JP5636012B2 - Inkjet head manufacturing method - Google Patents

Description

  Embodiments described herein relate generally to an inkjet head cutting grindstone and an inkjet head manufacturing method.

  The manufacturing process of the head of the ink jet printer includes a process of attaching a piezoelectric element on a substrate and cutting the piezoelectric element and the substrate into a predetermined shape.

  Here, the substrate is made of alumina, for example, and the piezoelectric element is made of PZT (lead zirconate titanate), for example, and have different hardnesses.

  Conventionally, the substrate and the piezoelectric element are cut with one grindstone. When a rough grindstone is used in accordance with the cutting of the substrate, chipping and cracks occur in the piezoelectric element. When a fine grindstone is used in accordance with the piezoelectric element, the cutting surface of the substrate is not sufficiently rough and the plating adhesion is weakened.

  Therefore, it has been difficult to select the roughness of the grindstone.

JP 2004-306172 A

  Therefore, there is a need for an inkjet head cutting grindstone and an inkjet head manufacturing method capable of imparting the required roughness to the substrate without causing chipping or cracks in the piezoelectric element.

In order to solve the above-mentioned problem, one embodiment of the present invention sandwiches a disk-shaped first grindstone layer and the first grindstone layer in the radial direction, and is finer than the abrasive contained in the first grindstone layer. And a second grinding wheel layer of an inkjet head cutting grindstone comprising an abrasive and two second grinding wheel layers having an angle determined by a shape of a piezoelectric element formed by cutting at a circumferential end. An inkjet head manufacturing method is provided in which a device is cut to form a hypotenuse in a cross-sectional shape, and a substrate is cut with a first grindstone layer and a second grindstone layer to form a groove .

It is a top view of the grindstone for inkjet head cutting. It is AA sectional view taken on the line in FIG. 1 of the grindstone for inkjet head cutting. FIG. 3 is an enlarged view of a portion surrounded by a dotted line in FIG. 2 of an inkjet head cutting grindstone. It is an enlarged view of the part enclosed by the dotted line in FIG. 2 of the grindstone for inkjet head cutting which concerns on an application example. It is a figure which shows the state which attached the piezoelectric element to the board | substrate with which an inkjet head is equipped. It is a figure which shows the state of the board | substrate of the inkjet head which completed cutting, and a piezoelectric element. It is a figure which shows the roughness of a 1st grindstone layer and a 2nd grindstone layer.

  Hereinafter, an embodiment of an inkjet head cutting grindstone and an inkjet head manufacturing method will be described in detail with reference to the drawings.

  The grindstone for cutting an inkjet head of the present embodiment includes a disc-shaped first grindstone layer and a first grindstone layer in the radial direction, and contains a finer abrasive than the abrasive contained in the first grindstone layer, Two second grindstone layers having an angle determined by a shape of a piezoelectric element formed by cutting at an end in the circumferential direction.

  FIG. 1 is a plan view of an inkjet head cutting grindstone 100 according to the present embodiment. 2 is a cross-sectional view of the inkjet head cutting grindstone 100 taken along the line AA in FIG.

  As shown in FIGS. 1 and 2, an inkjet head cutting grindstone 100 sandwiches a disk-shaped first grindstone layer 101 and the first grindstone layer 101 in the radial direction, and has a particle size larger than that of the first grindstone layer 101. And two second grindstone layers 101A and 101B that contain a fine abrasive and have an angle determined by the shape of the piezoelectric element that is cut and formed in the circumferential direction.

  The second grindstone layer 101A provided on one surface of the first grindstone layer 101 has the same thickness as the second grindstone layer 101B provided on the other surface of the first grindstone layer 101, and the shape is the first. The whetstone layer 101 has a symmetrical shape with respect to the center in the thickness direction.

  FIG. 3 is an enlarged view of a portion surrounded by a dotted line in FIG. 2 of the grinding wheel 100 for cutting an inkjet head. As shown in FIG. 3, the grinding head 100 for cutting an inkjet head has an angle θA with respect to a surface on which a circumferential end of one second grinding wheel layer 102 </ b> A is attached to the first grinding stone layer 101, The circumferential end of the second grindstone layer 102 </ b> B has an angle θB with respect to the surface attached to the first grindstone layer 101.

  The angle θA and the angle θB are equal in size, and the size of these angles is equal to the angle obtained by subtracting the angle formed by the hypotenuse and the base of the piezoelectric element formed by cutting from 90 °.

  One second grindstone layer 102A and the other second grindstone layer 102B both have a thickness W2.

  The first grindstone layer 101 has side surfaces that are parallel to the radial direction in the circumferential direction, that is, perpendicular to the surface on which the second grindstone layers 102A and 102B are attached. The first grindstone layer 101 has a thickness W1 equal to the width of the bottom surface of the groove 503 of the substrate formed by cutting.

  FIG. 4 is an enlarged view of a portion surrounded by a dotted line in FIG. 2 of the grinding wheel 100 for cutting an inkjet head according to an application example. As shown in FIG. 4, the inkjet head cutting grindstone 100 has an angle θA with respect to a surface 401A parallel to a surface on which the circumferential end of one second grindstone layer 102A is attached to the first grindstone layer 101. The other end of the second grindstone layer 102B in the circumferential direction has an angle θB with respect to a surface 401B parallel to the surface attached to the first grindstone layer 101.

  The angle θA and the angle θB are equal in size, and the size of these angles is equal to the angle obtained by subtracting the angle formed by the hypotenuse and the base of the piezoelectric element formed by cutting from 90 °. The angle θA and the angle θB are, for example, 45 °.

  The inkjet head cutting grindstone 100 has side surfaces that are parallel to the radial direction in the circumferential direction, that is, perpendicular to the surface on which the second grindstone layers 102A and 102B are attached. This side surface has a thickness W1 equal to the width of the bottom surface of the groove 503 of the substrate formed by cutting.

  In this application example, the first grindstone layer 101 has a thickness W3 that is smaller than the thickness W1.

  According to this application example, there is an effect that chipping and cracks are less likely to occur in the piezoelectric element 502.

  FIG. 5 is a diagram illustrating a state in which the piezoelectric element 502 is attached to the substrate 501 included in the inkjet head. As shown in FIG. 5, before cutting, the substrate 501 is flat, and the piezoelectric element 502 has a substantially rectangular parallelepiped shape. The substrate 501 is made of alumina, for example, and the piezoelectric element 502 is made of PZT (lead zirconate titanate), for example. The substrate 501 and the piezoelectric element 502 are different in hardness.

  FIG. 6 is a diagram illustrating a state of the substrate 501 and the piezoelectric element 502 of the ink jet head that has been cut. As shown in FIG. 6, the cut piezoelectric element 502 has a trapezoidal cross section, and the angle formed by the hypotenuse and the base of the trapezoid is θC.

  That is, θA and θB are equal to an angle obtained by subtracting θC from 90 °.

  The inkjet head cutting grindstone 100 cuts the piezoelectric element 502 by the second grindstone layers 102A and 102B.

  The inkjet head cutting grindstone 100 cuts the substrate 501 with the first grindstone layer 101 and the second grindstone layers 102 </ b> A and 102 </ b> B to form a groove 503. The bottom surface of the groove has a width W1.

  FIG. 7 is a diagram illustrating the roughness of the first grindstone layer 101 and the second grindstone layers 102A and 102B. As shown in FIG. 7, the particle size, that is, the roughness of the first grindstone layer 101 is desirably a grindstone number from 200 to 270, and most desirably a grindstone number 270.

  The grinding wheel number 200 is 200/230 in JIS, and the average particle size of the abrasive is 74 μm. The grindstone number 270 is 270/325 in JIS, and the average particle size of the abrasive is 53 μm.

  The roughness of the second grindstone layers 102A and 102B is desirably a grindstone number of 500 to 700, and most desirably a grindstone number of 600.

  In addition, as for the grindstone number 500, the average particle diameter of an abrasive | polishing agent is 30 micrometers-36 micrometers. In the grinding wheel number 600, the average particle size of the abrasive is 25 μm to 35 μm. In the grinding wheel number 700, the average particle size of the abrasive is 22 μm to 30 μm.

  As described above, the inkjet head cutting grindstone 100 of the present embodiment sandwiches the disc-shaped first grindstone layer 101 and the first grindstone layer 101 in the radial direction, and has a particle size larger than that of the first grindstone layer 101. And two second grindstone layers 101A and 101B containing fine abrasives and having an angle determined by the shape of the piezoelectric element 502 formed by cutting in the circumferential direction.

  Therefore, according to the inkjet head cutting grindstone 100 of the present embodiment, there is an effect that the piezoelectric element 502 is not chipped or cracked, and a necessary roughness can be imparted to the substrate 501.

  Although several embodiments have been described, these embodiments have been presented by way of example and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalents thereof.

101: First whetstone layer 102A, 102B: Second whetstone layer 501: Substrate 502: Piezoelectric element

Claims (4)

The disc-shaped first grindstone layer and the first grindstone layer are sandwiched in the radial direction, contain a finer abrasive than the abrasive contained in the first grindstone layer, and the end in the circumferential direction is formed by cutting The piezoelectric element is cut only by the second grindstone layer of an inkjet head cutting grindstone provided with two second grindstone layers having an angle determined by the shape of the piezoelectric element to form a hypotenuse in a cross-sectional shape ,
A method of manufacturing an ink jet head, wherein a groove is formed by cutting a substrate with the first grindstone layer and the second grindstone layer. The angle is
The process according to claim 1 ink jet head, wherein the angle obtained by subtracting an angle from 90 ° of angle between hypotenuse and the base of the cross-sectional shape of the piezoelectric element formed by cutting. The thickness of the first grindstone layer is
3. The method of manufacturing an ink jet head according to claim 2, wherein the width of the bottom surface of the groove portion of the substrate formed by cutting is thinner.   The method of manufacturing an ink jet head according to claim 1, further comprising a step of cutting the piezoelectric element to form the oblique side portion in a cross-sectional shape, cutting the substrate to form the groove portion, and then plating the groove portion. .

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