy resin, a polyimide, a polyurethane, a polyoxymethylene, a butyl rubber, or a natural rubber. Further, examples of the niobium particles include diamond, cubic boron nitride (CBN: Cubic Boron Nitride), alumina (Al 2 O 3 ), niobium carbide (SiC), pumice, or garnet. The particle size of the resin-bonded vermiculite 26 is preferably 200 to 1500 (JIS R6001: 1998) when the granules are diamond.

本申請案係基於2013年9月19日提出申請之日本專利申請2013-193933者,並將其內容作為參照併入本文。 The present application is based on Japanese Patent Application No. 2013-193933, filed on Jan.

12‧‧‧玻璃板 12‧‧‧ glass plate

12A‧‧‧玻璃板之緣部 12A‧‧‧The edge of the glass plate

26‧‧‧樹脂黏合砥石 26‧‧‧Resin bonded meteorite

44‧‧‧環狀槽 44‧‧‧ring groove

Claims (7)

一種板狀體之加工方法,其係使用外周面扁平之樹脂黏合砥石來加工板狀體之緣部,其特徵在於:一面使上述樹脂黏合砥石繞中心軸旋轉,一面使上述樹脂黏合砥石之上述外周面與上述板狀體之緣部相對地按壓,而於上述樹脂黏合砥石之上述外周面製作經轉印上述板狀體之上述緣部之形狀而成之環狀之研磨用槽,並且一面製作該研磨用槽,一面藉由所製作之上述研磨用槽來研磨上述板狀體。 A method for processing a plate-shaped body, wherein the edge portion of the plate-shaped body is processed by using a resin-bonded vermiculite having a flat outer peripheral surface, wherein the resin-bonded vermiculite is rotated around a central axis while the resin is bonded to the vermiculite The outer peripheral surface is pressed against the edge of the plate-like body, and an annular polishing groove formed by transferring the shape of the edge portion of the plate-like body is formed on the outer peripheral surface of the resin-bonded vermiculite. The polishing groove was produced, and the plate-shaped body was polished by the polishing groove produced. 如請求項1之板狀體之加工方法,其中一面藉由金屬黏合砥石將上述板狀體之緣部研削成特定之形狀,一面使被研削成上述特定之形狀之上述板狀體之上述緣部與上述樹脂黏合砥石之上述外周面相對地按壓,而於上述樹脂黏合砥石之上述外周面製作上述研磨用槽。 The method for processing a plate-shaped body according to claim 1, wherein the edge of the plate-like body is ground into a specific shape by metal-bonded vermiculite, and the edge of the plate-like body ground into the specific shape is formed. The portion is pressed against the outer peripheral surface of the resin-bonded vermiculite, and the polishing groove is formed on the outer peripheral surface of the resin-bonded vermiculite. 如請求項1或2之板狀體之加工方法,其中使上述樹脂黏合砥石之上述外周面按壓於上述板狀體之上述緣部中除角部以外之邊部而製作上述研磨用槽。 The method of processing a plate-shaped body according to claim 1 or 2, wherein the outer circumferential surface of the resin-bonded vermiculite is pressed against a side portion of the edge portion of the plate-shaped body other than the corner portion to form the polishing groove. 如請求項1或2之板狀體之加工方法,其中上述樹脂黏合砥石之黏合劑為苯酚、環氧樹脂、聚醯亞胺、聚胺基甲酸酯、聚矽氧、丁基橡膠、或天然橡膠,上述樹脂黏合砥石之砥粒為金剛石、立方晶氮化硼(CBN)、氧化鋁(Al2O3)、碳化矽(SiC)、浮石、或石榴石,且上述板狀體為玻璃板。 The method for processing a plate-shaped body according to claim 1 or 2, wherein the binder of the resin-bonded vermiculite is phenol, epoxy resin, polyimine, polyurethane, polyoxymethylene, butyl rubber, or Natural rubber, the above-mentioned resin-bonded vermiculite particles are diamond, cubic boron nitride (CBN), alumina (Al 2 O 3 ), tantalum carbide (SiC), pumice, or garnet, and the above-mentioned plate-like body is glass. board. 如請求項1或2之板狀體之加工方法,其中上述板狀體係厚度為0.7mm以下的玻璃板。 A method of processing a plate-like body according to claim 1 or 2, wherein the plate-like system has a thickness of 0.7 mm or less. 一種板狀體之加工裝置,其特徵在於包括: 平台,其保持板狀體;樹脂黏合砥石,其對保持於上述平台之上述板狀體之緣部進行研磨,該樹脂黏合砥石的外周面為扁平,藉由上述外周面被相對地按壓於上述板狀體之緣部,於上述外周面製作經轉印上述板狀體之上述緣部之形狀而成之環狀之研磨用槽,並藉由所製作之上述研磨用槽來研磨上述板狀體之緣部;旋轉機構,其使上述樹脂黏合砥石以上述樹脂黏合砥石之中心軸為中心進行旋轉;及移動機構,其使上述樹脂黏合砥石之上述研磨用槽與上述板狀體之緣部接觸,並使上述樹脂黏合砥石或上述板狀體沿上述板狀體之緣部移動。 A processing device for a plate body, comprising: a platform for holding a plate-shaped body; a resin-bonded vermiculite which is polished to an edge portion of the plate-like body held by the platform, wherein an outer peripheral surface of the resin-bonded vermiculite is flat, and the outer peripheral surface is relatively pressed by the outer peripheral surface An annular polishing groove formed by transferring the shape of the edge portion of the plate-like body on the outer peripheral surface of the plate-like body, and polishing the plate shape by the polishing groove produced a rotating mechanism for rotating the resin-bonded vermiculite around a central axis of the resin-bonded vermiculite; and a moving mechanism for bonding the polishing groove of the resin to the vermiculite and the edge of the plate-shaped body Contacting and adhering the resin to the vermiculite or the plate-like body moves along the edge of the plate-like body. 如請求項6之板狀體之加工裝置,其包括金屬黏合砥石,該金屬黏合砥石係研削保持於上述平台之上述板狀體之緣部而對其進行倒角加工,且上述樹脂黏合砥石係研磨上述板狀體之經上述倒角加工之緣部而對其進行鏡面加工。 A processing apparatus for a plate-shaped body according to claim 6, comprising metal-bonded vermiculite which is ground and held at an edge portion of the plate-like body of the platform and chamfered, and the resin-bonded vermiculite The edge of the above-mentioned plate-like body subjected to the above chamfering is polished and mirror-finished.
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