TWI591662B - Electronic parts, manufacturing method of electronic parts and electronic equipment - Google Patents

Description

Electronic component, electronic component manufacturing method and electronic device

The present invention relates to an electronic component including a magnetic member, a conductive member, and a connecting end portion, a method of manufacturing the electronic component, and an electronic device in which the electronic component is mounted.

In recent years, the miniaturization of electronic equipment has progressed, and the installation space for electronic components has become smaller. On the other hand, there is a diversification in the performance required for electronic equipment, such as speed, multi-function, and power saving. In order to cope with such requirements, the number of electronic components that should be mounted on an electronic device tends to increase. Therefore, recently, the demand for miniaturization of electronic components has been particularly high.

In order to properly cope with such demands, the re-examination of the materials constituting the electronic components is being actively carried out so as not to reduce the functions of the electronic components due to miniaturization. For example, as a magnetic material contained in a magnetic member provided as an inductance element of an electronic component, ferrite powder has been used in the past, but recently, a magnetic flux density higher than that of a ferrite powder has been used. A strong magnetic metal powder with a DC overlap characteristic maintained to a high magnetic field.

As the above-mentioned ferromagnetic metal powder, soft magnetic alloy powders such as Fe-based amorphous alloy powder, Fe-Ni-based alloy powder, Fe-Si-based alloy powder, and pure iron powder (high-purity iron powder) can be exemplified. As a specific example, Patent Document 1 discloses the following Fe-based amorphous alloy: its composition formula is represented by Fe _100-abcxyzt Ni _a Sn _b Cr _c P _x C _y B _z Si _t , 0 at% ≦a ≦ 10 at% , 0at%<c≦3at%, 6.8at%≦x≦10.8at%, 2.2at%≦y≦9.8at%, 0at%≦z≦4at%, 0at%≦t≦1at%, (addition of B) The addition amount t of z + Si is in the range of 1 at% to 4 at%, and the glass transition temperature (Tg) is 710 K or less. Further, Patent Document 2 discloses a Fe-Ni-based soft magnetic alloy powder having Ni: 41 wt% or more and less than 45 wt%, additive A: 1 wt% or more and 5 wt% or less, and the remainder: Fe and not The composition of the impurities to be avoided, and the additive A is at least one of Al, Si, Mn, Mo, Cr, and Cu.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Patent No. 5,539,302

Patent Document 2: Japanese Patent Laid-Open Publication No. 2007-254814

An electronic component having a magnetic member including a molded body of a ferromagnetic metal powder as disclosed in the above-mentioned patent document and having a plurality of conductive connecting ends on its surface requires the surface of the magnetic member to have appropriate insulating properties. No short circuit occurs between the connection ends.

In particular, in the case where a member constituting the conductive connecting end portion is to be formed by electroplating, as described below, it is preferable that the surface of the magnetic member has sufficient insulating properties. That is, in the case where a plating layer is formed on the surface of the magnetic member by electroplating, a metallization layer composed of a conductive paste or the like is formed on a portion of the surface of the magnetic member before electroplating, thereby making the region Power-on area. When the surface of the magnetic member has sufficient insulating properties, when the plating is performed, the electric power line from the anode reaches the energized region among the surfaces of the magnetic member, and the plating layer can be selectively formed on the energized region.

However, when the magnetic member does not have sufficient insulating properties, when the plating is performed, the electric power line from the anode also reaches a region (adjacent region) adjacent to the energization region in the surface of the magnetic member. As a result, the plating layer is formed beyond the energized region and is also formed in the adjacent region.

If the above-mentioned "plating excess" phenomenon occurs, the shape of the conductive layer is as follows. The metallized layer has a different shape in plan view, and thus the electronic component may have a poor appearance. In the case where the amount of plating exceeds a large amount, the plating layer is formed so as to electrically short between the energization regions provided on the surface of the magnetic member, and the electronic component cannot properly perform its function.

In view of such circumstances, it is an object of the present invention to provide an electronic component in which the insulation of the surface of a magnetic member is improved. Moreover, an object of the present invention is to provide a method of manufacturing the above electronic component and an electronic device in which the above electronic component is mounted.

As a result of research by the inventors of the present invention, it has been found that the above problem can be solved by providing the insulating layer located on the surface layer of the magnetic member with an inorganic insulating layer containing an inorganic material.

The present invention based on the above new findings is as follows.

(1) An electronic component comprising: a magnetic member including a molded body including a ferromagnetic metal powder; and an insulating layer formed on a surface portion of the molded body; and a conductive member having the magnetic property a portion of the inside of the member; and a connecting end portion of the conductive member formed on the surface of the magnetic member in a state of being electrically connected to the conductive member; and the insulating layer is provided with an inorganic insulating material formed of an inorganic material Floor.

(2) The electronic component according to the above (1), wherein the connection end portion is provided with a plating layer.

(3) The electronic component according to (2) above, wherein the plating layer is formed on the metallization layer provided on the insulating layer by electroplating.

(4) The electronic component according to any one of the above (1), wherein the inorganic insulating layer comprises an insulating oxide material.

(5) The electronic component according to any one of (1) to (4) wherein the insulating layer has a surface resistance of 1 × 10 ¹² Ω/□ or more.

(6) The electronic component according to any one of (1) to (5) wherein the insulating layer The ferromagnetic metal powder is disposed to cover the surface portion constituting the molded body.

The electronic component according to any one of the above aspects, wherein the insulating layer is provided with an impregnation coating layer between the inorganic insulating layer and the molded body.

(8) The electronic component according to (7) above, wherein the impregnated coating layer contains a polyoxynoxy resin.

The electronic component according to any one of the above aspects, wherein the molded article contains an organic component.

(10) The electronic component according to any one of (1) to (9) wherein the magnetic member has pores.

(11) A method of producing an electronic component, comprising: a magnetic component having a molded body and an insulating layer; and a method of manufacturing an electronic component having a conductive connecting end, and comprising: a forming step a mixture comprising the ferromagnetic metal powder and the binder component; and an inorganic insulating layer forming step of forming an insulating layer comprising an inorganic insulating layer formed of an inorganic material on the formed body obtained through the forming step. Obtaining the magnetic member; and a connecting end forming step of forming the connecting end portion on the insulating layer of the magnetic member.

(12) The method of producing an electronic component according to the above (11), further comprising an annealing step of annealing the molded article obtained by the molding step.

(13) The method of producing an electronic component according to the above (11) or (12), wherein the inorganic insulating layer forming step includes a dry film forming process.

(14) The method of producing an electronic component according to (11) or (12), wherein the inorganic insulating layer forming step comprises a wet film forming process.

(15) The method of producing an electronic component according to any one of the above (11), wherein, after the forming step is completed, and before the step of forming the inorganic insulating layer, further comprising the magnetic member An impregnation coating step of forming an impregnated coating.

(16) The method of producing an electronic component according to the above (15), wherein the impregnated coating layer comprises a polyfluorene oxide resin.

The method for producing an electronic component according to any one of the above aspects, wherein the conductive layer includes a metallization layer formed of a conductive paste and a plating layer formed on the metallization layer. Further, the connecting end portion forming step includes applying the conductive paste on the insulating layer to form a metallized layer, and performing a plating treatment to form the plating layer on the metallized layer.

The method of manufacturing an electronic component according to any one of the above aspects, wherein the magnetic member has a conductive member therein, and in the connecting end forming step, the connecting end The portion is formed to be electrically connected to the conductive member.

(19) An electronic device in which the electronic component according to any one of the above (1) to (10) is mounted.

(20) An electronic device to which an electronic component manufactured by the manufacturing method described in the above (11) to (18) is attached.

In the electronic component of the above invention, since the insulating layer of the magnetic member has an inorganic insulating layer, the insulation of the surface of the magnetic member can be improved. According to the present invention, a method of manufacturing the electronic component is provided. Further, according to the present invention, an electronic apparatus in which the above electronic component is mounted is also provided.

1‧‧‧Magnetic components

2‧‧‧Electrical components

2a‧‧‧End of conductive member 2

2b‧‧‧End of conductive member 2

3a‧‧‧Connective end of conductivity

3b‧‧‧Connective end of conductivity

10‧‧‧Electronic parts

Fig. 1 is a perspective view showing the entire configuration of an inductance element according to an embodiment of the present invention.

Fig. 2 is a view showing the results of cross-sectional observation of one electronic component manufactured by the first embodiment.

Fig. 3 is a view showing the result of observing the white frame (a) in Fig. 2, and the numerical values in the figure indicate the thickness of the inorganic insulating layer.

Fig. 4 is a view showing the result of observing the white frame (b) in Fig. 2, and the numerical values in the figure indicate the thickness of the inorganic insulating layer.

Fig. 5 is a view showing the result of observing the white frame (c) in Fig. 2, and the numerical values in the figure indicate the thickness of the inorganic insulating layer.

Fig. 6 is a view showing the result of visual observation of an electronic component manufactured by Comparative Example 1, and the inside of the white circular frame is a portion where the phenomenon of "plating excess" occurs.

Fig. 7 is a view showing the result of visual observation of an electronic component manufactured by the first embodiment.

Fig. 8 is a graph showing the results of Test Example 5.

Hereinafter, in the embodiment of the present invention, a case where the electronic component is the inductance element 10 shown in FIG. 1 will be described as a specific example.

Inductive component

As shown in Fig. 1, an inductance element 10 according to an embodiment of the present invention includes a magnetic member 1, a conductive member 2, and two connection end portions 3a and 3b. The magnetic member 1 includes a molded body and an insulating layer. The conductive member 2 has a portion located inside the magnetic member 1. Specifically, in the inductance element 10 shown in FIG. 1, a coil is embedded in the molded body of the magnetic member 1. The conductive connection end portions 3a and 3b are formed on the surface of the magnetic member 1 in a state of being electrically connected to the conductive member 2.

The size of the inductance element 10 according to an embodiment of the present invention is not limited. As described above, since the surface of the magnetic member 1 of the inductance element 10 according to the embodiment of the present invention is sufficiently high in insulation, the size of the magnetic member 1 can be 2 mm × 2 mm and a height of about 1 mm. Further, the separation distance between the connection end portions 3a and 3b may be 1 mm or less.

Hereinafter, the molded body, the insulating layer, the conductive member 2, and the connection end portions 3a and 3b provided in the magnetic member 1 will be described.

(1) Magnetic member (1-1) Shaped body

The shaped body contains a ferromagnetic metal powder. The type of the ferromagnetic metal powder is not limited. As described above, as the ferromagnetic metal powder, soft magnetic alloy powders such as Fe-based amorphous alloy powder, Fe-Ni-based alloy powder, Fe-Si-based alloy powder, and pure iron powder (high-purity iron powder) can be exemplified. Since the ferromagnetic metal powder has high conductivity, it is difficult to ensure the insulation of the surface of the molded body when the outermost surface of the molded body is formed of the surface of the ferromagnetic metal powder.

The molded body may also contain an organic component. The organic component is preferably such that the ferromagnetic metal powders are bonded to each other. The specific composition of the organic component having the bonding function is not limited. The organic component may also contain a resin material, and examples of the resin material include a polyoxyxylene resin, an epoxy resin, a phenol resin, a melamine resin, a urea resin, an acrylic resin, and an olefin resin. The organic component may also contain a material formed by heat treatment of the resin material as described above. The composition of the substance can be adjusted by the composition of the heat-treated resin material, heat treatment conditions, and the like. The organic component is preferably such that the ferromagnetic metal powder contained in the molded body is electrically independent of each other. The resin material of the organic component may be composed of one type or a plurality of types. For example, the resin material of the organic component may be a mixture of a thermosetting resin such as a phenol resin and a thermoplastic resin such as an acrylic resin.

When the molded body contains an organic component, the content of the organic component in the molded body is not limited. When the organic component has a bonding function, it is preferred to contain an amount which appropriately exhibits the function. In addition, when the content of the organic component is too high, the magnetic properties of the magnetic member 1 including the molded body tend to be lowered, and it is preferable to set the content of the organic component in the molded body in consideration of the above. .

The molded body may contain a substance other than the ferromagnetic metal powder and the organic component. Examples of the substance include an insulating inorganic component such as glass or alumina, and a coupling agent for improving the adhesion to the ferromagnetic metal powder and the organic component, such as a decane coupling agent. The content of these substances in the shaped body is not limited.

The shaped body may also have pores. The formation process of the pores is not limited. It can be formed by springback after molding, or can be formed by annealing the formed molded article as will be described later. When the molded body has pores, there is a tendency that the insulation between the ferromagnetic powders in the molded body becomes good, and the magnetic properties of the magnetic member 1 are improved. However, if the density of the pores in the molded body is too high, the degree of bonding between the ferromagnetic powders in the molded body is lowered, and the mechanical strength of the magnetic member 1 is lowered. Therefore, when the molded body has pores, the void ratio of the molded body (the percentage of the volume of the void portion defined as the portion where the solid matter is not present in the molded body with respect to the entire volume of the molded body) is preferably 3% or less. More preferably, it is 1% or less.

(1-2) Insulation layer

The insulating layer is formed on the surface of the molded body and a portion formed in the vicinity of the surface as needed (in the present specification, the surface of the molded body and the portion near the surface are collectively referred to as "surface portion") so that the surface of the magnetic member 1 has Insulation. In the magnetic member 1 according to the embodiment of the present invention, the insulating layer includes an inorganic insulating layer formed of an inorganic material. The material constituting the inorganic insulating layer is not limited as long as it has appropriate insulating properties. An oxide-based material, a carbide-based material, a nitride-based material, or the like can be exemplified. Specific examples of the oxide-based material include an oxide of cerium and an oxide of aluminum, and more specifically, SiO ₂ or Al ₂ O ₃ . However, in consideration of the simplicity in film formation, SiO _{2 is more} preferable. Since such an insulating oxide-based material has a high volume resistivity, even if it is a relatively thin film, a film excellent in insulating properties can be formed alone.

The thickness of the inorganic insulating layer is not limited. The insulating layer is appropriately set in such a manner as to have a desired insulating property. When the range of the thickness of the inorganic insulating layer is exemplified to be 0.1 μm or more and 100 μm or less, the thickness of the inorganic insulating layer is preferably from the viewpoint of a good balance between the insulating property of the insulating layer and the productivity of the inorganic insulating layer. It is set to 1 μm or more and 10 μm or less.

The method of producing the inorganic insulating layer is not limited. Can be dry process, wet process Any of them. As the dry process, CVD (Chemical Vapor Deposition), sputtering, vapor deposition, ion plating, or the like can be exemplified. As a wet process, a sol-gel method, a chemical conversion process, etc. are illustrated. From the viewpoint of improving the uniformity of the thickness of the inorganic insulating layer and the insulating property, the inorganic insulating layer is preferably formed by CVD which can form a dense inorganic coating film by surface reaction.

The insulating layer is preferably provided to cover the ferromagnetic metal powder (hereinafter also referred to as "surface powder") located on the outermost surface of the formed body. The surface powder is rubbed against the surface of the mold when it is taken out from the forming mold due to the rebound after forming, or is in contact with other members during the manufacturing process after the forming step, and therefore, the surface formed of the metallic material is exposed. Happening. Even in such a case, the insulation of the surface of the magnetic member 1 can be improved by forming the insulating layer so as to cover the surface powder.

The surface resistance of the insulating layer is preferably 1 × 10 ¹² Ω / □ or more. When the surface resistance is such a degree, when a plating layer is formed on the magnetic member 1 by a plating treatment, it is difficult for the plating material to be deposited outside the energization region provided on the magnetic member 1 by a metallization layer or the like. It is more stable to reduce the possibility of "plating excess". The surface resistance of the insulating layer is preferably 5 × 10 ¹² Ω / □ or more, and more preferably 1 × 10 ¹³ Ω / □ or more, from the viewpoint of further suppressing the occurrence of the "plating excess" phenomenon.

The insulating layer may also have an impregnation coating between the inorganic insulating layer and the formed body. The surface of the molded body formed of the surface powder or having a structure in which the surface powder is bonded by an organic component or the like may have a large degree of unevenness due to the difference in the particle size distribution of the ferromagnetic metal powder. In this case, it is not easy to form the inorganic insulating layer in such a manner as to cover the surface powder. Therefore, an impregnated coating layer is first formed on the surface of the formed body, and the degree of unevenness of the surface of the object of formation of the inorganic insulating layer (the formed body in which the impregnated coating layer is formed) is reduced, and thereafter an inorganic insulating layer is formed, whereby the inorganic insulating layer is formed. It is easy to cover the surface powder. Therefore, the impregnated coating may be formed by covering the entire surface of the surface powder, or may be present on the surface of the surface powder without being covered by the impregnated coating. In any case, it can be reduced by forming an impregnated coating The surface of the object to be formed by the small inorganic insulating layer may have a degree of unevenness.

The type of impregnated coating is not limited. A polyoxymethylene resin, an acrylic resin, a butyral phenol resin, etc. are illustrated. The possibility of being eroded in the treatment for forming the inorganic insulating layer (especially in the dry process) is relatively low, and therefore the impregnated coating preferably contains a polyoxynoxy resin.

In the prior art, the insulating layer was present only by the above-described impregnated coating. However, in the case where the electronic component of the inductance element 10 is particularly miniaturized as shown in FIG. 1 (a specific example is 2 mm × 2 mm, a height of about 1 mm or less), even if the impregnation coating composition is improved. It is also difficult to form an impregnation coating on the surface of the molded body with high uniformity in coating properties. Further, when the molded body has pores as described above, the impregnation coating composition is immersed in the pores, and one of the surfaces of the molded body is partially exposed, and the impregnated coating layer cannot be uniformly formed on the surface portion of the molded body. An area that does not have sufficient insulation (also referred to as "low insulation area" in the present specification) may be generated on the surface of the magnetic member provided in the electronic component. As mentioned above, such a low-insulation area may be the cause of the "plating excess" phenomenon. Therefore, if the amount of the impregnation coating composition for forming the impregnated coating layer is increased in order to reduce the possibility of producing a low insulating region, the amount of shrinkage when the impregnated coating composition is formed into an impregnation coating composition is increased. As a result, there is a case where the ferromagnetic metal powder in the electronic component is easily deformed by the shrinkage. The deformation generated in the ferromagnetic metal powder can be a cause of lowering the magnetic characteristics of the electronic component.

On the other hand, in the electronic component 10 according to the embodiment of the present invention, since the insulating layer includes the inorganic insulating layer, the possibility of generating a low insulating region on the surface of the magnetic member 1 is sufficiently reduced. Therefore, even when the size of the electronic component (inductor element 10) is particularly miniaturized, it is difficult to cause a problem such as "the plating on the surface of the magnetic member 1 is exceeded".

(2) Conductive member

The conductive member 2 is not limited in shape and composition as long as it can be buried inside the magnetic member 1. In the case of the inductance element 10 shown in FIG. 1, the electroconductive member 2 has a coil. Part of the shape. The specific shape of the coil is not limited. For example, the coil can be a flat coil. The conductive member 2 is preferably made of a material having a high electrical conductivity such as copper or aluminum.

(3) connecting end

The connection end portions 3a and 3b are electrically conductive members formed on the surface of the magnetic member 1 in a state of being electrically connected to the end portions 2a and 2b of the electroconductive member 2. The connection end portions 3a, 3b are usually formed on a plurality of regions of the surface of the magnetic member 1. The inductance element 10 shown in FIG. 1 is provided with two connection end portions 3a and 3b. The shape and composition of the connection end portions 3a and 3b are not limited as long as the connection end portions 3a and 3b have appropriate conductivity and the plurality of connection end portions 3a and 3b on the surface of the magnetic member 1 are not short-circuited.

In the inductance element 10 shown in FIG. 1, the connection end portions 3a and 3b are provided with a metallization layer formed of a conductive paste such as silver paste and a plating layer formed on the metallization layer. The material forming the plating layer is not limited. Examples of the metal element contained in the material include copper, aluminum, zinc, nickel, iron, tin, and the like.

That is, in the case where the plating layer described above is formed by plating, the surface of the magnetic member 1 according to the embodiment of the present invention also has sufficient insulating properties, so that it is difficult to cause "plating excess".

The thickness and size (shape) of the connecting end portions 3a, 3b should be appropriately set. As described above, when the connection end portions 3a and 3b are provided with the metallization layer and the plating layer, the coating amount of the conductive paste for forming the metallization layer may be, for example, about 0.05 g/cm ² as the thickness of the plating layer. It can be exemplified by about 5 to 10 μm.

2. Method of manufacturing electronic parts

The method for producing an electronic component according to an embodiment of the present invention is not particularly limited. When the manufacturing method is carried out by the manufacturing method described below, it is possible to efficiently manufacture the electronic component, specifically the inductance element 10, according to an embodiment of the present invention.

In one example, a method of manufacturing an electronic component (inductor component 10) according to an embodiment of the present invention includes a forming step, an inorganic insulating layer forming step, and a connecting end forming step. In a preferred embodiment, an annealing step and an impregnation coating step are provided between the forming step and the inorganic insulating layer forming step.

In the forming step, a mixture comprising the ferromagnetic metal powder and the binder component is formed. The binder component is not limited, and examples thereof include resin materials such as polyoxyxylene resin, epoxy resin, phenol resin, melamine resin, urea resin, acrylic resin, and olefin resin. The mixture may further contain an insulating inorganic component, a coupling agent, a lubricant (exemplified by zinc stearate, aluminum stearate, etc.). The preparation method of the mixture is also arbitrary. The mixture may be mixed using a ball mill or the like, or a dispersion containing the respective components may be adjusted, and the dispersion may be dried and pulverized to obtain a granulated powder containing a ferromagnetic metal powder. The molding conditions are also not limited. The pressurization can be carried out at room temperature in a range of about 0.1 GPa to 5 GPa.

In the molding step, the conductive member 2 is placed in the molded article by arranging and molding the conductive member 2 such as a coil in the cavity of the molding die.

An annealing step may also be performed in which the shaped article obtained by the forming step is annealed as needed. By performing the annealing treatment, the deformation in the ferromagnetic metal powder generated by the molding step is alleviated, and the magnetic properties of the magnetic member 1 can be improved. The conditions of the annealing treatment are appropriately set in consideration of the degree of deformation generated in the ferromagnetic metal powder and the thermal characteristics of the binder component. For example, the temperature is raised from room temperature to about 350 ° C to 500 ° C at a temperature increase rate of 20 ° C / min to 50 ° C / min, and is maintained at a heating temperature for about 0.5 to 5 hours.

The formed body obtained by the annealing step may be subjected to an impregnation coating step before the step of forming the inorganic insulating layer. In the impregnation coating step, the composition is impregnated into the surface layer of the formed body by bringing the impregnated coating composition into contact with the shaped body. The contact method is not limited. The molded body may be immersed in the impregnation coating composition, or the impregnated coating composition may be applied to the molded body. When the molded article is immersed in the impregnated coating composition, the impregnated coating composition can be easily introduced into the molded body by immersing while evacuating under vacuum. borrow The impregnation coating layer can be obtained by drying the impregnation coating composition impregnated on the surface layer of the molded body or by heating or the like as needed. By forming the impregnated coating layer, the surface of the formed body of the inorganic insulating layer forming step has a small degree of unevenness on the surface of the molded body on which the impregnated coating layer is formed, and the inorganic insulating layer having excellent insulating properties is easily formed in the inorganic insulating layer forming step. . The composition of the impregnated coating composition is not limited. A resin material such as a polyoxyxylene resin, an acrylic resin, or a butyral phenol resin may be contained.

In the inorganic insulating layer forming step, an insulating layer containing an inorganic insulating layer made of an inorganic material is formed on the molded body to obtain a magnetic member 1 including a molded body and an insulating layer. As described above, in the case where the annealing step is performed, the formed body is formed by subjecting the formed product obtained by the forming step to annealing treatment, and when the annealing step is not performed, the formed body is formed by forming The resulting shaped article obtained in the step. Further, as described above, in the case where the impregnation coating step is performed, the inorganic insulating layer is formed on the formed body on which the impregnated coating layer is formed. Therefore, in this case, the insulating layer is provided with an impregnation coating layer and an inorganic insulating layer. The insulating layer is provided with an inorganic insulating layer when the impregnation coating step is not performed.

As described above, the method for forming the inorganic insulating layer is not limited. It can be a dry process or a wet process. The insulating layer can be formed in such a manner as to cover the surface powder of the formed body by appropriately selecting a method of producing the inorganic insulating layer.

The step of forming a member constituting the insulating layer may be performed after the step of forming the inorganic insulating layer. As such a step, for example, a step for forming an organic coating layer or a step for forming a fluorine-based coating layer may be performed.

When the magnetic member 1 having the insulating layer on the surface layer is obtained, the connection between the connection end portions 3a and 3b electrically connected to the conductive member 2 disposed in the magnetic member 1 is formed on the insulating layer of the magnetic member 1. End forming step. In the case where the connection end portions 3a and 3b are composed of a metallization layer and a plating layer, first, a conductive paste such as silver paste is applied onto the insulating layer. The coating method is arbitrary. It is preferable to use a printing, a dispenser, or the like. By drying as needed, A metallization layer is formed on the insulating layer. Then, a plating treatment is performed to form a plating layer on the metallization layer. The method of electroplating is not limited. In the case where the size of the electronic component is particularly small as described above, it is preferable to perform barrel plating. In the method of manufacturing an electronic component according to the embodiment of the present invention, since the insulating layer is provided with the inorganic insulating layer, it is difficult to cause a problem that the plating layer is formed on the insulating layer of the magnetic member 1 beyond the metallization layer during plating ( "Plating exceeded" phenomenon).

3. Electronic machine

In the case of the electronic component (inductor element 10) according to the embodiment of the present invention, even when the electronic component (inductor element 10) is extremely small, it is difficult to cause a short circuit at the connection end portions 3a and 3b. Therefore, the electronic component (inductor element 10) according to an embodiment of the present invention is excellent in operational stability even when it is particularly small. Therefore, an electronic device to which the electronic component (inductor element 10) according to an embodiment of the present invention is mounted is easily miniaturized. Moreover, a plurality of electronic components can be mounted in the installation space of the electronic device. In this case, when the electronic component according to the embodiment of the present invention is the inductance element 10, since the inductance element 10 is small, the power switch circuit, the voltage rise and fall circuit, the smoothing circuit, the circuit for blocking the high-frequency current, and the like can be used. miniaturization. Therefore, it is easy to increase the power supply circuit of the electronic device. As a result, more precise power control can be performed, and power consumption of the electronic device can be suppressed.

The embodiments described above are described in order to facilitate the understanding of the present invention and are not intended to limit the present invention. Therefore, the various elements disclosed in the above embodiments are intended to cover all design changes or equivalents of the technical scope of the invention.

For example, in the above description, the conductive member is embedded in the molded body at the manufacturing stage of the molded body, but a plurality of molded bodies may be disposed so as to contain the conductive member. Specifically, one molded body has a groove portion in which a conductive member can be disposed, and a conductive member is disposed in the groove portion. Thereafter, another molded body is disposed so as to cover the conductive member, thereby obtaining a plurality of shapes. A structure in which a conductive member is contained in the body.

[Examples]

Hereinafter, the present invention will be specifically described by way of examples, but the scope of the invention is not limited to the examples and the like.

(Example 1)

Fe-based amorphous soft magnetic powder obtained by weighing with a composition of Fe _{74.43 at%} Cr _{1.96 at%} P _{9.04 at%} C _{2.16 at%} B _{7.54 at%} Si _{4.87 at%} by a water atomization method Made of ferromagnetic metal powder. The particle size distribution of the obtained soft magnetic powder was measured by a volume distribution using a "Microtrac particle size distribution measuring apparatus MT3300EX" manufactured by Nikkiso Co., Ltd. As a result, the average particle diameter (D50) was 10.6 μm.

100 parts by mass of the soft magnetic powder, 2 parts by mass of a binder containing a resin-based material containing an acrylic resin as a thermoplastic resin and a phenol-based resin as a thermosetting resin, and a lubricant formed of zinc stearate 0.3 The mass fraction was mixed in xylene as a solvent to obtain a slurry.

The obtained slurry was dried and pulverized, and a fine mesh of 300 μm or less and a coarse powder of 850 μm or more were removed using a sieve having a mesh size of 300 μm and a sieve of 850 μm to obtain a granulated powder.

The granulated powder obtained by the above method was filled in a mold in which a copper coil (number of turns: 5) which was previously covered with an insulating coating was placed in a cavity, and pressed at a mold temperature of 23 ° C and a surface pressure of 1.5 GPa. The press molding was carried out under the conditions to obtain a molded article.

The obtained molded article was placed in a furnace in a nitrogen gas atmosphere, and the following heat treatment was performed: the furnace temperature was heated from room temperature (23 ° C) to a temperature increase rate of 40 ° C / min to 372 ° C, and maintained at this temperature for 60 minutes. After that, it was cooled to room temperature in a furnace. Thus, it was obtained as a molded body of a rectangular parallelepiped of 2 mm × 2 mm and a thickness of 1 mm.

The impregnated coating composition containing a polyoxyxylene resin was prepared, and the molded body was immersed in the composition for 10 minutes while evacuating. Thereafter, the molded body was taken out from the impregnated coating composition and dried at 150 ° C for 30 minutes. The obtained member was further immersed in the impregnation coating composition for 4.5 minutes while being vacuum-exhausted, and thereafter, self-contained The dip coating composition was taken out and dried at 150 ° C for 30 minutes, whereby a molded body in which an impregnated coating layer was formed was obtained.

The formed body having the impregnated coating layer obtained in the above manner is treated by a CVD apparatus, thereby forming an inorganic insulating layer formed of an oxide of cerium, more specifically, SiO ₂ . In this manner, a magnetic member including an inorganic insulating layer and an insulating layer made of an impregnated coating layer having a molded body and a surface portion of the molded body is obtained.

A metallized layer formed of a silver paste having a rectangular shape of a shape of 2 mm × about 0.5 mm in plan view was formed by printing on the magnetic member having a size of 2 mm × 1 mm.

The obtained magnetic member on which the metallized layer was formed was subjected to barrel plating (metal: copper) to form a copper plating layer having a thickness of about 3 μm.

In this way, an inductance element as an electronic component having the appearance shown in FIG. 1 is obtained, and the inductance element includes a magnetic member having a molded body and an insulating layer, and the molded body includes a ferromagnetic metal powder composed of an amorphous soft magnetic powder. And an organic component, the insulating layer is formed on a surface portion of the molded body, and has an impregnated coating layer and an inorganic insulating layer formed of an oxide of tantalum; and an electrically conductive member having an inner portion of the molded body provided in the magnetic member a portion (coil); and a conductive connecting end portion formed on the surface of the magnetic member, having a metallization layer based on a silver paste and a copper plating layer.

(Comparative Example 1)

An inductance element was produced in the same manner as in Example 1 except that the inorganic insulating layer was not formed on the molded article in which the impregnated coating layer was formed.

(Test Example 1) Observation of inorganic insulating layer

The inductance element manufactured by the embodiment was embedded in a resin and cut, and the cut surface was polished and observed by an electron microscope. As shown in FIGS. 2 to 5, it was confirmed that the inorganic insulating layer was formed to cover the entire surface of the molded body. Further, as shown in FIG. 3 to FIG. 5, it was also confirmed that the inorganic insulating layer has a thickness of about 2.5 μm to about 3.5 μm, and an inorganic insulating layer having excellent uniformity is formed.

(Test Example 2) Measurement of surface resistance

The surface resistance (unit: Ω/□) was measured for the inductance elements (50 each) manufactured by the examples and the comparative examples, and an average value was obtained. The results are shown in Table 1. As shown in Table 1, it was confirmed that the surface resistance value was 10 times or more depending on the presence or absence of the inorganic insulating layer.

(Test Example 3) Evaluation of the phenomenon of "plating exceeded"

In the case of the inductance elements (each of 50) manufactured by the examples and the comparative examples, the appearance was observed to confirm whether or not the "plating exceeded" phenomenon occurred. As a result, as shown in FIG. 6, in the inductance element manufactured by the comparative example, the phenomenon of "plating excess" (in the white circle in FIG. 6) was observed. On the other hand, as shown in FIG. 7, in the inductance element manufactured by the Example, the phenomenon of "plating excess" was not seen.

(Test Example 4) Measurement of reactance

With respect to the inductance elements (each of 50) manufactured by the examples and the comparative examples, the reactance (unit: μH) was measured and an average value was obtained. The results are shown in Table 2. As shown in Table 2, no substantial change in reactance was observed depending on the presence or absence of the inorganic insulating layer.

According to the inductance element manufactured by the first embodiment of the present invention, it is confirmed that since the insulating layer having the inorganic insulating layer is provided, the magnetic property can be improved without substantially affecting the magnetic characteristics. The insulation of the surface of the component. As a result, the occurrence of the "plating excess" phenomenon was not observed in the inductance element of the first embodiment. On the other hand, in the inductance element manufactured by the comparative example 1, the phenomenon of "plating excess" was observed.

(Test Example 5)

For the inductance elements (each of 50) manufactured by the examples and the comparative examples, a reflow soldering test was performed under the following conditions.

Peak temperature: 270 ° C

Peak temperature retention time: 180 seconds

After performing the first or third reflow test, the surface resistance was measured in the same manner as in Test Example 2, and an average value was obtained. The results are shown in Table 3 and Figure 8.

As shown in Table 3 and FIG. 8, even if the inductance element manufactured by Example 1 was subjected to the reflow test, the insulation of the surface of the magnetic member was not lowered. On the other hand, in the inductance element manufactured by the comparative example 1, the insulation of the surface of the magnetic member was remarkably lowered by the reflow test. An electronic component such as an inductor component is subjected to a thermal process such as reflow soldering while being mounted on a substrate. In particular, during reflow soldering, since the solder is melted, if the mounted electronic component is small, the position of the electronic component may change with respect to the substrate. In the case where an electronic device having a small space is installed as in a smartphone or the like, if the position of the electronic component changes to a large extent, there is a case where the electronic component comes into contact with the casing of the electronic device. In other words, in the electronic component according to an embodiment of the present invention, since the surface resistance of the magnetic member is high, it is difficult to cause a short circuit or the like. problem. Further, since the inorganic insulating layer has high thermal stability, it is expected that the environmental resistance in the external environment is also improved.

[Industrial availability]

The electronic component of the present invention is suitable as a component mounted in an electronic device such as a mobile phone, a smartphone, or a notebook computer, and is particularly suitable as an inductance component used in a power supply circuit of the electronic device.

Claims (20)

An electronic component comprising: a magnetic member comprising a molded body comprising a ferromagnetic metal powder; and an insulating layer formed on a surface portion of the molded body; and an electrically conductive member having an inner portion of the magnetic member And a conductive connecting end portion formed on the surface of the magnetic member in a state of being electrically connected to the conductive member; and the insulating layer includes an inorganic insulating layer formed of an inorganic material; the insulating layer The layer is provided with an impregnation coating layer between the inorganic insulating layer and the molded body. The electronic component of claim 1, wherein the connecting end portion is provided with a plating layer. The electronic component of claim 2, wherein the plating layer is formed on the metallization layer provided on the insulating layer by electroplating. The electronic component according to any one of claims 1 to 3, wherein the inorganic insulating layer comprises an insulating oxide-based material. The electronic component according to any one of claims 1 to 3, wherein the insulating layer has a surface resistance of 1 × 10 ¹² Ω/□ or more. The electronic component according to any one of claims 1 to 3, wherein said insulating layer is provided to cover said ferromagnetic metal powder constituting a surface portion of said molded body. The electronic component of claim 1, wherein the impregnated coating comprises a polyoxynoxy resin. The electronic component according to any one of claims 1 to 3, wherein the molded body contains an organic component. The electronic component of claim 2 or 3, wherein the magnetic member has pores. An electronic component comprising: a magnetic member having a molded body comprising a ferromagnetic metal powder and formed thereon An insulating layer on a surface portion of the molded body; a conductive member having a portion located inside the magnetic member; and a conductive connecting end portion formed in the state electrically connected to the conductive member The insulating layer includes an inorganic insulating layer formed of an inorganic material, the insulating layer includes an impregnation coating layer between the inorganic insulating layer and the molded body, and the magnetic member has pores. A method for producing an electronic component, comprising: a method of manufacturing an electronic component including a magnetic member having a molded body and an insulating layer, and a conductive connecting end portion, and comprising: a forming step, comprising a mixture of a magnetic metal powder and a binder component; and an inorganic insulating layer forming step of forming an insulating layer comprising an inorganic insulating layer formed of an inorganic material on the molded body obtained by the forming step; And a connecting end forming step of forming the connecting end portion on the insulating layer of the magnetic member; and forming the magnetic member after the forming step is completed and before the inorganic insulating layer forming step is started The impregnation coating step of the impregnated coating. The method of producing an electronic component according to claim 11, further comprising an annealing step of annealing the formed article obtained by the forming step. The method of manufacturing an electronic component according to claim 11 or 12, wherein the inorganic insulating layer forming step comprises a dry film forming process. The method of manufacturing an electronic component according to claim 11 or 12, wherein the inorganic insulating layer forming step comprises a wet film forming process. The method of producing an electronic component according to claim 11, wherein the impregnated coating layer comprises a polyoxynoxy resin. The method of manufacturing the electronic component of claim 11 or 12, wherein the conductive layer comprises a metallization layer formed of a conductive paste and a plating layer formed on the metallization layer, and the connecting end forming step comprises: the insulating layer The conductive paste is applied to the layer to form a metallization layer, and a plating treatment is performed to form the plating layer on the metallization layer. The method of manufacturing an electronic component according to claim 11 or 12, wherein the magnetic member has a conductive member therein, and in the connecting end forming step, the connecting end portion is electrically connected to the conductive member. The way is formed. A method for producing an electronic component, comprising: a method of manufacturing an electronic component including a magnetic member having a molded body and an insulating layer, and a conductive connecting end portion, and comprising: a forming step, comprising a mixture of a magnetic metal powder and a binder component; and an inorganic insulating layer forming step of forming an insulating layer comprising an inorganic insulating layer formed of an inorganic material on the molded body obtained by the forming step; And a connecting end forming step of forming the connecting end portion on the insulating layer of the magnetic member; and forming the magnetic member after the forming step is completed and before the inorganic insulating layer forming step is started An impregnation coating step of the impregnated coating; and the magnetic member has pores. An electronic machine mounted with an electronic component according to any one of claims 1 to 3. An electronic machine mounted with an electronic component manufactured by the manufacturing method of claim 11 or 12.