TWI603158B - Exposure device, exposure method - Google Patents

Exposure device, exposure method Download PDF

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Publication number
TWI603158B
TWI603158B TW102120332A TW102120332A TWI603158B TW I603158 B TWI603158 B TW I603158B TW 102120332 A TW102120332 A TW 102120332A TW 102120332 A TW102120332 A TW 102120332A TW I603158 B TWI603158 B TW I603158B
Authority
TW
Taiwan
Prior art keywords
exposure
substrate
unit
disposed
moving
Prior art date
Application number
TW102120332A
Other languages
English (en)
Chinese (zh)
Other versions
TW201351067A (zh
Inventor
Ken Miyake
Toshihiro Takagi
Original Assignee
Sanei Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanei Giken Co Ltd filed Critical Sanei Giken Co Ltd
Publication of TW201351067A publication Critical patent/TW201351067A/zh
Application granted granted Critical
Publication of TWI603158B publication Critical patent/TWI603158B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
TW102120332A 2012-06-12 2013-06-07 Exposure device, exposure method TWI603158B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012132802A JP6082884B2 (ja) 2012-06-12 2012-06-12 露光装置、露光方法

Publications (2)

Publication Number Publication Date
TW201351067A TW201351067A (zh) 2013-12-16
TWI603158B true TWI603158B (zh) 2017-10-21

Family

ID=49828382

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102120332A TWI603158B (zh) 2012-06-12 2013-06-07 Exposure device, exposure method

Country Status (4)

Country Link
JP (1) JP6082884B2 (ja)
KR (1) KR102205976B1 (ja)
CN (1) CN103488055A (ja)
TW (1) TWI603158B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201643558A (zh) * 2015-03-31 2016-12-16 尼康股份有限公司 曝光裝置、平面顯示器之製造方法、元件製造方法、及曝光方法
CN112162465B (zh) * 2015-03-31 2023-06-20 株式会社尼康 曝光装置、平面显示器的制造方法、元件制造方法、及曝光方法
CN105217311A (zh) * 2015-09-09 2016-01-06 合肥芯碁微电子装备有限公司 一种ldi单机自动装置
JP5997409B1 (ja) * 2016-05-26 2016-09-28 株式会社 ベアック 両面露光装置及び両面露光装置におけるマスクとワークとの位置合わせ方法
CN109656104B (zh) * 2018-12-26 2021-03-16 深圳市华星光电半导体显示技术有限公司 一种基板曝光方法及装置
CN110286563A (zh) * 2019-06-19 2019-09-27 深圳凯世光研股份有限公司 一种循环式扫描曝光机
WO2021193494A1 (ja) * 2020-03-23 2021-09-30 サンエー技研株式会社 露光装置及び露光方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015615A1 (ja) * 2003-08-07 2005-02-17 Nikon Corporation 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法
JP2006350022A (ja) * 2005-06-16 2006-12-28 Fujifilm Holdings Corp 描画装置及び描画方法
JP2008046457A (ja) * 2006-08-18 2008-02-28 Orc Mfg Co Ltd 描画装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004012900A (ja) * 2002-06-07 2004-01-15 Fuji Photo Film Co Ltd 露光装置
US7429532B2 (en) 2005-08-08 2008-09-30 Applied Materials, Inc. Semiconductor substrate process using an optically writable carbon-containing mask
JP4887165B2 (ja) * 2007-02-02 2012-02-29 富士フイルム株式会社 描画装置及び方法
US20080187871A1 (en) * 2007-02-02 2008-08-07 Fujifilm Corporation Pattern forming apparatus and method
JP5420942B2 (ja) * 2009-03-19 2014-02-19 大日本スクリーン製造株式会社 パターン描画装置およびパターン描画方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005015615A1 (ja) * 2003-08-07 2005-02-17 Nikon Corporation 露光方法及び露光装置、ステージ装置、並びにデバイス製造方法
JP2006350022A (ja) * 2005-06-16 2006-12-28 Fujifilm Holdings Corp 描画装置及び描画方法
JP2008046457A (ja) * 2006-08-18 2008-02-28 Orc Mfg Co Ltd 描画装置

Also Published As

Publication number Publication date
TW201351067A (zh) 2013-12-16
JP6082884B2 (ja) 2017-02-22
KR102205976B1 (ko) 2021-01-20
JP2013257409A (ja) 2013-12-26
KR20130139170A (ko) 2013-12-20
CN103488055A (zh) 2014-01-01

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