TWI577776B - No substrate on both sides of the adhesive sheet - Google Patents

No substrate on both sides of the adhesive sheet Download PDF

Info

Publication number
TWI577776B
TWI577776B TW102142273A TW102142273A TWI577776B TW I577776 B TWI577776 B TW I577776B TW 102142273 A TW102142273 A TW 102142273A TW 102142273 A TW102142273 A TW 102142273A TW I577776 B TWI577776 B TW I577776B
Authority
TW
Taiwan
Prior art keywords
film
release
acid
group
meth
Prior art date
Application number
TW102142273A
Other languages
English (en)
Chinese (zh)
Other versions
TW201439271A (zh
Inventor
Yoshikazu Tanaka
Kimihiro Isaki
Tomohisa Saito
Original Assignee
Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012274250A external-priority patent/JP6001436B2/ja
Priority claimed from JP2012274251A external-priority patent/JP6001437B2/ja
Priority claimed from JP2012274252A external-priority patent/JP6091202B2/ja
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Publication of TW201439271A publication Critical patent/TW201439271A/zh
Application granted granted Critical
Publication of TWI577776B publication Critical patent/TWI577776B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/10—Definition of the polymer structure
    • C08G2261/14—Side-groups
    • C08G2261/142—Side-chains containing oxygen
    • C08G2261/1424—Side-chains containing oxygen containing ether groups, including alkoxy
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
    • C08G2261/32—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain
    • C08G2261/322—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed
    • C08G2261/3223—Monomer units or repeat units incorporating structural elements in the main chain incorporating heteroaromatic structural elements in the main chain non-condensed containing one or more sulfur atoms as the only heteroatom, e.g. thiophene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/70—Post-treatment
    • C08G2261/79—Post-treatment doping
    • C08G2261/794—Post-treatment doping with polymeric dopants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/005—Presence of (meth)acrylic polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2465/00—Presence of polyphenylene
    • C09J2465/005—Presence of polyphenylene in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/005—Presence of polyurethane in the release coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
TW102142273A 2012-12-17 2013-11-20 No substrate on both sides of the adhesive sheet TWI577776B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012274250A JP6001436B2 (ja) 2012-12-17 2012-12-17 基材レス両面粘着シート
JP2012274251A JP6001437B2 (ja) 2012-12-17 2012-12-17 基材レス両面粘着シート
JP2012274252A JP6091202B2 (ja) 2012-12-17 2012-12-17 基材レス両面粘着シート

Publications (2)

Publication Number Publication Date
TW201439271A TW201439271A (zh) 2014-10-16
TWI577776B true TWI577776B (zh) 2017-04-11

Family

ID=50978103

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102142273A TWI577776B (zh) 2012-12-17 2013-11-20 No substrate on both sides of the adhesive sheet

Country Status (4)

Country Link
KR (2) KR101971649B1 (ja)
CN (1) CN104781360B (ja)
TW (1) TWI577776B (ja)
WO (1) WO2014097757A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6488805B2 (ja) * 2015-03-23 2019-03-27 三菱ケミカル株式会社 基材レス両面粘着シート
JP2016187871A (ja) * 2015-03-30 2016-11-04 三菱樹脂株式会社 離型フィルム
JP2016188265A (ja) * 2015-03-30 2016-11-04 三菱樹脂株式会社 離型フィルム
JP6488819B2 (ja) * 2015-03-30 2019-03-27 三菱ケミカル株式会社 基材レス両面粘着シート
JP6536123B2 (ja) * 2015-03-28 2019-07-03 三菱ケミカル株式会社 離型フィルム
JP6480295B2 (ja) * 2015-09-25 2019-03-06 藤森工業株式会社 剥離性に優れた離型フィルム
JP6208728B2 (ja) * 2015-09-30 2017-10-04 日東電工株式会社 セパレータ付き粘着剤層、セパレータ付き粘着剤層付きの光学フィルム、画像表示装置及びその製造方法
KR102131894B1 (ko) * 2015-11-02 2020-07-08 미쯔비시 케미컬 주식회사 도포 필름
KR102296195B1 (ko) * 2016-06-30 2021-08-31 코오롱인더스트리 주식회사 폴리에스테르 다층필름
KR102426469B1 (ko) * 2016-09-15 2022-07-29 미쯔비시 케미컬 주식회사 점착 시트 적층체, 부형 점착 시트 적층체 및 그 제조방법
JP2018168359A (ja) * 2017-03-29 2018-11-01 三洋化成工業株式会社 感光性樹脂組成物
KR101880182B1 (ko) * 2018-01-02 2018-07-19 도레이첨단소재 주식회사 이형필름
JP7304143B2 (ja) * 2018-02-13 2023-07-06 日東電工株式会社 粘着シートおよび粘着シート積層体
CN110144175A (zh) * 2018-02-13 2019-08-20 日东电工株式会社 粘合片以及粘合片层叠体
JP7239579B2 (ja) * 2018-06-15 2023-03-14 リンテック株式会社 デバイス封止用接着シート、及びデバイス封止体を製造する方法
KR102152295B1 (ko) * 2018-09-04 2020-09-04 (주)이녹스첨단소재 디스플레이용 점착시트 및 이를 포함하는 디스플레이

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1616454A (zh) * 2004-09-29 2005-05-18 徐良衡 一种噻吩类聚合物单体的制备及其聚合方法
CN102597144A (zh) * 2009-11-06 2012-07-18 三菱树脂株式会社 带剥离片的双面粘合片

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0440957B1 (de) * 1990-02-08 1996-03-27 Bayer Ag Neue Polythiophen-Dispersionen, ihre Herstellung und ihre Verwendung
JPH11300895A (ja) * 1998-04-17 1999-11-02 Toyobo Co Ltd 離型フィルム
EP0924678B1 (en) * 1997-12-19 2004-09-29 Toyo Boseki Kabushiki Kaisha Labels, bottles fitted with these labels, and processes for their recycling
JP2003127286A (ja) * 2001-10-19 2003-05-08 Fujimori Kogyo Co Ltd 離型フィルムおよびその製造法
JP2003177241A (ja) * 2001-12-10 2003-06-27 Fujimori Kogyo Co Ltd 光学用積層体、粘着剤転写テープ、および光学用積層体の製造法
JP4439886B2 (ja) * 2003-11-25 2010-03-24 リンテック株式会社 帯電防止性を有する離型フィルムの製造方法
KR100718848B1 (ko) * 2005-11-30 2007-05-17 도레이새한 주식회사 대전방지 폴리에스테르 필름
JP5264009B2 (ja) * 2006-05-08 2013-08-14 三菱樹脂株式会社 塗布層を有するポリエステルフィルム
CN201072451Y (zh) * 2007-02-27 2008-06-11 叶隆泰 高透明导电性位相差胶膜
JP5126525B2 (ja) * 2008-07-10 2013-01-23 東洋紡株式会社 離型フィルム
JP2011189589A (ja) 2010-03-15 2011-09-29 Mitsubishi Plastics Inc 基材レス両面粘着シート用離型フィルム
JP5519361B2 (ja) * 2010-03-25 2014-06-11 帝人デュポンフィルム株式会社 離型フィルム
JP2011224904A (ja) 2010-04-21 2011-11-10 Mitsubishi Plastics Inc 基材レス両面粘着シート用離型フィルム
JP2011224896A (ja) 2010-04-21 2011-11-10 Mitsubishi Plastics Inc 基材レス両面粘着シート用離型フィルム
JP2011245739A (ja) 2010-05-27 2011-12-08 Mitsubishi Plastics Inc 基材レス両面粘着シート用離型フィルム
JP2012025030A (ja) 2010-07-23 2012-02-09 Mitsubishi Plastics Inc 基材レス両面粘着シート用ポリエステルフィルム
KR101232518B1 (ko) * 2010-12-28 2013-02-12 율촌화학 주식회사 정전기 방지 성능이 우수한 이형필름 및 그 제조방법
JP2012184327A (ja) 2011-03-05 2012-09-27 Mitsubishi Plastics Inc 基材レス両面粘着シート
JP2012207166A (ja) 2011-03-30 2012-10-25 Mitsubishi Plastics Inc 基材レス両面粘着シート
JP2012000993A (ja) * 2011-07-26 2012-01-05 Mitsubishi Plastics Inc 帯電防止性塗布層を有するポリエステルフィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1616454A (zh) * 2004-09-29 2005-05-18 徐良衡 一种噻吩类聚合物单体的制备及其聚合方法
CN102597144A (zh) * 2009-11-06 2012-07-18 三菱树脂株式会社 带剥离片的双面粘合片

Also Published As

Publication number Publication date
WO2014097757A1 (ja) 2014-06-26
CN104781360B (zh) 2017-09-22
KR20150097470A (ko) 2015-08-26
KR101971649B1 (ko) 2019-04-23
TW201439271A (zh) 2014-10-16
KR20180035867A (ko) 2018-04-06
CN104781360A (zh) 2015-07-15

Similar Documents

Publication Publication Date Title
TWI577776B (zh) No substrate on both sides of the adhesive sheet
TWI752902B (zh) 離型薄膜
JP6492572B2 (ja) 表面保護フィルム
JP6390150B2 (ja) ポリエステルフィルム
JP6492573B2 (ja) 表面保護フィルム
TW201432012A (zh) 無基材兩面黏著薄片
JP7003915B2 (ja) 離型フィルム
JP2015078251A (ja) 基材レス両面粘着シート
JP6091202B2 (ja) 基材レス両面粘着シート
JP2013001817A (ja) 基材レス両面粘着シート
JP2013001816A (ja) 基材レス両面粘着シート
JP6488819B2 (ja) 基材レス両面粘着シート
JP6001437B2 (ja) 基材レス両面粘着シート
JP6001436B2 (ja) 基材レス両面粘着シート
JP2015074732A (ja) 基材レス両面粘着シート
JP2015091905A (ja) 基材レス両面粘着シート
JP6046462B2 (ja) 基材レス両面粘着シート
JP2018058269A (ja) 積層ポリエステルフィルム
JP2015091904A (ja) 基材レス両面粘着シート
JP6046463B2 (ja) 基材レス両面粘着シート
JP2018058365A (ja) 積層ポリエステルフィルム
JP2015077686A (ja) 基材レス両面粘着シート