TWI591662B - Electronic parts, manufacturing method of electronic parts and electronic equipment - Google Patents
Electronic parts, manufacturing method of electronic parts and electronic equipment Download PDFInfo
- Publication number
- TWI591662B TWI591662B TW104102586A TW104102586A TWI591662B TW I591662 B TWI591662 B TW I591662B TW 104102586 A TW104102586 A TW 104102586A TW 104102586 A TW104102586 A TW 104102586A TW I591662 B TWI591662 B TW I591662B
- Authority
- TW
- Taiwan
- Prior art keywords
- insulating layer
- electronic component
- magnetic member
- molded body
- layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Soft Magnetic Materials (AREA)
- Insulating Of Coils (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014082210A JP6434709B2 (ja) | 2014-04-11 | 2014-04-11 | 電子部品、電子部品の製造方法および電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201541478A TW201541478A (zh) | 2015-11-01 |
TWI591662B true TWI591662B (zh) | 2017-07-11 |
Family
ID=54275507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104102586A TWI591662B (zh) | 2014-04-11 | 2015-01-26 | Electronic parts, manufacturing method of electronic parts and electronic equipment |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6434709B2 (ja) |
KR (1) | KR101667140B1 (ja) |
CN (2) | CN107256773B (ja) |
TW (1) | TWI591662B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI588847B (zh) * | 2015-12-25 | 2017-06-21 | 達方電子股份有限公司 | 電感、用於電感的磁性材料主體及電子零件之製造方法 |
JP6821946B2 (ja) * | 2016-04-27 | 2021-01-27 | Tdk株式会社 | 電子部品及びその製造方法 |
KR101825695B1 (ko) * | 2016-05-16 | 2018-02-05 | 주식회사 모다이노칩 | 회로 보호 소자 |
JP6680075B2 (ja) * | 2016-05-18 | 2020-04-15 | Tdk株式会社 | 積層コイル部品 |
KR101981466B1 (ko) * | 2016-09-08 | 2019-05-24 | 주식회사 모다이노칩 | 파워 인덕터 |
TWI624845B (zh) | 2016-11-08 | 2018-05-21 | Alps Electric Co Ltd | 電感元件及其製造方法 |
JP6683148B2 (ja) * | 2017-02-16 | 2020-04-15 | 株式会社村田製作所 | コイル部品 |
KR102370097B1 (ko) * | 2017-03-29 | 2022-03-04 | 삼성전기주식회사 | 전자 부품 및 시스템 인 패키지 |
JP2021022581A (ja) * | 2017-11-22 | 2021-02-18 | アルプスアルパイン株式会社 | チップインダクタ |
JP6702296B2 (ja) | 2017-12-08 | 2020-06-03 | 株式会社村田製作所 | 電子部品 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2700978B2 (ja) * | 1992-09-14 | 1998-01-21 | ティーディーケイ株式会社 | 電子部品及びその製造方法 |
JP2001102207A (ja) * | 1999-09-30 | 2001-04-13 | Tdk Corp | 圧粉磁心の製造方法 |
JP2002064027A (ja) * | 2000-08-22 | 2002-02-28 | Daido Steel Co Ltd | 圧粉磁心の製造方法 |
JP3593986B2 (ja) * | 2001-02-19 | 2004-11-24 | 株式会社村田製作所 | コイル部品及びその製造方法 |
JP2003282342A (ja) * | 2002-03-26 | 2003-10-03 | Tdk Corp | コイル封入圧粉磁芯 |
JP2004200373A (ja) * | 2002-12-18 | 2004-07-15 | Matsushita Electric Ind Co Ltd | 電子部品および製造方法 |
JP2005163134A (ja) * | 2003-12-04 | 2005-06-23 | Sumitomo Electric Ind Ltd | 細孔構造体およびその製造方法 |
JP4528058B2 (ja) * | 2004-08-20 | 2010-08-18 | アルプス電気株式会社 | コイル封入圧粉磁心 |
JP4899446B2 (ja) * | 2005-11-24 | 2012-03-21 | Tdk株式会社 | 複合電子部品及びその製造方法 |
JP2007242995A (ja) * | 2006-03-10 | 2007-09-20 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品とその製造方法 |
JP2007254814A (ja) | 2006-03-23 | 2007-10-04 | Tdk Corp | Fe−Ni系軟磁性合金粉末、圧粉体、コイル封入圧粉磁芯 |
JP5238376B2 (ja) * | 2008-06-27 | 2013-07-17 | 株式会社東芝 | 電子管 |
KR101174327B1 (ko) * | 2008-09-30 | 2012-08-16 | 티디케이가부시기가이샤 | 복합 전자 디바이스, 그 제조 방법, 및 복합 전자 디바이스의 접속 구조 |
JP5257137B2 (ja) * | 2009-02-25 | 2013-08-07 | トヨタ自動車株式会社 | 圧粉磁心の製造方法 |
JP4714779B2 (ja) * | 2009-04-10 | 2011-06-29 | 東光株式会社 | 表面実装インダクタの製造方法とその表面実装インダクタ |
WO2011016275A1 (ja) * | 2009-08-07 | 2011-02-10 | アルプス・グリーンデバイス株式会社 | Fe基非晶質合金、及び前記Fe基非晶質合金を用いた圧粉コア、ならびにコイル封入圧粉コア |
CN201749759U (zh) * | 2010-06-07 | 2011-02-16 | 佳邦科技股份有限公司 | 积层式芯片型电感器 |
JP5381956B2 (ja) * | 2010-10-21 | 2014-01-08 | Tdk株式会社 | コイル部品 |
KR101434351B1 (ko) * | 2010-10-21 | 2014-08-26 | 티디케이가부시기가이샤 | 코일 부품 및 그 제조 방법 |
JP6034553B2 (ja) * | 2011-08-25 | 2016-11-30 | 太陽誘電株式会社 | 電子部品の電極形成方法 |
JP5835047B2 (ja) * | 2012-03-22 | 2015-12-24 | Tdk株式会社 | セラミック電子部品 |
JP6166021B2 (ja) * | 2012-06-08 | 2017-07-19 | 太陽誘電株式会社 | 積層インダクタ |
-
2014
- 2014-04-11 JP JP2014082210A patent/JP6434709B2/ja active Active
-
2015
- 2015-01-26 TW TW104102586A patent/TWI591662B/zh active
- 2015-03-10 KR KR1020150033180A patent/KR101667140B1/ko active IP Right Grant
- 2015-03-30 CN CN201710372434.8A patent/CN107256773B/zh active Active
- 2015-03-30 CN CN201510144704.0A patent/CN104979082A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20150118020A (ko) | 2015-10-21 |
JP6434709B2 (ja) | 2018-12-05 |
CN107256773B (zh) | 2019-11-26 |
TW201541478A (zh) | 2015-11-01 |
CN104979082A (zh) | 2015-10-14 |
CN107256773A (zh) | 2017-10-17 |
KR101667140B1 (ko) | 2016-10-17 |
JP2015204337A (ja) | 2015-11-16 |
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