TWI594433B - 氧化物半導體薄膜與其製造方法以及薄膜電晶體 - Google Patents

氧化物半導體薄膜與其製造方法以及薄膜電晶體 Download PDF

Info

Publication number
TWI594433B
TWI594433B TW102142591A TW102142591A TWI594433B TW I594433 B TWI594433 B TW I594433B TW 102142591 A TW102142591 A TW 102142591A TW 102142591 A TW102142591 A TW 102142591A TW I594433 B TWI594433 B TW I594433B
Authority
TW
Taiwan
Prior art keywords
oxide semiconductor
thin film
semiconductor thin
film
oxide
Prior art date
Application number
TW102142591A
Other languages
English (en)
Chinese (zh)
Other versions
TW201431077A (zh
Inventor
中山德行
Original Assignee
住友金屬鑛山股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友金屬鑛山股份有限公司 filed Critical 住友金屬鑛山股份有限公司
Publication of TW201431077A publication Critical patent/TW201431077A/zh
Application granted granted Critical
Publication of TWI594433B publication Critical patent/TWI594433B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5806—Thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H10D30/6756—Amorphous oxide semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2923—Materials being conductive materials, e.g. metallic silicides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3238—Materials thereof being insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3451—Structure
    • H10P14/3452—Microstructure
    • H10P14/3454—Amorphous

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thin Film Transistor (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Crystallography & Structural Chemistry (AREA)
TW102142591A 2012-11-22 2013-11-22 氧化物半導體薄膜與其製造方法以及薄膜電晶體 TWI594433B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012256866A JP6107085B2 (ja) 2012-11-22 2012-11-22 酸化物半導体薄膜および薄膜トランジスタ

Publications (2)

Publication Number Publication Date
TW201431077A TW201431077A (zh) 2014-08-01
TWI594433B true TWI594433B (zh) 2017-08-01

Family

ID=50776173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102142591A TWI594433B (zh) 2012-11-22 2013-11-22 氧化物半導體薄膜與其製造方法以及薄膜電晶體

Country Status (6)

Country Link
US (1) US9368639B2 (https=)
JP (1) JP6107085B2 (https=)
KR (1) KR20150088793A (https=)
CN (1) CN104798205B (https=)
TW (1) TWI594433B (https=)
WO (1) WO2014080996A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104319262B (zh) 2014-11-13 2017-02-01 京东方科技集团股份有限公司 一种多晶氧化物薄膜晶体管阵列基板及其制备方法
CN106435491B (zh) * 2015-08-06 2019-02-12 清华大学 溅射靶及氧化物半导体膜以及其制备方法
JP7187775B2 (ja) * 2018-01-17 2022-12-13 住友金属鉱山株式会社 非晶質試料の結晶化温度測定方法および結晶化温度測定システム
JP2019124598A (ja) * 2018-01-17 2019-07-25 住友金属鉱山株式会社 非晶質試料の結晶化温度測定方法および結晶化温度測定システム
CN109378274B (zh) * 2018-10-11 2022-04-22 吉林建筑大学 一种制备不同类型铟镓锌氧薄膜晶体管的方法
KR20200072408A (ko) * 2018-12-11 2020-06-22 한양대학교 산학협력단 인듐산화물층, 인듐 산화물층을 채널층으로 포함하는 박막트랜지스터, 및 박막트랜지스터의 제조방법
JP7326795B2 (ja) * 2019-03-20 2023-08-16 株式会社リコー 電界効果型トランジスタ、表示素子、画像表示装置、及びシステム
WO2025187689A1 (ja) * 2024-03-04 2025-09-12 出光興産株式会社 酸化物半導体膜、トランジスタ、及び酸化物半導体膜の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201119971A (en) * 2009-09-30 2011-06-16 Idemitsu Kosan Co Sintered in-ga-zn-o-type oxide
US20120273777A1 (en) * 2007-03-20 2012-11-01 Idemitsu Kosan Co., Ltd. Sputtering target, oxide semiconductor film and semiconductor device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7141186B2 (en) * 2002-10-29 2006-11-28 Sumitomo Metal Mining Co., Ltd. Oxide sintered body and sputtering target, and manufacturing method for transparent conductive oxide film as electrode
KR20070116888A (ko) 2004-03-12 2007-12-11 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 아몰퍼스 산화물 및 박막 트랜지스터
US7646015B2 (en) 2006-10-31 2010-01-12 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device and semiconductor device
JP4662075B2 (ja) 2007-02-02 2011-03-30 株式会社ブリヂストン 薄膜トランジスタ及びその製造方法
JP5466939B2 (ja) 2007-03-23 2014-04-09 出光興産株式会社 半導体デバイス、多結晶半導体薄膜、多結晶半導体薄膜の製造方法、電界効果型トランジスタ、及び、電界効果型トランジスタの製造方法
WO2009081885A1 (ja) * 2007-12-25 2009-07-02 Idemitsu Kosan Co., Ltd. 酸化物半導体電界効果型トランジスタ及びその製造方法
CN102105619B (zh) 2008-06-06 2014-01-22 出光兴产株式会社 氧化物薄膜用溅射靶及其制造方法
JP2010045263A (ja) 2008-08-15 2010-02-25 Idemitsu Kosan Co Ltd 酸化物半導体、スパッタリングターゲット、及び薄膜トランジスタ
JPWO2010032422A1 (ja) * 2008-09-19 2012-02-02 出光興産株式会社 酸化物焼結体及びスパッタリングターゲット
US8445903B2 (en) 2008-10-23 2013-05-21 Idemitsu Kosan Co., Ltd. Thin film transistor having a crystalline semiconductor film including indium oxide which contains a hydrogen element and method for manufacturing same
JP2010106291A (ja) 2008-10-28 2010-05-13 Idemitsu Kosan Co Ltd 酸化物半導体及びその製造方法
JP5553997B2 (ja) 2009-02-06 2014-07-23 古河電気工業株式会社 トランジスタおよびその製造方法
EP2421048A4 (en) 2009-04-17 2012-08-29 Bridgestone Corp THIN-LAYER TRANSISTOR AND METHOD FOR PRODUCING A THIN-LAYER TRANSISTOR
JP2010251606A (ja) 2009-04-17 2010-11-04 Bridgestone Corp 薄膜トランジスタ
JP2010251604A (ja) 2009-04-17 2010-11-04 Bridgestone Corp 薄膜トランジスタの製造方法
KR101741278B1 (ko) * 2009-08-05 2017-05-29 스미토모 긴조쿠 고잔 가부시키가이샤 산화물 소결물체와 그 제조 방법, 타겟 및 투명 도전막
JP5437825B2 (ja) 2010-01-15 2014-03-12 出光興産株式会社 Ｉｎ−Ｇａ−Ｏ系酸化物焼結体、ターゲット、酸化物半導体薄膜及びこれらの製造方法
WO2011152048A1 (ja) * 2010-06-02 2011-12-08 出光興産株式会社 スパッタリングターゲット

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120273777A1 (en) * 2007-03-20 2012-11-01 Idemitsu Kosan Co., Ltd. Sputtering target, oxide semiconductor film and semiconductor device
TW201119971A (en) * 2009-09-30 2011-06-16 Idemitsu Kosan Co Sintered in-ga-zn-o-type oxide

Also Published As

Publication number Publication date
CN104798205B (zh) 2018-01-05
CN104798205A (zh) 2015-07-22
US9368639B2 (en) 2016-06-14
WO2014080996A1 (ja) 2014-05-30
KR20150088793A (ko) 2015-08-03
US20150287830A1 (en) 2015-10-08
JP2014107303A (ja) 2014-06-09
JP6107085B2 (ja) 2017-04-05
TW201431077A (zh) 2014-08-01

Similar Documents

Publication Publication Date Title
TWI595668B (zh) 氧化物半導體薄膜及薄膜電晶體
TWI594433B (zh) 氧化物半導體薄膜與其製造方法以及薄膜電晶體
JP6376153B2 (ja) 酸化物半導体薄膜および薄膜トランジスタ
JPWO2010032422A1 (ja) 酸化物焼結体及びスパッタリングターゲット
TWI640492B (zh) 氧化物半導體薄膜、氧化物半導體薄膜之製造方法及使用其之薄膜電晶體
JP6036984B2 (ja) 酸窒化物半導体薄膜
KR20240168335A (ko) 반도체막, 및 반도체막의 제조 방법
JP2018104772A (ja) 酸化物半導体薄膜の製造方法及び薄膜トランジスタの製造方法
JP2019024058A (ja) 酸化物半導体薄膜及び薄膜トランジスタの製造方法
JP2017168572A (ja) 酸化物半導体薄膜、酸化物焼結体、薄膜トランジスタ及び表示装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees