JP6288951B2 - 走査電子顕微鏡を利用した検査システム - Google Patents
走査電子顕微鏡を利用した検査システム Download PDFInfo
- Publication number
- JP6288951B2 JP6288951B2 JP2013112191A JP2013112191A JP6288951B2 JP 6288951 B2 JP6288951 B2 JP 6288951B2 JP 2013112191 A JP2013112191 A JP 2013112191A JP 2013112191 A JP2013112191 A JP 2013112191A JP 6288951 B2 JP6288951 B2 JP 6288951B2
- Authority
- JP
- Japan
- Prior art keywords
- scanning electron
- electron microscope
- inspection
- chamber
- inspection object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
- H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24592—Inspection and quality control of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/2602—Details
- H01J2237/2605—Details operating at elevated pressures, e.g. atmosphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0057468 | 2012-05-30 | ||
| KR1020120057468A KR101914231B1 (ko) | 2012-05-30 | 2012-05-30 | 주사 전자 현미경을 이용한 검사 시스템 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013251262A JP2013251262A (ja) | 2013-12-12 |
| JP2013251262A5 JP2013251262A5 (enExample) | 2016-07-07 |
| JP6288951B2 true JP6288951B2 (ja) | 2018-03-07 |
Family
ID=48520797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013112191A Active JP6288951B2 (ja) | 2012-05-30 | 2013-05-28 | 走査電子顕微鏡を利用した検査システム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8890067B2 (enExample) |
| EP (1) | EP2669927A3 (enExample) |
| JP (1) | JP6288951B2 (enExample) |
| KR (1) | KR101914231B1 (enExample) |
| CN (1) | CN103454295B (enExample) |
| TW (1) | TWI597757B (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10197501B2 (en) | 2011-12-12 | 2019-02-05 | Kla-Tencor Corporation | Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors |
| US9496425B2 (en) | 2012-04-10 | 2016-11-15 | Kla-Tencor Corporation | Back-illuminated sensor with boron layer |
| US9601299B2 (en) | 2012-08-03 | 2017-03-21 | Kla-Tencor Corporation | Photocathode including silicon substrate with boron layer |
| US9426400B2 (en) | 2012-12-10 | 2016-08-23 | Kla-Tencor Corporation | Method and apparatus for high speed acquisition of moving images using pulsed illumination |
| CN104006949A (zh) * | 2013-02-26 | 2014-08-27 | 北京京东方光电科技有限公司 | 一种透过率检测设备 |
| KR102026936B1 (ko) * | 2013-03-26 | 2019-10-01 | 삼성디스플레이 주식회사 | 주사 전자 현미경을 이용한 검사 시스템 |
| US9478402B2 (en) | 2013-04-01 | 2016-10-25 | Kla-Tencor Corporation | Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor |
| US9347890B2 (en) | 2013-12-19 | 2016-05-24 | Kla-Tencor Corporation | Low-noise sensor and an inspection system using a low-noise sensor |
| US9748294B2 (en) | 2014-01-10 | 2017-08-29 | Hamamatsu Photonics K.K. | Anti-reflection layer for back-illuminated sensor |
| KR20150107939A (ko) * | 2014-03-13 | 2015-09-24 | 참엔지니어링(주) | 시료 관찰 장치 |
| US9410901B2 (en) | 2014-03-17 | 2016-08-09 | Kla-Tencor Corporation | Image sensor, an inspection system and a method of inspecting an article |
| US9767986B2 (en) * | 2014-08-29 | 2017-09-19 | Kla-Tencor Corporation | Scanning electron microscope and methods of inspecting and reviewing samples |
| TWI573165B (zh) * | 2014-12-09 | 2017-03-01 | 財團法人工業技術研究院 | 電子顯微鏡、讀取器以及擷取元素頻譜之方法 |
| US9860466B2 (en) | 2015-05-14 | 2018-01-02 | Kla-Tencor Corporation | Sensor with electrically controllable aperture for inspection and metrology systems |
| US10748730B2 (en) | 2015-05-21 | 2020-08-18 | Kla-Tencor Corporation | Photocathode including field emitter array on a silicon substrate with boron layer |
| US10462391B2 (en) | 2015-08-14 | 2019-10-29 | Kla-Tencor Corporation | Dark-field inspection using a low-noise sensor |
| US11094502B2 (en) * | 2015-12-24 | 2021-08-17 | Asml Netherlands B.V. | Method and apparatus for inspection |
| US10313622B2 (en) | 2016-04-06 | 2019-06-04 | Kla-Tencor Corporation | Dual-column-parallel CCD sensor and inspection systems using a sensor |
| US10778925B2 (en) | 2016-04-06 | 2020-09-15 | Kla-Tencor Corporation | Multiple column per channel CCD sensor architecture for inspection and metrology |
| TWI744325B (zh) * | 2016-05-10 | 2021-11-01 | 日商住化分析中心股份有限公司 | 有機電子裝置的檢查方法、分析方法及其利用 |
| CN106291899A (zh) * | 2016-09-29 | 2017-01-04 | 东方晶源微电子科技(北京)有限公司 | 照明模块、光学显微系统及电子束检测装置 |
| CN106770405A (zh) * | 2016-12-09 | 2017-05-31 | 清华大学 | 一种完全大气压下超光学衍射成像装置 |
| CN107116308B (zh) * | 2017-05-03 | 2019-01-04 | 湖北工业大学 | 波导微纳加工系统以及加工方法 |
| US10049904B1 (en) * | 2017-08-03 | 2018-08-14 | Applied Materials, Inc. | Method and system for moving a substrate |
| CN109975340A (zh) * | 2017-12-26 | 2019-07-05 | 上海梅山钢铁股份有限公司 | 镀铝锌板无铬钝化膜厚度的微观分析方法 |
| US11114489B2 (en) | 2018-06-18 | 2021-09-07 | Kla-Tencor Corporation | Back-illuminated sensor and a method of manufacturing a sensor |
| US10943760B2 (en) | 2018-10-12 | 2021-03-09 | Kla Corporation | Electron gun and electron microscope |
| KR20200062573A (ko) | 2018-11-27 | 2020-06-04 | 김창섭 | 디스펜서형 노즈워크 장난감 |
| US11114491B2 (en) | 2018-12-12 | 2021-09-07 | Kla Corporation | Back-illuminated sensor and a method of manufacturing a sensor |
| CN119480594A (zh) | 2018-12-31 | 2025-02-18 | Asml荷兰有限公司 | 使用多束的透镜内晶片预充电和检查 |
| US11417492B2 (en) | 2019-09-26 | 2022-08-16 | Kla Corporation | Light modulated electron source |
| US11821860B2 (en) * | 2019-10-16 | 2023-11-21 | Carl Zeiss X-Ray Microscopy Inc. | Optical three-dimensional scanning for collision avoidance in microscopy system |
| US11848350B2 (en) | 2020-04-08 | 2023-12-19 | Kla Corporation | Back-illuminated sensor and a method of manufacturing a sensor using a silicon on insulator wafer |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS57132657A (en) * | 1981-02-06 | 1982-08-17 | Akashi Seisakusho Co Ltd | Inclined moving body tube type scanning electron microscope and its similar apparatus |
| US4528451A (en) * | 1982-10-19 | 1985-07-09 | Varian Associates, Inc. | Gap control system for localized vacuum processing |
| US4607167A (en) * | 1982-10-19 | 1986-08-19 | Varian Associates, Inc. | Charged particle beam lithography machine incorporating localized vacuum envelope |
| US4864228A (en) * | 1985-03-15 | 1989-09-05 | Fairchild Camera And Instrument Corporation | Electron beam test probe for integrated circuit testing |
| JPH02168547A (ja) * | 1988-12-22 | 1990-06-28 | Nippon Telegr & Teleph Corp <Ntt> | 走査電子顕微鏡 |
| NL8902843A (nl) * | 1989-11-17 | 1991-06-17 | Philips Nv | Contaminatiemonitor voor het meten van een verontreinigingsgraad in een evacueerbaar geladen deeltjesbundelsysteem. |
| US5270643A (en) * | 1990-11-28 | 1993-12-14 | Schlumberger Technologies | Pulsed laser photoemission electron-beam probe |
| JPH05248987A (ja) * | 1992-03-06 | 1993-09-28 | Olympus Optical Co Ltd | レンズ接合面自動検査装置 |
| JPH08195179A (ja) * | 1995-01-17 | 1996-07-30 | Hitachi Ltd | 電子顕微鏡のアクティブ除振装置 |
| US5572327A (en) * | 1995-02-01 | 1996-11-05 | W. L. Gore & Associates, Inc. | Remote leak detection sensing method and device |
| US5814814A (en) * | 1995-02-28 | 1998-09-29 | Ebara Corporation | Electron microscope |
| JPH09134699A (ja) | 1995-11-09 | 1997-05-20 | Hitachi Ltd | 集束イオンビーム装置 |
| JP2000202384A (ja) * | 1999-01-12 | 2000-07-25 | Nikon Corp | 異物除去方法及び異物除去装置 |
| JP2000346817A (ja) * | 1999-06-07 | 2000-12-15 | Nikon Corp | 測定装置、照射装置および露光方法 |
| US6442857B1 (en) * | 2000-11-10 | 2002-09-03 | Toto Ltd. | Portable surface inspector |
| US20020117969A1 (en) * | 2001-02-28 | 2002-08-29 | Nikon Corporation | Magnetic shielding devices and methods involving active cancellation of external magnetic fields at the column of a charged-particle-beam optical system |
| US6683316B2 (en) * | 2001-08-01 | 2004-01-27 | Aspex, Llc | Apparatus for correlating an optical image and a SEM image and method of use thereof |
| JP2003217500A (ja) * | 2002-01-21 | 2003-07-31 | Sony Corp | 走査型電子顕微鏡を用いた検査装置 |
| JP2004214110A (ja) * | 2003-01-08 | 2004-07-29 | Hitachi High-Technologies Corp | 電子線装置、および電子線装置の試料室容器の製造方法 |
| KR20040070733A (ko) | 2003-02-04 | 2004-08-11 | 아남반도체 주식회사 | 가변 배율 광학 렌즈를 지원하는 전자주사현미경 |
| US6812462B1 (en) * | 2003-02-21 | 2004-11-02 | Kla-Tencor Technologies Corporation | Dual electron beam instrument for multi-perspective |
| KR20040076734A (ko) | 2003-02-26 | 2004-09-03 | 삼성전자주식회사 | 주사형 전자 현미경 및 광학 현미경을 이용한 리소그래피공정 검사 시스템 |
| KR100592242B1 (ko) * | 2003-08-12 | 2006-06-21 | 삼성에스디아이 주식회사 | 캐리어 및 이를 구비하는 분석장치 |
| KR100525312B1 (ko) * | 2003-11-28 | 2005-11-23 | 삼성코닝정밀유리 주식회사 | 유리기판의 파티클 측정방법 |
| NL1026547C2 (nl) * | 2004-07-01 | 2006-01-03 | Fei Co | Apparaat voor het evacueren van een sample. |
| JP2006114225A (ja) * | 2004-10-12 | 2006-04-27 | Hitachi High-Technologies Corp | 荷電粒子線装置 |
| JP2006114385A (ja) * | 2004-10-15 | 2006-04-27 | Toshiba Corp | 電子ビーム装置 |
| JP2007003352A (ja) | 2005-06-23 | 2007-01-11 | Sony Corp | ポリシリコン膜の結晶状態検査装置、これを用いたポリシリコン膜の結晶状態検査方法及び薄膜トランジスタの製造システム |
| JP2007093673A (ja) * | 2005-09-27 | 2007-04-12 | Seiko Epson Corp | 電気光学装置の検査装置及び検査方法 |
| KR100700287B1 (ko) * | 2005-11-18 | 2007-03-29 | 주식회사 파이컴 | 액정표시패널 검사 장비의 검사 스테이지 |
| US20070145267A1 (en) * | 2005-12-12 | 2007-06-28 | Adler David L | Portable scanning electron microscope |
| JP4855170B2 (ja) * | 2006-07-28 | 2012-01-18 | 株式会社日立ハイテクノロジーズ | 電子顕微鏡装置 |
| WO2008050321A2 (en) * | 2006-10-24 | 2008-05-02 | B-Nano Ltd. | An interface, a methof for observing an object within a non-vacuum environment and a scanning electron microscope |
| JP2008210715A (ja) * | 2007-02-27 | 2008-09-11 | Ebara Corp | 荷電粒子線装置及びこれを用いた試料表面観察方法 |
| JP4945267B2 (ja) * | 2007-02-28 | 2012-06-06 | 株式会社日立ハイテクノロジーズ | 電子顕微鏡 |
| JP2009016073A (ja) * | 2007-07-02 | 2009-01-22 | Tokyo Seimitsu Co Ltd | 真空装置およびそのベーキング処理方法 |
| JP2009217049A (ja) * | 2008-03-11 | 2009-09-24 | Hoya Corp | 顕微鏡対物レンズおよび顕微鏡 |
| EP2105944A1 (en) * | 2008-03-28 | 2009-09-30 | FEI Company | Environmental cell for a particle-optical apparatus |
| JP2009252809A (ja) * | 2008-04-02 | 2009-10-29 | Hitachi High-Technologies Corp | ステージ装置及びステージ装置におけるステージの位置決め制御方法 |
| DE102008035770A1 (de) * | 2008-07-31 | 2010-02-18 | Eads Deutschland Gmbh | Optischer Partikeldetektor sowie Detektionsverfahren |
| US8492716B2 (en) * | 2008-09-28 | 2013-07-23 | B-Nano Ltd. | Vacuumed device and a scanning electron microscope |
| JP5690086B2 (ja) * | 2010-07-02 | 2015-03-25 | 株式会社キーエンス | 拡大観察装置 |
-
2012
- 2012-05-30 KR KR1020120057468A patent/KR101914231B1/ko active Active
-
2013
- 2013-05-28 JP JP2013112191A patent/JP6288951B2/ja active Active
- 2013-05-29 CN CN201310205662.8A patent/CN103454295B/zh active Active
- 2013-05-30 TW TW102119052A patent/TWI597757B/zh active
- 2013-05-30 EP EP13169847.4A patent/EP2669927A3/en not_active Ceased
- 2013-05-30 US US13/905,623 patent/US8890067B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101914231B1 (ko) | 2018-11-02 |
| KR20130134160A (ko) | 2013-12-10 |
| EP2669927A2 (en) | 2013-12-04 |
| TW201403652A (zh) | 2014-01-16 |
| US8890067B2 (en) | 2014-11-18 |
| JP2013251262A (ja) | 2013-12-12 |
| EP2669927A3 (en) | 2015-08-12 |
| CN103454295A (zh) | 2013-12-18 |
| US20130320211A1 (en) | 2013-12-05 |
| TWI597757B (zh) | 2017-09-01 |
| CN103454295B (zh) | 2017-12-29 |
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