JP2015006697A - Processing device and processing method of plate-like object - Google Patents

Processing device and processing method of plate-like object Download PDF

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Publication number
JP2015006697A
JP2015006697A JP2011239107A JP2011239107A JP2015006697A JP 2015006697 A JP2015006697 A JP 2015006697A JP 2011239107 A JP2011239107 A JP 2011239107A JP 2011239107 A JP2011239107 A JP 2011239107A JP 2015006697 A JP2015006697 A JP 2015006697A
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Prior art keywords
plate
chamfering grindstone
chamfering
edge
grindstone
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英雄 本村
Hideo Motomura
英雄 本村
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AGC Inc
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Asahi Glass Co Ltd
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Priority to JP2011239107A priority Critical patent/JP2015006697A/en
Priority to PCT/JP2012/076859 priority patent/WO2013065490A1/en
Priority to TW101140410A priority patent/TW201318776A/en
Publication of JP2015006697A publication Critical patent/JP2015006697A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B24B9/102Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for travelling sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a plate-like object processing device including jet means that jets a coolant to a proper position.SOLUTION: A nozzle 26 of a chamfering device 10 of the invention is installed at a position where the nozzle 26 jets a coolant from a position, which is located at the upstream side relative to a contact position P between an annular groove 34 of a chamfering grindstone 18 and an end edge part 12A of a glass plate 12 in a rotation direction of the chamfering grindstone 18, toward the contact position P. Further, the nozzle 26 is installed at a position where the nozzle 26 jets the coolant in an in-plane direction perpendicular to a rotation shaft 19 of the chamfering grindstone 18. Furthermore, the nozzle 26 is installed at a position where the nozzle 26 jets the coolant in a tangential direction of a peripheral part of the chamfering grindstone 18.

Description

本発明は、板状物の加工装置及び加工方法に関する。   The present invention relates to a processing apparatus and a processing method for a plate-like object.

液晶ディスプレイ、プラズマディスプレイ等に使用されるFPD(Flat Panel Display)用のガラス板(板状物)は、溶融ガラスを板状に成形し、その後、切断装置によって所定の矩形サイズのガラス板に切断される。その後、ガラス板は、面取装置(加工装置)の面取用砥石によって、その端縁部が研削加工されることにより面取りされる。面取装置としては、特許文献1の如く公知である。   Glass plates (plates) for FPD (Flat Panel Display) used in liquid crystal displays, plasma displays, etc., are formed by forming molten glass into plates and then cutting them into glass plates of a predetermined rectangular size using a cutting device. Is done. Thereafter, the glass plate is chamfered by grinding the edge thereof with a chamfering grindstone of a chamfering device (processing device). As a chamfering device, it is known as in Patent Document 1.

また、特許文献2に記載された面取装置は、面取用砥石、及び冷却液(研削液)噴射ノズル等を備えている。前記面取用砥石は、ガラス板の平面に直交する軸と平行な軸を中心に回転されるとともに、その回転方向は、ガラス板の研削部においてガラス板の搬送方向と相対する方向に設定されている。また、面取用砥石の研削面となる外周面は、略凹状で円弧状の断面輪郭形状をなし、ガラス板の端縁部を断面円弧状に研削加工する。   The chamfering device described in Patent Document 2 includes a chamfering grindstone, a coolant (grinding fluid) injection nozzle, and the like. The chamfering grindstone is rotated around an axis parallel to an axis perpendicular to the plane of the glass plate, and the rotation direction is set to a direction opposite to the conveyance direction of the glass plate in the grinding portion of the glass plate. ing. Moreover, the outer peripheral surface used as the grinding surface of the chamfering grindstone is substantially concave and has an arcuate cross-sectional contour shape, and the edge of the glass plate is ground into an arcuate cross-sectional shape.

一方、前記冷却液噴射ノズルは、ガラス板と面取用砥石との接触部を基準として、面取用砥石の回転方向上流側から、前記接触部に向けて冷却液を噴射するように構成されている。   On the other hand, the coolant injection nozzle is configured to inject coolant toward the contact portion from the upstream side in the rotation direction of the chamfering grindstone with reference to the contact portion between the glass plate and the chamfering grindstone. ing.

また、特許文献3に記載された冷却液(クーラント)噴射ノズルは、ワークを挟んで両側に一対配置されるとともに、ワークと砥石との接触部に対して斜め上方に設置されており、前記接触部及びその近傍に向けて冷却液を斜め方向から噴射している。すなわち、特許文献3の加工装置では2本の冷却液噴射ノズルを備えている。   In addition, a pair of coolant (coolant) injection nozzles described in Patent Document 3 are disposed on both sides of the workpiece, and are disposed obliquely above the contact portion between the workpiece and the grindstone, and the contact Coolant is sprayed from an oblique direction toward the portion and the vicinity thereof. That is, the processing apparatus of Patent Document 3 includes two coolant injection nozzles.

特開2002−160147号公報JP 2002-160147 A 特開2009−172749号公報JP 2009-172749 A 特開2007−30051号公報JP 2007-30051 A

しかしながら、従来の面取装置では、冷却液噴射ノズルが最適な位置に設置されていないため、冷却液噴射ノズルから噴射された冷却液が最適な位置に噴射されず、研削加工後のガラス板の端縁部に焼け、欠けが発生し、ガラス板の割れの要因になるとともに、生産性を阻害する要因になっていた。   However, in the conventional chamfering device, the coolant spray nozzle is not installed at the optimal position, so the coolant sprayed from the coolant spray nozzle is not sprayed to the optimal position, and the glass plate after grinding is not Burning and chipping occurred at the edge, causing cracks in the glass plate and inhibiting productivity.

特に、5000rpm以上の高速回転の面取用砥石は、回転中の面取用砥石の外周面に沿って層の厚い空気層が形成される。冷却液噴射ノズルを含む冷却液噴射装置では、前記空気層を貫通させるための冷却液の噴射圧力、噴射量が設定されているが、冷却液噴射ノズルが最適な位置に設置されていない場合には、前記噴射圧力、噴射量が無用に大きくなり、冷却液噴射装置の負荷が大きくなるという問題があった。   Particularly, in a chamfering grindstone rotating at a high speed of 5000 rpm or more, a thick air layer is formed along the outer peripheral surface of the rotating chamfering grindstone. In the coolant injection device including the coolant injection nozzle, the coolant injection pressure and the injection amount for penetrating the air layer are set, but the coolant injection nozzle is not installed at the optimum position. Has the problem that the injection pressure and the injection amount become unnecessarily large, and the load of the coolant injection device becomes large.

本発明は、このような事情に鑑みてなされたもので、最適な位置に冷却液を噴射する噴射手段を備えた板状物の加工装置及び加工方法を提供することを目的とする。   This invention is made | formed in view of such a situation, and it aims at providing the processing apparatus and processing method of a plate-shaped object provided with the injection means which injects a cooling liquid to the optimal position.

本発明は、前記目的を達成するために、板状物を保持する定盤と、前記定盤に保持された前記板状物の端縁部を研削して面取りする円盤状又は円柱状の面取用砥石と、前記面取用砥石を回転させる回転手段と、前記面取用砥石の周縁部を前記板状物の外周面の研削面に接触させて前記面取用砥石、又は前記板状物を、前記板状物の端縁部に沿って移動させる移動手段と、前記面取用砥石の前記研削面と前記板状物の端縁部との接触箇所に冷却液を噴射するとともに、前記面取用砥石の回転軸に対して直交する面内方向に前記冷却液を噴射する噴射手段と、を備えたことを特徴とする板状物の加工装置を提供する。   In order to achieve the above object, the present invention provides a surface plate for holding a plate-like object, and a disk-like or columnar surface for chamfering by grinding an edge of the plate-like object held by the surface plate. A chamfering grindstone, a rotating means for rotating the chamfering grindstone, and a peripheral surface of the chamfering grindstone contacting a grinding surface of an outer peripheral surface of the plate-like object, or the chamfering grindstone or the plate shape A moving means for moving the object along the edge of the plate-like object, and spraying a coolant on the contact portion between the grinding surface of the chamfering grindstone and the edge of the plate-like object, and There is provided an apparatus for processing a plate-like object, comprising: an injection unit that injects the cooling liquid in an in-plane direction orthogonal to a rotation axis of the chamfering grindstone.

本発明は、前記目的を達成するために、板状体の端縁部に、回転する円盤状又は円柱状の面取用砥石の研削面を押し付けるとともに、前記板状体及び前記面取用砥石を、前記板状体の前記端縁部に沿って相対的に移動させながら、前記面取用砥石の前記研削面と前記板状物の前記端縁部との接触箇所に冷却液を噴射させることにより、前記板状体の端縁部を面取り加工する板状体の加工方法において、前記面取用砥石の回転軸に対して直交する面内方向に前記冷却液を噴射することを特徴とする板状物の加工方法を提供する。   In order to achieve the above object, the present invention presses the grinding surface of a rotating disk-shaped or columnar chamfering grindstone against the edge of the plate-shaped body, and the plate-shaped body and the chamfering grindstone Is moved relatively along the edge of the plate-like body, and a coolant is sprayed onto the contact portion between the grinding surface of the chamfering grindstone and the edge of the plate-like object. Thus, in the plate-like body processing method for chamfering the edge of the plate-like body, the coolant is jetted in an in-plane direction perpendicular to the rotation axis of the chamfering grindstone. Provided is a method for processing a plate-like product.

本発明によれば、面取用砥石の研削面と板状物の端縁部との接触箇所に冷却液を噴射するとともに、面取用砥石の回転軸に対して直交する面内方向に前記冷却液を噴射する位置に噴射手段を設置した。これにより、冷却液が最適な位置に噴射されるので、面取用砥石によって板状物の端縁部を良好に面取りできるとともに、冷却液噴射量を低減できる。また、本発明は、1つの噴射手段を用いて冷却液を最適な位置に噴射しているので、2本の冷却液噴射ノズルを用いる特許文献3の装置と比較して、冷却水の使用量を削減できる。なお、板状物がガラス板の場合には、ガラス板の端縁部に生じる焼け、欠けの発生を低減できる。   According to the present invention, the coolant is injected to the contact portion between the grinding surface of the chamfering grindstone and the edge of the plate-like object, and the in-plane direction orthogonal to the rotation axis of the chamfering grindstone is An injection means was installed at a position for injecting the coolant. Thereby, since the coolant is sprayed to the optimum position, the edge portion of the plate-like object can be well chamfered by the chamfering grindstone, and the coolant spray amount can be reduced. Further, since the present invention injects the cooling liquid to the optimum position using one injection means, the amount of cooling water used is compared with the apparatus of Patent Document 3 using two cooling liquid injection nozzles. Can be reduced. In addition, when a plate-shaped object is a glass plate, generation | occurrence | production of the burning and chipping which arise in the edge part of a glass plate can be reduced.

本発明の前記噴射手段は、前記面取用砥石の前記研削面の接線方向に前記冷却液を噴射することが好ましい。   It is preferable that the injection means of the present invention injects the cooling liquid in a tangential direction of the grinding surface of the chamfering grindstone.

本発明によれば、冷却液の噴射圧力によって面取用砥石に回転負荷をかけることなく、冷却液を最適な位置に噴射することができる。   According to the present invention, the coolant can be sprayed to the optimum position without applying a rotational load to the chamfering grindstone by the spray pressure of the coolant.

本発明の前記面取用砥石は、該面取用砥石の前記研削面の形状が扁平である円盤状又は円柱状であって、前記板状物の端縁部が接触されると、接触圧によって該端縁部の形状に沿って、前記面取用砥石の厚さ方向の断面形状が凹状に弾性変形することが好ましい。   The chamfering grindstone of the present invention is a disk or columnar shape in which the shape of the grinding surface of the chamfering grindstone is flat, and when the edge of the plate-like object is contacted, the contact pressure Accordingly, it is preferable that the cross-sectional shape of the chamfering grindstone is elastically deformed into a concave shape along the shape of the edge portion.

本発明の前記面取用砥石は、その外周面に環状溝(研削面)が形成された溝付きの面取用砥石ではなく、外周面が扁平であり、板状物の端縁部が接触されると、接触圧によって端縁部の形状に沿って、前記面取用砥石の厚さ方向の断面形状が凹状に弾性変形する面取用砥石である。この場合、弾性変形した凹部の底部に冷却液を噴射するように、噴射手段の位置を設定すればよい。   The chamfering grindstone of the present invention is not a grooved chamfering grindstone in which an annular groove (grinding surface) is formed on the outer peripheral surface thereof, but the outer peripheral surface is flat and the edge of the plate-like object is in contact Then, the chamfering grindstone whose cross-sectional shape in the thickness direction of the chamfering grindstone is elastically deformed into a concave shape along the shape of the edge portion by contact pressure. In this case, the position of the injection means may be set so that the cooling liquid is injected to the bottom of the elastically deformed recess.

本発明によれば、板状物の端縁部のうち、板状物の端面と主面との境界面に面取用砥石が接触するので、前記境界面を円滑に研削加工できる。板状物がガラス板の場合には、前記境界面に生じる微小なチッピング(欠け)を低減できる。   According to the present invention, since the chamfering grindstone contacts the boundary surface between the end surface of the plate-like object and the main surface among the edge portions of the plate-like object, the boundary surface can be smoothly ground. In the case where the plate-like object is a glass plate, minute chipping (chips) generated on the boundary surface can be reduced.

本発明の前記面取用砥石は、前記外周面に1本又は複数本の環状溝を備えていることが好ましい。   The chamfering grindstone of the present invention preferably includes one or a plurality of annular grooves on the outer peripheral surface.

本発明に係る板状物の加工装置によれば、最適な位置に冷却液を噴射することができるので、面取用砥石によって板状物の端縁部を良好に面取りできるとともに、冷却液噴射量を低減できる。   According to the plate-like material processing apparatus of the present invention, the coolant can be sprayed to an optimum position, so that the edge portion of the plate-like material can be well chamfered by the chamfering grindstone, and the coolant is sprayed. The amount can be reduced.

本発明の板状物の加工装置が適用された面取装置の平面図The top view of the chamfering apparatus to which the processing apparatus of the plate-shaped object of this invention was applied 面取用砥石とガラス板とノズルの配置位置を示した斜視図The perspective view which showed the arrangement position of the grindstone for grinding, a glass plate, and a nozzle ガラス板の端縁部に面取用砥石の溝が対向配置された説明図Explanatory drawing in which the groove of the chamfering grindstone is placed opposite to the edge of the glass plate 面取用砥石の溝によってガラス板の端縁部が研削されている説明図Explanatory drawing in which the edge part of the glass plate is ground by the groove of the chamfering grindstone 研削加工されて面取りされたガラス板の端縁部の説明図Explanatory drawing of the edge part of the glass plate chamfered by grinding 図2に示した配置位置を側面から見た説明図Explanatory drawing which looked at the arrangement position shown in FIG. 2 from the side 図2に示した配置位置を上面から見た説明図Explanatory drawing which looked at the arrangement position shown in FIG. 2 from the upper surface 他の面取用砥石を示した全体斜視図Overall perspective view showing another chamfering grindstone ガラス板の端縁部に図5の面取用砥石の研削面が対向配置された説明図Explanatory drawing in which the grinding surface of the chamfering grindstone in FIG. 5 is disposed opposite to the edge of the glass plate. ガラス板の端縁部が図5の面取用砥石によって研削されている説明図Explanatory drawing in which the edge part of a glass plate is ground with the grindstone for chamfering of FIG. 図5の面取用砥石によって面取りされたガラス板の端縁部の説明図Explanatory drawing of the edge part of the glass plate chamfered with the grindstone for chamfering of FIG. ガラス板の端縁部が図5の面取用砥石によって研削されている側面図Side view in which edge of glass plate is ground by chamfering grindstone in FIG.

以下、添付図面に従って本発明に係る板状物の加工装置及び加工方法の好ましい実施の形態を詳説する。   Hereinafter, preferred embodiments of a processing apparatus and a processing method for a plate-like object according to the present invention will be described in detail with reference to the accompanying drawings.

図1は、本発明の板状物の加工装置が適用された、実施の形態の面取装置10の平面図である。この面取装置10は、厚さが0.7mm以下の液晶ディスプレイ用ガラス板(板状物)12の端縁部を面取りする装置である。なお、本発明の加工装置に適用できる板状物は、液晶ディスプレイ用ガラス板に限定されず、プラズマディスプレイ用ガラス板、LEDディスプレイ用ガラス板等のFPD用ガラス板、建材用やミラー用等の一般的なガラス板、金属製、又は樹脂製の板状物に適用してもよい。また板状物の厚さも0.7mm以下に限定されず、0.7mmを超える厚さであってもよい。   FIG. 1 is a plan view of a chamfering apparatus 10 according to an embodiment to which a processing apparatus for a plate-like object of the present invention is applied. This chamfering device 10 is a device that chamfers an edge portion of a glass plate (plate-like object) 12 having a thickness of 0.7 mm or less. In addition, the plate-like object applicable to the processing apparatus of the present invention is not limited to the glass plate for a liquid crystal display, but is a glass plate for an FPD such as a glass plate for a plasma display or a glass plate for an LED display, a building material or a mirror. The present invention may be applied to a general glass plate, metal plate, or resin plate. Further, the thickness of the plate-like material is not limited to 0.7 mm or less, and may be a thickness exceeding 0.7 mm.

面取装置10は、矩形状のガラス板12を吸着保持する定盤14、定盤14を矢印A−B方向に往復移動させる移動装置(移動手段)16、ガラス板12の端縁部を研削加工して面取りする円盤状又は円柱状の一対の面取用砥石18、20、面取用砥石18、20を高速回転させるモータ(回転手段)22、24、及び冷却液を噴射するノズル(噴射手段)26、28等から構成される。   The chamfering apparatus 10 grinds the edge of the glass plate 12, a surface plate 14 that sucks and holds the rectangular glass plate 12, a moving device (moving means) 16 that reciprocates the surface plate 14 in the direction of arrows AB. A pair of chamfering grindstones 18 and 20 that are processed and chamfered, motors (rotating means) 22 and 24 that rotate chamfering grindstones 18 and 20 at high speed, and nozzles that inject coolant (injection) Means) 26, 28 and the like.

実施の形態の面取装置10は、定盤14の搭載面にガラス板12の主面を吸着保持させ、定盤14を移動装置16によって矢印A方向に移動させながら、その移動中にガラス板12の対向する端縁部12A、12Bを、ガラス板12の移動方向に対して対向する方向に回転(自転)している面取用砥石18、20によって研削加工する。これによって、ガラス板12の端縁部12A、12Bが面取りされる。また、前記研削加工時には、面取用砥石18とガラス板12の端縁部12Aとの接触箇所に、ノズル26から冷却液が噴射されるとともに、面取用砥石20とガラス板12の端縁部12Bとの接触箇所に、ノズル28から冷却液が噴射される。これにより、前記接触箇所が前記冷却液によって冷却されるので、ガラス板12の端縁部12Aに生じる焼け、欠け等の発生が低減され、また、ガラス板12の前記主面と研削された端面との境界部に生じるチッピングが低減される。前記ノズル26、28については後述する。   The chamfering apparatus 10 according to the embodiment holds the main surface of the glass plate 12 on the mounting surface of the surface plate 14 and moves the surface plate 14 in the direction of arrow A by the moving device 16 while moving the glass plate during the movement. The 12 opposing edge portions 12A and 12B are ground by chamfering grindstones 18 and 20 that are rotating (spinning) in a direction facing the moving direction of the glass plate 12. Thereby, the edge portions 12A and 12B of the glass plate 12 are chamfered. Further, at the time of the grinding process, the coolant is sprayed from the nozzle 26 to the contact portion between the chamfering grindstone 18 and the edge portion 12 </ b> A of the glass plate 12, and the chamfering grindstone 20 and the edge of the glass plate 12. Cooling liquid is sprayed from the nozzle 28 to the contact portion with the portion 12B. Thereby, since the said contact location is cooled with the said cooling liquid, generation | occurrence | production of the burning, chipping, etc. which arise in the edge part 12A of the glass plate 12 is reduced, and the end surface ground with the said main surface of the glass plate 12 Chipping that occurs at the boundary between and is reduced. The nozzles 26 and 28 will be described later.

冷却液の材料は特に限定されず、純水、研削油、及びこれらの混合物でよい。   The material of the coolant is not particularly limited, and may be pure water, grinding oil, or a mixture thereof.

面取装置10では、ガラス板12の対向する一対の端縁部12A、12Bを同時に面取りするために、面取用砥石18が端縁部12Aに対向して配置されるとともに、面取用砥石20が端縁部12Bに対向して配置されている。   In the chamfering device 10, a chamfering grindstone 18 is disposed to face the edge portion 12 </ b> A in order to chamfer a pair of opposite edge portions 12 </ b> A and 12 </ b> B of the glass plate 12 at the same time. 20 is arranged to face the edge 12B.

図1において面取用砥石18は、モータ22によって反時計方向に回転され、面取用砥石20は、モータ24によって時計方向に回転される。また、面取用砥石18、20の回転数は、5000rpm以上に設定されている。   In FIG. 1, the chamfering grindstone 18 is rotated counterclockwise by the motor 22, and the chamfering grindstone 20 is rotated clockwise by the motor 24. Further, the rotational speed of the chamfering grindstones 18 and 20 is set to 5000 rpm or more.

なお、同図では、ガラス板12を矢印A方向に移動させながら、固定された面取用砥石18、20によって端縁部12A、12Bを研削加工する面取装置10を示しているが、これに限定されるものではなく、ガラス板12を固定し、面取用砥石18、20をガラス板12の端縁部12A、12Bに沿って移動させる面取装置でもよく、ガラス板12及び面取用砥石18、20の双方をガラス板12の端縁部12A、12Bに沿って互いに近づく方向に移動させる面取装置でもよい。また、ガラス板12の他の対向する端縁部12C、12Dは、図1の面取用砥石18、20の後段に配置された不図示の一対の面取用砥石によって研削加工してもよい。又は、ガラス板12を定盤14によってB方向に移動させて元の位置に復帰させ、次に、ガラス板12を定盤14によって、ガラス板12の主面方向の垂線を軸にして90度回転させた後、定盤14によってガラス板12をA方向に移動させながら、間隔が変更された面取用砥石18、20によって端縁部12C、12Dを研削加工してもよい。   In addition, although the figure shows the chamfering device 10 that grinds the edge portions 12A and 12B with the fixed chamfering grindstones 18 and 20 while moving the glass plate 12 in the direction of arrow A, The chamfering device that fixes the glass plate 12 and moves the chamfering grindstones 18 and 20 along the edge portions 12A and 12B of the glass plate 12 may be used. A chamfering device that moves both the grindstones 18 and 20 along the edge portions 12A and 12B of the glass plate 12 toward each other may be used. Further, the other opposing edge portions 12C and 12D of the glass plate 12 may be ground by a pair of chamfering grindstones (not shown) arranged at the rear stage of the chamfering grindstones 18 and 20 in FIG. . Alternatively, the glass plate 12 is moved in the B direction by the surface plate 14 to return to the original position, and then the glass plate 12 is moved by the surface plate 14 to 90 degrees with the perpendicular in the main surface direction of the glass plate 12 as an axis. After the rotation, the edge portions 12C and 12D may be ground by the chamfering grindstones 18 and 20 whose intervals are changed while the glass plate 12 is moved in the A direction by the surface plate 14.

面取用砥石18、20は、図2の如くガラス板12の端面12Eに対向して配置されている。ここで端面12Eとは、ガラス板12の主面12Fに対して直交する方向の面であり、面取り前の面である。この端面12Eと主面12Fとの境界部、及び端面12Eを含む部分を端縁部12A〜12Dと称し、端縁部12A〜12Dを面取用砥石18、20によって研削加工する。なお、特許文献1に記載の如く、面取用砥石18、20の回転軸を、ガラス板12の主面に立てた垂線に対して所定角度傾斜させてもよい。   The chamfering grindstones 18 and 20 are arranged to face the end face 12E of the glass plate 12 as shown in FIG. Here, the end surface 12E is a surface in a direction orthogonal to the main surface 12F of the glass plate 12, and is a surface before chamfering. The boundary portion between the end surface 12E and the main surface 12F and the portion including the end surface 12E are referred to as end edge portions 12A to 12D, and the end edge portions 12A to 12D are ground by the chamfering grindstones 18 and 20. In addition, as described in Patent Document 1, the rotation axes of the chamfering grindstones 18 and 20 may be inclined at a predetermined angle with respect to a vertical line standing on the main surface of the glass plate 12.

面取用砥石18、20は同時に回転駆動され、図1の移動装置16によるガラス板12の移動によって、ガラス板12の対向する端縁部12A、12Bが面取用砥石18、20によって同時に研削加工される。   The chamfering grindstones 18 and 20 are simultaneously driven to rotate, and the opposing edge portions 12A and 12B of the glass plate 12 are simultaneously ground by the chamfering grindstones 18 and 20 by the movement of the glass plate 12 by the moving device 16 of FIG. Processed.

図3A、図3Bは、面取用砥石18、20の外周面30、32の要部拡大断面図である。なお、面取用砥石18、20は同一構成なので、ここでは面取用砥石18について説明し、面取用砥石20の説明は省略する。   3A and 3B are enlarged cross-sectional views of main parts of the outer peripheral surfaces 30 and 32 of the chamfering grindstones 18 and 20, respectively. Since the chamfering grindstones 18 and 20 have the same configuration, the chamfering grindstone 18 will be described here, and the description of the chamfering grindstone 20 will be omitted.

面取用砥石18の外周面30には、研削面である複数本の環状溝34が水平方向に形成され、この環状溝34が図4Aの側面図の如く上下方向に複数本平行に備えられている。なお、環状溝34の面取用砥石18の厚さ方向の断面形状は、図3A、図3Bに記載のU字状に限定されず、V字状、凹状であってもよい。また、環状溝34の本数は1本でもよいが、面取用砥石18の交換作業を省くため、図4Aの如く複数本備えることが好ましい。環状溝34が面取用砥石18に複数本備えられているため、使用中の環状溝34が寿命になったとき、図示しない制御装置で面取用砥石18を環状溝34のピッチ単位で上下方向(面取用砥石18の厚さ方向)に昇降させれば、面取用砥石18の交換作業をせずに新しい環状溝34で面取りできる。また、環状溝34の形状は、単一の曲率半径を有する形状でもよく、端面12Eを研削する部分、及び図3Cに示すように研削終了した端面12E′と主面12Fとの境界面12Gを研削する部分が異なる曲率半径を有する形状のものでもよい。   On the outer peripheral surface 30 of the chamfering grindstone 18, a plurality of annular grooves 34 that are grinding surfaces are formed in the horizontal direction, and a plurality of annular grooves 34 are provided in parallel in the vertical direction as shown in the side view of FIG. 4A. ing. The cross-sectional shape in the thickness direction of the chamfering grindstone 18 of the annular groove 34 is not limited to the U shape shown in FIGS. 3A and 3B, and may be a V shape or a concave shape. Although the number of the annular grooves 34 may be one, it is preferable to provide a plurality of the annular grooves 34 as shown in FIG. 4A in order to eliminate the replacement work of the chamfering grindstone 18. Since a plurality of the annular grooves 34 are provided in the chamfering grindstone 18, the chamfering grindstone 18 is moved up and down by the pitch unit of the annular groove 34 by a control device (not shown) when the annular groove 34 in use reaches the end of its life. If the chamfering grindstone 18 is raised and lowered in the direction (thickness direction of the chamfering grindstone 18), the chamfering grindstone 18 can be chamfered without replacement. The shape of the annular groove 34 may be a shape having a single radius of curvature, and includes a portion where the end surface 12E is ground and a boundary surface 12G between the end surface 12E ′ and the main surface 12F which has been ground as shown in FIG. 3C. The part to be ground may have a shape having different radii of curvature.

図3Aに示すように、ガラス板12の端縁部12Aは、環状溝34に対向され、図3Bの如く、面取用砥石18が研削代分だけ端縁部12Aに向けて送られることにより、端縁部12Aに面取用砥石18の環状溝34が押圧当接される。これにより、図3Cの如く、端縁部12Aが環状溝34によって研削加工される。なお、図3Aの破線で示すように、端面12Eのガラス板12の厚さ方向の中心部が環状溝34の最深部に当接するように面取用砥石18が端縁部12Aに向けて送られる。   As shown in FIG. 3A, the edge 12A of the glass plate 12 is opposed to the annular groove 34, and as shown in FIG. 3B, the chamfering grindstone 18 is fed toward the edge 12A by the grinding allowance. The annular groove 34 of the chamfering grindstone 18 is pressed and brought into contact with the end edge portion 12A. Thereby, as shown in FIG. 3C, the end edge portion 12 </ b> A is ground by the annular groove 34. As shown by a broken line in FIG. 3A, the chamfering grindstone 18 is fed toward the end edge 12A so that the center portion of the end surface 12E in the thickness direction of the glass plate 12 is in contact with the deepest portion of the annular groove 34. It is done.

面取用砥石18、20としては、鉄系、銅系、コバルト系、真鍮系等の金属の結合剤で砥粒を保持したメタルボンド砥石、熱硬化性樹脂の結合剤で砥粒を保持したレジンボンド砥石、ガラス等の磁器質の結合剤で砥粒を保持したビトリファイドボンド砥石、砥石の台座表面にメッキ層をつくり、前記メッキ層に砥粒を固着した電着砥石が挙げられる。   As the chamfering grindstones 18 and 20, a metal bond grindstone in which abrasive grains are held with a metal binder such as iron, copper, cobalt, or brass, or abrasive grains are held with a thermosetting resin binder. Examples thereof include a resin bond grindstone, a vitrified bond grindstone in which abrasive grains are held with a porcelain binder such as glass, and an electrodeposited grindstone in which a plating layer is formed on a pedestal surface of the grindstone, and the abrasive grains are fixed to the plating layer.

結合剤に配される研磨砥粒としては、ダイヤモンド、炭化ケイ素(SiC)、アルミナ(Al)等を挙げることができる。 Examples of the abrasive grains arranged in the binder include diamond, silicon carbide (SiC), and alumina (Al 2 O 3 ).

図5は、他の面取用砥石40を示した全体斜視図であり、図6A〜図6Cは、図5の面取用砥石40によるガラス板12の研削の説明図である。   FIG. 5 is an overall perspective view showing another chamfering grindstone 40, and FIGS. 6A to 6C are explanatory views of grinding of the glass plate 12 by the chamfering grindstone 40 of FIG.

同図に示す面取用砥石40は、円盤状又は円柱状に構成されるとともに、外周面の研削面42が実質的に扁平な面取用砥石である。また、面取用砥石40の研削面42は、図6Aの如く、ガラス板12の端縁部12Aに対向配置され、図6Bに示すように、ガラス板12の端縁部12Aが研削面42に接触されると、その接触圧により、端縁部12Aの形状に沿って、面取用砥石40の厚さ方向の断面形状が凹状に弾性変形するゴム製等の弾性体である。   The chamfering grindstone 40 shown in the figure is a chamfering grindstone having a disk shape or a columnar shape and a substantially flat grinding surface 42 on the outer peripheral surface. Further, the grinding surface 42 of the chamfering grindstone 40 is disposed opposite to the edge portion 12A of the glass plate 12 as shown in FIG. 6A, and the edge portion 12A of the glass plate 12 is ground surface 42 as shown in FIG. 6B. The elastic body made of rubber or the like whose cross-sectional shape in the thickness direction of the chamfering grindstone 40 is elastically deformed into a concave shape along the shape of the end edge portion 12A due to the contact pressure.

この面取用砥石40によれば、ガラス板12の端縁部12A〜12Dが面取用砥石40の扁平な研削面42に接触すると、研削面42は端縁部12A〜12Dの輪郭形状に略一致する凹状に凹まされる。この時、ガラス板12の端面12Eと主面12Fとの境界部12G、12Gに接触による圧力が集中するので、境界部12G、12Gが他の部分よりも多めに研削されていき、ガラス板12の端縁部12Aが図6Cの如く研削される。   According to this chamfering grindstone 40, when the edge portions 12A to 12D of the glass plate 12 come into contact with the flat grinding surface 42 of the chamfering grindstone 40, the grinding surface 42 has the contour shape of the edge portions 12A to 12D. It is recessed into a substantially matching concave shape. At this time, pressure due to contact concentrates on the boundary portions 12G and 12G between the end surface 12E and the main surface 12F of the glass plate 12, so that the boundary portions 12G and 12G are ground more than the other portions, and the glass plate 12 The edge portion 12A is ground as shown in FIG. 6C.

図7は、ガラス板12の端縁部12Aが図5の面取用砥石40によって研削されている側面図である。図7の如く、ガラス板12の端縁部12Aに押されて膨らむ面取用砥石40の研削面42の凹部44の上下のエッジ部分46、46が、ガラス板12の上下の境界部12G、12Gに低圧で接触するため、境界部12G、12Gがエッジ部分46、46によって円滑に研削され、境界部12G、12Gに生じるチッピングの発生が低減される。   FIG. 7 is a side view in which the edge portion 12A of the glass plate 12 is ground by the chamfering grindstone 40 of FIG. As shown in FIG. 7, the upper and lower edge portions 46, 46 of the concave portion 44 of the grinding surface 42 of the chamfering grindstone 40 that is pushed and expanded by the end edge portion 12 </ b> A of the glass plate 12 are the upper and lower boundary portions 12 </ b> G, Since the boundary portions 12G and 12G are in contact with 12G at a low pressure, the boundary portions 12G and 12G are smoothly ground by the edge portions 46 and 46, and the occurrence of chipping at the boundary portions 12G and 12G is reduced.

面取用砥石40は、弾性体内に研磨砥粒を分散することにより構成される。弾性体としては、ブチルゴム、シリコーン、ポリウレタン、天然ゴムを挙げることができる。前記研磨砥粒としては、ダイヤモンド、アルミナ(Al)、炭化ケイ素(SiC)、軽石、ガーネット等を挙げることができる。 The chamfering grindstone 40 is configured by dispersing abrasive grains in an elastic body. Examples of the elastic body include butyl rubber, silicone, polyurethane, and natural rubber. Examples of the abrasive grains include diamond, alumina (Al 2 O 3 ), silicon carbide (SiC), pumice, and garnet.

次に、実施の形態のノズル26、28について図2、及び図4A、Bを参照して説明する。なお、ノズル26、28は同一部材であり、配置位置の概念も同一なので、ここではノズル26について説明し、ノズル28の説明は省略する。   Next, the nozzles 26 and 28 according to the embodiment will be described with reference to FIGS. 2 and 4A and 4B. Since the nozzles 26 and 28 are the same member and the concept of the arrangement position is the same, the nozzle 26 will be described here, and the description of the nozzle 28 will be omitted.

前述の如く、ノズル26は、面取用砥石18(面取用砥石40も同様)の研削面(面取用砥石18の場合には環状溝34、面取用砥石40の場合には凹んだ凹部44)とガラス板12の端縁部12Aとの接触位置P1に対して面取用砥石18の回転方向上流側の位置P2であって、図2の如く、面取用砥石18(40)の回転方向の上流側の位置から位置P2(図4B)に向けて冷却液を噴射する位置に設置されている。また、位置P2は、面取用砥石18の環状溝34の直径d及び接触位置P1と位置P2との距離xの比x/dが、0.04(4%)〜0.05(5%)の範囲内(0.04(4%)≦x/d≦0.05(5%))となるように設定される。   As described above, the nozzle 26 is recessed on the grinding surface of the chamfering grindstone 18 (the same applies to the chamfering grindstone 40) (in the case of the chamfering grindstone 18, the annular groove 34, and in the case of the chamfering grindstone 40). The chamfering grindstone 18 (40) as shown in FIG. 2 is a position P2 upstream of the chamfering grindstone 18 in the rotational direction with respect to the contact position P1 between the concave portion 44) and the edge 12A of the glass plate 12. It is installed in the position which injects a cooling liquid toward the position P2 (FIG. 4B) from the position of the upstream of the rotation direction. Further, the position P2 is such that the diameter d of the annular groove 34 of the chamfering grindstone 18 and the ratio x / d of the distance x between the contact position P1 and the position P2 are 0.04 (4%) to 0.05 (5%). ) (0.04 (4%) ≦ x / d ≦ 0.05 (5%)).

また、ノズル26は、図4Aの如く、面取用砥石18の回転軸19に対して直交する面内方向に冷却液を噴射する位置に設置されている。すなわち、実施の形態のノズル26は、図4Bの矢印Cの如く、位置P2に向けて冷却液を、ガラス板12の主面Fの面内方向と平行方向に噴射する。   Moreover, the nozzle 26 is installed in the position which injects a cooling liquid in the in-plane direction orthogonal to the rotating shaft 19 of the grindstone 18 for chamfering like FIG. 4A. That is, the nozzle 26 according to the embodiment injects the cooling liquid toward the position P2 in a direction parallel to the in-plane direction of the main surface F of the glass plate 12 as indicated by an arrow C in FIG. 4B.

これにより、実施の形態のノズル26によれば、冷却液が面取用砥石18(40)の最適な位置、すなわち回転中の面取用砥石18の外周面に沿って形成された、空気層を貫通できる位置に噴射されるので、面取用砥石18(40)によってガラス板12の端縁部12Aを良好に面取りできるとともに、冷却液の噴射量を低減できる。なお、良好に面取りできるとは、ガラス板12の端縁部12Aに生じる焼け、欠けの発生を低減でき、境界面12Gに発生するチッピングを軽減できるという意味である。また、面取用砥石18(40)からノズル26(28)の噴射口までの距離は特に限定されず、それぞれが接しない程度に近接する距離であってもよい。当該距離に設置されたノズル26(28)から噴射された冷却液は、面取用砥石18(40)の回転に伴って位置P2に瞬時に供給されるので、ガラス板12の良好な研削加工に支障は生じない。   As a result, according to the nozzle 26 of the embodiment, an air layer in which the coolant is formed along the optimum position of the chamfering grindstone 18 (40), that is, along the outer peripheral surface of the rotating chamfering grindstone 18. Therefore, the chamfering grindstone 18 (40) can chamfer the edge 12A of the glass plate 12 satisfactorily, and the amount of coolant injected can be reduced. In addition, being able to chamfer well means that it is possible to reduce the occurrence of burning and chipping at the edge portion 12A of the glass plate 12 and to reduce chipping generated at the boundary surface 12G. In addition, the distance from the chamfering grindstone 18 (40) to the injection port of the nozzle 26 (28) is not particularly limited, and may be a distance close to each other so as not to contact each other. Since the coolant sprayed from the nozzle 26 (28) installed at the distance is instantaneously supplied to the position P2 along with the rotation of the chamfering grindstone 18 (40), the glass plate 12 is favorably ground. Will not cause any problems.

また、ノズル26は、図4Bの如く、面取用砥石18(40)の前記研削面(環状溝34、凹部44)の接線方向に冷却液を噴射する位置に設置されることが好ましい。これにより、ノズル26から噴射された冷却液の噴射圧力によって面取用砥石18(40)に回転負荷をかけることなく、冷却液を面取用砥石18(40)の最適な位置に噴射することができる。また、実施の形態では、1本のノズル26(28)を用いて冷却液を最適な位置に噴射しているので、2本の冷却液噴射ノズルを用いる特許文献3の装置と比較して、冷却水の使用量を削減できる。   Moreover, it is preferable that the nozzle 26 is installed in the position which injects a cooling fluid in the tangential direction of the said grinding surface (annular groove 34, recessed part 44) of the grindstone 18 (40) for chamfering like FIG. 4B. Thus, the coolant is sprayed to the optimum position of the chamfering grindstone 18 (40) without applying a rotational load to the chamfering grindstone 18 (40) by the spraying pressure of the coolant sprayed from the nozzle 26. Can do. In the embodiment, since the coolant is sprayed to the optimum position using the single nozzle 26 (28), compared with the apparatus of Patent Document 3 using two coolant spray nozzles, The amount of cooling water used can be reduced.

なお、高速回転中の面取用砥石18(40)の外周面に形成される空気層に、ノズル26から噴射される冷却液を貫通させる好適な条件は、ノズル26の噴射口の径が2〜3mm、位置P2からノズル26の噴射口までの距離が10〜20mm、冷却液の流速が10〜20m/sec、及び面取用砥石18(40)による面取り加工速度(ガラス板12の面取用砥石18、20に対する相対速度)が12m/minであることが好ましい。このような条件下で面取り加工を行うことにより、冷却液を前記空気層に貫通させることができるとともに、冷却液の供給量を3〜5L/minに低減できる。   A preferable condition for allowing the coolant injected from the nozzle 26 to penetrate the air layer formed on the outer peripheral surface of the chamfering grindstone 18 (40) during high-speed rotation is that the diameter of the injection port of the nozzle 26 is 2. ~ 3mm, the distance from the position P2 to the injection port of the nozzle 26 is 10 ~ 20mm, the flow rate of the coolant is 10 ~ 20m / sec, and the chamfering speed by the chamfering grindstone 18 (40) (the chamfering of the glass plate 12) The relative speed with respect to the grinding wheels 18 and 20 for use is preferably 12 m / min. By performing chamfering under such conditions, the coolant can be penetrated through the air layer, and the supply amount of the coolant can be reduced to 3 to 5 L / min.

本発明の板状物の加工装置による加工対象物は、高い面取り精度が要求される液晶ディスプレイ等のFPD用ガラス板に限定されず、建材用やミラー用等の一般的なガラス板でもよい。また、ガラス板に限定されず、金属製、又は樹脂製の板状物であってもよい。   The object to be processed by the plate-like material processing apparatus of the present invention is not limited to a glass plate for FPD such as a liquid crystal display that requires high chamfering accuracy, and may be a general glass plate for building materials or mirrors. Moreover, it is not limited to a glass plate, A metal-made or resin-made plate-shaped object may be sufficient.

10…面取装置、12…ガラス板、12A〜12D…端縁部、12E…端面、12E′…端面、12F…主面、12G…境界面、14…定盤、16…移動装置、18、20…面取用砥石、19…回転軸、22、24…モータ、26、28…ノズル、30、32…外周面、40…面取用砥石、42…研削面、44…凹部、46…エッジ部   DESCRIPTION OF SYMBOLS 10 ... Chamfering device, 12 ... Glass plate, 12A-12D ... End edge part, 12E ... End surface, 12E '... End surface, 12F ... Main surface, 12G ... Boundary surface, 14 ... Surface plate, 16 ... Moving device, 18, DESCRIPTION OF SYMBOLS 20 ... Chamfering wheel, 19 ... Rotating shaft, 22, 24 ... Motor, 26, 28 ... Nozzle, 30, 32 ... Outer peripheral surface, 40 ... Chamfering grindstone, 42 ... Grinding surface, 44 ... Recess, 46 ... Edge Part

Claims (5)

板状物を保持する定盤と、
前記定盤に保持された前記板状物の端縁部を研削して面取りする円盤状又は円柱状の面取用砥石と、
前記面取用砥石を回転させる回転手段と、
前記面取用砥石の周縁部を前記板状物の外周面の研削面に接触させて前記面取用砥石、又は前記板状物を、前記板状物の端縁部に沿って移動させる移動手段と、
前記面取用砥石の前記研削面と前記板状物の端縁部との接触箇所に冷却液を噴射するとともに、前記面取用砥石の回転軸に対して直交する面内方向に前記冷却液を噴射する噴射手段と、
を備えたことを特徴とする板状物の加工装置。
A surface plate for holding a plate-like object;
A disc-shaped or column-shaped chamfering grindstone for grinding and chamfering the edge of the plate-like object held by the surface plate;
Rotating means for rotating the chamfering grindstone,
Moving the chamfering grindstone or the plate-like object along the edge of the plate-like object by bringing the peripheral part of the chamfering grindstone into contact with the grinding surface of the outer peripheral surface of the plate-like object Means,
The coolant is sprayed to a contact portion between the grinding surface of the chamfering grindstone and the edge of the plate-like object, and the coolant is in an in-plane direction orthogonal to the rotation axis of the chamfering grindstone. Injection means for injecting
An apparatus for processing a plate-like object.
前記噴射手段は、前記面取用砥石の前記研削面の接線方向に前記冷却液を噴射する請求項1に記載の板状物の加工装置。   The plate-like object processing apparatus according to claim 1, wherein the injection unit injects the cooling liquid in a tangential direction of the grinding surface of the chamfering grindstone. 前記面取用砥石は、該面取用砥石の前記周縁部の形状が扁平である円盤状又は円柱状であって、前記板状物の前記研削面が接触されると、接触圧によって該端縁部の形状に沿って、前記面取用砥石の厚さ方向の断面形状が凹状に弾性変形する弾性体である請求項1、又は2に記載の板状物の加工装置   The chamfering grindstone has a disk shape or a columnar shape in which the shape of the peripheral portion of the chamfering grindstone is flat, and when the grinding surface of the plate-like object is contacted, the end is caused by contact pressure. The processing apparatus for a plate-like object according to claim 1 or 2, wherein the chamfering grindstone is an elastic body whose cross-sectional shape in the thickness direction is elastically deformed into a concave shape along an edge shape. 前記面取用砥石は、前記外周面に1本又は複数本の環状溝を備えている請求項1、又は2に記載の板状物の加工装置。   The said chamfering grindstone is a processing apparatus of the plate-shaped object of Claim 1 or 2 provided with the 1 or several annular groove in the said outer peripheral surface. 板状体の端縁部に、回転する円盤状又は円柱状の面取用砥石の研削面を押し付けるとともに、前記板状体及び前記面取用砥石を、前記板状体の前記端縁部に沿って相対的に移動させながら、前記面取用砥石の前記研削面と前記板状物の前記端縁部との接触箇所に冷却液を噴射させることにより、前記板状体の端縁部を面取り加工する板状体の加工方法において、
前記面取用砥石の回転軸に対して直交する面内方向に前記冷却液を噴射することを特徴とする板状物の加工方法。
While pressing the grinding surface of the rotating disk-shaped or column-shaped chamfering grindstone against the edge of the plate-like body, the plate-like body and the chamfering grindstone are pressed against the edge of the plate-like body. The edge of the plate-like body is moved by spraying a cooling liquid onto the contact portion between the grinding surface of the chamfering grindstone and the edge of the plate-like object while relatively moving along the chamfering grindstone. In the processing method of the plate-like body to be chamfered,
A processing method for a plate-like object, wherein the cooling liquid is sprayed in an in-plane direction orthogonal to a rotation axis of the chamfering grindstone.
JP2011239107A 2011-10-31 2011-10-31 Processing device and processing method of plate-like object Pending JP2015006697A (en)

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