TWI604550B - 匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法 - Google Patents

匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法 Download PDF

Info

Publication number
TWI604550B
TWI604550B TW101147753A TW101147753A TWI604550B TW I604550 B TWI604550 B TW I604550B TW 101147753 A TW101147753 A TW 101147753A TW 101147753 A TW101147753 A TW 101147753A TW I604550 B TWI604550 B TW I604550B
Authority
TW
Taiwan
Prior art keywords
unit
substrate
moving
processing
unit portion
Prior art date
Application number
TW101147753A
Other languages
English (en)
Chinese (zh)
Other versions
TW201351528A (zh
Inventor
濱田智秀
鈴木智也
Original Assignee
尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 尼康股份有限公司 filed Critical 尼康股份有限公司
Publication of TW201351528A publication Critical patent/TW201351528A/zh
Application granted granted Critical
Publication of TWI604550B publication Critical patent/TWI604550B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/182—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations
    • B65H23/185—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations motor-controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/198—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations motor-controlled (Controlling electrical drive motors therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2220/00—Function indicators
    • B65H2220/02—Function indicators indicating an entity which is controlled, adjusted or changed by a control process, i.e. output
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B65H2513/11—Speed angular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/113—Size
    • B65H2701/1133—Size of webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Cleaning In General (AREA)
  • Replacement Of Web Rolls (AREA)
  • Liquid Crystal (AREA)
  • Winding Of Webs (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
  • Coating Apparatus (AREA)
TW101147753A 2012-04-13 2012-12-17 匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法 TWI604550B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012092132 2012-04-13

Publications (2)

Publication Number Publication Date
TW201351528A TW201351528A (zh) 2013-12-16
TWI604550B true TWI604550B (zh) 2017-11-01

Family

ID=49327304

Family Applications (3)

Application Number Title Priority Date Filing Date
TW101147753A TWI604550B (zh) 2012-04-13 2012-12-17 匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法
TW106132627A TWI661498B (zh) 2012-04-13 2012-12-17 基板之搬送方法
TW108112834A TWI695445B (zh) 2012-04-13 2012-12-17 元件製造方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW106132627A TWI661498B (zh) 2012-04-13 2012-12-17 基板之搬送方法
TW108112834A TWI695445B (zh) 2012-04-13 2012-12-17 元件製造方法

Country Status (5)

Country Link
JP (5) JP6011615B2 (ja)
KR (6) KR101949113B1 (ja)
CN (2) CN104203785B (ja)
TW (3) TWI604550B (ja)
WO (1) WO2013153706A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI604550B (zh) * 2012-04-13 2017-11-01 尼康股份有限公司 匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法
JP6264619B2 (ja) * 2015-02-09 2018-01-24 三菱重工機械システム株式会社 フロントストップ装置，シート積重装置，カウンタエゼクタ及び製函機
CN110773536B (zh) * 2018-07-31 2021-10-22 台湾积体电路制造股份有限公司 晶粒容器工作站、晶粒容器处理的系统及方法
CN110449432B (zh) * 2019-07-25 2024-02-23 老肯医疗科技股份有限公司 一种清洗机自动进出车控制系统及使用方法
WO2024105976A1 (ja) * 2022-11-15 2024-05-23 村田機械株式会社 搬送車システム

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62225380A (ja) * 1986-03-27 1987-10-03 Minolta Camera Co Ltd 熱転写プリンタのインクフイルムカセツト
DE3713170A1 (de) * 1987-04-17 1988-11-03 Agfa Gevaert Ag Fotografisches geraet zur verarbeitung von in fahrbaren kassetten unterbringbarem fotografischem rollenmaterial
JPH03256629A (ja) * 1990-03-08 1991-11-15 Canon Inc 物品供給部材の搬送による物品供給方法
DE59107083D1 (de) * 1991-06-24 1996-01-25 Gretag Imaging Ag Fotografisches Kopiergerät
JPH0910446A (ja) * 1995-06-30 1997-01-14 Aprica Kassai Inc 乳幼児用絵画玩具
US5652645A (en) * 1995-07-24 1997-07-29 Anvik Corporation High-throughput, high-resolution, projection patterning system for large, flexible, roll-fed, electronic-module substrates
JP3278714B2 (ja) * 1996-08-30 2002-04-30 東京エレクトロン株式会社 塗布膜形成装置
US6451145B1 (en) * 1998-03-09 2002-09-17 Frontier Industrial Technology, Inc. Web splicing system
JP2000159099A (ja) * 1998-11-27 2000-06-13 Nkk Corp 有軌道台車
JP3376935B2 (ja) * 1999-01-25 2003-02-17 ウシオ電機株式会社 帯状ワークの露光装置
JP2000303178A (ja) 1999-04-16 2000-10-31 Sanyo Electric Co Ltd 薄膜形成装置
JP4491779B2 (ja) * 2004-06-28 2010-06-30 ノーリツ鋼機株式会社 マガジン
JP4542836B2 (ja) 2004-06-29 2010-09-15 ルネサスエレクトロニクス株式会社 搬送台車
WO2006100868A1 (ja) 2005-03-18 2006-09-28 Konica Minolta Holdings, Inc. 有機化合物層の形成方法、有機ｅｌ素子の製造方法、有機ｅｌ素子
JP4969138B2 (ja) * 2006-04-17 2012-07-04 大日本スクリーン製造株式会社 基板処理装置
JP4409552B2 (ja) * 2006-09-08 2010-02-03 住友重機械工業株式会社 ロール自動供給装置
CN101809709B (zh) * 2007-11-15 2014-04-30 株式会社尼康 掩模盒、搬送装置、曝光装置、掩模搬送方法及器件制造方法
JP5294141B2 (ja) * 2008-03-25 2013-09-18 株式会社ニコン 表示素子の製造装置
JP5407514B2 (ja) * 2009-04-21 2014-02-05 株式会社明電舎 無人搬送車の操舵駆動方法及び装置
JP2011098808A (ja) 2009-11-05 2011-05-19 Nikon Corp 基板カートリッジ、基板処理装置、基板処理システム、基板処理方法、制御装置及び表示素子の製造方法
JP5063712B2 (ja) * 2010-01-26 2012-10-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR101816327B1 (ko) * 2010-02-12 2018-01-08 가부시키가이샤 니콘 기판 처리 장치
JP5494124B2 (ja) * 2010-03-30 2014-05-14 大日本印刷株式会社 パターン形成方法、カラーフィルターの製造方法、およびパターン形成装置
CN102835189B (zh) * 2010-04-09 2016-06-29 株式会社尼康 基板处理装置
JP5724564B2 (ja) * 2010-04-13 2015-05-27 株式会社ニコン マスクケース、マスクユニット、露光装置、基板処理装置及びデバイス製造方法
WO2011158584A1 (ja) * 2010-06-18 2011-12-22 コニカミノルタホールディングス株式会社 薄膜ガラスの搬送装置、及び薄膜ガラスの搬送方法
JP4691205B1 (ja) * 2010-09-03 2011-06-01 日東電工株式会社 薄型高機能偏光膜を含む光学フィルム積層体の製造方法
TWI604550B (zh) * 2012-04-13 2017-11-01 尼康股份有限公司 匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法

Also Published As

Publication number Publication date
KR101787330B1 (ko) 2017-10-18
JP6384580B2 (ja) 2018-09-05
KR101949113B1 (ko) 2019-02-15
KR20180136574A (ko) 2018-12-24
KR20150002647A (ko) 2015-01-07
TW201810492A (zh) 2018-03-16
KR20180049114A (ko) 2018-05-10
KR20190126455A (ko) 2019-11-11
CN104203785A (zh) 2014-12-10
KR101816343B1 (ko) 2018-02-21
KR20170081752A (ko) 2017-07-12
KR102042952B1 (ko) 2019-11-08
JPWO2013153706A1 (ja) 2015-12-17
JP6011615B2 (ja) 2016-10-19
CN104203785B (zh) 2016-08-24
KR20180003639A (ko) 2018-01-09
JP2017004007A (ja) 2017-01-05
JP6249127B2 (ja) 2017-12-20
JP2016172645A (ja) 2016-09-29
CN106185413A (zh) 2016-12-07
TWI661498B (zh) 2019-06-01
TW201929123A (zh) 2019-07-16
CN106185413B (zh) 2017-11-07
JP2018011065A (ja) 2018-01-18
JP2017175161A (ja) 2017-09-28
JP6156555B2 (ja) 2017-07-05
TWI695445B (zh) 2020-06-01
JP6304331B2 (ja) 2018-04-04
WO2013153706A1 (ja) 2013-10-17
KR102126421B1 (ko) 2020-06-24
TW201351528A (zh) 2013-12-16
KR101868310B1 (ko) 2018-07-17

Similar Documents

Publication Publication Date Title
JP6384580B2 (ja) デバイス製造方法
JP6593507B2 (ja) パターン形成装置
TWI576301B (zh) 基板處理裝置
TWI587428B (zh) 基板處理裝置及元件製造方法
TWI611500B (zh) 基板處理裝置
JP5929761B2 (ja) 基板処理システム及び表示素子の製造方法
WO2012081605A1 (ja) 基板保管装置