TWI600969B - Method for producing photosensitive resin element - Google Patents

Method for producing photosensitive resin element Download PDF

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Publication number
TWI600969B
TWI600969B TW102125967A TW102125967A TWI600969B TW I600969 B TWI600969 B TW I600969B TW 102125967 A TW102125967 A TW 102125967A TW 102125967 A TW102125967 A TW 102125967A TW I600969 B TWI600969 B TW I600969B
Authority
TW
Taiwan
Prior art keywords
mass
photosensitive resin
acetone
solvent
film
Prior art date
Application number
TW102125967A
Other languages
English (en)
Chinese (zh)
Other versions
TW201405247A (zh
Inventor
Tsutomu Igarashi
Tomohiro Kino
Original Assignee
Asahi Kasei E-Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corp filed Critical Asahi Kasei E-Materials Corp
Publication of TW201405247A publication Critical patent/TW201405247A/zh
Application granted granted Critical
Publication of TWI600969B publication Critical patent/TWI600969B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0048Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Optical Filters (AREA)
  • Polymerisation Methods In General (AREA)
TW102125967A 2012-07-20 2013-07-19 Method for producing photosensitive resin element TWI600969B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161993 2012-07-20

Publications (2)

Publication Number Publication Date
TW201405247A TW201405247A (zh) 2014-02-01
TWI600969B true TWI600969B (zh) 2017-10-01

Family

ID=49948907

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102125967A TWI600969B (zh) 2012-07-20 2013-07-19 Method for producing photosensitive resin element

Country Status (6)

Country Link
JP (1) JP6359452B2 (ja)
KR (2) KR101985992B1 (ja)
CN (1) CN104471482B (ja)
MY (1) MY180919A (ja)
TW (1) TWI600969B (ja)
WO (1) WO2014014087A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6809873B2 (ja) * 2015-12-28 2021-01-06 旭化成株式会社 積層体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006106287A (ja) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法
JP2012053229A (ja) * 2010-08-31 2012-03-15 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性樹脂ワニス、感光性樹脂フィルム、感光性樹脂硬化物、及び可視光導光路

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0860742B1 (en) * 1997-02-25 2001-04-04 E.I. Du Pont De Nemours And Company Flexible, flame-retardant, photoimageable composition for coating printing circuits
JPH11143069A (ja) 1997-11-10 1999-05-28 Fuji Photo Film Co Ltd プリント配線用原板
JP2002053621A (ja) * 2000-08-10 2002-02-19 Asahi Kasei Corp 光重合性樹脂組成物および積層体
JP4259855B2 (ja) * 2002-11-26 2009-04-30 旭化成エレクトロニクス株式会社 感光性樹脂組成物
JP2006220858A (ja) * 2005-02-09 2006-08-24 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP4966528B2 (ja) * 2005-09-14 2012-07-04 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2008003558A (ja) * 2006-05-26 2008-01-10 Fujifilm Corp パターン形成材料、パターン形成方法、及びパターン
JP5476739B2 (ja) * 2008-07-30 2014-04-23 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2011209515A (ja) * 2010-03-30 2011-10-20 Mitsubishi Paper Mills Ltd ネガ型感光性平版印刷版
JP5505060B2 (ja) * 2010-04-23 2014-05-28 日立化成株式会社 感光性樹脂組成物、感光性樹脂ワニス、感光性樹脂フィルム、感光性樹脂硬化物及び可視光導光路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006106287A (ja) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及び感光性エレメントの製造方法
JP2012053229A (ja) * 2010-08-31 2012-03-15 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性樹脂ワニス、感光性樹脂フィルム、感光性樹脂硬化物、及び可視光導光路

Also Published As

Publication number Publication date
WO2014014087A1 (ja) 2014-01-23
KR101986032B1 (ko) 2019-06-04
KR101985992B1 (ko) 2019-06-04
KR20170102582A (ko) 2017-09-11
TW201405247A (zh) 2014-02-01
CN104471482A (zh) 2015-03-25
KR20150029695A (ko) 2015-03-18
JP6359452B2 (ja) 2018-07-18
JPWO2014014087A1 (ja) 2016-07-07
CN104471482B (zh) 2019-08-02
MY180919A (en) 2020-12-12

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