TWI582843B - The manufacturing method of the attached wafer - Google Patents

The manufacturing method of the attached wafer Download PDF

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Publication number
TWI582843B
TWI582843B TW101137429A TW101137429A TWI582843B TW I582843 B TWI582843 B TW I582843B TW 101137429 A TW101137429 A TW 101137429A TW 101137429 A TW101137429 A TW 101137429A TW I582843 B TWI582843 B TW I582843B
Authority
TW
Taiwan
Prior art keywords
wafer
component
dividing
component wafer
cutting
Prior art date
Application number
TW101137429A
Other languages
English (en)
Chinese (zh)
Other versions
TW201322322A (zh
Inventor
Yoshiaki Yodo
Shunichiro Hirosawa
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW201322322A publication Critical patent/TW201322322A/zh
Application granted granted Critical
Publication of TWI582843B publication Critical patent/TWI582843B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW101137429A 2011-11-11 2012-10-11 The manufacturing method of the attached wafer TWI582843B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011247343A JP5995428B2 (ja) 2011-11-11 2011-11-11 カバー付きチップの製造方法

Publications (2)

Publication Number Publication Date
TW201322322A TW201322322A (zh) 2013-06-01
TWI582843B true TWI582843B (zh) 2017-05-11

Family

ID=48314889

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101137429A TWI582843B (zh) 2011-11-11 2012-10-11 The manufacturing method of the attached wafer

Country Status (4)

Country Link
JP (1) JP5995428B2 (ja)
KR (1) KR101893617B1 (ja)
CN (1) CN103107137B (ja)
TW (1) TWI582843B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6234312B2 (ja) * 2014-04-11 2017-11-22 株式会社ディスコ 積層基板の加工方法
JP6305853B2 (ja) * 2014-07-08 2018-04-04 株式会社ディスコ ウエーハの加工方法
DE102016215473B4 (de) * 2015-09-10 2023-10-26 Disco Corporation Verfahren zum Bearbeiten eines Substrats
JP6814646B2 (ja) * 2017-01-23 2021-01-20 株式会社ディスコ 光デバイスウェーハの加工方法
JP7292803B2 (ja) * 2019-09-12 2023-06-19 株式会社ディスコ ウェーハの加工方法
CN110842769A (zh) * 2019-11-19 2020-02-28 长江存储科技有限责任公司 一种用于提高芯片摩擦去层均匀性的装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103328A (ja) * 2008-10-24 2010-05-06 Disco Abrasive Syst Ltd 貼り合わせウエーハの分割方法
JP2010141085A (ja) * 2008-12-11 2010-06-24 Disco Abrasive Syst Ltd 積層製品の製造方法
JP2011066294A (ja) * 2009-09-18 2011-03-31 Fujitsu Semiconductor Ltd 半導体装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03270156A (ja) * 1990-03-20 1991-12-02 Oki Electric Ind Co Ltd 半導体装置の製造方法
JP4231349B2 (ja) * 2003-07-02 2009-02-25 株式会社ディスコ レーザー加工方法およびレーザー加工装置
JP2005051144A (ja) * 2003-07-31 2005-02-24 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JP3842769B2 (ja) * 2003-09-01 2006-11-08 株式会社東芝 レーザ加工装置、レーザ加工方法、及び半導体装置の製造方法
JP5318634B2 (ja) * 2009-03-30 2013-10-16 ラピスセミコンダクタ株式会社 チップサイズパッケージ状の半導体チップ及び製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103328A (ja) * 2008-10-24 2010-05-06 Disco Abrasive Syst Ltd 貼り合わせウエーハの分割方法
JP2010141085A (ja) * 2008-12-11 2010-06-24 Disco Abrasive Syst Ltd 積層製品の製造方法
JP2011066294A (ja) * 2009-09-18 2011-03-31 Fujitsu Semiconductor Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
KR101893617B1 (ko) 2018-10-04
CN103107137B (zh) 2017-06-16
JP5995428B2 (ja) 2016-09-21
CN103107137A (zh) 2013-05-15
KR20130052721A (ko) 2013-05-23
TW201322322A (zh) 2013-06-01
JP2013105821A (ja) 2013-05-30

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