TWI590904B - Droplet discharge device and its adjustment method - Google Patents

Droplet discharge device and its adjustment method Download PDF

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Publication number
TWI590904B
TWI590904B TW105112592A TW105112592A TWI590904B TW I590904 B TWI590904 B TW I590904B TW 105112592 A TW105112592 A TW 105112592A TW 105112592 A TW105112592 A TW 105112592A TW I590904 B TWI590904 B TW I590904B
Authority
TW
Taiwan
Prior art keywords
plunger
liquid chamber
abutting portion
liquid
moving member
Prior art date
Application number
TW105112592A
Other languages
English (en)
Chinese (zh)
Other versions
TW201642983A (zh
Inventor
Kazumasa Ikushima
Original Assignee
Musashi Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Musashi Engineering Inc filed Critical Musashi Engineering Inc
Publication of TW201642983A publication Critical patent/TW201642983A/zh
Application granted granted Critical
Publication of TWI590904B publication Critical patent/TWI590904B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04586—Control methods or devices therefor, e.g. driver circuits, control circuits controlling heads of a type not covered by groups B41J2/04575 - B41J2/04585, or of an undefined type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04588—Control methods or devices therefor, e.g. driver circuits, control circuits using a specific waveform
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2002/041—Electromagnetic transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/05—Heads having a valve

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW105112592A 2007-03-08 2008-03-07 Droplet discharge device and its adjustment method TWI590904B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007057963 2007-03-08

Publications (2)

Publication Number Publication Date
TW201642983A TW201642983A (zh) 2016-12-16
TWI590904B true TWI590904B (zh) 2017-07-11

Family

ID=39737994

Family Applications (4)

Application Number Title Priority Date Filing Date
TW105112592A TWI590904B (zh) 2007-03-08 2008-03-07 Droplet discharge device and its adjustment method
TW103102252A TWI537084B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method
TW097108004A TWI426973B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method
TW106115292A TWI631997B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method

Family Applications After (3)

Application Number Title Priority Date Filing Date
TW103102252A TWI537084B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method
TW097108004A TWI426973B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method
TW106115292A TWI631997B (zh) 2007-03-08 2008-03-07 Droplet discharge device and method

Country Status (5)

Country Link
JP (4) JP5271254B2 (enExample)
KR (3) KR101521902B1 (enExample)
CN (1) CN101646502B (enExample)
TW (4) TWI590904B (enExample)
WO (1) WO2008108097A1 (enExample)

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JP5465936B2 (ja) * 2009-07-01 2014-04-09 武蔵エンジニアリング株式会社 液体材料吐出方法、装置およびプログラム
JP2011224436A (ja) * 2010-04-16 2011-11-10 Alps Electric Co Ltd 吐出装置及び吐出方法
KR101869089B1 (ko) * 2011-01-04 2018-06-19 주식회사 탑 엔지니어링 점성물질 젯팅 장치
JP5806868B2 (ja) 2011-07-11 2015-11-10 武蔵エンジニアリング株式会社 液滴吐出装置および方法
JP5986727B2 (ja) 2011-10-07 2016-09-06 武蔵エンジニアリング株式会社 液体材料の吐出装置および方法
MY169189A (en) 2012-02-06 2019-02-25 Musashi Eng Inc Liquid material discharge device and discharge method
JP5971018B2 (ja) * 2012-08-06 2016-08-17 富士通株式会社 塗布ノズル、塗布装置、及び塗布方法
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JP6180283B2 (ja) * 2013-11-06 2017-08-16 武蔵エンジニアリング株式会社 液体材料吐出装置および方法
KR101512766B1 (ko) * 2013-11-14 2015-04-16 한형수 솔더 페이스트 토출 장치
CN105980064A (zh) * 2014-02-14 2016-09-28 诺信公司 喷射分配器以及用于喷射流体材料滴的方法
PL3117909T3 (pl) * 2014-03-10 2026-02-16 Musashi Engineering, Inc. Urządzenie aplikujące i sposób aplikacji
KR102036680B1 (ko) * 2014-05-20 2019-10-25 엔지니아린구 시스템 가부시키가이샤 미량액체 유출방법 및 미량액체 디스펜서
JP5802347B1 (ja) * 2014-05-20 2015-10-28 エンジニアリングシステム株式会社 微量液体滴下方法および微量液体ディスペンサ
JP6582238B2 (ja) * 2016-01-18 2019-10-02 パナソニックＩｐマネジメント株式会社 液体吐出装置
JP6842152B2 (ja) * 2016-05-31 2021-03-17 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
CN106076693A (zh) * 2016-07-15 2016-11-09 苏州锡友微连电子科技有限公司 一种锡膏喷射阀
JP6772725B2 (ja) * 2016-09-29 2020-10-21 セイコーエプソン株式会社 流体吐出装置および流体を吐出する方法
JP6839834B2 (ja) * 2016-10-04 2021-03-10 武蔵エンジニアリング株式会社 流体吐出装置
US11173562B2 (en) 2017-04-14 2021-11-16 Illinois Tool Works Inc. Solder paste feeding assembly and method
EP4789777A2 (en) * 2017-05-31 2026-08-12 Musashi Engineering, Inc. Liquid material application method and device for implementing said method
IT201700067828A1 (it) * 2017-06-19 2018-12-19 Kromia S R L Macchina di smaltatura per supporti ceramici.
JP6892686B2 (ja) * 2017-12-27 2021-06-23 株式会社日本スペリア社 はんだ塗布装置用ノズル
AT522763B1 (de) * 2019-12-05 2021-01-15 Metallconcept Gmbh Druckkopf
KR102446597B1 (ko) * 2020-11-17 2022-09-23 주식회사 엠아이티 고정밀 솔더링 장치 및 이의 제어방법
JP7066229B2 (ja) * 2021-01-06 2022-05-13 武蔵エンジニアリング株式会社 液体材料吐出装置、その塗布装置および塗布方法
TWI775477B (zh) * 2021-06-07 2022-08-21 萬潤科技股份有限公司 液室機構及液材擠出裝置
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CN120569263A (zh) * 2023-02-16 2025-08-29 松下知识产权经营株式会社 液滴喷出装置

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Also Published As

Publication number Publication date
JP5684853B2 (ja) 2015-03-18
KR20150029008A (ko) 2015-03-17
JP6312758B2 (ja) 2018-04-18
TW201733685A (zh) 2017-10-01
HK1140720A1 (en) 2010-10-22
CN101646502A (zh) 2010-02-10
TW201427788A (zh) 2014-07-16
TW200918229A (en) 2009-05-01
WO2008108097A1 (ja) 2008-09-12
JP2013208613A (ja) 2013-10-10
TWI426973B (zh) 2014-02-21
KR101499597B1 (ko) 2015-03-06
TWI631997B (zh) 2018-08-11
TWI537084B (zh) 2016-06-11
JP5990290B2 (ja) 2016-09-14
JP2015134347A (ja) 2015-07-27
JP2017006916A (ja) 2017-01-12
KR20090119770A (ko) 2009-11-19
JPWO2008108097A1 (ja) 2010-06-10
KR20140077222A (ko) 2014-06-23
KR101600432B1 (ko) 2016-03-08
CN101646502B (zh) 2013-02-20
KR101521902B1 (ko) 2015-05-20
TW201642983A (zh) 2016-12-16
JP5271254B2 (ja) 2013-08-21

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