TWI597757B - 使用掃描式電子顯微鏡之檢測系統 - Google Patents

使用掃描式電子顯微鏡之檢測系統 Download PDF

Info

Publication number
TWI597757B
TWI597757B TW102119052A TW102119052A TWI597757B TW I597757 B TWI597757 B TW I597757B TW 102119052 A TW102119052 A TW 102119052A TW 102119052 A TW102119052 A TW 102119052A TW I597757 B TWI597757 B TW I597757B
Authority
TW
Taiwan
Prior art keywords
scanning electron
electron microscope
tested
cavity
detection system
Prior art date
Application number
TW102119052A
Other languages
English (en)
Chinese (zh)
Other versions
TW201403652A (zh
Inventor
朴英吉
白原奉
吳基元
Original Assignee
三星顯示器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星顯示器有限公司 filed Critical 三星顯示器有限公司
Publication of TW201403652A publication Critical patent/TW201403652A/zh
Application granted granted Critical
Publication of TWI597757B publication Critical patent/TWI597757B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245—Detection characterised by the variable being measured
    • H01J2237/24592—Inspection and quality control of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/2602—Details
    • H01J2237/2605—Details operating at elevated pressures, e.g. atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW102119052A 2012-05-30 2013-05-30 使用掃描式電子顯微鏡之檢測系統 TWI597757B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120057468A KR101914231B1 (ko) 2012-05-30 2012-05-30 주사 전자 현미경을 이용한 검사 시스템

Publications (2)

Publication Number Publication Date
TW201403652A TW201403652A (zh) 2014-01-16
TWI597757B true TWI597757B (zh) 2017-09-01

Family

ID=48520797

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102119052A TWI597757B (zh) 2012-05-30 2013-05-30 使用掃描式電子顯微鏡之檢測系統

Country Status (6)

Country Link
US (1) US8890067B2 (enExample)
EP (1) EP2669927A3 (enExample)
JP (1) JP6288951B2 (enExample)
KR (1) KR101914231B1 (enExample)
CN (1) CN103454295B (enExample)
TW (1) TWI597757B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11152191B2 (en) 2018-12-31 2021-10-19 Asml Netherlands B.V. In-lens wafer pre-charging and inspection with multiple beams

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10197501B2 (en) 2011-12-12 2019-02-05 Kla-Tencor Corporation Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors
US9496425B2 (en) 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
US9601299B2 (en) 2012-08-03 2017-03-21 Kla-Tencor Corporation Photocathode including silicon substrate with boron layer
US9426400B2 (en) 2012-12-10 2016-08-23 Kla-Tencor Corporation Method and apparatus for high speed acquisition of moving images using pulsed illumination
CN104006949A (zh) * 2013-02-26 2014-08-27 北京京东方光电科技有限公司 一种透过率检测设备
KR102026936B1 (ko) * 2013-03-26 2019-10-01 삼성디스플레이 주식회사 주사 전자 현미경을 이용한 검사 시스템
US9478402B2 (en) 2013-04-01 2016-10-25 Kla-Tencor Corporation Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
US9748294B2 (en) 2014-01-10 2017-08-29 Hamamatsu Photonics K.K. Anti-reflection layer for back-illuminated sensor
KR20150107939A (ko) * 2014-03-13 2015-09-24 참엔지니어링(주) 시료 관찰 장치
US9410901B2 (en) 2014-03-17 2016-08-09 Kla-Tencor Corporation Image sensor, an inspection system and a method of inspecting an article
US9767986B2 (en) * 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
TWI573165B (zh) * 2014-12-09 2017-03-01 財團法人工業技術研究院 電子顯微鏡、讀取器以及擷取元素頻譜之方法
US9860466B2 (en) 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
US10748730B2 (en) 2015-05-21 2020-08-18 Kla-Tencor Corporation Photocathode including field emitter array on a silicon substrate with boron layer
US10462391B2 (en) 2015-08-14 2019-10-29 Kla-Tencor Corporation Dark-field inspection using a low-noise sensor
US11094502B2 (en) 2015-12-24 2021-08-17 Asml Netherlands B.V. Method and apparatus for inspection
US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
KR102307522B1 (ko) * 2016-05-10 2021-09-29 가부시키가이샤 스미카 분세키 센터 유기 전자 소자의 검사 방법 및 분석 방법, 그리고 그 이용
CN106291899A (zh) * 2016-09-29 2017-01-04 东方晶源微电子科技（北京）有限公司 照明模块、光学显微系统及电子束检测装置
CN106770405A (zh) * 2016-12-09 2017-05-31 清华大学 一种完全大气压下超光学衍射成像装置
CN107116308B (zh) * 2017-05-03 2019-01-04 湖北工业大学 波导微纳加工系统以及加工方法
US10049904B1 (en) * 2017-08-03 2018-08-14 Applied Materials, Inc. Method and system for moving a substrate
CN109975340A (zh) * 2017-12-26 2019-07-05 上海梅山钢铁股份有限公司 镀铝锌板无铬钝化膜厚度的微观分析方法
US11114489B2 (en) 2018-06-18 2021-09-07 Kla-Tencor Corporation Back-illuminated sensor and a method of manufacturing a sensor
US10943760B2 (en) 2018-10-12 2021-03-09 Kla Corporation Electron gun and electron microscope
KR20200062573A (ko) 2018-11-27 2020-06-04 김창섭 디스펜서형 노즈워크 장난감
US11114491B2 (en) 2018-12-12 2021-09-07 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor
US11417492B2 (en) 2019-09-26 2022-08-16 Kla Corporation Light modulated electron source
US11821860B2 (en) * 2019-10-16 2023-11-21 Carl Zeiss X-Ray Microscopy Inc. Optical three-dimensional scanning for collision avoidance in microscopy system
US11848350B2 (en) 2020-04-08 2023-12-19 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor using a silicon on insulator wafer

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57132657A (en) * 1981-02-06 1982-08-17 Akashi Seisakusho Co Ltd Inclined moving body tube type scanning electron microscope and its similar apparatus
US4528451A (en) * 1982-10-19 1985-07-09 Varian Associates, Inc. Gap control system for localized vacuum processing
US4607167A (en) * 1982-10-19 1986-08-19 Varian Associates, Inc. Charged particle beam lithography machine incorporating localized vacuum envelope
US4864228A (en) * 1985-03-15 1989-09-05 Fairchild Camera And Instrument Corporation Electron beam test probe for integrated circuit testing
JPH02168547A (ja) * 1988-12-22 1990-06-28 Nippon Telegr & Teleph Corp <Ntt> 走査電子顕微鏡
NL8902843A (nl) * 1989-11-17 1991-06-17 Philips Nv Contaminatiemonitor voor het meten van een verontreinigingsgraad in een evacueerbaar geladen deeltjesbundelsysteem.
US5270643A (en) * 1990-11-28 1993-12-14 Schlumberger Technologies Pulsed laser photoemission electron-beam probe
JPH05248987A (ja) * 1992-03-06 1993-09-28 Olympus Optical Co Ltd レンズ接合面自動検査装置
JPH08195179A (ja) * 1995-01-17 1996-07-30 Hitachi Ltd 電子顕微鏡のアクティブ除振装置
US5572327A (en) * 1995-02-01 1996-11-05 W. L. Gore & Associates, Inc. Remote leak detection sensing method and device
US5814814A (en) * 1995-02-28 1998-09-29 Ebara Corporation Electron microscope
JPH09134699A (ja) 1995-11-09 1997-05-20 Hitachi Ltd 集束イオンビーム装置
JP2000202384A (ja) * 1999-01-12 2000-07-25 Nikon Corp 異物除去方法及び異物除去装置
JP2000346817A (ja) * 1999-06-07 2000-12-15 Nikon Corp 測定装置、照射装置および露光方法
US6442857B1 (en) * 2000-11-10 2002-09-03 Toto Ltd. Portable surface inspector
US20020117969A1 (en) * 2001-02-28 2002-08-29 Nikon Corporation Magnetic shielding devices and methods involving active cancellation of external magnetic fields at the column of a charged-particle-beam optical system
US6683316B2 (en) * 2001-08-01 2004-01-27 Aspex, Llc Apparatus for correlating an optical image and a SEM image and method of use thereof
JP2003217500A (ja) * 2002-01-21 2003-07-31 Sony Corp 走査型電子顕微鏡を用いた検査装置
JP2004214110A (ja) * 2003-01-08 2004-07-29 Hitachi High-Technologies Corp 電子線装置、および電子線装置の試料室容器の製造方法
KR20040070733A (ko) 2003-02-04 2004-08-11 아남반도체 주식회사 가변 배율 광학 렌즈를 지원하는 전자주사현미경
US6812462B1 (en) * 2003-02-21 2004-11-02 Kla-Tencor Technologies Corporation Dual electron beam instrument for multi-perspective
KR20040076734A (ko) 2003-02-26 2004-09-03 삼성전자주식회사 주사형 전자 현미경 및 광학 현미경을 이용한 리소그래피공정 검사 시스템
KR100592242B1 (ko) * 2003-08-12 2006-06-21 삼성에스디아이 주식회사 캐리어 및 이를 구비하는 분석장치
KR100525312B1 (ko) * 2003-11-28 2005-11-23 삼성코닝정밀유리 주식회사 유리기판의 파티클 측정방법
NL1026547C2 (nl) * 2004-07-01 2006-01-03 Fei Co Apparaat voor het evacueren van een sample.
JP2006114225A (ja) 2004-10-12 2006-04-27 Hitachi High-Technologies Corp 荷電粒子線装置
JP2006114385A (ja) * 2004-10-15 2006-04-27 Toshiba Corp 電子ビーム装置
JP2007003352A (ja) 2005-06-23 2007-01-11 Sony Corp ポリシリコン膜の結晶状態検査装置、これを用いたポリシリコン膜の結晶状態検査方法及び薄膜トランジスタの製造システム
JP2007093673A (ja) * 2005-09-27 2007-04-12 Seiko Epson Corp 電気光学装置の検査装置及び検査方法
KR100700287B1 (ko) * 2005-11-18 2007-03-29 주식회사 파이컴 액정표시패널 검사 장비의 검사 스테이지
US20070145267A1 (en) * 2005-12-12 2007-06-28 Adler David L Portable scanning electron microscope
JP4855170B2 (ja) * 2006-07-28 2012-01-18 株式会社日立ハイテクノロジーズ 電子顕微鏡装置
EP2080014B1 (en) * 2006-10-24 2016-08-31 B-Nano Ltd. An interface, a method for observing an object within a non-vacuum environment and a scanning electron microscope
JP2008210715A (ja) * 2007-02-27 2008-09-11 Ebara Corp 荷電粒子線装置及びこれを用いた試料表面観察方法
JP4945267B2 (ja) * 2007-02-28 2012-06-06 株式会社日立ハイテクノロジーズ 電子顕微鏡
JP2009016073A (ja) * 2007-07-02 2009-01-22 Tokyo Seimitsu Co Ltd 真空装置およびそのベーキング処理方法
JP2009217049A (ja) * 2008-03-11 2009-09-24 Hoya Corp 顕微鏡対物レンズおよび顕微鏡
EP2105944A1 (en) * 2008-03-28 2009-09-30 FEI Company Environmental cell for a particle-optical apparatus
JP2009252809A (ja) * 2008-04-02 2009-10-29 Hitachi High-Technologies Corp ステージ装置及びステージ装置におけるステージの位置決め制御方法
DE102008035770A1 (de) * 2008-07-31 2010-02-18 Eads Deutschland Gmbh Optischer Partikeldetektor sowie Detektionsverfahren
KR20110076934A (ko) * 2008-09-28 2011-07-06 비-나노 리미티드 진공 디바이스 및 주사 전자 현미경
JP5690086B2 (ja) * 2010-07-02 2015-03-25 株式会社キーエンス 拡大観察装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11152191B2 (en) 2018-12-31 2021-10-19 Asml Netherlands B.V. In-lens wafer pre-charging and inspection with multiple beams
US12374524B2 (en) 2018-12-31 2025-07-29 Asml Netherlands B.V. In-lens wafer PE-charging and inspection with multiple beams

Also Published As

Publication number Publication date
TW201403652A (zh) 2014-01-16
EP2669927A3 (en) 2015-08-12
US20130320211A1 (en) 2013-12-05
CN103454295B (zh) 2017-12-29
US8890067B2 (en) 2014-11-18
KR101914231B1 (ko) 2018-11-02
JP6288951B2 (ja) 2018-03-07
KR20130134160A (ko) 2013-12-10
JP2013251262A (ja) 2013-12-12
CN103454295A (zh) 2013-12-18
EP2669927A2 (en) 2013-12-04

Similar Documents

Publication Publication Date Title
TWI597757B (zh) 使用掃描式電子顯微鏡之檢測系統
KR102026936B1 (ko) 주사 전자 현미경을 이용한 검사 시스템
US9368322B2 (en) Inspection apparatus
KR102462037B1 (ko) 반도체 웨이퍼 검사용 x-레이 검사 장치들
US10883945B2 (en) Simultaneous multi-elements analysis type X-ray fluorescence spectrometer, and simultaneous multi-elements X-ray fluorescence analyzing method
US8158955B2 (en) Charged particle beam application apparatus
TWI495847B (zh) 用於試料圖案檢查裝置之ｘｙ座標補正裝置及方法
US6627889B2 (en) Apparatus and method for observing sample using electron beam
CN115901831A (zh) 用于检查基板的设备、用于检查基板的方法、大面积基板检查设备及其操作方法
KR102345477B1 (ko) 하전 입자 빔 이미징을 위한 로드 락 시스템
JP2010123354A (ja) 荷電粒子線装置
JP6737598B2 (ja) 検査装置及び検査方法
JP5302934B2 (ja) 試料表面検査方法および検査装置
KR20140131413A (ko) 평판 표시 장치의 수리 시스템
JP6193608B2 (ja) 検査装置および検査用画像データの生成方法
KR20140139298A (ko) 주사 전자 현미경을 이용한 검사 시스템
TW202022365A (zh) 荷電粒子線裝置
JP2012248733A (ja) 荷電粒子線装置および静電チャック装置