TWI587441B - 靜電夾頭 - Google Patents

靜電夾頭 Download PDF

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Publication number
TWI587441B
TWI587441B TW102113700A TW102113700A TWI587441B TW I587441 B TWI587441 B TW I587441B TW 102113700 A TW102113700 A TW 102113700A TW 102113700 A TW102113700 A TW 102113700A TW I587441 B TWI587441 B TW I587441B
Authority
TW
Taiwan
Prior art keywords
plate
electrostatic chuck
insulator
adhesive layer
base
Prior art date
Application number
TW102113700A
Other languages
English (en)
Chinese (zh)
Other versions
TW201347082A (zh
Inventor
白岩則雄
河合治郎
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW201347082A publication Critical patent/TW201347082A/zh
Application granted granted Critical
Publication of TWI587441B publication Critical patent/TWI587441B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
TW102113700A 2012-04-26 2013-04-18 靜電夾頭 TWI587441B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012100925A JP6006972B2 (ja) 2012-04-26 2012-04-26 静電チャック

Publications (2)

Publication Number Publication Date
TW201347082A TW201347082A (zh) 2013-11-16
TWI587441B true TWI587441B (zh) 2017-06-11

Family

ID=49477074

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102113700A TWI587441B (zh) 2012-04-26 2013-04-18 靜電夾頭

Country Status (4)

Country Link
US (1) US9240340B2 (https=)
JP (1) JP6006972B2 (https=)
KR (1) KR102092094B1 (https=)
TW (1) TWI587441B (https=)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5829509B2 (ja) * 2011-12-20 2015-12-09 東京エレクトロン株式会社 載置台及びプラズマ処理装置
US9101038B2 (en) 2013-12-20 2015-08-04 Lam Research Corporation Electrostatic chuck including declamping electrode and method of declamping
JP5811513B2 (ja) 2014-03-27 2015-11-11 Toto株式会社 静電チャック
JP6219227B2 (ja) * 2014-05-12 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構及びステージの温度制御方法
JP6292977B2 (ja) * 2014-05-22 2018-03-14 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
JP6308871B2 (ja) 2014-05-28 2018-04-11 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
JP6433204B2 (ja) * 2014-09-01 2018-12-05 株式会社ディスコ 静電支持プレート及び静電支持プレートの製造方法
US10002782B2 (en) 2014-10-17 2018-06-19 Lam Research Corporation ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough
JP6572788B2 (ja) * 2016-01-29 2019-09-11 住友大阪セメント株式会社 静電チャック装置
JP6238097B1 (ja) * 2016-07-20 2017-11-29 Toto株式会社 静電チャック
JP6238098B1 (ja) * 2016-07-20 2017-11-29 Toto株式会社 静電チャック
WO2018016587A1 (ja) * 2016-07-20 2018-01-25 Toto株式会社 静電チャック
WO2018016588A1 (ja) * 2016-07-20 2018-01-25 Toto株式会社 静電チャック
US10388558B2 (en) * 2016-12-05 2019-08-20 Tokyo Electron Limited Plasma processing apparatus
JP6758175B2 (ja) * 2016-12-21 2020-09-23 日本特殊陶業株式会社 静電チャック
WO2019146796A1 (ja) * 2018-01-29 2019-08-01 京セラ株式会社 試料保持具
JP7090481B2 (ja) * 2018-06-15 2022-06-24 新光電気工業株式会社 静電チャック及びその製造方法
JP2020061445A (ja) * 2018-10-09 2020-04-16 京セラ株式会社 試料保持具
WO2020111194A1 (ja) * 2018-11-30 2020-06-04 京セラ株式会社 試料保持具
KR102203859B1 (ko) * 2019-05-14 2021-01-15 주식회사 동탄이엔지 절연 저항이 우수한 정전척
JP7586682B2 (ja) * 2020-10-07 2024-11-19 日本特殊陶業株式会社 保持装置
JP7550685B2 (ja) 2021-03-17 2024-09-13 新光電気工業株式会社 静電チャック及び基板固定装置
JP7797762B2 (ja) * 2021-08-25 2026-01-14 新光電気工業株式会社 基板固定装置
JP7554171B2 (ja) * 2021-10-19 2024-09-19 日本碍子株式会社 ウエハ載置台
US20250273498A1 (en) * 2024-02-23 2025-08-28 Applied Materials, Inc. Embedded electrostatic chuck (esc)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539179A (en) * 1990-11-17 1996-07-23 Tokyo Electron Limited Electrostatic chuck having a multilayer structure for attracting an object
US6151203A (en) * 1998-12-14 2000-11-21 Applied Materials, Inc. Connectors for an electrostatic chuck and combination thereof
US20110096460A1 (en) * 2009-10-26 2011-04-28 Shinko Electric Industries Co., Ltd Electrostatic chuck

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060016A (ja) * 2001-07-31 2003-02-28 Applied Materials Inc 電流導入端子及び半導体製造装置
JP3993408B2 (ja) * 2001-10-05 2007-10-17 株式会社巴川製紙所 静電チャック装置、その組立方法および静電チャック装置用部材
JP2003197727A (ja) * 2001-12-21 2003-07-11 Kyocera Corp ウエハ載置ステージ
JP2006344613A (ja) 2003-06-24 2006-12-21 Shin-Etsu Engineering Co Ltd 基板貼り合わせ装置
US8038796B2 (en) 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5539179A (en) * 1990-11-17 1996-07-23 Tokyo Electron Limited Electrostatic chuck having a multilayer structure for attracting an object
US6151203A (en) * 1998-12-14 2000-11-21 Applied Materials, Inc. Connectors for an electrostatic chuck and combination thereof
US20110096460A1 (en) * 2009-10-26 2011-04-28 Shinko Electric Industries Co., Ltd Electrostatic chuck

Also Published As

Publication number Publication date
TW201347082A (zh) 2013-11-16
JP6006972B2 (ja) 2016-10-12
US20130286531A1 (en) 2013-10-31
KR102092094B1 (ko) 2020-03-23
KR20130121020A (ko) 2013-11-05
US9240340B2 (en) 2016-01-19
JP2013229464A (ja) 2013-11-07

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