KR102091389B1 - 수지 경화제 및 일액성 에폭시 수지 조성물 - Google Patents

수지 경화제 및 일액성 에폭시 수지 조성물 Download PDF

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Publication number
KR102091389B1
KR102091389B1 KR1020157017194A KR20157017194A KR102091389B1 KR 102091389 B1 KR102091389 B1 KR 102091389B1 KR 1020157017194 A KR1020157017194 A KR 1020157017194A KR 20157017194 A KR20157017194 A KR 20157017194A KR 102091389 B1 KR102091389 B1 KR 102091389B1
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KR
South Korea
Prior art keywords
component
epoxy resin
resin composition
mercaptobutyrate
mercaptopropionate
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KR1020157017194A
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English (en)
Korean (ko)
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KR20150090217A (ko
Inventor
요시마사 후지와라
게이지 오기노
기요노리 후루타
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아지노모토 가부시키가이샤
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Publication of KR20150090217A publication Critical patent/KR20150090217A/ko
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Publication of KR102091389B1 publication Critical patent/KR102091389B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1483—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
KR1020157017194A 2012-11-28 2013-11-28 수지 경화제 및 일액성 에폭시 수지 조성물 KR102091389B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-259336 2012-11-28
JP2012259336 2012-11-28
PCT/JP2013/081990 WO2014084292A1 (ja) 2012-11-28 2013-11-28 樹脂硬化剤および一液性エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
KR20150090217A KR20150090217A (ko) 2015-08-05
KR102091389B1 true KR102091389B1 (ko) 2020-03-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157017194A KR102091389B1 (ko) 2012-11-28 2013-11-28 수지 경화제 및 일액성 에폭시 수지 조성물

Country Status (5)

Country Link
JP (1) JP5716871B2 (ja)
KR (1) KR102091389B1 (ja)
CN (1) CN104797623B (ja)
TW (1) TWI608029B (ja)
WO (1) WO2014084292A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6439960B2 (ja) * 2014-08-07 2018-12-19 パナソニックＩｐマネジメント株式会社 絶縁樹脂シート、並びにそれを用いた回路基板および半導体パッケージ
KR102359684B1 (ko) * 2014-11-12 2022-02-07 쓰리본드 화인 케미칼 가부시키가이샤 에폭시 수지조성물
JP6635258B2 (ja) * 2015-11-17 2020-01-22 株式会社スリーボンド 硬化性組成物
KR102374782B1 (ko) * 2016-10-26 2022-03-15 나믹스 가부시끼가이샤 수지 조성물, 접착제, 밀봉재, 댐제, 반도체 장치 및 이미지 센서 모듈
KR102379912B1 (ko) * 2017-03-15 2022-03-29 엘지전자 주식회사 수지 코팅 방법
CN107955134B (zh) * 2017-12-02 2020-05-19 常州宝利美石墨烯有限公司 一种石墨烯在环氧树脂复合材料中的应用
CN107936477B (zh) * 2017-12-02 2020-05-22 常州宝利美石墨烯有限公司 一种石墨烯/环氧树脂复合高分子材料
JP7413678B2 (ja) * 2019-08-09 2024-01-16 味の素株式会社 樹脂組成物
KR102242440B1 (ko) * 2019-11-25 2021-04-20 주식회사 케이씨씨 접착제 조성물
CN111019093B (zh) * 2019-12-10 2022-05-03 武汉市科达云石护理材料有限公司 室温快速环氧固化剂及其在制备环氧干挂胶中的应用
CN116239758B (zh) * 2022-12-08 2023-12-19 南京贝迪新材料科技股份有限公司 含硫醇-氨基-环氧树脂基体的量子点材料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009173744A (ja) 2008-01-23 2009-08-06 Shin Etsu Chem Co Ltd アンダーフィル剤組成物
JP2010077353A (ja) 2008-09-29 2010-04-08 Yokohama Rubber Co Ltd:The エポキシ樹脂用硬化剤およびそれを含むエポキシ樹脂組成物

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JP2695599B2 (ja) * 1993-09-29 1997-12-24 ホーヤ株式会社 ポリウレタンレンズの製造方法
JP3584537B2 (ja) 1995-03-31 2004-11-04 東レ・ファインケミカル株式会社 チオール基含有ポリエーテルポリマー及びその製造 方法
JPH0952068A (ja) * 1995-08-14 1997-02-25 Showa Denko Kk 塗膜の硬化方法
CN1312194C (zh) * 2002-12-20 2007-04-25 Ppg工业俄亥俄公司 含硫的多硫醇
JP2005132890A (ja) * 2003-10-28 2005-05-26 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP4899479B2 (ja) * 2004-01-22 2012-03-21 味の素株式会社 一液性エポキシ樹脂組成物
JP5092676B2 (ja) * 2007-10-16 2012-12-05 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP5653623B2 (ja) * 2007-12-13 2015-01-14 昭和電工株式会社 エポキシ樹脂硬化剤およびその製造方法ならびにエポキシ樹脂組成物
WO2009113485A1 (ja) * 2008-03-10 2009-09-17 三井化学株式会社 プライマー組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009173744A (ja) 2008-01-23 2009-08-06 Shin Etsu Chem Co Ltd アンダーフィル剤組成物
JP2010077353A (ja) 2008-09-29 2010-04-08 Yokohama Rubber Co Ltd:The エポキシ樹脂用硬化剤およびそれを含むエポキシ樹脂組成物

Also Published As

Publication number Publication date
TW201433587A (zh) 2014-09-01
WO2014084292A1 (ja) 2014-06-05
KR20150090217A (ko) 2015-08-05
CN104797623A (zh) 2015-07-22
JPWO2014084292A1 (ja) 2017-01-05
CN104797623B (zh) 2018-09-25
TWI608029B (zh) 2017-12-11
JP5716871B2 (ja) 2015-05-13

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