JP2009056517A - Method and tool for truing diamond wheel - Google Patents

Method and tool for truing diamond wheel Download PDF

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JP2009056517A
JP2009056517A JP2007223449A JP2007223449A JP2009056517A JP 2009056517 A JP2009056517 A JP 2009056517A JP 2007223449 A JP2007223449 A JP 2007223449A JP 2007223449 A JP2007223449 A JP 2007223449A JP 2009056517 A JP2009056517 A JP 2009056517A
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truing
diamond
grinding
abrasive
quartz glass
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Kiyoshi Ebata
潔 江端
Kensuke Handa
賢祐 半田
Keiji Honda
啓志 本多
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Tosoh Quartz Corp
Yamagata Prefecture
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Tosoh Quartz Corp
Yamagata Prefecture
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Abstract

<P>PROBLEM TO BE SOLVED: To set the height of the cutting edges of the tip ends of abrasive grains so as to produce a ground surface of a mirror finish level, and also to reduce the resistance in truing, and to make the truing of a thin abrasive wheel possible, and to prevent the metallic contamination due to truing. <P>SOLUTION: A material containing silica glass as a main component is used as a truing tool. The heights of the cutting edges of abrasive grains are arranged by efficiently forming smooth flat portions on the tip ends of the abrasive grains on the surface of a bond by grinding the truing tool by a diamond wheel. The tip ends of the diamond grains wear by grinding the silica glass, and the tip ends of the projecting grains than the average height of the cutting edges are furthermore largely worn by deeply grinding the silica glass, and further the tip ends of the low grains have a small depth of cut, and their wear become small. As a result, the diamond wheels can be trued such that the heights of the cutting edges of the abrasive grains are uniformly arranged. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、ダイヤモンド砥石のツルーイング方法及びそれに使用するツルーイング工具に関する。   The present invention relates to a truing method for a diamond grindstone and a truing tool used therefor.

検査分析の分野で微量液体の試料を流すための溝をもつ石英ガラス製セルが用いられることが多くなっている。この溝の表面粗さは、液体を滑らかに流し、さらに、光散乱による検出感度の低下を防ぐため、鏡面レベルの滑らかさと平面度が求められる。   In the field of inspection analysis, a quartz glass cell having a groove for flowing a trace amount of liquid sample is increasingly used. The surface roughness of the grooves requires smoothness and flatness at a mirror surface level in order to allow liquid to flow smoothly and to prevent a decrease in detection sensitivity due to light scattering.

脆性材料である石英ガラスに微細溝を形成する加工方法として、石英ガラス部品を光学研磨したのち接合して溝形成する方法が知られているが、高精度な研磨加工と手加工により製造されるのでコスト低減が困難である。   As a processing method for forming fine grooves in quartz glass, which is a brittle material, a method is known in which quartz glass parts are optically polished and then joined to form grooves, which are manufactured by high-precision polishing and manual processing. Therefore, cost reduction is difficult.

また、マイクロ流体チップ、μTASの溝形成方法として、石英ガラス基板上に耐腐食性膜を形成し、リソグラフィーにより必要なパターンを抜いたあとに、フッ酸系エッチング液により石英ガラスをエッチング、あるいは、ショットブラストにより溝を形成する方法が知られているが、光学的性能の面、あるいは、形成された溝断面形状の点で分析用セルとしての性能を満たすことができない場合がある。   Further, as a microfluidic chip and μTAS groove forming method, after forming a corrosion-resistant film on a quartz glass substrate and removing a necessary pattern by lithography, etching quartz glass with a hydrofluoric acid-based etching solution, or Although a method of forming a groove by shot blasting is known, there are cases where the performance as an analysis cell cannot be satisfied in terms of optical performance or the shape of the groove cross-section formed.

一方、機械加工により直接石英ガラスに溝形成する方法として、ダイヤモンド砥石、あるいは、CBN砥石といった超砥粒砥石による研削加工法がある。一般に、ダイヤモンド砥石を使用するときは、ダイヤモンド工具や通常砥石、または鋼材その他の金属などをツルーイング工具として用いてダイヤモンド砥石のボンドを除去し、ツルーイングをおこなう。この方法は、ボンドを除去、または、砥粒を破砕する方法であるため、砥粒の突出量が一様ではなく、微視的には砥粒切れ刃高さが整列していない。そのため、最大砥粒切込み深さの微小化が困難であり、鏡面研削の妨げになっている。   On the other hand, there is a grinding method using a superabrasive grindstone such as a diamond grindstone or a CBN grindstone as a method for forming grooves directly in quartz glass by machining. In general, when a diamond grindstone is used, the diamond grindstone bond is removed using a diamond tool, a normal grindstone, or a steel material or other metal as a truing tool, and truing is performed. Since this method is a method of removing the bond or crushing the abrasive grains, the protruding amount of the abrasive grains is not uniform, and the heights of the abrasive grain cutting edges are not aligned microscopically. Therefore, it is difficult to reduce the maximum abrasive cutting depth, which hinders mirror grinding.

そこで、砥粒切れ刃高さを揃えることによって、光学ガラスやセラミックスなどの硬脆材料やアルミニウム合金などの延性材料を鏡面加工する技術が研究されている。切れ刃の整列は必然的に切れ刃先端の平坦化を伴う。
本発明における「ツルーイング」とは、この整列作業を意味する。この作業は、スムージング、若しくはシェービングとも呼ばれるものである。
従ってドレッシングが砥粒の突き出し量を調整したり、鈍化した砥粒の切れ刃を創生する作業であるのに対し、ツルーイングは、取り付けられた砥石の作用面の振れを取り除いたり、加工物の形状に合わせて所定の形状に仕上げる作業のことをいうものである。
なお、ツルーイング工具としては、平型、カップツルア型、ロータリーツルア型等が用いられている。
特許第3286941号公報 特開2001−212766号公報
Then, the technique of mirror-finishing hard brittle materials, such as optical glass and ceramics, and ductile materials, such as an aluminum alloy, by aligning the abrasive cutting edge height has been studied. Cutting edge alignment inevitably involves flattening of the cutting edge tip.
The “truing” in the present invention means this alignment work. This operation is also called smoothing or shaving.
Therefore, while dressing is an operation that adjusts the protruding amount of abrasive grains and creates a blunted abrasive cutting edge, truing removes run-out of the working surface of the mounted grindstone, This refers to the work of finishing to a predetermined shape according to the shape.
As the truing tool, a flat type, a cup truer type, a rotary truer type or the like is used.
Japanese Patent No. 3286941 JP 2001-212766 A

ダイヤモンド砥石による研削加工において、切れ刃高さの整列作業に用いられるツルーイング工具にダイヤモンド工具を用いた場合、硬度が同じため、ダイヤモンド砥石の砥粒先端の平坦部にチップポケットとなる凹凸が生じ、目詰まりの原因となることがある。また、ツルーイング時の加工抵抗が大きいため、剛性の低い薄刃の切断用砥石、あるいは、溝加工用砥石には適用が困難である。
一方、鋼材や超硬合金材料がツルーイング工具の場合、作用部分で塑性変形を生じやすいため平面度が出にくく、また、ダイヤモンド砥石に金属のコンタミネーションが残る可能性がある。
In grinding with a diamond grindstone, when a diamond tool is used as a truing tool used for aligning the cutting edge height, because the hardness is the same, irregularities that become chip pockets occur in the flat part of the diamond grindstone tip, May cause clogging. Further, since the processing resistance during truing is large, it is difficult to apply it to a cutting blade with a thin blade with low rigidity or a grindstone for grooving.
On the other hand, in the case where a steel material or a cemented carbide material is a truing tool, flatness is difficult to be obtained because plastic deformation is likely to occur at the working portion, and metal contamination may remain on the diamond grindstone.

本発明は、石英ガラス等の脆性材料の研削加工に用いられるダイヤモンド砥石のツルーイングにおいて、砥粒切れ刃高さを鏡面レベルの研削面が得られるように揃えると共に、ツルーイング時の加工抵抗を低下させ、薄型砥石のツルーイングを可能とすること、及び、半導体用部品研削加工用ダイヤモンド砥石のツルーイングによる金属汚染を無くすることが課題である。   In the truing of a diamond grindstone used for grinding brittle materials such as quartz glass, the present invention aligns the height of the abrasive grain cutting edge so that a mirror-level grinding surface can be obtained, and reduces the machining resistance during truing. It is a problem to enable truing of a thin grindstone and to eliminate metal contamination due to truing of a diamond grindstone for grinding a semiconductor component.

石英ガラスを主成分とする材料をツルーイング工具とし、ダイヤモンド砥石によってツルーイング工具を研削加工することにより、ボンド表面の砥粒の先端に平滑な平坦部を高能率に形成し、砥粒切れ刃高さを整列させるものである。ダイヤモンド砥粒の先端は、石英ガラスを研削加工することで摩滅磨耗するが、平均的な切れ刃高さより突出している砥粒先端は、石英ガラスに深く切り込むことで磨耗が相対的に大きく、また、低い砥粒先端は切り込みが浅く、磨耗が相対的に小さくなり、結果として砥粒切れ刃高さが整列されるようにツルーイングされる。   By using a truing tool made of quartz glass as a main component and grinding the truing tool with a diamond grindstone, a smooth flat part is formed at the tip of the abrasive grain on the bond surface with high efficiency, and the abrasive cutting edge height Are arranged. The tip of the diamond abrasive is worn away by grinding the quartz glass, but the tip of the abrasive that protrudes from the average cutting edge height is relatively heavily worn by cutting deep into the quartz glass. The lower abrasive tip is shallower and wear is relatively small, resulting in truing so that the abrasive cutting edge height is aligned.

ダイヤモンド砥石のボンドが有機質系であるときは、前述の効果に加え、砥粒をボンドに埋没させて砥粒切れ刃密度が高められる。
研削面の表面粗さを小さくする要素の一つとして、砥粒切れ刃密度を高めることがあるが、ツルーイング工具として用いる石英ガラスは熱伝導率が小さく、また、ボンドの有機質も熱伝導率が小さいため発生した熱が逃げにくい。従って、適切な条件で研削加工をおこなうことで有機質のボンドが軟化してダイヤモンド砥粒がボンドに埋没し、砥粒切れ刃密度が高まるのである。有機質ボンドの材質としては、フェノール系レジンボンドなどが望ましい。
When the bond of the diamond grindstone is organic, in addition to the above-described effects, the abrasive grains are buried in the bond to increase the abrasive cutting edge density.
One of the factors that reduce the surface roughness of the ground surface is to increase the abrasive cutting edge density, but quartz glass used as a truing tool has low thermal conductivity, and the organic material of the bond also has thermal conductivity. Because it is small, the generated heat is difficult to escape. Accordingly, by performing grinding under appropriate conditions, the organic bond is softened, the diamond abrasive grains are buried in the bond, and the abrasive cutting edge density is increased. As a material for the organic bond, a phenolic resin bond or the like is desirable.

石英ガラスを主成分とする材料をツルーイング工具とし、切断・溝入れ用ダイヤモンド砥石でツルーイング工具を研削加工することによりツルーイングが実行され、砥石側面の砥粒切れ刃高さを整列させると共に、砥石側面の砥粒をボンドに埋没、または砥粒先端を磨耗させることにより側面振れを除去し、鏡面レベルの研削ができるようになる。   Truing is performed by grinding the truing tool with a diamond grindstone for cutting and grooving using a material composed mainly of quartz glass as a truing tool. By burying the abrasive grains in the bond or wearing the tip of the abrasive grains, the side run-out is removed, and mirror-level grinding can be performed.

石英ガラスは、ダイヤモンド(炭素)との化学反応性があり、ツルーイング工具の主成分として適している。石英ガラス単体で用いる場合は、金属不純物を殆ど含まないことから、半導体用途の部品研削において不純物汚染を防ぐことができる。
石英ガラスの形態としては、バルク体、発泡体、あるいは焼結体などを用いることができる。
また、石英ガラスを主成分とし、副成分として鉄などを微量加えることにより石英ガラスの摩滅磨耗効果に拡散磨耗の効果が加わることでツルーイング効果の向上、ドレッシング作用などの機能を付加することができる。このような材料の製造方法としては、石英ガラスの従来製造方法である火炎溶融堆積、電気溶融法、スート法等において、所望の元素成分を含む微粒子、ガスを導入して製造する方法のほか、射出成形法が好ましく、これら副成分を粒子状に粉砕し、石英ガラス粉に混練し、射出成形して所定形状の石英ガラスを主成分としたツルーイング工具を製造することができる。
Quartz glass has chemical reactivity with diamond (carbon) and is suitable as a main component of a truing tool. When quartz glass is used alone, it contains almost no metal impurities, so that impurity contamination can be prevented in component grinding for semiconductor applications.
As a form of the quartz glass, a bulk body, a foamed body, a sintered body, or the like can be used.
In addition, by adding a small amount of iron or the like as a main component and adding a small amount of iron or the like as a subcomponent, the effect of diffusion wear can be added to the wear and wear effect of quartz glass, thereby adding functions such as truing effect and dressing action. . As a method for producing such a material, in addition to a method for producing by introducing fine particles containing a desired element component, gas, etc. in flame fusion deposition, electric melting method, soot method, etc., which are conventional methods for producing quartz glass, An injection molding method is preferable, and these subcomponents are pulverized into particles, kneaded into quartz glass powder, and injection molded to produce a truing tool mainly composed of quartz glass having a predetermined shape.

本発明のツルーイング方法によりツルーイングしたダイヤモンド砥石を用いることにより、分析用セルとしての性能を満足させると共に金属汚染のない分析用石英ガラス製チャンネルセルを低コストで製造することが可能となる。具体的には、従来の手加工を中心とする多工程加工プロセスであるのに対し、機械加工が可能となり低コスト化が達成される。また、砥石先端部への平滑な平坦部の形成と、砥粒埋没による砥粒切れ刃密度の高密度化により研削加工面の光学的低散乱特性を向上させることが可能となる。   By using the diamond grindstone truing by the truing method of the present invention, it is possible to satisfy the performance as an analytical cell and to manufacture a quartz glass channel cell for analysis free from metal contamination at low cost. Specifically, it is a multi-step machining process centering on the conventional manual machining, but machining is possible and a reduction in cost is achieved. Further, it is possible to improve the optical low scattering characteristics of the ground surface by forming a smooth flat portion at the tip of the grindstone and increasing the density of the abrasive cutting edge by burying the abrasive.

ボンド中にダイヤモンド砥粒を分散させた研削加工用砥石のツルーイングにおいて、石英ガラスをツルーイング工具として用いることにより、ダイヤモンド砥石の切れ刃先端を平坦化すると共に高さを整列させることができ、また、砥石の砥粒切れ刃密度の高密度化を達成できる。   In the truing of grinding wheels in which diamond abrasive grains are dispersed in the bond, by using quartz glass as a truing tool, the cutting edge tip of the diamond wheel can be flattened and the height can be aligned. It is possible to achieve high density of the abrasive cutting edge density of the grindstone.

本発明のツルーイング方法を施されたダイヤモンド砥石により研削された被研削材の表面は、鏡面レベルの加工表面が得られ、切断砥石のような薄刃砥石の切断面についても鏡面レベルの研削切断面が得られる。さらに、研削加工用ダイヤモンド砥石のボンド材がレジンボンドのような有機質材料の場合は、ツルーイングにより生じる加工熱と加工圧力によりダイヤモンド砥粒のボンド内への埋没現象を生じ、切り刃密度が高密度化されて研削表面粗さの鏡面レベルの向上に効果がある。   The surface of the material to be ground that has been ground by the diamond grinding wheel that has been subjected to the truing method of the present invention provides a mirror-level processed surface. can get. In addition, when the bond material of the diamond wheel for grinding is an organic material such as resin bond, the processing heat and processing pressure generated by truing causes the diamond grain to be buried in the bond, resulting in a high cutting edge density. Is effective in improving the mirror surface level of the grinding surface roughness.

本発明のダイヤモンド砥石のツルーイング方法は、検査分析用の分野で微量液体を流すための溝をもつガラス製セルの溝研削加工に用いることができる。被研削材としては、分析用石英ガラス製チャンネルセル部品に限らず石英ガラス研削加工品全般に応用できる。また、石英ガラスの他、一般のガラス、セラミックの脆性材料の研削加工用のダイヤモンド砥石に利用できる。また、ツルーイング工具として高純度石英ガラスを使用することで、不純物汚染を防ぐことを求められる半導体製造装置部品の研削加工用砥石のツルーイング方法として利用できる。
以上の様に、石英ガラスは、高純度、高硬度、低熱伝導率であるので、ダイヤモンドに対する磨耗効果が高く、ツルーイング工具として有効であることが知見された。
The truing method for a diamond grindstone of the present invention can be used for groove grinding of a glass cell having a groove for flowing a trace amount liquid in the field of inspection analysis. The material to be ground is not limited to a quartz cell channel cell component for analysis, and can be applied to all quartz glass grinding products. Moreover, it can utilize for the diamond grindstone for grinding processing of brittle material of general glass and ceramic besides quartz glass. Further, by using high-purity quartz glass as a truing tool, it can be used as a truing method for a grinding wheel for grinding a semiconductor manufacturing apparatus component that is required to prevent impurity contamination.
As described above, since quartz glass has high purity, high hardness, and low thermal conductivity, it has been found that it has a high wear effect on diamond and is effective as a truing tool.

以下、本発明を実施例に基づいて説明する。
実施例1
直径100mm、厚み0.25mm、#2000のレジンボンドダイヤモンド切断砥石を外周刃切断機に取り付け、研磨された石英ガラスをツルーイング工具として用い、該石英ガラス表面を研削加工することにより本発明のツルーイング方法を実施した。ツルーイング条件は、砥石周速30m/分、送り速度25mm/分、切り込み深さ0.25mmで、加工長は630mmとした。
ツルーイング後、この切断砥石外周の砥粒を観察したところ、ダイヤモンド砥粒の切れ刃先端は平坦化されており、また、ダイヤモンド砥粒のレジンボンド内への埋没による切れ刃の高密度化が観察された。SEMによる観察結果を図1の写真に示す。
Hereinafter, the present invention will be described based on examples.
Example 1
A truing method of the present invention by attaching a resin bond diamond cutting grindstone having a diameter of 100 mm, a thickness of 0.25 mm, and # 2000 to an outer peripheral blade cutting machine, using the polished quartz glass as a truing tool, and grinding the surface of the quartz glass. Carried out. The truing conditions were a grinding wheel peripheral speed of 30 m / min, a feed speed of 25 mm / min, a cutting depth of 0.25 mm, and a working length of 630 mm.
After truing, when the abrasive grains on the outer periphery of this cutting wheel were observed, the cutting edge tip of the diamond abrasive grains was flattened, and it was observed that the cutting edge was densified by burying the diamond abrasive grains in the resin bond. It was done. The observation result by SEM is shown in the photograph of FIG.

次いで、このツルーイングされた切断砥石1を使用して被削材である石英ガラス板2に溝加工をおこなった。溝加工の模式図を図2に示す。溝加工条件は、砥石周速30m/分、送り速度2mm/分、切り込み深さ0.25mmとした。
レーザプローブ方式の非接触3次元測定装置を用いて、石英ガラス板2を研削して形成した溝3の表面粗さを測定したところ、底面は0.020μmRa、側面は0.007μmRaであり、底面と側面の両方に対して鏡面レベルの表面粗さ、平面度が得られることが確認された。
Next, grooving was performed on the quartz glass plate 2 as a work material using the true cutting wheel 1. A schematic diagram of the groove processing is shown in FIG. The groove processing conditions were a grinding wheel peripheral speed of 30 m / min, a feed rate of 2 mm / min, and a cutting depth of 0.25 mm.
When the surface roughness of the groove 3 formed by grinding the quartz glass plate 2 was measured using a laser probe type non-contact three-dimensional measuring apparatus, the bottom surface was 0.020 μmRa and the side surface was 0.007 μmRa. It was confirmed that the surface roughness and flatness at the mirror surface level were obtained for both the surface and the side surface.

比較例1
直径100mm、厚み0.25mm、#2000のレジンボンドダイヤモンド切断砥石1を外周刃切断機に取り付け、GC3000、直径90mmのカップ砥石4を取り付けた公知のツルーイング工具であるカップツルア4を用いて、図3に示す形態で従来のツルーイング方法を実施した。
ツルーイングを完了したこの切断砥石により被削材である石英ガラス板に実施例1と同様に送り速度2mm/分で溝加工をおこない、レーザプローブ方式の非接触3次元測定装置で溝の表面粗さを測定したところ、底面、側面共に0.10μmRaであり、本発明のツルーイング方法が格段に良好であることを示した。
Comparative Example 1
A resin bond diamond cutting grindstone 1 having a diameter of 100 mm, a thickness of 0.25 mm, and # 2000 was attached to an outer peripheral cutting machine, and a cup tourer 4 which is a known truing tool having a GC 3000 and a cup grindstone 4 having a diameter of 90 mm was used. The conventional truing method was implemented in the form shown in FIG.
Using this cutting wheel that has been trued, a quartz glass plate as a work material is grooved at a feed rate of 2 mm / min in the same manner as in Example 1, and the surface roughness of the groove is measured with a laser probe type non-contact three-dimensional measuring device. As a result, the bottom surface and the side surface were both 0.10 μmRa, indicating that the truing method of the present invention was remarkably good.

本発明のツルーイング後の切断砥石外周の砥粒のSEM写真。The SEM photograph of the abrasive grain of the cutting grindstone outer periphery after truing of the present invention. 本発明によるツルーイング方法を実施した砥石による溝加工の模式図。The schematic diagram of the groove process by the grindstone which implemented the truing method by this invention. GC3000を用いた従来のツルーイング方法の模式図。The schematic diagram of the conventional truing method using GC3000.

符号の説明Explanation of symbols

1 砥石
2 石英ガラス板
3 溝
4 カップツルア
1 Whetstone 2 Quartz glass plate 3 Groove 4 Cup truer

Claims (4)

石英ガラスを主成分とする材料をツルーイング工具とし、ボンド中に分散された砥粒の先端に平滑な平坦部を形成し、砥粒切れ刃高さを整列させることを特徴とするダイヤモンド砥石のツルーイング方法。 A truing tool for diamond grindstones that uses a truing tool made of quartz glass as the main component, forms a smooth flat part at the tip of the abrasive grains dispersed in the bond, and aligns the height of the abrasive cutting edges. Method. 石英ガラスを主成分とする材料をツルーイング工具とし、切断や溝入れに用いられるダイヤモンド砥石でツルーイング工具を研削加工することにより、砥石側面の砥粒切れ刃高さを整列すると共に、砥石側面の振れを除去することを特徴とするダイヤモンド砥石のツルーイング方法。 By using a truing tool made of quartz glass as the main component and grinding the truing tool with a diamond grindstone used for cutting and grooving, the height of the abrasive cutting edge on the side of the grindstone is aligned and the wobbling on the side of the grindstone A method of truing a diamond grindstone characterized by removing 請求項1〜2において、ダイヤモンド砥石のボンドが有機質系であり、砥粒切れ刃密度を高めることを特徴とするダイヤモンド砥石のツルーイング方法。 3. A truing method for a diamond grindstone according to claim 1, wherein the bond of the diamond grindstone is an organic type, and the abrasive cutting edge density is increased. 石英ガラスを主成分とする材料からなるダイヤモンド砥石のツルーイング工具。 A diamond grinding wheel truing tool made of quartz glass as the main component.
JP2007223449A 2007-08-30 2007-08-30 Method and tool for truing diamond wheel Pending JP2009056517A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104440607A (en) * 2013-09-19 2015-03-25 旭硝子株式会社 Manufacturing method of grinding groove of resin binder grinding wheel, resin binder grinding wheel, processing device and processing method of plate body
GB2528638A (en) * 2014-06-18 2016-02-03 Element Six Technologies Ltd Post-synthesis processing of diamond and related super-hard materials

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07290366A (en) * 1994-04-22 1995-11-07 Asahi Glass Co Ltd Metal bond grinding wheel
JP2001001262A (en) * 1999-06-22 2001-01-09 Olympus Optical Co Ltd Truing method for forming tool, and truer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07290366A (en) * 1994-04-22 1995-11-07 Asahi Glass Co Ltd Metal bond grinding wheel
JP2001001262A (en) * 1999-06-22 2001-01-09 Olympus Optical Co Ltd Truing method for forming tool, and truer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104440607A (en) * 2013-09-19 2015-03-25 旭硝子株式会社 Manufacturing method of grinding groove of resin binder grinding wheel, resin binder grinding wheel, processing device and processing method of plate body
KR20150032644A (en) * 2013-09-19 2015-03-27 아사히 가라스 가부시키가이샤 Method for manufacturing groove for grinding of resin-bond grindstone, resin-bond grindstone, and apparatus and method for processing plate-like body
JP2015058507A (en) * 2013-09-19 2015-03-30 旭硝子株式会社 Method for forming groove for grinding in resin bond grindstone and resin bond grindstone, and processing device for plate-like body and processing method for plate-like body
KR102192452B1 (en) * 2013-09-19 2020-12-17 에이지씨 가부시키가이샤 Method for manufacturing groove for grinding of resin-bond grindstone, resin-bond grindstone, and apparatus and method for processing plate-like body
GB2528638A (en) * 2014-06-18 2016-02-03 Element Six Technologies Ltd Post-synthesis processing of diamond and related super-hard materials

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