TWI608029B - Resin hardener and one-component epoxy resin composition - Google Patents
Resin hardener and one-component epoxy resin composition Download PDFInfo
- Publication number
- TWI608029B TWI608029B TW102143543A TW102143543A TWI608029B TW I608029 B TWI608029 B TW I608029B TW 102143543 A TW102143543 A TW 102143543A TW 102143543 A TW102143543 A TW 102143543A TW I608029 B TWI608029 B TW I608029B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- mercaptobutyrate
- dipentaerythritol
- bis
- mercaptoacetate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/66—Mercaptans
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012259336 | 2012-11-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201433587A TW201433587A (zh) | 2014-09-01 |
TWI608029B true TWI608029B (zh) | 2017-12-11 |
Family
ID=50827924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102143543A TWI608029B (zh) | 2012-11-28 | 2013-11-28 | Resin hardener and one-component epoxy resin composition |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5716871B2 (ja) |
KR (1) | KR102091389B1 (ja) |
CN (1) | CN104797623B (ja) |
TW (1) | TWI608029B (ja) |
WO (1) | WO2014084292A1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6439960B2 (ja) * | 2014-08-07 | 2018-12-19 | パナソニックIpマネジメント株式会社 | 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ |
KR102359684B1 (ko) * | 2014-11-12 | 2022-02-07 | 쓰리본드 화인 케미칼 가부시키가이샤 | 에폭시 수지조성물 |
JP6635258B2 (ja) * | 2015-11-17 | 2020-01-22 | 株式会社スリーボンド | 硬化性組成物 |
WO2018079466A1 (ja) * | 2016-10-26 | 2018-05-03 | ナミックス株式会社 | 樹脂組成物、接着剤、封止材、ダム剤、半導体装置、およびイメージセンサーモジュール |
KR102379912B1 (ko) * | 2017-03-15 | 2022-03-29 | 엘지전자 주식회사 | 수지 코팅 방법 |
CN107936477B (zh) * | 2017-12-02 | 2020-05-22 | 常州宝利美石墨烯有限公司 | 一种石墨烯/环氧树脂复合高分子材料 |
CN107955134B (zh) * | 2017-12-02 | 2020-05-19 | 常州宝利美石墨烯有限公司 | 一种石墨烯在环氧树脂复合材料中的应用 |
JP7014998B2 (ja) * | 2018-01-18 | 2022-02-02 | 味の素株式会社 | 樹脂組成物 |
JP7413678B2 (ja) * | 2019-08-09 | 2024-01-16 | 味の素株式会社 | 樹脂組成物 |
KR102242440B1 (ko) * | 2019-11-25 | 2021-04-20 | 주식회사 케이씨씨 | 접착제 조성물 |
CN111019093B (zh) * | 2019-12-10 | 2022-05-03 | 武汉市科达云石护理材料有限公司 | 室温快速环氧固化剂及其在制备环氧干挂胶中的应用 |
CN116239758B (zh) * | 2022-12-08 | 2023-12-19 | 南京贝迪新材料科技股份有限公司 | 含硫醇-氨基-环氧树脂基体的量子点材料 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009173744A (ja) * | 2008-01-23 | 2009-08-06 | Shin Etsu Chem Co Ltd | アンダーフィル剤組成物 |
TW200936631A (en) * | 2007-12-13 | 2009-09-01 | Showa Denko Kk | Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2695599B2 (ja) * | 1993-09-29 | 1997-12-24 | ホーヤ株式会社 | ポリウレタンレンズの製造方法 |
JP3584537B2 (ja) | 1995-03-31 | 2004-11-04 | 東レ・ファインケミカル株式会社 | チオール基含有ポリエーテルポリマー及びその製造 方法 |
JPH0952068A (ja) * | 1995-08-14 | 1997-02-25 | Showa Denko Kk | 塗膜の硬化方法 |
CN1312194C (zh) * | 2002-12-20 | 2007-04-25 | Ppg工业俄亥俄公司 | 含硫的多硫醇 |
JP2005132890A (ja) * | 2003-10-28 | 2005-05-26 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
EP1707585B1 (en) * | 2004-01-22 | 2011-09-28 | Ajinomoto Co., Inc. | One-component epoxy resin composition |
JP5092676B2 (ja) * | 2007-10-16 | 2012-12-05 | 住友ベークライト株式会社 | エポキシ樹脂組成物及び半導体装置 |
WO2009113485A1 (ja) * | 2008-03-10 | 2009-09-17 | 三井化学株式会社 | プライマー組成物 |
JP2010077353A (ja) * | 2008-09-29 | 2010-04-08 | Yokohama Rubber Co Ltd:The | エポキシ樹脂用硬化剤およびそれを含むエポキシ樹脂組成物 |
-
2013
- 2013-11-28 JP JP2014531806A patent/JP5716871B2/ja active Active
- 2013-11-28 KR KR1020157017194A patent/KR102091389B1/ko active IP Right Grant
- 2013-11-28 CN CN201380062183.3A patent/CN104797623B/zh active Active
- 2013-11-28 WO PCT/JP2013/081990 patent/WO2014084292A1/ja active Application Filing
- 2013-11-28 TW TW102143543A patent/TWI608029B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200936631A (en) * | 2007-12-13 | 2009-09-01 | Showa Denko Kk | Epoxy resin curing agent, method for producing the same, and epoxy resin composition |
JP2009173744A (ja) * | 2008-01-23 | 2009-08-06 | Shin Etsu Chem Co Ltd | アンダーフィル剤組成物 |
Also Published As
Publication number | Publication date |
---|---|
CN104797623B (zh) | 2018-09-25 |
JP5716871B2 (ja) | 2015-05-13 |
TW201433587A (zh) | 2014-09-01 |
KR20150090217A (ko) | 2015-08-05 |
CN104797623A (zh) | 2015-07-22 |
JPWO2014084292A1 (ja) | 2017-01-05 |
WO2014084292A1 (ja) | 2014-06-05 |
KR102091389B1 (ko) | 2020-03-20 |
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