MY180919A - Method for producing photosensitive resin element - Google Patents

Method for producing photosensitive resin element

Info

Publication number
MY180919A
MY180919A MYPI2015000144A MYPI2015000144A MY180919A MY 180919 A MY180919 A MY 180919A MY PI2015000144 A MYPI2015000144 A MY PI2015000144A MY PI2015000144 A MYPI2015000144 A MY PI2015000144A MY 180919 A MY180919 A MY 180919A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
mass
resin element
acetone
liquid blend
Prior art date
Application number
MYPI2015000144A
Inventor
Tsutomu Igarashi
Tomohiro Kino
Original Assignee
Asahi Kasei E Mat Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Mat Corporation filed Critical Asahi Kasei E Mat Corporation
Publication of MY180919A publication Critical patent/MY180919A/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0048Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Polymerisation Methods In General (AREA)
  • Optical Filters (AREA)

Abstract

The present invention addresses the problem of providing a method for producing a photosensitive resin element that has excellent productivity and good appearance. The present invention provides a method for producing a photosensitive resin element, which comprises: a step for obtaining a liquid blend by blending (a) a binder resin that has a weight average molecular weight of 5,000-500,000 and a carboxyl group content of 100-600 in terms of acid equivalent, (b) a photopolymerizable unsaturated compound, (c) a photopolymerization initiator, (d) acetone and (e) a non-ace?one solvent, with the mass ratio of the (d) acetone to the total mass of the (d) acetone and the (e) non-acefone solvent being 30-98% by mass and with the ratio of the total solid content in the liquid blend being 30-80% by mass; and a step wherein the liquid blend is applied onto a supporting layer and dried thereon, thereby forming a photosensitive resin element on the supporting layer. Figure 1.
MYPI2015000144A 2012-07-20 2013-07-19 Method for producing photosensitive resin element MY180919A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012161993 2012-07-20

Publications (1)

Publication Number Publication Date
MY180919A true MY180919A (en) 2020-12-12

Family

ID=49948907

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015000144A MY180919A (en) 2012-07-20 2013-07-19 Method for producing photosensitive resin element

Country Status (6)

Country Link
JP (1) JP6359452B2 (en)
KR (2) KR101985992B1 (en)
CN (1) CN104471482B (en)
MY (1) MY180919A (en)
TW (1) TWI600969B (en)
WO (1) WO2014014087A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6809873B2 (en) * 2015-12-28 2021-01-06 旭化成株式会社 Laminate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0860742B1 (en) * 1997-02-25 2001-04-04 E.I. Du Pont De Nemours And Company Flexible, flame-retardant, photoimageable composition for coating printing circuits
JPH11143069A (en) 1997-11-10 1999-05-28 Fuji Photo Film Co Ltd Master plate for printed wiring
JP2002053621A (en) * 2000-08-10 2002-02-19 Asahi Kasei Corp Photopolymerizable resin composition and laminate
JP4259855B2 (en) * 2002-11-26 2009-04-30 旭化成エレクトロニクス株式会社 Photosensitive resin composition
JP2006106287A (en) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element and method for manufacturing photosensitive element
JP2006220858A (en) * 2005-02-09 2006-08-24 Fuji Photo Film Co Ltd Pattern formation material, pattern formation device, and pattern formation method
JP4966528B2 (en) * 2005-09-14 2012-07-04 旭化成イーマテリアルズ株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
JP2008003558A (en) * 2006-05-26 2008-01-10 Fujifilm Corp Pattern forming material, pattern forming method and pattern
JP5476739B2 (en) * 2008-07-30 2014-04-23 日立化成株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method
JP2011209515A (en) * 2010-03-30 2011-10-20 Mitsubishi Paper Mills Ltd Negative photosensitive lithographic printing plate
JP5505060B2 (en) * 2010-04-23 2014-05-28 日立化成株式会社 Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, photosensitive resin cured product, and visible light guide
JP2012053229A (en) * 2010-08-31 2012-03-15 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive resin varnish, photosensitive resin film, photosensitive resin cured product and light guide path for visible light

Also Published As

Publication number Publication date
JP6359452B2 (en) 2018-07-18
JPWO2014014087A1 (en) 2016-07-07
WO2014014087A1 (en) 2014-01-23
CN104471482A (en) 2015-03-25
KR101985992B1 (en) 2019-06-04
KR20170102582A (en) 2017-09-11
KR20150029695A (en) 2015-03-18
KR101986032B1 (en) 2019-06-04
TWI600969B (en) 2017-10-01
CN104471482B (en) 2019-08-02
TW201405247A (en) 2014-02-01

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