CN111496680A - Method for processing glass plate - Google Patents

Method for processing glass plate Download PDF

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Publication number
CN111496680A
CN111496680A CN202010127639.1A CN202010127639A CN111496680A CN 111496680 A CN111496680 A CN 111496680A CN 202010127639 A CN202010127639 A CN 202010127639A CN 111496680 A CN111496680 A CN 111496680A
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CN
China
Prior art keywords
grinding wheel
glass plate
edge
resin
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010127639.1A
Other languages
Chinese (zh)
Inventor
今里祐介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of CN111496680A publication Critical patent/CN111496680A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0023Other grinding machines or devices grinding machines with a plurality of working posts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Surface Treatment Of Glass (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention provides a method for processing a glass plate. A chamfered surface is formed by grinding an edge portion (12A) of a glass plate (12) with a metal bond grinding wheel (18), and an annular groove (44) is formed in the outer peripheral surface (43) of the resin bond grinding wheels (26, 28) by pressing the flat outer peripheral surface (43) of the resin bond grinding wheels (26) against the chamfered surface. According to the manufacturing method, an annular groove (44) having the same contour shape as the chamfered surface of the glass plate can be manufactured on the outer peripheral surface (43) of the resin bonded grinding wheel (26). Furthermore, it is possible to manufacture an annular groove (44) and grind the chamfered surface by the manufactured annular groove (44). This improves the efficiency of chamfering the glass plate (12).

Description

Method for processing glass plate
The present application is a divisional application of an application entitled "method for manufacturing grooves for polishing resin bonded grinding wheel, and apparatus and method for processing plate-like body" having application date of 2014, 9, 19, and application number of 201410483712.3.
Technical Field
The present invention relates to a method for processing a glass sheet.
Background
A glass plate for an FPD (Flat panel display) used for a liquid crystal display, a plasma display, or the like, which is a plate-shaped body, is formed into a plate shape from molten glass, and then cut into a glass plate having a predetermined rectangular size by a cutting device. Then, the glass plate is chamfered by grinding the edge thereof with a chamfering grindstone of a chamfering device (a plate-shaped body processing device) disclosed in patent document 1 or the like.
The chamfering device described in patent document 2 includes a grinding wheel for chamfering, a coolant (grinding fluid) injection nozzle, and the like. The chamfering grindstone rotates about an axis parallel to an axis orthogonal to the principal surface of the glass plate, and the rotation direction of the chamfering grindstone is set in a direction opposite to the conveyance direction of the glass plate at the grinding portion of the glass plate. An arc-shaped grinding groove is formed in the outer peripheral surface of the chamfering grindstone, which is a grinding surface, and the edge of the glass sheet is ground into an arc-shaped cross section by the grinding groove.
Further, as shown in patent document 3, a plate-shaped body chamfering device is known which includes a metal bond grinding wheel for grinding (rough machining) and a resin bond grinding wheel for polishing (precision machining). According to this chamfering device, the edge of the plate-like body is ground by the metal bond grindstone to form a chamfered surface at the edge, and then the chamfered surface is ground by the resin bond grindstone.
A grinding groove, with which the chamfered surface of the plate-like body abuts, is formed on the outer peripheral surface of the resin bonded grinding wheel of patent document 3.
[ Prior Art document ]
[ patent document ]
[ patent document 1 ] Japanese laid-open patent application No. 2002-160147
[ patent document 2 ] Japanese patent application laid-open No. 2009-172749
[ patent document 3 ] Japanese unexamined patent publication No. 2001-71244
In recent years, when chamfering the edge of a plate-like body, the demand for finishing has increased due to the increased quality demand. When finishing is performed by the resin bonded grinding wheel disclosed in patent document 3, it is necessary to produce a groove shape that matches the shape of the edge of the plate-like body. In order to perform high-quality finishing, it is necessary to accurately align the groove of the finishing grindstone with the edge of the plate-like body. This adjustment operation requires skill and takes time.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a method for manufacturing a groove for polishing a resin bonded grinding wheel, which can manufacture a groove for polishing an end portion of a plate-like body into a groove shape conforming to a shape of an edge portion of the plate-like body, a resin bonded grinding wheel manufactured by the manufacturing method, and a device and a method for processing a plate-like body using the resin bonded grinding wheel.
[ MEANS FOR solving PROBLEMS ] A method for solving the problems
In order to achieve the above object, the present invention provides a method for manufacturing a groove for polishing a resin bonded grinding wheel, wherein a resin bonded grinding wheel having a flat outer peripheral surface is aligned with a plate-like body having a hardness higher than that of a binder of the resin bonded grinding wheel, the resin bonded grinding wheel is rotated around a central axis, the outer peripheral surface of the resin bonded grinding wheel is pressed against an edge of the plate-like body, and an annular groove for polishing to which a shape of the edge of the plate-like body is transferred is manufactured on the outer peripheral surface of the resin bonded grinding wheel.
According to the present invention, the resin bonded grinding wheel having a flat outer peripheral surface is aligned with the plate-like body having a hardness higher than that of the binder of the resin bonded grinding wheel. The resin bonded grinding wheel is rotated around the central axis of the resin bonded grinding wheel, and the flat outer peripheral surface of the resin bonded grinding wheel is pressed against the edge of the plate-like body. In this way, the outer peripheral surface of the resin bonded grinding wheel is ground by the edge of the plate-like body, and therefore, an annular polishing groove to which the outline shape of the edge of the plate-like body is transferred can be produced on the outer peripheral surface of the resin bonded grinding wheel. Further, according to the present invention, the adjustment work of aligning the existing groove of the resin bonded grinding wheel with the position of the edge of the plate-like body as in the conventional resin bonded grinding wheel is not required. That is, one aspect of the present invention can polish the edge of the plate-like body simultaneously with the production of the polishing grooves.
In one aspect of the present invention, it is preferable that the edge of the plate-like body is ground into a predetermined shape by a metal bond grinding wheel, and the edge of the plate-like body ground into the predetermined shape is pressed against the outer peripheral surface of the resin bond grinding wheel, so that the polishing groove is formed in the outer peripheral surface of the resin bond grinding wheel.
According to one aspect of the present invention, the edge of the plate-like body is ground by a metal bond grinding wheel, and a chamfered surface is formed on the edge. The chamfered surface is pressed against the flat outer peripheral surface of the resin bonded grinding wheel. Thus, the grinding groove having the same shape as the contour shape of the chamfered surface can be formed on the outer peripheral surface of the resin bonded grinding wheel.
In one aspect of the present invention, the grinding groove is preferably produced by pressing the outer peripheral surface of the resin bonded grinding wheel against a side portion of the edge portion of the plate-like body excluding a corner portion.
When the corner portion of the edge of the plate-like body and the outer peripheral surface of the resin bonded grinding wheel are pressed against each other, an external force generated by the rotation of the resin bonded grinding wheel acts on the corner portion, and stress is concentrated on the corner portion, and the corner portion may be damaged.
In contrast, in one aspect of the present invention, since the edge portion of the plate-like body is pressed against the outer peripheral surface of the resin bonded grinding wheel, the stress is dispersed, and thus the plate-like body can be prevented from being damaged.
In one aspect of the present invention, the resin bonded grinding wheel is preferablyThe bonding agent is phenolic aldehyde, epoxy, polyimide, polyurethane, silicone, butyl rubber or natural rubber, and the abrasive grains of the resin bonding agent grinding wheel are diamond, Cubic Boron Nitride (CBN) and aluminum oxide (Al)2O3) Silicon carbide (SiC), pumice or garnet, the plate-like body being a glass plate.
According to one aspect of the present invention, the polishing grooves are formed on the outer peripheral surface of the resin bonded grinding wheel by using the edge portion of the glass plate which is harder than the binder of the resin bonded grinding wheel. The edge of the glass plate can be polished by the manufactured polishing grooves. That is, the production of the polishing grooves and the polishing of the edge portions using the produced polishing grooves can be performed in the same step. The glass plate is harder than the resin bond grinding wheel bond.
In order to achieve the above object, the present invention provides a resin bonded grinding wheel, which is produced by the method for producing a groove for grinding a resin bonded grinding wheel according to the present invention.
In order to achieve the above object, the present invention provides a plate-like body processing apparatus, comprising: a platform for holding the plate-like body; the resin bond grinding wheel of the present invention grinds the edge of the plate-like body held by the table; a rotating unit that rotates the resin bond grinding wheel around a central axis of the resin bond grinding wheel; a moving means for moving the resin bonded grinding wheel or the plate-like body along an edge of the plate-like body by bringing the grinding groove of the resin bonded grinding wheel into contact with the edge of the plate-like body; and a spraying unit for spraying a cooling liquid to a contact portion between the polishing groove of the resin bonded grinding wheel and the edge of the plate-like body.
In addition, according to an aspect of the present invention, there is provided a plate-like body processing method, wherein the edge portion of the plate-like body is processed using the processing apparatus according to the aspect of the present invention.
According to the present invention, the resin bond grinding wheel is rotated by the rotating unit. Then, the groove for polishing the resin bonded grinding wheel is brought into contact with the edge of the plate-like body held by the table by the moving means, and the resin bonded grinding wheel or the plate-like body is moved along the edge of the plate-like body. Then, a cooling liquid is sprayed by a spraying means to a contact portion between the polishing groove of the resin bonded grinding wheel and the edge portion of the plate-like body. This enables smooth polishing of the edge of the plate-like body by the polishing grooves of the resin bonded grinding wheel.
In one aspect of the present invention, it is preferable that the metal bond grinding wheel is provided for grinding and chamfering an edge of the plate-like body held by the table, and the resin bond grinding wheel grinds and mirrors the chamfered edge of the plate-like body.
According to one aspect of the present invention, the edge of the plate-like body is chamfered by the metal bond grinding wheel, and a chamfered surface is formed on the edge. The chamfered surface is polished with a resin binder grinding wheel to perform mirror finishing.
[ Effect of the invention ]
According to the present invention, the polishing groove for polishing the end portion of the plate-like body can be formed in a groove shape conforming to the shape of the edge portion of the plate-like body.
Drawings
Fig. 1 is a plan view of a chamfering device to which a plate-like body processing device of the present invention is applied.
FIG. 2 is a perspective view showing the arrangement positions of the grindstone, the glass plate, and the nozzle.
Fig. 3A is an explanatory view of the arrangement of the grinding groove of the metal bond grinding wheel and the edge of the glass plate facing each other.
Fig. 3B is an explanatory view of grinding the edge of the glass plate with a metal bond grinding wheel.
Fig. 3C is an enlarged view of the edge of the glass plate ground to form the chamfered surface.
Figure 4 is a side view of a metal bond grinding wheel.
Fig. 5 is an overall perspective view of the resin bonded grinding wheel.
Fig. 6A is an explanatory view showing a method for manufacturing a groove for polishing in a resin bonded grinding wheel.
Fig. 6B is an explanatory view showing a method for manufacturing a groove for polishing in a resin bonded grinding wheel.
Fig. 7 is an explanatory view of pressing the resin bonded grinding wheel against a corner of an edge portion of the glass plate.
Fig. 8 is an explanatory view of pressing the resin bonded grinding wheel against the edge of the glass plate.
[ Mark Specification ]
10 … chamfering device, 12 … glass plate, edge of 12A-12D … glass plate, end face of 12E, 12E' … glass plate, main face of 12F … glass plate, interface of 12G … glass plate, 14 … platform, 16 … moving device, 18, 20 … metal cement grinding wheel, 22, 24 … motor, 26, 28 … resin cement grinding wheel, 30, 32 … motor, 34, 36, 38, 40 … nozzle, 42, 44 … annular groove
Detailed Description
Preferred embodiments of a method for manufacturing grooves for polishing a resin bonded grinding wheel, a device for processing a plate-like body, and a method for processing a plate-like body according to the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a plan view of a chamfering device 10 to which an embodiment of the plate-like body processing device of the present invention is applied. The chamfering device 10 is a device for grinding and chamfering the edge portions 12A to 12D of a glass plate (plate-like body) 12 for a liquid crystal display having a thickness of 0.7mm or less, and polishing the chamfered surface after chamfering and mirror-finishing the same.
The plate-like body applicable to the processing apparatus of the present invention is not limited to a glass plate for a liquid crystal display, and may be, for example, a glass plate for an FPD such as a glass plate for a plasma display and a glass plate for an L ED display, or may be a general glass plate for a solar cell, an illumination, a building material, a reflector, or the like, and may be applied even to a metal or resin plate-like body, and the thickness of the plate-like body is not limited to 0.7mm or less, and may be more than 0.7 mm.
The chamfering device 10 is constituted of a table 14 for holding a rectangular glass plate 12 by suction, a moving device (moving means) 16 for reciprocating the table 14 in the direction of the arrow A-B, a pair of disk-shaped or cylindrical metal bond grindstones 18, 20 for grinding the edges 12A to 12D of the glass plate 12 to form chamfered surfaces on the edges, motors 22, 24 for rotating the metal bond grindstones 18, 20 at high speed, disk-shaped or cylindrical resin bond grindstones 26, 28 for grinding the chamfered surfaces to form mirror surfaces, motors (rotating means) 30, 32 for rotating the resin bond grindstones 26, 28 at high speed, nozzles (ejecting means) 34, 36 for ejecting a coolant to a processing portion (contact portion) processed by the metal bond grindstones 18, 20, and nozzles (ejecting means) 38 for ejecting a coolant to a processing portion (contact portion) processed by the resin bond grindstones 26, 28, 40, etc. The method of manufacturing the grooves for polishing the resin bonded grindstones 26 and 28 will be described later. The shapes of the metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28 are not limited to a disk shape or a cylindrical shape, and may be cylindrical.
In the chamfering device 10 of the embodiment, in a state where the edge portion of the glass plate 12 having 2 opposing main surfaces is exposed from the upper surface of the surface plate 14, one main surface of the glass plate 12 is sucked and held on the suction surface of the upper surface of the surface plate 14, and the surface plate 14 is moved in the arrow a direction by the moving device 16. During this movement, the opposed edge portions 12A, 12B of the glass plate 12 are ground by the metal bond grindstones 18, 20 rotating in the direction opposite to the moving direction of the glass plate 12, and chamfered surfaces are formed. The chamfered surface is ground by resin bonded grindstones 26 and 28 rotating in the direction opposite to the moving direction of the glass plate 12. Thus, the edge portions 12A and 12B of the glass plate 12 are chamfered and then mirror-finished.
In addition, during chamfering, the cooling liquid is sprayed from the nozzle 34 to the processing portion where the metal bond grindstone 18 contacts the edge portion 12A of the glass plate 12, and the cooling liquid is sprayed from the nozzle 36 to the processing portion where the metal bond grindstone 20 contacts the edge portion 12B of the glass plate 12. In the mirror surface processing, the cooling liquid is sprayed from the nozzle 38 to the processing portion where the resin bonded grindstone 26 contacts the edge portion 12A of the glass plate 12, and the cooling liquid is sprayed from the nozzle 40 to the processing portion where the resin bonded grindstone 28 contacts the edge portion 12B of the glass plate 12.
Thus, the processed portion is cooled by the coolant, and therefore, the occurrence of sintering, defects, and the like, which occur in the edge portions 12A, 12B of the glass plate 12, is reduced. Further, the edge curl generated at the interface between the 2 main surfaces of the glass plate 12 and the end surfaces of the edge portions 12A and 12B is reduced. The coolant may be pure water, grinding oil, or a mixture thereof.
In the chamfering device 10, in order to simultaneously perform chamfering and mirror finishing on a pair of opposing edge portions 12A, 12B of a glass plate 12, a metal bond grindstone 18 and a resin bond grindstone 26 are disposed with respect to the edge portion 12A, and a metal bond grindstone 20 and a resin bond grindstone 28 are disposed with respect to the edge portion 12B. The resin bonded grindstones 26, 28 are disposed on the downstream side in the conveying direction of the glass plate 12 with respect to the metal bonded grindstones 18, 20.
In fig. 1, the metal bond grinding wheel 18 is rotated clockwise by the motor 22, and the metal bond grinding wheel 20 is rotated counterclockwise by the motor 24. The resin bonded grinding wheel 26 is rotated clockwise by the motor 30, and the resin bonded grinding wheel 28 is rotated counterclockwise by the motor 32. The rotational speed of the grindstones 18, 20, 26, 28 is preferably set to 3000rpm or more.
In fig. 1, the chamfering device 10 is shown in which the glass plate 12 is moved in the direction of arrow a and the edge portions 12A and 12B are machined by the fixed metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28, but the chamfering device is not limited to this. For example, the chamfering device may be configured to fix the glass plate 12 and move the metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28 along the edge portions 12A and 12B of the glass plate 12. Further, the metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28 may be chamfering devices that move the glass plate 12 in the direction in which they approach each other along the edge portions 12A and 12B of the glass plate 12. The other opposing edge portions 12C and 12D of the glass plate 12 may be processed by a metal bond grinding wheel and a resin bond grinding wheel, not shown, disposed at the rear stages of the metal bond grinding wheels 18 and 20 and the resin bond grinding wheels 26 and 28 in fig. 1. Alternatively, the glass plate 12 may be moved in the B direction by the surface plate 14 to return to the original position, and then the glass plate 12 may be rotated by 90 degrees about the perpendicular line to the main surface direction of the glass plate 12 by the surface plate 14, and then the glass plate 12 may be moved in the a direction by the surface plate 14, and the edge portions 12C and 12D may be processed by the metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28, which have intervals changed according to the lengths of the edge portions 12A and 12B of the glass plate 12.
Fig. 2 is a perspective view showing the arrangement positions of the metal bond grinding wheel 18, the resin bond grinding wheel 26, and the nozzles 34 and 38 with respect to the glass plate 12. The metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28 are disposed to face the end face 12E of the glass plate 12. Here, the end face 12E is a face in a direction perpendicular to the main face 12F of the glass plate 12 and is a face before processing. The portions including the interface between the end face 12E and the main face 12F and the end face 12E are referred to as edge portions 12A to 12D, and the edge portions 12A to 12D are processed by the metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28. As described in patent document 1, the rotation axes of the metal bonded grindstones 18 and 20 and the resin bonded grindstones 26 and 28 may be inclined at a predetermined angle with respect to a vertical line that rises on the main surface 12F of the glass plate 12.
The metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28 are simultaneously driven and rotated, and the opposing edge portions 12A and 12B of the glass plate 12 are simultaneously machined by the metal bond grindstones 18 and 20 and the resin bond grindstones 26 and 28 by the movement of the glass plate 12 by the moving device 16 of fig. 1.
Fig. 3A and 3B are enlarged sectional views of a main portion of the outer peripheral surface of the metal bond grinding wheel 18. Since the metal bond grindstones 18 and 20 shown in fig. 1 have the same configuration, the metal bond grindstone 18 will be described here, and the description of the metal bond grindstone 20 will be omitted.
On the outer peripheral surface of the metal bond grinding wheel 18, an annular groove 42 as a grinding groove is formed along the horizontal direction (the direction perpendicular to the rotation axis shown by the alternate long and short dash line in fig. 4). As shown in the side view of the cemented metal carbide grindstone 18 of fig. 4, a plurality of the annular grooves 42 are provided in parallel in the vertical direction.
The cross-sectional shape of the annular groove 42 in the thickness direction of the metal bond grindstone 18 is not limited to the U-shape shown in fig. 3A and 3B, and may be a V-shape or a concave shape (concave). The number of the annular grooves 42 may be 1, but in order to save the work of replacing the metal bond grinding wheel 18, it is preferable to provide a plurality of the annular grooves at predetermined intervals along the thickness direction of the metal bond grinding wheel 18 as shown in fig. 4. Since the annular groove 42 is provided in plural in the metal bond grinding wheel 18, when the service life of the annular groove 42 is reached, if the metal bond grinding wheel 18 is moved up and down (in the thickness direction of the metal bond grinding wheel 18) by the pitch unit of the annular groove 42 by a control device (not shown), the edge 12A of the glass plate 12 can be ground by a new annular groove 42 without performing the replacement work of the metal bond grinding wheel 18. The annular groove 42 may have a single radius of curvature, or may have a portion ground as shown in fig. 3A at the end face 12E and a portion ground at the interface 12G between the end face 12E' and the main face 12F after the end of grinding the edge portion 12A of the glass plate 12 shown in fig. 3C.
As shown in fig. 3A, the annular groove 42 of the metal bond wheel 18 faces the end face 12E of the glass plate 12 in the horizontal direction, and from this state, the metal bond wheel 18 is conveyed in the horizontal direction toward the end face 12E. At a position where the annular groove 42 of the metal bond grinding wheel 18 abuts the end face 12E, the metal bond grinding wheel 18 feeds a grinding margin toward the edge portion 12A as shown in fig. 3B. As a result, as shown in fig. 3C, the edge portion 12A is ground by the annular groove 42, and a chamfered surface is formed on the edge portion 12A. As shown by the broken line B in fig. 3A, the metal bond grindstone 18 is conveyed toward the edge portion 12A so that the central portion of the end surface 12E in the thickness direction of the glass plate 12 abuts on the deepest portion of the annular groove 42.
Next, a first method of manufacturing the annular groove 44 shown in fig. 2, which is a groove for polishing the resin bonded grindstones 26 and 28, will be described. Since the resin bonded grinding wheel 26 and the resin bonded grinding wheel 28 are the same, the resin bonded grinding wheel 26 will be described here, and the resin bonded grinding wheel 28 will not be described. Moreover, the description relating to the resin bond grinding wheel 28 is also omitted.
Fig. 5 is an overall perspective view of the resin bonded grinding wheel 26 in a state where the annular groove 44 is not formed. The resin bonded grinding wheel 26 is a grinding wheel having a disk-like, cylindrical or cylindrical shape and having a flat outer peripheral surface 43 as a grinding surface. Fig. 6A and 6B are explanatory views showing a procedure for manufacturing the annular groove 44 in the resin bonded grinding wheel 26 of fig. 5. Fig. 6A and 6B show the glass sheet 12 for manufacturing the annular groove 44. Of course, the glass plate 12 is harder than the resin bond of the grinding wheel 26.
In manufacturing the annular groove 44, a method is employed in which the chamfered surface of the edge portion 12A of the glass plate 12 ground by the metal bond grindstone 18 of the chamfering device 10 is transferred to the flat outer peripheral surface 43 of the resin bond grindstone 26.
That is, using the chamfering device 10 of fig. 1 including the table 14, the moving device 16, the motors 30, 32, and the nozzles 38, 40, the edge portion 12A of the glass plate 12 is ground by the metal bond grindstone 18 to form a chamfered surface, and the flat outer peripheral surface 43 of the resin bond grindstone 26 is pressed against the chamfered surface, thereby producing the annular groove 44 in the outer peripheral surface 43 of the resin bond grindstones 26, 28.
According to the manufacturing method, the annular groove 44 having the same contour shape as the chamfered surface of the glass plate 12 can be manufactured on the outer peripheral surface 43 of the resin bonded grinding wheel 26. Also, it is possible to manufacture the annular groove 44 and grind the chamfered surface through the manufactured annular groove 44 at the same time. This improves the chamfering efficiency of the glass plate 12.
The resin bonded grinding wheel 26 having the annular groove 44 manufactured by the manufacturing method described above is continuously used in the chamfering device 10. When the service life of the first annular groove 44 is exhausted, the resin bonded grinding wheel 26 is raised by a predetermined amount, and a second new annular groove 44 is formed in the flat outer peripheral surface 43 in the above-described procedure. In this case, since the annular groove 44 is manufactured by the edge portion 12A of the glass sheet 12 held by the platen 14, the height adjustment of the annular groove 44 with respect to the height of the edge portion 12A is not necessary.
That is, in the resin bonded grinding wheel of patent document 3 in which the annular groove 44 is formed in advance, the height adjustment is required each time the old annular groove is changed to a new annular groove, but the manufacturing method does not require the height adjustment as described above. Thus, according to the manufacturing method, chamfering efficiency can be improved.
Although the chamfering device 10 of fig. 1 includes the metal bond grindstones 18 and 20, the present invention is also applicable to a chamfering device that does not include the metal bond grindstones 18 and 20, that is, a chamfering device that grinds the edge portions 12A and 12B of the glass plate 12 only with the resin bond grindstones 26 and 28.
On the other hand, in manufacturing the annular groove 44, as shown in fig. 2, it is preferable to manufacture the annular groove by pressing the outer peripheral surface 43 of the resin bonded grinding wheel 26 against the side portion S of the edge portion 12A of the glass plate 12 excluding the corner portion C.
Fig. 7 and 8 show the pressing position of the resin bonded grinding wheel 26 against the edge 12A of the glass plate 12.
As shown in fig. 7, when the corner portion C of the edge portion 12A of the glass plate 12 is pressed against the outer peripheral surfaces of the resin bonded grindstones 26 and 28, an external force generated by the rotation of the resin bonded grindstones 26 and 28 acts on the corner portion C, and stress is concentrated on the corner portion C, which may cause breakage of the corner portion C.
In contrast, when the side portion S of the edge portion 12A of the glass plate 12 is pressed against the outer peripheral surface of the resin bonded grindstone 26 as shown in fig. 8, the stress is dispersed, and therefore, breakage of the glass plate 12 can be prevented.
The resin bonded grinding wheel 26 is a grinding wheel in which abrasive grains are held by a bond of thermosetting resin. Examples of the binder include phenol, epoxy, polyimide, urethane, silicone, butyl rubber, and natural rubber. Further, the abrasive grains include diamond, Cubic Boron Nitride (CBN), and alumina (Al)2O3) Silicon carbide (SiC), pumice, garnet, or the like. For example, when the abrasive grains are diamond, the abrasive grains of the resin bond grinding wheel 26 preferably have a grain size of 200 to 1500 (JIS R6001: 1998).
The present application is based on japanese patent application 2013-193933 filed on 19.9.2013, the contents of which are hereby incorporated by reference.

Claims (7)

1. A method for processing an edge of a rectangular glass plate by a chamfering device, the method comprising:
a first step of manufacturing, in a chamfering device, an annular polishing groove, to which the shape of the edge of the glass plate is transferred, on the outer peripheral surface of a resin bond grinding wheel by rotating the resin bond grinding wheel, the outer peripheral surface of which is flat, around a central axis and pressing the outer peripheral surface of the resin bond grinding wheel against the edge of the glass plate; and
and a second step of continuing to grind the edge of the glass plate by using the resin bonded grinding wheel having the grinding groove in the chamfering device.
2. The method of processing a glass sheet as claimed in claim 1, comprising:
a third step of manufacturing, in the chamfering device, a second new annular polishing groove on the flat outer peripheral surface of the resin bonded grinding wheel on which the polishing groove is manufactured, after the second step; and
and a fourth step of continuing to grind the edge of the glass plate by using the resin bonded grinding wheel having the grinding groove in the chamfering device.
3. The method for processing a glass sheet according to claim 1 or 2,
the adjustment work for aligning the polishing groove with the edge of the glass plate is not performed.
4. The method for processing a glass sheet according to claim 1 or 2,
comprising, before the first step, the steps of: the glass plate is ground to a predetermined shape at the edge thereof by a metal bond grinding wheel.
5. The method for processing a glass sheet according to claim 1 or 2,
the outer peripheral surface of the resin bonded grinding wheel is pressed against the side portion of the edge portion of the glass plate except for the corner portion to manufacture the grinding groove.
6. The method for processing a glass sheet according to claim 1 or 2,
the binding agent of the resin binding agent grinding wheel is phenolic aldehyde, epoxy, polyimide, polyurethane, silicone, butyl rubber or natural rubber,
the abrasive particles of the resin bond grinding wheel are diamond, Cubic Boron Nitride (CBN) and aluminum oxide (Al)2O3) Silicon carbide (SiC), pumice or garnet.
7. The method for processing a glass sheet according to claim 1 or 2,
the thickness of the glass plate is less than 0.7 mm.
CN202010127639.1A 2013-09-19 2014-09-19 Method for processing glass plate Pending CN111496680A (en)

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JP2013-193933 2013-09-19
JP2013193933A JP6238117B2 (en) 2013-09-19 2013-09-19 Processing method of plate
CN201410483712.3A CN104440607A (en) 2013-09-19 2014-09-19 Manufacturing method of grinding groove of resin binder grinding wheel, resin binder grinding wheel, processing device and processing method of plate body

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